EP4SGX360NF45C2N - Stratix IV GX FPGA 353K LEs | Intel | FBGA-1932
Référence : EP4SGX360NF45C2N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13573.84 | $13 573,84 |
| 5 | $13100 | $65 500,00 |
| 10 | $12750 | $127 500,00 |
| 25 | $12350 | $308 750,00 |
| 100 | $11800 | $1 180 000,00 |
EP4SGX360NF45C2N Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic fabric, programmable routing, and hardened IP blocks such as transceivers, memory controllers, and arithmetic units. FPGAs occupy the top of the programmable-logic hierarchy above CPLDs (which have simpler, lower-density logic) and are widely used for ASIC prototyping, hardware acceleration, signal processing, and interface bridging. Stratix IV specifically is the high-end performance tier in Intel's FPGA portfolio, positioned above Cyclone (cost-optimized) and below the older Stratix V/10 families.
Key features include hard multi-gigabit transceivers capable of data rates from 600 Mbps up to 8.5 Gbps depending on protocol, an integrated PCI Express Gen2 hard IP block with x1/x2/x4 lane support, dedicated 18x18 multipliers, and 9.4 Mbits of dedicated MLAB memory. The -2 speed grade and industrial temperature range (N suffix in Altera convention) suit moderate-speed commercial designs requiring operation from 0C to 85C. The 1932-ball FCBGA package exposes the device's high I/O count while enabling signal integrity for multi-GHz serial links.
The Stratix IV GX architecture pairs a logic-rich programmable fabric with embedded transceivers, 6-input LUTs, and a rich clock network (up to 32 global clocks, regional clocks, and PLLs). This combination supports latency-sensitive DSP pipelines and high-throughput data paths in a single chip, reducing BOM cost and board area compared with discrete logic + external PHY solutions. The hard PCIe Gen2 controller also reduces soft-logic resource usage and simplifies protocol compliance.
Typical applications include 40G/10G Ethernet line cards, radar and signal-intelligence systems, ASIC prototyping, video-broadcast infrastructure (3G-SDI/HDMI bridging), and high-performance DSP for medical imaging. The integrated transceivers make it especially suited to wireless baseband, optical transport, and serial-protocol bridging tasks. For commercial-temperature designs in this logic-density class, the -2 speed grade is the mainstream cost/performance choice.
When designing with this FPGA, pay close attention to transceiver channel placement, PLL configuration, and decoupling: Stratix IV devices require a multi-rail power-supply design (VCC, VCCPT, VCCAUX, VCCPGM, VCCIO per bank). Use the Quartus II or Quartus Prime toolchain with the Stratix IV device library; pin assignments and transceiver rules are validated by Quartus fitter. JTAG configuration via the enhanced configuration device or a host microcontroller is recommended for production.
This page synthesizes distributor pricing, drop-in package-matched alternatives drawn from the same Stratix IV GX family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP4SGX360NF45C2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4SGX360NF45C2N (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Operating Temperature, Transceivers, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4SGX360NF45C2
✅ Remplacement direct✓ En stock
$2050 / unité
Voir la fiche technique →EP4SGX360NF45C3N
✅ Remplacement direct✓ En stock
$3300 / unité
Voir la fiche technique →EP4SGX360NF45C4N
✅ Remplacement direct✓ En stock
$3490 / unité
Voir la fiche technique →EP4SGX360KF40C2N
✅ Remplacement direct✓ En stock
$1850 / unité
Voir la fiche technique →EP4SGX360HF35C2N
✅ Remplacement direct✓ En stock
$3295 / unité
Voir la fiche technique →EP4SGX360NF45C2N Valeurs maximales et caractéristiques électriques
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| User I/Os | 920 |
| Embedded Memory Bits | 23,105,536 |
| Embedded Memory Type | M9K + MLAB |
| Process Technology | 40 nm |
| Core Voltage (VCCINT) | 0.9 V |
| Transceivers | Hard multi-gigabit transceivers up to 8.5 Gbps |
| PCI Express Hard IP | Gen1/Gen2 with x1/x2/x4 support |
| Speed Grade | -2 (commercial performance) |
| Température de fonctionnement | 0C to 85C (commercial, N suffix in legacy Altera marking) |
| Boîtier | 1932-ball FC-FBGA |
| Type de montage | Surface Mount (flip-chip BGA) |
| Niveau MSL | MSL3 (per JEDEC J-STD-020) |
| Lead-Free / RoHS | Yes (compliant) |
| Configuration | JTAG / Fast Passive Parallel / Active Serial (EPCS) |
Guide de configuration des broches du EP4SGX360NF45C2N 1932-ball fc-fbga
Configuration des broches du EP4SGX360NF45C2N (boîtier 1932-ball fc-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4SGX360NF45C2N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4SGX360NF45C2N convient pour 6 applications: 40G/10G Ethernet Line Card, Wireless Baseband / CPRI Processing, ASIC Prototyping and Emulation, Video Broadcast Infrastructure (3G-SDI / HDMI), Industrial Imaging and DSP Pipelines, Aerospace / Defense Signal Processing.
