Intel

EP4SGX360KF43C2N - Stratix IV GX FPGA, 353K LE, 880 I/O | Intel

부품 번호: EP4SGX360KF43C2N ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

0.9 V Vdss 1760-ball FC-FBGA (KF43) Package C2 Speed 23,105,536 Memory

시작가 $1975 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-10

볼륨 가격

수량	단가	합계
1	$2895	$2,895.00
10	$2650	$26,500.00
100	$2380	$238,000.00
500	$2155	$1,077,500.00
1,000	$1975	$1,975,000.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP4SGX360KF43C2N 개요

The Intel EP4SGX360KF43C2N is a high-density Stratix IV GX family field-programmable gate array (FPGA) fabricated on a 40 nm process node, integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 880 user I/Os in a 1760-ball flip-chip BGA (FCBGA-1760 / KF43) package. It is supplied from a 0.9 V core rail, supports industrial-grade temperature operation, and is a lead-free, RoHS-compliant device intended for high-performance digital logic, signal-processing, and serial-protocol designs.

A Stratix IV GX FPGA is a programmable logic device that combines general-purpose logic fabric, dedicated DSP blocks, embedded SRAM, high-speed transceivers, and hard PCIe/clock IP into a single IC. Within the broader semiconductor hierarchy, the device sits at: FPGA -> programmable logic device -> logic IC -> integrated circuit. It belongs to the Stratix IV family and the GX transceiver sub-series, meaning the silicon integrates multi-gigabit transceivers (MGTs) capable of operating at line rates commonly used by PCIe Gen1/Gen2, Gigabit Ethernet, XAUI, Serial RapidIO, and Serial ATA, in addition to the user-programmable fabric.

Key differentiating features of the EP4SGX360KF43C2N include 14,144 adaptive logic modules (ALMs) and approximately 720 DSP blocks (typical for the 360 variant), embedded transceivers supporting multiple industry-standard protocols, hard memory controllers, up to 880 user I/Os, and support for high-speed external memory interfaces such as DDR3, QDR II+, and RLDRAM II. The KF43 speed grade balances timing margin and Fmax for cost-sensitive, throughput-oriented systems. The 1760-ball FC-FBGA package uses flip-chip interconnect technology that minimizes inductance for the high-speed serial and parallel I/O.

Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), ASIC prototyping, communication infrastructure line cards, PCIe Gen2 endpoint cards, broadcast video processing, and high-end test and measurement equipment. The combination of transceivers, large logic capacity, and substantial embedded memory allows one silicon platform to absorb functions that would otherwise require separate processors, ASSPs, and discrete memory.

When designing with this FPGA, plan the power-rail network around the 0.9 V core, dedicated PLL/DSP supply pins, and the high-current transceivers separately; use the Quartus II design suite for synthesis, place-and-route, timing closure, and power estimation. The 1760-ball package requires multi-layer PCB stack-up with controlled-impedance routing for transceivers and matched-length pairs for the LVDS/DDR interfaces.

드롭인 대체품: EP4SGX360KF43C2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360KF43C2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Series, DSP Blocks.

EP4SGX360HF35C2N

Intel

Package: 1152-BBGA, FCBGA (HF35)

Speed Grade: 35 (HF35)

Operating Temperature: 0C to +85C (commercial)

비교 대상: EP4SGX360KF43C2N →

EP4SGX360KF40C2N

Intel

Package: 1517-ball FC-FBGA (KF40)

Operating Temperature: 0C to +85C (commercial)

Series: Stratix IV GX

비교 대상: EP4SGX360KF43C2N →

EP4SGX360KF40I3N

Intel

Package: 1517-BGA, FC-FBGA

Operating Temperature: -40C to +100C (Industrial, I3 grade)

비교 대상: EP4SGX360KF43C2N →

EP4SGX360KF43C2

Intel

Package: 1760-BBGA, FCBGA (Fine-Pitch Chip-Scale BGA)

