EP4SGX530KF43I4N - 531K LE Stratix IV GX FPGA, 880 IO | Intel
Référence : EP4SGX530KF43I4N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2680 | $26 800,00 |
| 50 | $2510 | $125 500,00 |
| 100 | $2390 | $239 000,00 |
| 500 | $2240 | $1 120 000,00 |
EP4SGX530KF43I4N Présentation
A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), programmable routing, dedicated memory blocks, and hardened IP such as transceivers, DSP slices, and PCIe controllers. FPGAs occupy the highest tier of the programmable logic hierarchy, above CPLDs and PALs, and are widely used as application-specific hardware accelerators when GPU or ASIC deployment is too costly or inflexible.
Key features of the EP4SGX530KF43I4N include 880 user I/Os, integrated multi-gigabit transceivers, 28 Mb of RAM, 1.6 GHz internal performance, and support for DDR3 memory interfaces up to 1,066 Mbps. The device includes up to 48 transceivers supporting data rates suitable for 10 Gbps and 6.144 Gbps CPRI/O2 links common in wireless baseband applications.
The Stratix IV GX architecture combines a 40 nm low-power process with adaptive logic modules (ALMs) and a 9-bit partial-product multiplier, yielding high DSP performance for complex digital signal processing while preserving low static and dynamic power consumption. The transceivers include hard PCS, PMA, and physical coding sublayer blocks supporting protocols such as PCIe Gen1/Gen2, XAUI, and Serial RapidIO.
Typical applications include 40G/100G Ethernet bridge and adapter cards, wireless LTE baseband processing, radar and EW signal processing, high-performance computing (HPC) coprocessors, and ASIC prototyping. The KF43 speed grade with the I4 industrial temperature grade supports operation from 0C to 85C.
When designing with this device, ensure adequate power delivery and thermal management: at full utilization the FPGA can exceed 25 W. A multi-layer PCB with dedicated power planes and high-count vias under the BGA is required, and a heatsink or high-airflow cooling solution is typically necessary.
This page consolidates distributor pricing, lifecycle status, drop-in Stratix IV and Stratix V family alternatives, and design guidance not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP4SGX530KF43I4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4SGX530KF43I4N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Mounting Type, Process Technology, Design Software.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4SGX530KF43I4
✅ Remplacement direct✓ En stock
$1995 / unité
Voir la fiche technique →EP4SGX530KF43I3N
✅ Remplacement direct✓ En stock
$7100 / unité
Voir la fiche technique →EP4SGX530KF43C4N
✅ Remplacement direct✓ En stock
$3500 / unité
Voir la fiche technique →EP4SGX530KF43C3N
✅ Remplacement direct✓ En stock
$3425 / unité
Voir la fiche technique →EP4SGX530KF43I4N Valeurs maximales et caractéristiques électriques
| Family | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Embedded Memory (RAM) | 28,033,024 bits |
| User I/O Pins | 880 |
| Number of I/Os | 880 |
| Boîtier | 1760-ball FCBGA (KF43) |
| Package Dimensions | 42.50 x 42.50 mm |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Internal Performance | 800 MHz (max) |
| Speed Grade | KF43 (fast) |
| Temperature Grade | Industrial (I4) |
| Température de fonctionnement | 0C to 85C |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du EP4SGX530KF43I4N 42.50 x 42.50 mm
Configuration des broches du EP4SGX530KF43I4N (boîtier 42.50 x 42.50 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4SGX530KF43I4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4SGX530KF43I4N convient pour 6 applications: 40G/100G Ethernet Bridge and Adapter Cards, Wireless LTE Baseband Processing, Radar and Electronic Warfare Signal Processing, ASIC Prototyping and Emulation, High-Performance Computing Coprocessor, Broadcast Video Processing.
40G/100G Ethernet Bridge and Adapter Cards
The EP4SGX530KF43I4N is well-suited for high-speed Ethernet bridge designs where its 531,200 logic elements support full hardware MAC and packet processing pipelines. The integrated multi-gigabit transceivers at 8.5 Gbps enable aggregation of multiple 10G lanes, while the 28 Mb of embedded memory provides line-rate buffering for packet reordering. Placed on a line card as the central traffic manager, the FPGA performs parsing, classification, and queuing at wire speed. Compared with discrete PHY plus ASSP solutions, this part reduces BOM by integrating the PCS layer, MAC, and switch fabric into a single device.
Recommandé
Wireless LTE Baseband Processing
For LTE base station baseband processing, the EP4SGX530KF43I4N's 21,248 LABs deliver the parallel processing throughput needed for uplink/downlink FFT, channel estimation, and MIMO decoding. The integrated transceivers support CPRI at 6.144 Gbps for direct connectivity to RRH modules. With 0.9 V core voltage and 40 nm process, power consumption is optimized for baseband cards mounted in temperature-controlled enclosures. The 880 user I/Os accommodate multiple CPRI links plus parallel antenna data paths.
Recommandé
Radar and Electronic Warfare Signal Processing
In radar signal processing chains, the EP4SGX530KF43I4N's logic density enables real-time implementation of pulse compression, MTI filtering, and adaptive beamforming for phased array systems. The 28 Mb of embedded RAM allows storage of look-up tables for matched filtering and CFAR detection. Multi-gigabit transceivers connect the FPGA directly to high-speed ADCs and DACs at the antenna front-end. Industrial temperature operation (0C to 85C) supports ground-based and shipboard radar enclosures with active cooling.
