EP1S30F780C6GA - Stratix FPGA 32470 LEs 780-FBGA | Intel
Référence : EP1S30F780C6GA ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1337.09 | $1 337,09 |
| 10 | $1280 | $12 800,00 |
| 100 | $1200 | $120 000,00 |
| 500 | $1150 | $575 000,00 |
| 1 000 | $1100 | $1 100 000,00 |
EP1S30F780C6GA Présentation
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and high-speed serial transceivers. FPGAs sit above fixed-function ASICs and microcontrollers in the silicon hierarchy because they offer hardware-level parallelism with the ability to be re-programmed in-system, placing them in the broader category of programmable logic devices (PLDs) within digital semiconductors.
Key features of the EP1S30F780C6GA include 32,470 logic elements, 3,317,184 RAM bits, 597 maximum user I/O pins, embedded DSP blocks for high-throughput multiplication-accumulation, multiple phase-locked loops for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 780-FBGA package exposes all user I/O through a high-density ball grid that supports dense board layouts.
The EP1S30F780C6GA uses Altera's Stratix architecture with embedded memory and dedicated signal-processing blocks. Designers configure logic and routing through the Quartus II design software, which is also used for timing closure, floorplanning, and bitstream generation. The architecture targets high-throughput parallel processing where conventional processors would bottleneck.
Typical applications include communications infrastructure such as base station baseband and protocol bridging, industrial automation controllers, high-speed data acquisition front-ends, and military/aerospace signal processing. The 597-I/O capacity also makes the device suitable for prototyping ASIC designs and for high-density test and measurement instrumentation.
When designing with this part, pay close attention to power planning: the 1.5 V core supply must be tightly decoupled with bulk and ceramic capacitors close to each supply pin. The 780-BGA footprint requires careful PCB stack-up and via-in-pad or microvia technology for reliable assembly. Signal integrity must be simulated for high-speed LVDS pairs and external memory interfaces to maintain timing margins.
This product page consolidates distributor pricing, parametric comparison, and a drop-in alternative list to streamline sourcing and design decisions, supplementing the official Intel datasheet.
Alternatives de remplacement direct pour EP1S30F780C6GA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S30F780C6GA (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Process Technology, DSP Blocks.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S30F780C6
✅ Remplacement direct✓ En stock
$1125 / unité
Voir la fiche technique →EP1S25F780C6
✅ Remplacement direct✓ En stock
$791.02 / unité
Voir la fiche technique →EP1S25F780C6N
✅ Remplacement direct✓ En stock
$780 / unité
Voir la fiche technique →EP1S20F780C6
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP1S20F780C6N
✅ Remplacement direct✓ En stock
$188.75 / unité
Voir la fiche technique →EP1S30F780C6GA Valeurs maximales et caractéristiques électriques
| Series | Stratix |
| Family | Stratix FPGA |
| Logic Elements | 32,470 |
| Total RAM Bits | 3,317,184 |
| Number of I/O | 597 (maximum user I/O) |
| Core Voltage | 1.425 V to 1.575 V |
| Process Technology | 0.13 um |
| Boîtier / Format | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA (29 x 29 mm) |
| Type de montage | Surface Mount |
| DSP Blocks | Integrated dedicated multipliers |
| PLL Count | Multiple (per Stratix family) |
| Configuration Memory | SRAM-based, volatile |
| Architecture | Altera Stratix (programmable logic + TriMatrix memory + DSP blocks) |
Guide de configuration des broches du EP1S30F780C6GA 780-fbga (29 x 29 mm)
Configuration des broches du EP1S30F780C6GA (boîtier 780-fbga (29 x 29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S30F780C6GA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S30F780C6GA convient pour 6 applications: Communications Baseband Processing, Industrial Automation and Control, High-Speed Data Acquisition Front-Ends, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
Communications Baseband Processing
The EP1S30F780C6GA suits communications baseband and protocol-bridging designs because of its 32,470 logic elements and dedicated DSP blocks for high-throughput multiply-accumulate operations. Its 597 user I/O accommodate multiple external memory interfaces (DDR, QDR, SRAM) and high-speed LVDS links to RF front-ends. The 1.5 V core and Stratix TriMatrix memory deliver deterministic latency for symbol-rate processing in 3G/4G base stations.
Recommandé
Industrial Automation and Control
Industrial controllers, programmable logic controllers (PLCs), and motion-control systems benefit from the EP1S30F780C6GA's high logic density and abundant I/O. The 597 available user I/O can drive dozens of sensor inputs, encoder feedback channels, and actuator outputs concurrently. Integrated PLLs provide deterministic clocking for multi-axis servo loops, and Quartus II enables deterministic real-time firmware development for safety-critical machinery.