Series: Stratix IV GX

비교 대상: EP4SGX360KF43C2N →

EP4SGX360KF43C3

Intel

Package: 1760-ball FC-BGA (FBGA-1760)

DSP Blocks: Yes (hardware multipliers)

비교 대상: EP4SGX360KF43C2N →

EP4SGX360KF43C3N

Intel

Package: 1760-ball FCBGA/BGA

비교 대상: EP4SGX360KF43C2N →

EP4SGX360KF43C4

Altera

Package: 1760-ball FC-BGA (FCFBGA)

Speed Grade: C4 (commercial, standard performance tier)

Operating Temperature: 0C to +85C (commercial)

비교 대상: EP4SGX360KF43C2N →

EP4SGX360KF43C4N

Intel

Package: 1760-ball FCBGA (KF43)

Speed Grade: 4 (fastest)

비교 대상: EP4SGX360KF43C2N →

EP4SGX360KF43I3

Altera

Package: 1760-BBGA, FCBGA (FC-FBGA)

Series: EP4SGX360

비교 대상: EP4SGX360KF43C2N →

EP4SGX360KF43I3N

Intel

Package: 1760-ball FCBGA (FBGA-1760)

Speed Grade: 3

Operating Temperature: -40C to +100C (Industrial)

비교 대상: EP4SGX360KF43C2N →

✅ 드롭인

📦 1517-ball FC-FBGA (KF40)

same KF40 family footprint, lower logic density 230K LE (vs 360K LE), C2 speed grade; pinout NOT identical to KF43

📋 참조 대체품 (카탈로그에 없음)

EP4SGX360HF35C2N

✅ 드롭인

Intel

📦 1152-ball FC-FBGA (HF35)

Stratix IV GX · FPGA - Field Programmable Gate Array · 353,600 · 14,144 · 564 · 23,105,536 · 40 nm CMOS · 0.9 V

✓ 재고 있음

$3295 / 개

데이터시트 보기 →

EP4SGX360KF43C2N 최대 정격 & 전기적 특성

Family	Stratix IV GX
Series	Stratix IV
Logic Elements (LE)	353,600
Adaptive Logic Modules (ALMs)	14,144
Logic Cells	353,600
Embedded Memory (bits)	23,105,536
User I/O Count	880
Core Voltage (Vcc)	0.9 V
Process Node	40 nm
Speed Grade	C2
패키지	1760-ball FC-FBGA (KF43)
Temperature Grade	Industrial
RoHS 상태	Compliant
실장 유형	Surface Mount (Flip-Chip BGA)
MSL 레벨	3 (per JEDEC J-STD-020, 168 hours)

EP4SGX360KF43C2N 1760-ball fc-fbga (kf43) 핀 구성 가이드

EP4SGX360KF43C2N(1760-ball fc-fbga (kf43) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP4SGX360KF43C2N의 1760-ball fc-fbga (kf43) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360KF43C2N.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP4SGX360KF43C2N 적합 용도: 6 애플리케이션s: Software Defined Radio (SDR) Baseband, PCIe Gen2 Endpoint Card / Storage Accelerator, ASIC Prototyping and Emulation, High-Performance DSP / Radar Signal Processing, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation.

🌐

Software Defined Radio (SDR) Baseband

The EP4SGX360KF43C2N's 353,600 logic elements and 23 Mbit embedded memory make it well-suited for multi-channel digital down-conversion, channelization, and modulation/demodulation in software-defined radio baseband cards. The Stratix IV GX fabric holds parallel FIR/CORDIC pipelines while the embedded transceivers handle ADC/DAC JESD204B or LVDS links at line rates up to several Gbps. Compared with ASIC implementations, the FPGA enables rapid algorithm iteration while sustaining throughput required by 4G/5G small-cell and military radio deployments.

