EP4SGX530KF43I4N - 531K LE Stratix IV GX FPGA, 880 IO | Intel
부품 번호: EP4SGX530KF43I4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 50 | $2510 | $125,500.00 |
| 100 | $2390 | $239,000.00 |
| 500 | $2240 | $1,120,000.00 |
EP4SGX530KF43I4N 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), programmable routing, dedicated memory blocks, and hardened IP such as transceivers, DSP slices, and PCIe controllers. FPGAs occupy the highest tier of the programmable logic hierarchy, above CPLDs and PALs, and are widely used as application-specific hardware accelerators when GPU or ASIC deployment is too costly or inflexible.
Key features of the EP4SGX530KF43I4N include 880 user I/Os, integrated multi-gigabit transceivers, 28 Mb of RAM, 1.6 GHz internal performance, and support for DDR3 memory interfaces up to 1,066 Mbps. The device includes up to 48 transceivers supporting data rates suitable for 10 Gbps and 6.144 Gbps CPRI/O2 links common in wireless baseband applications.
The Stratix IV GX architecture combines a 40 nm low-power process with adaptive logic modules (ALMs) and a 9-bit partial-product multiplier, yielding high DSP performance for complex digital signal processing while preserving low static and dynamic power consumption. The transceivers include hard PCS, PMA, and physical coding sublayer blocks supporting protocols such as PCIe Gen1/Gen2, XAUI, and Serial RapidIO.
Typical applications include 40G/100G Ethernet bridge and adapter cards, wireless LTE baseband processing, radar and EW signal processing, high-performance computing (HPC) coprocessors, and ASIC prototyping. The KF43 speed grade with the I4 industrial temperature grade supports operation from 0C to 85C.
When designing with this device, ensure adequate power delivery and thermal management: at full utilization the FPGA can exceed 25 W. A multi-layer PCB with dedicated power planes and high-count vias under the BGA is required, and a heatsink or high-airflow cooling solution is typically necessary.
This page consolidates distributor pricing, lifecycle status, drop-in Stratix IV and Stratix V family alternatives, and design guidance not found in the manufacturer datasheet.
드롭인 대체품: EP4SGX530KF43I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX530KF43I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Mounting Type, Process Technology, Design Software.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX530KF43I4
✅ 드롭인✓ 재고 있음
$1995 / 개
데이터시트 보기 →EP4SGX530KF43I3N
✅ 드롭인✓ 재고 있음
$7100 / 개
데이터시트 보기 →EP4SGX530KF43C4N
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP4SGX530KF43C3N
✅ 드롭인✓ 재고 있음
$3425 / 개
데이터시트 보기 →EP4SGX530KF43I4N 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Embedded Memory (RAM) | 28,033,024 bits |
| User I/O Pins | 880 |
| Number of I/Os | 880 |
| 패키지 | 1760-ball FCBGA (KF43) |
| Package Dimensions | 42.50 x 42.50 mm |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Internal Performance | 800 MHz (max) |
| Speed Grade | KF43 (fast) |
| Temperature Grade | Industrial (I4) |
| 동작 온도 | 0C to 85C |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP4SGX530KF43I4N 42.50 x 42.50 mm 핀 구성 가이드
EP4SGX530KF43I4N(42.50 x 42.50 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX530KF43I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX530KF43I4N 적합 용도: 6 애플리케이션s: 40G/100G Ethernet Bridge and Adapter Cards, Wireless LTE Baseband Processing, Radar and Electronic Warfare Signal Processing, ASIC Prototyping and Emulation, High-Performance Computing Coprocessor, Broadcast Video Processing.
40G/100G Ethernet Bridge and Adapter Cards
The EP4SGX530KF43I4N is well-suited for high-speed Ethernet bridge designs where its 531,200 logic elements support full hardware MAC and packet processing pipelines. The integrated multi-gigabit transceivers at 8.5 Gbps enable aggregation of multiple 10G lanes, while the 28 Mb of embedded memory provides line-rate buffering for packet reordering. Placed on a line card as the central traffic manager, the FPGA performs parsing, classification, and queuing at wire speed. Compared with discrete PHY plus ASSP solutions, this part reduces BOM by integrating the PCS layer, MAC, and switch fabric into a single device.
추천
Wireless LTE Baseband Processing
For LTE base station baseband processing, the EP4SGX530KF43I4N's 21,248 LABs deliver the parallel processing throughput needed for uplink/downlink FFT, channel estimation, and MIMO decoding. The integrated transceivers support CPRI at 6.144 Gbps for direct connectivity to RRH modules. With 0.9 V core voltage and 40 nm process, power consumption is optimized for baseband cards mounted in temperature-controlled enclosures. The 880 user I/Os accommodate multiple CPRI links plus parallel antenna data paths.
추천
Radar and Electronic Warfare Signal Processing
In radar signal processing chains, the EP4SGX530KF43I4N's logic density enables real-time implementation of pulse compression, MTI filtering, and adaptive beamforming for phased array systems. The 28 Mb of embedded RAM allows storage of look-up tables for matched filtering and CFAR detection. Multi-gigabit transceivers connect the FPGA directly to high-speed ADCs and DACs at the antenna front-end. Industrial temperature operation (0C to 85C) supports ground-based and shipboard radar enclosures with active cooling.
