EP4SGX230DF29I3N - Stratix IV GX FPGA 228K LE | Intel
부품 번호: EP4SGX230DF29I3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 250 | $1540 | $385,000.00 |
| 500 | $1480 | $740,000.00 |
EP4SGX230DF29I3N 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose interconnect and logic fabric can be programmed after manufacturing to implement custom digital circuits, signal-processing functions, or hardware accelerators. FPGAs occupy a distinct tier in the digital logic hierarchy: above fixed-function ASICs in flexibility and below microcontrollers in software programmability. The Stratix IV family targets high-performance applications where parallel hardware execution and very high I/O bandwidth are mandatory, such as high-speed communications, signal processing, and ASIC prototyping.
The EP4SGX230DF29I3N combines a high-density programmable logic fabric with multi-gigabit transceivers, on-chip memory, and DSP blocks. The Stratix IV GX variant integrates transceivers capable of multi-gigabit-per-second serial links, supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and custom serial interfaces. The 17544192 bits of embedded RAM enable large buffer pools and on-chip data storage without external memory for many use cases.
Architecturally, the device leverages a 40 nm process with adaptive logic modules (ALMs), M9K and M144K memory blocks, variable-precision DSP blocks, and a rich clock network with PLLs. The 780-pin FCBGA package exposes 372 general-purpose I/Os, multiple transceiver channels, and high-speed memory interfaces, allowing the part to interface to DDR3, QDRII+, and RLDRAM II external memories.
Typical applications include high-speed serial communication cards, software-defined radio, ASIC and SoC prototyping, high-performance computing accelerators, and high-bandwidth signal processing platforms. Designers typically choose the EP4SGX230DF29I3N when the design requires the combination of high logic density, integrated transceivers, and large on-chip memory.
When designing with this FPGA, ensure PCB layout supports the FCBGA-780 footprint with proper via-in-pad construction and controlled-impedance routing for the transceiver channels. Power delivery must cover the core, PLL, transceiver, and I/O rails independently, with decoupling placed close to the package. Configuration via JTAG or a supported boot memory should be planned early in the schematic.
This page consolidates distributor pricing, drop-in and same-family alternatives, and practical design considerations for the EP4SGX230DF29I3N that are not duplicated from the manufacturer datasheet.
드롭인 대체품: EP4SGX230DF29I3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX230DF29I3N (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, RoHS Status, Operating Temperature, Package, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX230DF29I3G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX230DF29C2N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX230DF29C3N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX230DF29C4N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX230DF29I4N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX230DF29I3N 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Series | EP4SGX230 |
| Logic Elements | 228000 |
| Number of LABs/CLBs | 9120 |
| Number of Logic Elements/Cells | 228000 |
| Total RAM Bits | 17544192 |
| Number of I/O | 372 |
| Voltage - Supply | 0.87 V to 0.93 V |
| 동작 온도 | -40C to +100C (TJ) |
| 실장 유형 | Surface Mount |
| 패키지 / 케이스 | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA (29x29 mm) |
| Programmable | Not Verified (per distributor listing) |
| Part Status | Obsolete |
| RoHS 상태 | Compliant (per distributor listing) |
EP4SGX230DF29I3N 780-fbga (29x29 mm) 핀 구성 가이드
EP4SGX230DF29I3N(780-fbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX230DF29I3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX230DF29I3N 적합 용도: 6 애플리케이션s: High-Speed Serial Communication Card, Software-Defined Radio (SDR) Platform, ASIC and SoC Prototyping, High-Performance Computing Accelerator, Industrial Imaging and Video Processing, Military and Aerospace Embedded System.
High-Speed Serial Communication Card
The EP4SGX230DF29I3N is well suited to high-speed serial line cards because its Stratix IV GX transceivers deliver multi-gigabit-per-second serial links while the 9120 LABs and 17.5 Mbit of embedded RAM provide the parallel datapath needed for protocol processing. Designers can implement multiple lanes of PCI Express Gen1/Gen2, Serial RapidIO, or custom 8B/10B protocols directly in the FPGA fabric. The 372 user I/Os and FCBGA-780 footprint expose enough I/O for lane replication and external memory. Compared with an ASIC flow, an FPGA implementation lets the design iterate as protocols evolve, which is critical during standards transitions.
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Software-Defined Radio (SDR) Platform
For software-defined radio the EP4SGX230DF29I3N provides the DSP blocks, embedded RAM, and transceiver channels required for wideband ADC/DAC interfacing and real-time baseband processing. The 228000 logic elements support parallel FFTs, channelizers, and modem functions at sample rates that microcontrollers cannot reach. Multi-gigabit transceivers stream digitized RF between the ADC and FPGA without an intermediate protocol converter. Industrial temperature grading (-40C to +100C TJ) supports outdoor or vehicular deployment. Compared with discrete DSP clusters, the integrated fabric reduces board area, BOM cost, and inter-chip latency.