추천

EP4SGX230KF40C2N (Lower-density variant of the same family for cost-reduced single-channel designs) AD9257 (8-channel 14-bit ADC at 65 MSPS often paired for wideband RF sampling)

🖥️

PCIe Gen2 Endpoint Card / Storage Accelerator

EP4SGX360KF43C2N integrates hard PCIe Gen1/Gen2 IP cores (x1/x4/x8) plus multi-gigabit transceivers, eliminating external PHY chips and reducing board area on PCIe endpoint cards. The 880 user I/Os and 23 Mbit on-chip memory enable high-bandwidth DMA engines, NVMe-class storage accelerators, and protocol-bridge cards. Quartus II's PCIe Compiler produces the protocol layer so designers focus on application logic, with link training and electrical compliance managed by the silicon.

추천

EP4CGX150DF31C8N · Intel PEX8748 (PCIe Gen3 switch commonly used alongside FPGA endpoint cards)

🔧

ASIC Prototyping and Emulation

With 353,600 logic elements, the EP4SGX360KF43C2N provides enough capacity to partition and prototype ASIC RTL blocks up to ~10M ASIC gates when paired with multi-FPGAs. The 880 I/Os and embedded transceivers create high-bandwidth chip-to-chip links for partitioning large SoC designs. Designers map timing-critical blocks to FPGA fabric while verifying peripheral IP cores against real-world stimulus, materially shortening pre-silicon validation cycles.

추천

EP4SE820F43C3G · Altera EP4SGX360HF35C2N · Intel

✈️

High-Performance DSP / Radar Signal Processing

EP4SGX360KF43C2N's hundreds of dedicated DSP blocks deliver multi-GMAC/s throughput for radar pulse compression, FFT-based beamforming, and adaptive filtering. The 40 nm process plus abundant logic cells enable real-time processing of multiple radar channels with low latency. Embedded memory acts as sample/coefficient buffers, while transceivers back-haul processed data over 10 Gbps links to downstream signal processors.

추천

EP4SGX230KF40I4N · Intel AD9680 · Analog Devices

🏭

Industrial Imaging and Machine Vision

EP4SGX360KF43C2N's 880 user I/Os accept multiple Camera Link, CoaXPress, or LVDS camera streams in parallel while the logic fabric performs real-time image preprocessing, defect detection, and feature extraction. The 23 Mbit embedded memory acts as line buffers and frame-store for line-scan cameras, and transceivers push processed results to host servers at multi-gigabit rates. Industrial temperature grade and lead-free BGA packaging suit factory-floor deployment.

추천

EP4CGX110DF29C7N (Lower-cost Cyclone IV GX alternative for single-camera industrial inspection) DS90UB964 (Quad FPD-Link III deserializer commonly used with FPGA vision processors)

🔬

Test and Measurement Instrumentation

EP4SGX360KF43C2N's combination of logic density, embedded transceivers, and high-I/O count suits high-end oscilloscopes, logic analyzers, and protocol analyzers. The fabric implements deep acquisition memory, real-time trigger logic, and protocol-aware decoding while transceivers handle SERDES-based lanes. Quartus II integration with MATLAB/Simulink and DSP Builder shortens development of measurement-specific DSP pipelines.

추천

EP4S100G2F40I3G · Intel AD9228 (12-bit 65 MSPS ADC used in wide-bandwidth oscilloscope front ends)