Recommandé
High-Speed Data Acquisition Front-Ends
The EP1S30F780C6GA's 3,317,184 RAM bits provide buffering for streaming ADC data at hundreds of MSPS, while 597 user I/O support wide LVDS or parallel CMOS interfaces to high-resolution converters. The dedicated DSP blocks accelerate FIR filtering and FFT pipelines commonly required in oscilloscopes, spectrum analyzers, and software-defined radio front-ends. Pin counts at 597 leave ample margin for downstream processing and storage links.
Recommandé
ASIC Prototyping and Emulation
Designers use the EP1S30F780C6GA for ASIC prototyping and hardware emulation because the 32,470 LEs can map large RTL blocks before committing to silicon. The 780-FBGA package exposes enough I/O to bring out test points, memory buses, and emulation headers. Quartus II integration with synthesis tools allows rapid incremental compilation cycles that speed verification of multi-million-gate ASIC designs.
Recommandé
Military and Aerospace Signal Processing
The EP1S30F780C6GA, when ordered with industrial or military temperature grades, serves in avionics, radar processing, and electronic-warfare subsystems. Its high logic density implements parallel beamforming and pulse-Doppler processing at sample rates unattainable with general-purpose processors. The 780-BGA package supports ruggedized board stacks with underfill and is documented in the Stratix Device Handbook for defense applications.
Recommandé
Test and Measurement Instrumentation
Logic analyzers, protocol testers, and bit-error-rate testers leverage the EP1S30F780C6GA's 597 I/O for multi-channel pattern generation and capture. On-chip TriMatrix memory buffers deep acquisition records, while DSP blocks accelerate real-time protocol decoding. Quartus II IP cores for PCIe, Ethernet, and serial RapidIO simplify integrating the FPGA into modular instrumentation chassis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S30F780C6GA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S30F780C6 | EP1S25F780C6 | EP1S25F780C6N | EP1S20F780C6 | EP1S20F780C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29) | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same |
| Logic Elements | 32,470 | 32,470 (same) | 25,660 | 25,660 | 18,460 | 18,460 |
| Total RAM Bits | 3,317,184 | 3,317,184 (same) | 1,922,048 | 1,922,048 | 1,663,696 | 1,663,696 |
| User I/O (max) | 597 | 597 | 597 | 597 | 586 | 586 |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Speed Grade | C6 | C6 | C6 | C6 | C6 | C6 |
| Lead-Free (N suffix) | Unknown | Unknown | Unknown | Yes (N suffix) | Unknown | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Higher logic capacity in same 780-FBGA footprint (vs EP1S25F780C6)
- Larger TriMatrix memory than smaller density siblings (vs EP1S20F780C6)
- Single-supply 1.5 V core simplifies power architecture (vs Cross-brand SRAM FPGAs)
Notes de conception
Estimated: at a typical Stratix core current of approximately 1.5 A at 1.5 V plus I/O bank power, the EP1S30F780C6GA can draw 3 to 5 W depending on toggle rate. Use a buck regulator with at least 10 percent headroom on the 1.5 V rail, and decouple with 100 nF X7R ceramic capacitors within 5 mm of every supply pin plus bulk polymer or tantalum capacitors on each power plane. The 780-FBGA exposes dozens of GND balls; connect all to a continuous ground plane for thermal dissipation.
The 780-FBGA package has a fine 1.0 mm ball pitch, which typically requires 0.4 mm laser-drilled microvias and via-in-pad technology for reliable assembly. Use a high-Tg FR-4 or low-loss PCB laminate to manage z-axis expansion, and apply underfill during board-level reliability qualification. Per the Stratix Device Handbook pinout guide, all 597 user I/O are assigned to banks; place bank reference voltage pins with local decoupling and verify with the Quartus II pin planner before tape-out.
Stratix SRAM-based FPGAs are volatile and must be configured at every power-up from a configuration device such as an EPC16 or EPCS serial flash; forgetting the configuration source renders the device non-functional. JTAG and passive serial configuration modes are supported but require dedicated pins that must be reserved in the pin planner. Mixing I/O standards across banks without matching VREF voltages causes input latch-up, and exceeding the 1.575 V maximum core voltage instantly destroys the die.
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-mineral compliance were not present in the verified distributor snippets for EP1S30F780C6GA. Intel/Altera discontinued the original Stratix family long before these compliance fields were systematically published, so most reseller listings do not surface them. Industrial (I) temperature grade variants exist for the same die.