EP4SGX230DF29I3N - Stratix IV GX FPGA 228K LE | Intel
Référence : EP4SGX230DF29I3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1750 | $17 500,00 |
| 100 | $1620 | $162 000,00 |
| 250 | $1540 | $385 000,00 |
| 500 | $1480 | $740 000,00 |
EP4SGX230DF29I3N Présentation
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose interconnect and logic fabric can be programmed after manufacturing to implement custom digital circuits, signal-processing functions, or hardware accelerators. FPGAs occupy a distinct tier in the digital logic hierarchy: above fixed-function ASICs in flexibility and below microcontrollers in software programmability. The Stratix IV family targets high-performance applications where parallel hardware execution and very high I/O bandwidth are mandatory, such as high-speed communications, signal processing, and ASIC prototyping.
The EP4SGX230DF29I3N combines a high-density programmable logic fabric with multi-gigabit transceivers, on-chip memory, and DSP blocks. The Stratix IV GX variant integrates transceivers capable of multi-gigabit-per-second serial links, supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and custom serial interfaces. The 17544192 bits of embedded RAM enable large buffer pools and on-chip data storage without external memory for many use cases.
Architecturally, the device leverages a 40 nm process with adaptive logic modules (ALMs), M9K and M144K memory blocks, variable-precision DSP blocks, and a rich clock network with PLLs. The 780-pin FCBGA package exposes 372 general-purpose I/Os, multiple transceiver channels, and high-speed memory interfaces, allowing the part to interface to DDR3, QDRII+, and RLDRAM II external memories.
Typical applications include high-speed serial communication cards, software-defined radio, ASIC and SoC prototyping, high-performance computing accelerators, and high-bandwidth signal processing platforms. Designers typically choose the EP4SGX230DF29I3N when the design requires the combination of high logic density, integrated transceivers, and large on-chip memory.
When designing with this FPGA, ensure PCB layout supports the FCBGA-780 footprint with proper via-in-pad construction and controlled-impedance routing for the transceiver channels. Power delivery must cover the core, PLL, transceiver, and I/O rails independently, with decoupling placed close to the package. Configuration via JTAG or a supported boot memory should be planned early in the schematic.
This page consolidates distributor pricing, drop-in and same-family alternatives, and practical design considerations for the EP4SGX230DF29I3N that are not duplicated from the manufacturer datasheet.
Alternatives de remplacement direct pour EP4SGX230DF29I3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4SGX230DF29I3N (même facteur de forme et même empreinte) — différant par Mounting Type, RoHS Status, Operating Temperature, Package, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4SGX230DF29I3G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP4SGX230DF29C2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP4SGX230DF29C3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP4SGX230DF29C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP4SGX230DF29I4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP4SGX230DF29I3N Valeurs maximales et caractéristiques électriques
| Family | Stratix IV GX |
| Series | EP4SGX230 |
| Logic Elements | 228000 |
| Number of LABs/CLBs | 9120 |
| Number of Logic Elements/Cells | 228000 |
| Total RAM Bits | 17544192 |
| Number of I/O | 372 |
| Voltage - Supply | 0.87 V to 0.93 V |
| Température de fonctionnement | -40C to +100C (TJ) |
| Type de montage | Surface Mount |
| Boîtier / Format | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA (29x29 mm) |
| Programmable | Not Verified (per distributor listing) |
| Part Status | Obsolete |
| Statut RoHS | Compliant (per distributor listing) |
Guide de configuration des broches du EP4SGX230DF29I3N 780-fbga (29x29 mm)
Configuration des broches du EP4SGX230DF29I3N (boîtier 780-fbga (29x29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4SGX230DF29I3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4SGX230DF29I3N convient pour 6 applications: High-Speed Serial Communication Card, Software-Defined Radio (SDR) Platform, ASIC and SoC Prototyping, High-Performance Computing Accelerator, Industrial Imaging and Video Processing, Military and Aerospace Embedded System.
High-Speed Serial Communication Card
The EP4SGX230DF29I3N is well suited to high-speed serial line cards because its Stratix IV GX transceivers deliver multi-gigabit-per-second serial links while the 9120 LABs and 17.5 Mbit of embedded RAM provide the parallel datapath needed for protocol processing. Designers can implement multiple lanes of PCI Express Gen1/Gen2, Serial RapidIO, or custom 8B/10B protocols directly in the FPGA fabric. The 372 user I/Os and FCBGA-780 footprint expose enough I/O for lane replication and external memory. Compared with an ASIC flow, an FPGA implementation lets the design iterate as protocols evolve, which is critical during standards transitions.
Recommandé
Software-Defined Radio (SDR) Platform
For software-defined radio the EP4SGX230DF29I3N provides the DSP blocks, embedded RAM, and transceiver channels required for wideband ADC/DAC interfacing and real-time baseband processing. The 228000 logic elements support parallel FFTs, channelizers, and modem functions at sample rates that microcontrollers cannot reach. Multi-gigabit transceivers stream digitized RF between the ADC and FPGA without an intermediate protocol converter. Industrial temperature grading (-40C to +100C TJ) supports outdoor or vehicular deployment. Compared with discrete DSP clusters, the integrated fabric reduces board area, BOM cost, and inter-chip latency.