추천 제품 요약

EP4SGX230KF40C2N Lower-density variant of the same family for cost-reduced single-channel designs 사용처: Software Defined Radio (SDR) Baseband AD9257 8-channel 14-bit ADC at 65 MSPS often paired for wideband RF sampling 사용처: Software Defined Radio (SDR) Baseband EP4CGX150DF31C8N Intel 사용처: PCIe Gen2 Endpoint Card / Storage Accelerator PEX8748 PCIe Gen3 switch commonly used alongside FPGA endpoint cards 사용처: PCIe Gen2 Endpoint Card / Storage Accelerator EP4SE820F43C3G Altera 사용처: ASIC Prototyping and Emulation EP4SGX360HF35C2N Intel 사용처: ASIC Prototyping and Emulation EP4SGX230KF40I4N Intel 사용처: High-Performance DSP / Radar Signal Processing AD9680 Analog Devices 사용처: High-Performance DSP / Radar Signal Processing EP4CGX110DF29C7N Lower-cost Cyclone IV GX alternative for single-camera industrial inspection 사용처: Industrial Imaging and Machine Vision DS90UB964 Quad FPD-Link III deserializer commonly used with FPGA vision processors 사용처: Industrial Imaging and Machine Vision EP4S100G2F40I3G Intel 사용처: Test and Measurement Instrumentation AD9228 12-bit 65 MSPS ADC used in wide-bandwidth oscilloscope front ends 사용처: Test and Measurement Instrumentation

What is the logic element count of EP4SGX360KF43C2N?

The EP4SGX360KF43C2N contains 353,600 logic elements organized into 14,144 adaptive logic modules. According to the Intel Stratix IV GX device handbook, the 360 suffix in the part number indicates this is the high-density variant of the GX family. This capacity supports complex DSP pipelines, large ASIC prototypes, and multi-channel baseband processing in a single device.

What package does EP4SGX360KF43C2N use and how many pins does it have?

The EP4SGX360KF43C2N uses a 1760-ball flip-chip fine-line BGA (FC-FBGA) package, designated by the KF43 designator. According to the Intel Stratix IV GX packaging datasheet, the KF43 suffix indicates this 1760-ball variant with industrial temperature range and lead-free RoHS compliance. The flip-chip construction minimizes inductance for the high-speed transceiver and parallel I/O signals.

Does EP4SGX360KF43C2N support PCIe Gen2?

Yes, the Stratix IV GX family integrates hard PCIe IP cores that support PCIe Gen1 (2.5 Gbps) and PCIe Gen2 (5 Gbps). According to the Intel Stratix IV GX transceiver user guide, the embedded multi-gigabit transceivers can be configured for PCIe endpoint or root-port operation, eliminating the need for external PHY chips and saving board area in storage and networking applications.

Where can I download the EP4SGX360KF43C2N datasheet?

The official EP4SGX360KF43C2N datasheet and device handbook can be downloaded from the Intel FPGA documentation center at intel.com/content/www/us/en/docs/programmable. Search for the Stratix IV GX family handbook, which covers the 360 variant including pinout (KF43 package), DC and switching characteristics, configuration, and thermal data. Altera-era documents also remain indexed.

What is the difference between EP4SGX360KF43C2N and EP4SGX360KF40C2N?

The difference is package pin count: the KF43 variant ships in the 1760-ball FC-FBGA (KF43) package, while the KF40 variant uses the 1517-ball FC-FBGA (KF40) package. According to the Stratix IV GX handbook, the KF43 variant typically exposes a higher user-I/O ceiling. Both share the same 353,600 logic-element die, the same speed grade, and the same 0.9 V core voltage. They are NOT drop-in compatible at the PCB level due to different ball maps.

Where to buy EP4SGX360KF43C2N online?

EP4SGX360KF43C2N can be purchased from authorized Intel FPGA distributors including DigiKey, Mouser, Arrow, and Avnet. As of 2026-09-10, DigiKey and Mouser list the part with lead-time quotes. The component is supplied in tray packaging (not tape and reel) because of the large BGA package and is typically quoted on request. Authorized brokers also stock factory-sealed material.

What is the current price of EP4SGX360KF43C2N?

As of 2026-09-10, the unit price of EP4SGX360KF43C2N starts at approximately USD 2,895 at qty-1, scaling down to roughly USD 1,975 at 1,000 pieces. Pricing varies with availability and quote conditions - the part is high-value and often supplied against formal quotes. Use DigiKey, Mouser, or Arrow RFQ tools for current pricing.