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ASIC and SoC Prototyping
The EP4SGX230DF29I3N is widely deployed for ASIC and SoC prototyping because its 228000 logic elements can host production RTL for early silicon bring-up, firmware development, and software validation. The 17.5 Mbit embedded RAM models realistic on-chip memory behavior, and the 372 I/Os map cleanly to DDR3, QDRII+, and RLDRAM II external memories used by SoCs. Multi-gigabit transceivers emulate high-speed SERDES lanes, allowing full bandwidth verification of the design. Compared with smaller FPGAs, the higher logic density reduces multi-FPGAs partitioning complexity and shortens bring-up cycles.
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High-Performance Computing Accelerator
The EP4SGX230DF29I3N serves as a hardware accelerator for high-performance computing workloads such as genomics, image processing, and scientific simulations. Its DSP blocks execute SIMD-style math at high throughput, while the embedded memory holds intermediate results close to the multipliers to avoid external memory round-trips. Multi-gigabit transceivers deliver a fast host link (PCIe Gen2 or custom) so the accelerator can keep the CPU fed with data. The 780-ball FCBGA package supports the power delivery required for sustained bursts at high utilization. Compared with GPU offload, FPGA acceleration often wins on per-watt throughput for streaming workloads.
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Industrial Imaging and Video Processing
Industrial camera and video systems benefit from the EP4SGX230DF29I3N because its logic density and embedded RAM can buffer multi-stream image data, perform real-time pre-processing, and drive high-speed display outputs. Multi-gigabit transceivers support CoaXPress, Camera Link HS, and custom serial interfaces used in machine vision. The 372 user I/Os expose enough pins for parallel sensor aggregation, LVDS links, and DDR3 frame buffers. The industrial temperature grade ensures stable operation in factory environments. Compared with a discrete DSP+FPGA architecture, a single Stratix IV GX part simplifies the bill of materials and reduces PCB complexity.
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Military and Aerospace Embedded System
Long-lifecycle military and aerospace platforms continue to specify the EP4SGX230DF29I3N for its industrial temperature grade, mature IP library, and existing avionics certification evidence. The part provides deterministic parallel processing for sensor fusion, EW signal conditioning, and crypto offload, while multi-gigabit transceivers interface with MIL-STD-1553, ARINC, and custom high-speed serial buses. The FCBGA-780 package supports ruggedized PCB variants. Compared with newer Stratix 10 devices, the EP4SGX230DF29I3N is preferred when re-certification cost dominates the design trade and supply is sourced from qualified brokers.
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추천 제품 요약
엔지니어링 참조 데이터: EP4SGX230DF29I3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX230DF29I3G | EP4SGX230DF29C2N | EP4SGX230DF29C3N | EP4SGX230DF29C4N | EP4SGX230DF29I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Logic Elements | 228000 | 228000 | 228000 | 228000 | 228000 | 228000 |
| Total RAM Bits | 17544192 | 17544192 | 17544192 | 17544192 | 17544192 | 17544192 |
| Number of I/O | 372 | 372 | 372 | 372 | 372 | 372 |
| Number of LABs/CLBs | 9120 | 9120 | 9120 | 9120 | 9120 | 9120 |
| Supply Voltage | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V |
| Operating Temperature | -40C to +100C (TJ) | -40C to +100C (TJ) | 0C to +85C (TJ) | 0C to +85C (TJ) | 0C to +85C (TJ) | -40C to +100C (TJ) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industrial temperature grade variant in FCBGA-780 (vs EP4SGX230DF29C2N)
- Slower speed grade for lower power/heat (vs EP4SGX230DF29C4N)
- Highest logic density in the DF29 Stratix IV GX family (vs EP4SGX180KF40I3N)
설계 노트
Stratix IV GX devices draw substantial current on the core (VCC), PLL (VCCA_PLL), transceiver (VCC_GXB), and I/O (VCCIO) rails. Decoupling must follow Intel's Stratix IV GX power-distribution-network guidelines: bulk capacitors for each rail placed near the package, plus a high-density array of small MLCCs under the FCBGA escape vias. The 0.87 V to 0.93 V core rail typically requires 20+ A at full utilization; a multi-phase controller is recommended for production boards.
The FCBGA-780 package must be soldered to a PCB thermal pattern that spreads heat across multiple inner planes. Without a properly designed thermal pad array and via farm, junction temperature will exceed the -40C to +100C industrial limit under sustained utilization. Measure board temperature in worst-case workload before finalizing the enclosure thermal solution.
The FCBGA-780 (29x29 mm) footprint requires via-in-pad construction with filled and plated-over micro-vias for the inner pads and standard through-vias on outer pads. Maintain controlled-impedance routing for all transceiver channels (100 ohm differential per Intel recommendation) and match lengths within the lane budget. Use Intel's package pin-out file to assign signals to banks before schematic capture.
Do not assume the obsolete lifecycle status means the part is unusable - many defense and industrial programs continue to procure EP4SGX230DF29I3N from qualified brokers. However, do not start a new commercial design on this part because new FPGA firmware and Quartus II support no longer receive updates. Plan a migration path to Stratix V or Stratix 10 for new programs.
규정 준수 정보
RoHS compliance per distributor listing on sdes-ic.com. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free and conflict-minerals status not specified in available data; do not assume without verification.