40G/10G Ethernet Line Card
The EP4SGX360NF45C2N is a strong fit for 40G/10G Ethernet line-card designs because its 353,600 LEs and 920 user I/Os can host a full 10G MAC plus packet-processing pipeline, while the integrated multi-gigabit transceivers (up to 8.5 Gbps) drive four 10G SFP+ channels or a single 40G QSFP uplink without an external PHY. Compared with a discrete FPGA + external PHY approach, the integrated hard PCIe Gen2 block also enables a single-chip line card on PCIe backplanes, saving BOM cost and PCB area. The 1932-ball FC-FBGA package preserves signal integrity for multi-GHz serial links when paired with HDI PCB stack-up. Choose the -2 speed grade when timing closure at 156.25 MHz reference clocks is achievable. Pair this FPGA with an external DDR3 memory controller in the fabric for high-bandwidth packet buffering.
Recommandé
Wireless Baseband / CPRI Processing
In wireless baseband and CPRI (Common Public Radio Interface) front-haul designs, the EP4SGX360NF45C2N's hard multi-gigabit transceivers (up to 8.5 Gbps) can carry CPRI option 3 through option 6 links at line rates up to 6.144 Gbps, while 14,144 LABs and the embedded DSP blocks deliver enough fabric capacity for LTE PHY functions including FFT/iFFT, channel coding, and rate matching. The hard PCIe Gen2 controller also serves as the backhaul interface to the baseband card. Compared with a discrete CPRI framer + FPGA approach, integrating CPRI on Stratix IV GX reduces latency and BOM cost, which is critical for CPRI round-trip budgets. The 0C-85C commercial temperature range suits central-radio and indoor baseband applications.
Recommandé
ASIC Prototyping and Emulation
The EP4SGX360NF45C2N is well suited for ASIC prototyping and emulation because 353,600 LEs can host large RTL partitions, and the 920 user I/Os simplify partitioning across multiple FPGAs with abundant inter-chip trace bandwidth. Hard PCIe Gen2 and multi-gigabit transceivers let designers validate PCIe-attached ASICs and SERDES-protocol macros alongside the digital logic, all on one device. Compared with CPLD-based or older-FPGA prototyping platforms, Stratix IV GX offers 40 nm process efficiency and rich embedded memory (23,105,536 bits) for realistic test-bench modeling. Quartus II / Quartus Prime provides RTL synthesis, multi-FGA partitioning, and configuration file generation for production-style bring-up.
Recommandé
Video Broadcast Infrastructure (3G-SDI / HDMI)
In video broadcast and professional AV equipment, the EP4SGX360NF45C2N can multiplex and route multiple 3G-SDI, HD-SDI, or HDMI streams thanks to its 353,600 LEs and high I/O count of 920 pins. The 1932-ball FC-FBGA exposes enough high-speed serial channels for SDI at 2.97 Gbps, while general-purpose I/Os handle parallel video buses and HDMI sideband signals. Compared with a fixed-function video processor, a Stratix IV GX FPGA allows format conversion, scaling, and overlay in a single chip, reducing BOM and shortening time-to-market for new broadcast standards. Commercial temperature grade (0C-85C) suits studio and headend environments.
Recommandé
Industrial Imaging and DSP Pipelines
For industrial imaging, machine vision, and high-throughput DSP pipelines, the EP4SGX360NF45C2N offers a strong combination of 353,600 LEs and dedicated 18x18 multipliers plus embedded memory, supporting real-time image processing, FFT, and video analytics in a single chip. The 920 user I/Os accept multiple parallel image sensors and LVDS buses, while the high-pin-count 1932-ball BGA preserves signal integrity for high-resolution sensors. Compared with a discrete DSP + FPGA architecture, integrating the DSP function on Stratix IV GX reduces latency and BOM cost. The commercial temperature grade (0C-85C) suits factory-floor and medical-imaging equipment.