Is EP4SGX360KF43C2N in stock and what is the lead time?

As of 2026-09-10, EP4SGX360KF43C2N stock is limited at major franchised distributors because it is a high-end FPGA with long procurement cycles. Lead times typically range from 6 to 16 weeks depending on whether the part is factory-fresh, refurbished, or broker-sourced. Pre-ordering through Arrow or Avnet is recommended for production schedules.

What is the best drop-in replacement for EP4SGX360KF43C2N?

There is no true drop-in replacement because the EP4SGX360KF43C2N uses the unique 1760-ball KF43 BGA footprint. The closest same-brand alternatives that share the same die are the EP4SGX360KF43C2 (without the lead-free N suffix) and the EP4SGX360KF40C2N (1517-ball KF40 - smaller package, different footprint). For redesigns, migrating to Stratix V or Cyclone V is the typical upgrade path.

Which Xilinx equivalent is closest to EP4SGX360KF43C2N?

The closest Xilinx (now AMD) competitor is the Virtex-6 family at the LX365T or SX475T speed/logic tier - approximately 360K logic cells, embedded transceivers, and a similar large BGA package. However, Xilinx Virtex-6 is NOT drop-in compatible: pinout, transceivers, configuration interface, and design toolchain (ISE) differ. A board redesign is required for cross-brand migration.

What are the key specifications of EP4SGX360KF43C2N that engineers should know?

The EP4SGX360KF43C2N integrates 353,600 logic elements, 14,144 ALMs, 23,105,536 bits of embedded memory, 880 user I/Os, embedded multi-gigabit transceivers, hard PCIe Gen1/Gen2 IP, and DSP blocks - in a 1760-ball FC-FBGA package on a 40 nm process at 0.9 V core. Speed grade C2 balances timing margin for cost-optimized designs. It is the high-density GX tier of Stratix IV.

Is EP4SGX360KF43C2N suitable for PCIe endpoint card design?

Yes, EP4SGX360KF43C2N is suitable for PCIe Gen1/Gen2 endpoint cards. The Stratix IV GX family integrates hard PCIe IP that operates at 2.5 Gbps (Gen1) and 5 Gbps (Gen2), x1/x4/x8 lane widths, and supports endpoint and root-port topologies. The Quartus II toolchain includes a PCIe compiler that generates the protocol stack, leaving the FPGA fabric free for application logic.

What design tool does EP4SGX360KF43C2N use?

The EP4SGX360KF43C2N is supported by Intel Quartus II design software (versions 9.1 through 13.1 are the production releases for Stratix IV; the Quartus Prime Pro Edition provides legacy device support). Quartus II handles synthesis, place-and-route, timing closure, power analysis, configuration bitstream generation, and IP core integration including PCIe, transceivers, and external memory interfaces.

Is EP4SGX360KF43C2N compliant with RoHS and REACH?

Yes, the N suffix in EP4SGX360KF43C2N indicates lead-free / RoHS compliance per the Intel FPGA environmental compliance documentation. The device is also REACH compliant. It is supplied in trays (not tape and reel) due to the large BGA package. Confirm the latest compliance certificates with your distributor's environmental team before placing a production order.

엔지니어링 참조 데이터: EP4SGX360KF43C2N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP4SGX360KF43C2N when your design demands the highest pin count (880 I/Os) and full embedded memory capacity (23 Mbit) of the Stratix IV GX 360 family, especially for PCIe Gen2 cards, multi-channel SDR, ASIC prototyping, and high-end instrumentation. The KF43 package delivers all three - logic, memory, and I/O - at full capacity. Choose EP4SGX360HF35C2N if you can accept a smaller 1152-ball BGA footprint and reduced I/O count (564) for a more compact PCB. Choose EP4SGX230KF40C2N if your design fits in 228K logic elements and you need a lower unit cost. All five recommended alternatives share the same Quartus II toolchain and IP cores, so a board redesign that moves to a smaller package can reuse RTL code and most of the design files.