추천
ASIC Prototyping and Emulation
The EP4SGX530KF43I4N serves as an ASIC prototyping platform where its 531,200 logic elements can map complex SoC designs spanning CPU cores, interconnect fabrics, and peripherals. The 880 user I/Os enable connection to external memory and daughter cards implementing additional IP blocks. Compared to ASIC fabrication cycles of 6-9 months, FPGA prototyping reduces validation time to weeks. Quartus II compile times are substantial (often 8-24 hours) for full-chip designs.
추천
High-Performance Computing Coprocessor
For HPC acceleration, the EP4SGX530KF43I4N functions as a PCIe-attached coprocessor card implementing custom floating-point or fixed-point pipelines. The integrated PCIe Gen1/Gen2 hard IP block enables direct host CPU communication via PCIe xA11/Gen2 lanes, freeing the transceivers for inter-FPGA links. 28 Mb of embedded RAM supports tile-based algorithm acceleration. Each card consumes 25-40 W under load, requiring active cooling solutions.
추천
Broadcast Video Processing
In broadcast video infrastructure, the EP4SGX530KF43I4N processes uncompressed SDI streams at 3G-SDI and 12G-SDI data rates using integrated transceivers. The 531,200 logic elements implement real-time video scaling, format conversion, and HDR processing. The 880 user I/Os support multiple parallel SDI streams plus external memory interfaces for frame buffering. Industrial temperature grade and high reliability make it suitable for permanent installation in broadcast control rooms.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX530KF43I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX530KF43I4 | EP4SGX530KF43I3N | EP4SGX530KF43C4N | EP4SGX530KF43C3N | EP4SGX530HH35I4N |
|---|---|---|---|---|---|---|
| Package | 1760-ball FCBGA (F43) | 1760-ball FCBGA - same | 1760-ball FCBGA - same | 1760-ball FCBGA - same | 1760-ball FCBGA - same | 1152-pin HBGA - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| LABs | 21,248 | 21,248 | 21,248 | 21,248 | 21,248 | 21,248 |
| Embedded Memory | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits |
| User I/Os | 880 | 880 | 880 | 880 | 880 | Reduced (HBGA package) |
| Temperature Grade | Industrial 0C to 85C | Industrial | Industrial | Commercial 0C to 85C | Commercial 0C to 85C | Industrial |
| Speed Grade | I4 (fast) | I4 | I3 | C4 | C3 | I4 |
주요 차별점
- Highest-density Stratix IV GX device in 1760-ball FCBGA (vs EP4SGX360KF43I4N)
- Highest user I/O count available in Stratix IV GX KF43 package (vs EP4SGX530HH35I4N)
- N-RND status with limited authorized distributor stock (vs EP4SGX530KF43I4 (without N))
설계 노트
Estimated: at 0.9 V core voltage and full utilization (80% logic toggle rate), the EP4SGX530KF43I4N dissipates approximately 18-25 W. With the 1760-ball FCBGA package thermal resistance theta_JA typically around 0.4 C/W when mounted on a multi-layer board with thermal vias, junction temperature rise is approximately 7-10 C above ambient at 25 W. A heatsink with 200 LFM forced airflow is recommended; without it, junction temperature can exceed 100 C at industrial ambient. Always run the Quartus II PowerPlay Power Analyzer for design-specific estimates.
The 1760-ball FCBGA at 1.00 mm ball pitch requires a PCB stack-up with laser-drilled microvias and at least 6 layers for signal routing plus dedicated power and ground planes. Decoupling requires high-frequency 0402 ceramic capacitors placed within 200 mils of every supply pin, plus bulk polymer or tantalum capacitors on each power rail. Use Intel's Stratix IV GX pin connection guidelines to assign bank voltages and reference voltage pins for high-speed transceivers, which require isolated analog supply planes.
Multi-gigabit transceiver channels operate at up to 8.5 Gbps and require careful PCB routing with controlled impedance (100 ohm differential for most protocols, 85 ohm for PCIe). Matched-length routing within 0.127 mm tolerance and AC-coupled coupling capacitors (typically 100 nF) at transmitter outputs are mandatory. Series coupling capacitors must use X7R dielectric with 0402 or 0201 case size to minimize stub effects. Reference the Stratix IV GX Transceiver User Guide for protocol-specific PCB layout requirements.
Estimated: power sequencing is critical - the Stratix IV GX requires VCCINT, VCCAUX, VCCPD, and bank I/O voltages to ramp in a specific order; failure to follow the sequence can cause permanent damage to the device. The MSEL pins must be configured to the correct AS or JTAG configuration mode at power-up; incorrect settings cause configuration failure. Always validate the configuration scheme with the Quartus II Programmer before final board bring-up.
규정 준수 정보
RoHS and lead-free compliance confirmed per Intel/Altera product page. AEC-Q100 not applicable for this FPGA category. Halogen-free status not specified in available data.