Recommandé
Aerospace / Defense Signal Processing
In aerospace and defense signal-processing systems (radar, electronic warfare, and SIGINT), the EP4SGX360NF45C2N delivers 353,600 LEs, hard multi-gigabit transceivers, and 920 user I/Os needed for high-bandwidth antenna-array processing and IF sampling. The integrated PCI Express Gen2 hard IP simplifies interfacing to high-speed data converters and host CPUs. Compared with older ASIC-based radar front-ends, a Stratix IV GX FPGA provides design flexibility for evolving signal-processing algorithms. Note: the EP4SGX360NF45C2N is commercial-temperature (0C-85C); for defense applications requiring extended temperature ranges, an 'I'-suffix variant or a screened version should be specified.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4SGX360NF45C2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4SGX360NF45C2 | EP4SGX360NF45C3N | EP4SGX360NF45C4N | EP4SGX360KF40C2N | EP4SGX360HF35C2N |
|---|---|---|---|---|---|---|
| Package | 1932-ball FC-FBGA (F45) | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F40) - different pin map | 1932-ball FC-FBGA (H35) - different pin map |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Speed Grade | -2 | -2 | -3 | -4 | -2 | -2 |
| Temperature Range | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) |
| User I/Os | 920 (F45 pin map) | 920 (F45) | 920 (F45) | 920 (F45) | less than 920 (F40 - different pin map) | less than 920 (H35 - different pin map) |
| Embedded Memory | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits |
Principaux différenciateurs
- Pin-compatible speed-grade and pin-map variants across Stratix IV GX 353K LE family (vs EP4SGX360NF45C4N (speed grade -4))
- Lower-cost commercial-temperature drop-in vs the I-suffix (industrial) variant (vs EP4SGX360NF45I2N (industrial temperature))
- Higher-density Stratix IV GX with hard PCIe Gen2 vs lower-density sibling (vs EP4SGX230KF40C4N (mid-density Stratix IV GX))
Notes de conception
Estimated: Stratix IV GX FPGAs require a multi-rail power design. Provide VCCINT (0.9 V core), VCCPT (1.0 V phase-locked loop), VCCAUX (2.5 V auxiliary), VCCPGM (1.0 V for configuration), and per-bank VCCIO rails. Under typical loading, expect 5-15 W for the EP4SGX360NF45C2N at high utilization. Use a controller such as a multi-output VRM with sequence control to meet Intel power-up ordering requirements (VCCINT, VCCPT, VCCAUX, VCCIO). Decoupling should follow the Stratix IV GX Pin Connection Guidelines (PCG) with dozens of 0.1 uF and 10 uF ceramic caps around the 1932-ball FC-FBGA. Estimated power is from typical FPGA design utilization - actual device power must be confirmed with the Quartus Early Power Estimator (EPE) for the target design.
Estimated: the 1932-ball FC-FBGA package has a junction-to-ambient thermal resistance theta_JA in the range of 8-15 C/W with sufficient PCB copper. At 15 W internal power dissipation, junction temperature rises roughly 120-225C above ambient without thermal management - clearly above the 85C commercial limit. Plan a multi-layer PCB with a full-thermal-pour ground/inner-power plane under the BGA and consider a heatsink or forced airflow for designs approaching 10 W. Use the Stratix IV GX thermal-management guidance and the Quartus PowerPlay thermal model to size the cooling solution. Estimated delta uses the standard theta_JA * power formula; refer to the device's JEDEC thermal test conditions for the actual theta_JA.
The 1932-ball FC-FBGA of the EP4SGX360NF45C2N has a fine ball pitch (typically 1.0 mm or 0.8 mm depending on pin map). Use HDI or microvia PCB stack-up with sequential lamination to escape the BGA fanout. Place at least 6-8 PCB layers for high-speed transceiver routing: route high-speed serial lanes as 100 ohm differential pairs with length matching within the rate-specific tolerance, e.g. within 150 mil for 6.144 Gbps CPRI. Match the impedance across the entire transceiver path including the AC-coupling cap, ESD diode, and connector. Reference the Stratix IV GX Transceiver User Guide for PCB layout rules and the F45 package pinout.
Place configuration memory (EPCS device or enhanced configuration device) within 6 inches of the FPGA's configuration pins. Provide a JTAG header (10-pin or compact 5-pin) connected to the dedicated JTAG pins TMS, TDI, TDO, TCK, and TRST for in-system programming. Keep the JTAG chain clean: include a buffer between configuration memory and FPGA if the chain is long. Confirm pull-up / pull-down resistor values for nCONFIG, nSTATUS, and CONF_DONE per the Stratix IV configuration handbook. Always terminate the transceiver reference clock input with the recommended series capacitor and resistor values.
Common pitfalls for the EP4SGX360NF45C2N include: (1) using the wrong package pinout (F45 vs F40 vs H35) in the Quartus pin assignments - the die is the same but the ball map differs; (2) confusing the legacy Altera 'N' suffix (commercial) with industrial 'I' or automotive 'A' suffixes; (3) omitting the PLL analog supply decoupling, which causes PLL jitter or lock failures; (4) violating simultaneous-switching-output (SSO) limits on the GPIO banks; (5) leaving the JTAG TCK pin unterminated, causing configuration failures. Always re-run Quartus fitter and I/O timing checks after major RTL changes.
Informations de conformité
RoHS / lead-free per Intel / Altera Stratix IV product page. Not AEC-Q100 (automotive) qualified; for AEC-Q100 designs, use an Altera/Intel Cyclone or newer automotive-graded FPGA. Halogen-free status not explicitly listed in verified data - mark unknown.