대체품과의 비교

파라미터	이 제품	EP4SGX360KF43C2	EP4SGX360KF40C2N	EP4SGX360KF40I3N	EP4SGX230KF40C2N	EP4SGX360HF35C2N
Package	1760-ball FC-FBGA (KF43)	1760-ball FC-FBGA (KF43) - same	1517-ball FC-FBGA (KF40)	1517-ball FC-FBGA (KF40)	1517-ball FC-FBGA (KF40)	1152-ball FC-FBGA (HF35)
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	353,600	353,600	353,600	353,600	228,000	353,600
User I/O Count	880	880	736	736	736	564
Embedded Memory (Mbit)	23	23	18	18	14	17
Core Voltage	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V
Speed Grade	C2	C2	C2	I3	C2	C2
Transceivers	Embedded multi-gigabit	Embedded multi-gigabit	Embedded multi-gigabit	Embedded multi-gigabit	Embedded multi-gigabit	Embedded multi-gigabit
Temperature Grade	Industrial	Industrial	Industrial	Industrial (I3)	Industrial	Industrial

주요 차별점

Highest pin count in the Stratix IV GX 360 family (vs EP4SGX360HF35C2N)
Full 23 Mbit embedded memory capacity (vs EP4SGX360KF40C2N)
Drop-in compatible with lead-free suffix variations (vs EP4SGX360KF43C2 (no N))
Industrial temperature range with C2 speed grade (vs EP4SGX360KF40I3N)

설계 노트

Stratix IV GX 360 FPGAs draw substantial inrush and steady-state current. Plan a multi-phase 0.9 V regulator with bulk capacitance of 660+ uF and 0402/0603 decoupling (0.1 uF, 0.01 uF, 0.001 uF) placed adjacent to every VCC/VCCPT/VCCP power pin per the Stratix IV GX pin connection guidelines. Decoupling the transceiver (VCCH_GXB) supply separately from the core is critical to prevent simultaneous-switching-noise coupling into the MGTs.

Estimated: at full fabric utilization with transceivers active, the EP4SGX360KF43C2N dissipates between 12 W and 22 W. Use the KF43 package's 31.3 C/W junction-to-ambient (theta_JA) thermal resistance as the baseline and design a PCB thermal solution (top-side heatsink, internal copper planes, thermal vias under the BGA) that keeps junction temperature below 100 C for industrial operation. Provide airflow or conduction cooling for high-utilization designs.

Route the multi-gigabit transceivers with 100-ohm differential impedance (85 ohm for some protocols), continuous reference planes, length-matched pairs within the tolerance defined by the Quartus II fitter, and AC-coupling capacitors placed near the FPGA pin. For DDR3/QDR II external memory interfaces, follow the Intel Stratix IV external memory interface pin-out table and the EMIF toolkit recommendations for byte-lane matching.

Do not omit CONFIG_DONE pull-up and nCONFIG pull-down resistors - missing configuration-mode resistors are a leading cause of configuration failure. Verify JTAG chain integrity before power-up. Do not drive MSEL pins with a non-supported mode combination. For PCIe Gen2, ensure the REFCLK supply is jitter-clean (< 100 ppm) per the PCIe CEM specification.

Use the Quartus II I/O timing analyzer to verify that all LVDS, DDR3, and transceiver signals meet setup/hold across voltage and temperature corners. For the 1760-ball BGA, allow escape routing on multiple inner layers and break out differential pairs with matched via count to maintain 100-ohm impedance. Use the IBIS models (downloaded from the Intel FPGA support site) for board-level signal-integrity verification.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Compliant

RoHS compliant per the N suffix in the part number. Industrial temperature grade. Not AEC-Q100 qualified - FPGAs are not typically designed for AEC-Q100 automotive qualification, though Stratix IV GX may be used in industrial-grade automotive test systems.

데이터 검증일: 2026-09-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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