EP4SGX360KF43C2N - Stratix IV GX FPGA, 353K LE, 880 I/O | Intel
Référence : EP4SGX360KF43C2N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2895 | $2 895,00 |
| 10 | $2650 | $26 500,00 |
| 100 | $2380 | $238 000,00 |
| 500 | $2155 | $1 077 500,00 |
| 1 000 | $1975 | $1 975 000,00 |
EP4SGX360KF43C2N Présentation
A Stratix IV GX FPGA is a programmable logic device that combines general-purpose logic fabric, dedicated DSP blocks, embedded SRAM, high-speed transceivers, and hard PCIe/clock IP into a single IC. Within the broader semiconductor hierarchy, the device sits at: FPGA -> programmable logic device -> logic IC -> integrated circuit. It belongs to the Stratix IV family and the GX transceiver sub-series, meaning the silicon integrates multi-gigabit transceivers (MGTs) capable of operating at line rates commonly used by PCIe Gen1/Gen2, Gigabit Ethernet, XAUI, Serial RapidIO, and Serial ATA, in addition to the user-programmable fabric.
Key differentiating features of the EP4SGX360KF43C2N include 14,144 adaptive logic modules (ALMs) and approximately 720 DSP blocks (typical for the 360 variant), embedded transceivers supporting multiple industry-standard protocols, hard memory controllers, up to 880 user I/Os, and support for high-speed external memory interfaces such as DDR3, QDR II+, and RLDRAM II. The KF43 speed grade balances timing margin and Fmax for cost-sensitive, throughput-oriented systems. The 1760-ball FC-FBGA package uses flip-chip interconnect technology that minimizes inductance for the high-speed serial and parallel I/O.
Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), ASIC prototyping, communication infrastructure line cards, PCIe Gen2 endpoint cards, broadcast video processing, and high-end test and measurement equipment. The combination of transceivers, large logic capacity, and substantial embedded memory allows one silicon platform to absorb functions that would otherwise require separate processors, ASSPs, and discrete memory.
When designing with this FPGA, plan the power-rail network around the 0.9 V core, dedicated PLL/DSP supply pins, and the high-current transceivers separately; use the Quartus II design suite for synthesis, place-and-route, timing closure, and power estimation. The 1760-ball package requires multi-layer PCB stack-up with controlled-impedance routing for transceivers and matched-length pairs for the LVDS/DDR interfaces.
Alternatives de remplacement direct pour EP4SGX360KF43C2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4SGX360KF43C2N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Series, DSP Blocks.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4SGX360KF43C2
✅ Remplacement direct✓ En stock
$8803.34 / unité
Voir la fiche technique →EP4SGX360KF43C2N
✅ Remplacement direct✓ En stock
$1975 / unité
Voir la fiche technique →EP4SGX360KF40C2N
✅ Remplacement direct✓ En stock
$1850 / unité
Voir la fiche technique →EP4SGX360KF40I3N
✅ Remplacement direct✓ En stock
$5120 / unité
Voir la fiche technique →EP4SGX230KF40C2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4SGX360HF35C2N
✅ Remplacement direct✓ En stock
$3295 / unité
Voir la fiche technique →EP4SGX360KF43C2N Valeurs maximales et caractéristiques électriques
| Family | Stratix IV GX |
| Series | Stratix IV |
| Logic Elements (LE) | 353,600 |
| Adaptive Logic Modules (ALMs) | 14,144 |
| Logic Cells | 353,600 |
| Embedded Memory (bits) | 23,105,536 |
| User I/O Count | 880 |
| Core Voltage (Vcc) | 0.9 V |
| Process Node | 40 nm |
| Speed Grade | C2 |
| Boîtier | 1760-ball FC-FBGA (KF43) |
| Temperature Grade | Industrial |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (Flip-Chip BGA) |
| Niveau MSL | 3 (per JEDEC J-STD-020, 168 hours) |
Guide de configuration des broches du EP4SGX360KF43C2N 1760-ball fc-fbga (kf43)
Configuration des broches du EP4SGX360KF43C2N (boîtier 1760-ball fc-fbga (kf43)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4SGX360KF43C2N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4SGX360KF43C2N convient pour 6 applications: Software Defined Radio (SDR) Baseband, PCIe Gen2 Endpoint Card / Storage Accelerator, ASIC Prototyping and Emulation, High-Performance DSP / Radar Signal Processing, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation.
Software Defined Radio (SDR) Baseband
The EP4SGX360KF43C2N's 353,600 logic elements and 23 Mbit embedded memory make it well-suited for multi-channel digital down-conversion, channelization, and modulation/demodulation in software-defined radio baseband cards. The Stratix IV GX fabric holds parallel FIR/CORDIC pipelines while the embedded transceivers handle ADC/DAC JESD204B or LVDS links at line rates up to several Gbps. Compared with ASIC implementations, the FPGA enables rapid algorithm iteration while sustaining throughput required by 4G/5G small-cell and military radio deployments.
Recommandé
PCIe Gen2 Endpoint Card / Storage Accelerator
EP4SGX360KF43C2N integrates hard PCIe Gen1/Gen2 IP cores (x1/x4/x8) plus multi-gigabit transceivers, eliminating external PHY chips and reducing board area on PCIe endpoint cards. The 880 user I/Os and 23 Mbit on-chip memory enable high-bandwidth DMA engines, NVMe-class storage accelerators, and protocol-bridge cards. Quartus II's PCIe Compiler produces the protocol layer so designers focus on application logic, with link training and electrical compliance managed by the silicon.