Recommandé
ASIC and SoC Prototyping
The EP4SGX230DF29I3N is widely deployed for ASIC and SoC prototyping because its 228000 logic elements can host production RTL for early silicon bring-up, firmware development, and software validation. The 17.5 Mbit embedded RAM models realistic on-chip memory behavior, and the 372 I/Os map cleanly to DDR3, QDRII+, and RLDRAM II external memories used by SoCs. Multi-gigabit transceivers emulate high-speed SERDES lanes, allowing full bandwidth verification of the design. Compared with smaller FPGAs, the higher logic density reduces multi-FPGAs partitioning complexity and shortens bring-up cycles.
Recommandé
High-Performance Computing Accelerator
The EP4SGX230DF29I3N serves as a hardware accelerator for high-performance computing workloads such as genomics, image processing, and scientific simulations. Its DSP blocks execute SIMD-style math at high throughput, while the embedded memory holds intermediate results close to the multipliers to avoid external memory round-trips. Multi-gigabit transceivers deliver a fast host link (PCIe Gen2 or custom) so the accelerator can keep the CPU fed with data. The 780-ball FCBGA package supports the power delivery required for sustained bursts at high utilization. Compared with GPU offload, FPGA acceleration often wins on per-watt throughput for streaming workloads.
Recommandé
Industrial Imaging and Video Processing
Industrial camera and video systems benefit from the EP4SGX230DF29I3N because its logic density and embedded RAM can buffer multi-stream image data, perform real-time pre-processing, and drive high-speed display outputs. Multi-gigabit transceivers support CoaXPress, Camera Link HS, and custom serial interfaces used in machine vision. The 372 user I/Os expose enough pins for parallel sensor aggregation, LVDS links, and DDR3 frame buffers. The industrial temperature grade ensures stable operation in factory environments. Compared with a discrete DSP+FPGA architecture, a single Stratix IV GX part simplifies the bill of materials and reduces PCB complexity.
Recommandé
Military and Aerospace Embedded System
Long-lifecycle military and aerospace platforms continue to specify the EP4SGX230DF29I3N for its industrial temperature grade, mature IP library, and existing avionics certification evidence. The part provides deterministic parallel processing for sensor fusion, EW signal conditioning, and crypto offload, while multi-gigabit transceivers interface with MIL-STD-1553, ARINC, and custom high-speed serial buses. The FCBGA-780 package supports ruggedized PCB variants. Compared with newer Stratix 10 devices, the EP4SGX230DF29I3N is preferred when re-certification cost dominates the design trade and supply is sourced from qualified brokers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4SGX230DF29I3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4SGX230DF29I3G | EP4SGX230DF29C2N | EP4SGX230DF29C3N | EP4SGX230DF29C4N | EP4SGX230DF29I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Logic Elements | 228000 | 228000 | 228000 | 228000 | 228000 | 228000 |
| Total RAM Bits | 17544192 | 17544192 | 17544192 | 17544192 | 17544192 | 17544192 |
| Number of I/O | 372 | 372 | 372 | 372 | 372 | 372 |
| Number of LABs/CLBs | 9120 | 9120 | 9120 | 9120 | 9120 | 9120 |
| Supply Voltage | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V |
| Operating Temperature | -40C to +100C (TJ) | -40C to +100C (TJ) | 0C to +85C (TJ) | 0C to +85C (TJ) | 0C to +85C (TJ) | -40C to +100C (TJ) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature grade variant in FCBGA-780 (vs EP4SGX230DF29C2N)
- Slower speed grade for lower power/heat (vs EP4SGX230DF29C4N)
- Highest logic density in the DF29 Stratix IV GX family (vs EP4SGX180KF40I3N)
Notes de conception
Stratix IV GX devices draw substantial current on the core (VCC), PLL (VCCA_PLL), transceiver (VCC_GXB), and I/O (VCCIO) rails. Decoupling must follow Intel's Stratix IV GX power-distribution-network guidelines: bulk capacitors for each rail placed near the package, plus a high-density array of small MLCCs under the FCBGA escape vias. The 0.87 V to 0.93 V core rail typically requires 20+ A at full utilization; a multi-phase controller is recommended for production boards.
The FCBGA-780 package must be soldered to a PCB thermal pattern that spreads heat across multiple inner planes. Without a properly designed thermal pad array and via farm, junction temperature will exceed the -40C to +100C industrial limit under sustained utilization. Measure board temperature in worst-case workload before finalizing the enclosure thermal solution.
The FCBGA-780 (29x29 mm) footprint requires via-in-pad construction with filled and plated-over micro-vias for the inner pads and standard through-vias on outer pads. Maintain controlled-impedance routing for all transceiver channels (100 ohm differential per Intel recommendation) and match lengths within the lane budget. Use Intel's package pin-out file to assign signals to banks before schematic capture.
Do not assume the obsolete lifecycle status means the part is unusable - many defense and industrial programs continue to procure EP4SGX230DF29I3N from qualified brokers. However, do not start a new commercial design on this part because new FPGA firmware and Quartus II support no longer receive updates. Plan a migration path to Stratix V or Stratix 10 for new programs.
Informations de conformité
RoHS compliance per distributor listing on sdes-ic.com. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free and conflict-minerals status not specified in available data; do not assume without verification.