Recommandé
ASIC Prototyping and Emulation
The EP4SGX530KF43I4N serves as an ASIC prototyping platform where its 531,200 logic elements can map complex SoC designs spanning CPU cores, interconnect fabrics, and peripherals. The 880 user I/Os enable connection to external memory and daughter cards implementing additional IP blocks. Compared to ASIC fabrication cycles of 6-9 months, FPGA prototyping reduces validation time to weeks. Quartus II compile times are substantial (often 8-24 hours) for full-chip designs.
Recommandé
High-Performance Computing Coprocessor
For HPC acceleration, the EP4SGX530KF43I4N functions as a PCIe-attached coprocessor card implementing custom floating-point or fixed-point pipelines. The integrated PCIe Gen1/Gen2 hard IP block enables direct host CPU communication via PCIe xA11/Gen2 lanes, freeing the transceivers for inter-FPGA links. 28 Mb of embedded RAM supports tile-based algorithm acceleration. Each card consumes 25-40 W under load, requiring active cooling solutions.
Recommandé
Broadcast Video Processing
In broadcast video infrastructure, the EP4SGX530KF43I4N processes uncompressed SDI streams at 3G-SDI and 12G-SDI data rates using integrated transceivers. The 531,200 logic elements implement real-time video scaling, format conversion, and HDR processing. The 880 user I/Os support multiple parallel SDI streams plus external memory interfaces for frame buffering. Industrial temperature grade and high reliability make it suitable for permanent installation in broadcast control rooms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4SGX530KF43I4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4SGX530KF43I4 | EP4SGX530KF43I3N | EP4SGX530KF43C4N | EP4SGX530KF43C3N | EP4SGX530HH35I4N |
|---|---|---|---|---|---|---|
| Package | 1760-ball FCBGA (F43) | 1760-ball FCBGA - same | 1760-ball FCBGA - same | 1760-ball FCBGA - same | 1760-ball FCBGA - same | 1152-pin HBGA - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| LABs | 21,248 | 21,248 | 21,248 | 21,248 | 21,248 | 21,248 |
| Embedded Memory | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits |
| User I/Os | 880 | 880 | 880 | 880 | 880 | Reduced (HBGA package) |
| Temperature Grade | Industrial 0C to 85C | Industrial | Industrial | Commercial 0C to 85C | Commercial 0C to 85C | Industrial |
| Speed Grade | I4 (fast) | I4 | I3 | C4 | C3 | I4 |
Principaux différenciateurs
- Highest-density Stratix IV GX device in 1760-ball FCBGA (vs EP4SGX360KF43I4N)
- Highest user I/O count available in Stratix IV GX KF43 package (vs EP4SGX530HH35I4N)
- N-RND status with limited authorized distributor stock (vs EP4SGX530KF43I4 (without N))
Notes de conception
Estimated: at 0.9 V core voltage and full utilization (80% logic toggle rate), the EP4SGX530KF43I4N dissipates approximately 18-25 W. With the 1760-ball FCBGA package thermal resistance theta_JA typically around 0.4 C/W when mounted on a multi-layer board with thermal vias, junction temperature rise is approximately 7-10 C above ambient at 25 W. A heatsink with 200 LFM forced airflow is recommended; without it, junction temperature can exceed 100 C at industrial ambient. Always run the Quartus II PowerPlay Power Analyzer for design-specific estimates.
The 1760-ball FCBGA at 1.00 mm ball pitch requires a PCB stack-up with laser-drilled microvias and at least 6 layers for signal routing plus dedicated power and ground planes. Decoupling requires high-frequency 0402 ceramic capacitors placed within 200 mils of every supply pin, plus bulk polymer or tantalum capacitors on each power rail. Use Intel's Stratix IV GX pin connection guidelines to assign bank voltages and reference voltage pins for high-speed transceivers, which require isolated analog supply planes.
Multi-gigabit transceiver channels operate at up to 8.5 Gbps and require careful PCB routing with controlled impedance (100 ohm differential for most protocols, 85 ohm for PCIe). Matched-length routing within 0.127 mm tolerance and AC-coupled coupling capacitors (typically 100 nF) at transmitter outputs are mandatory. Series coupling capacitors must use X7R dielectric with 0402 or 0201 case size to minimize stub effects. Reference the Stratix IV GX Transceiver User Guide for protocol-specific PCB layout requirements.
Estimated: power sequencing is critical - the Stratix IV GX requires VCCINT, VCCAUX, VCCPD, and bank I/O voltages to ramp in a specific order; failure to follow the sequence can cause permanent damage to the device. The MSEL pins must be configured to the correct AS or JTAG configuration mode at power-up; incorrect settings cause configuration failure. Always validate the configuration scheme with the Quartus II Programmer before final board bring-up.
Informations de conformité
RoHS and lead-free compliance confirmed per Intel/Altera product page. AEC-Q100 not applicable for this FPGA category. Halogen-free status not specified in available data.