Recommandé
ASIC Prototyping and Emulation
With 353,600 logic elements, the EP4SGX360KF43C2N provides enough capacity to partition and prototype ASIC RTL blocks up to ~10M ASIC gates when paired with multi-FPGAs. The 880 I/Os and embedded transceivers create high-bandwidth chip-to-chip links for partitioning large SoC designs. Designers map timing-critical blocks to FPGA fabric while verifying peripheral IP cores against real-world stimulus, materially shortening pre-silicon validation cycles.
Recommandé
High-Performance DSP / Radar Signal Processing
EP4SGX360KF43C2N's hundreds of dedicated DSP blocks deliver multi-GMAC/s throughput for radar pulse compression, FFT-based beamforming, and adaptive filtering. The 40 nm process plus abundant logic cells enable real-time processing of multiple radar channels with low latency. Embedded memory acts as sample/coefficient buffers, while transceivers back-haul processed data over 10 Gbps links to downstream signal processors.
Recommandé
Industrial Imaging and Machine Vision
EP4SGX360KF43C2N's 880 user I/Os accept multiple Camera Link, CoaXPress, or LVDS camera streams in parallel while the logic fabric performs real-time image preprocessing, defect detection, and feature extraction. The 23 Mbit embedded memory acts as line buffers and frame-store for line-scan cameras, and transceivers push processed results to host servers at multi-gigabit rates. Industrial temperature grade and lead-free BGA packaging suit factory-floor deployment.
Recommandé
Test and Measurement Instrumentation
EP4SGX360KF43C2N's combination of logic density, embedded transceivers, and high-I/O count suits high-end oscilloscopes, logic analyzers, and protocol analyzers. The fabric implements deep acquisition memory, real-time trigger logic, and protocol-aware decoding while transceivers handle SERDES-based lanes. Quartus II integration with MATLAB/Simulink and DSP Builder shortens development of measurement-specific DSP pipelines.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4SGX360KF43C2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4SGX360KF43C2 | EP4SGX360KF40C2N | EP4SGX360KF40I3N | EP4SGX230KF40C2N | EP4SGX360HF35C2N |
|---|---|---|---|---|---|---|
| Package | 1760-ball FC-FBGA (KF43) | 1760-ball FC-FBGA (KF43) - same | 1517-ball FC-FBGA (KF40) | 1517-ball FC-FBGA (KF40) | 1517-ball FC-FBGA (KF40) | 1152-ball FC-FBGA (HF35) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 228,000 | 353,600 |
| User I/O Count | 880 | 880 | 736 | 736 | 736 | 564 |
| Embedded Memory (Mbit) | 23 | 23 | 18 | 18 | 14 | 17 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Speed Grade | C2 | C2 | C2 | I3 | C2 | C2 |
| Transceivers | Embedded multi-gigabit | Embedded multi-gigabit | Embedded multi-gigabit | Embedded multi-gigabit | Embedded multi-gigabit | Embedded multi-gigabit |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial (I3) | Industrial | Industrial |
Principaux différenciateurs
- Highest pin count in the Stratix IV GX 360 family (vs EP4SGX360HF35C2N)
- Full 23 Mbit embedded memory capacity (vs EP4SGX360KF40C2N)
- Drop-in compatible with lead-free suffix variations (vs EP4SGX360KF43C2 (no N))
- Industrial temperature range with C2 speed grade (vs EP4SGX360KF40I3N)
Notes de conception
Stratix IV GX 360 FPGAs draw substantial inrush and steady-state current. Plan a multi-phase 0.9 V regulator with bulk capacitance of 660+ uF and 0402/0603 decoupling (0.1 uF, 0.01 uF, 0.001 uF) placed adjacent to every VCC/VCCPT/VCCP power pin per the Stratix IV GX pin connection guidelines. Decoupling the transceiver (VCCH_GXB) supply separately from the core is critical to prevent simultaneous-switching-noise coupling into the MGTs.
Estimated: at full fabric utilization with transceivers active, the EP4SGX360KF43C2N dissipates between 12 W and 22 W. Use the KF43 package's 31.3 C/W junction-to-ambient (theta_JA) thermal resistance as the baseline and design a PCB thermal solution (top-side heatsink, internal copper planes, thermal vias under the BGA) that keeps junction temperature below 100 C for industrial operation. Provide airflow or conduction cooling for high-utilization designs.
Route the multi-gigabit transceivers with 100-ohm differential impedance (85 ohm for some protocols), continuous reference planes, length-matched pairs within the tolerance defined by the Quartus II fitter, and AC-coupling capacitors placed near the FPGA pin. For DDR3/QDR II external memory interfaces, follow the Intel Stratix IV external memory interface pin-out table and the EMIF toolkit recommendations for byte-lane matching.
Do not omit CONFIG_DONE pull-up and nCONFIG pull-down resistors - missing configuration-mode resistors are a leading cause of configuration failure. Verify JTAG chain integrity before power-up. Do not drive MSEL pins with a non-supported mode combination. For PCIe Gen2, ensure the REFCLK supply is jitter-clean (< 100 ppm) per the PCIe CEM specification.
Use the Quartus II I/O timing analyzer to verify that all LVDS, DDR3, and transceiver signals meet setup/hold across voltage and temperature corners. For the 1760-ball BGA, allow escape routing on multiple inner layers and break out differential pairs with matched via count to maintain 100-ohm impedance. Use the IBIS models (downloaded from the Intel FPGA support site) for board-level signal-integrity verification.
Informations de conformité
RoHS compliant per the N suffix in the part number. Industrial temperature grade. Not AEC-Q100 qualified - FPGAs are not typically designed for AEC-Q100 automotive qualification, though Stratix IV GX may be used in industrial-grade automotive test systems.
