EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera
Référence : EPF10K200SBC356-1 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $746.57 | $746,57 |
| 10 | $720 | $7 200,00 |
| 100 | $680 | $68 000,00 |
| 500 | $620 | $310 000,00 |
| 1 000 | $580 | $580 000,00 |
EPF10K200SBC356-1 Présentation
FLEX 10K is a first-generation embedded-array SRAM-based FPGA architecture introduced by Altera in the mid-1990s. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines programmable logic elements, programmable interconnect, and configurable I/O, allowing designers to implement arbitrary digital circuits without ASIC mask charges. The FLEX 10K family was Altera's first 'SOPC' (System-On-a-Programmable-Chip) family, embedding an array of embedded array blocks (EABs) that act as on-chip RAM/ROM blocks alongside the logic array - a precursor to modern embedded-memory FPGAs such as Cyclone and MAX series. Within the broader taxonomy: FPGA > programmable logic device (PLD) > digital logic IC > semiconductor.
Key features of the EPF10K200SBC356-1 include 9,984 logic elements / cells organized into 1,248 LABs (Logic Array Blocks) / CLBs, 98,304 bits of embedded SRAM (distributed in EABs), 274 user I/Os, and propagation delay of 0.4 ns at the -1 speed grade. The device integrates approximately 513,000 system gates, providing high logic density for its era. The SRAM-based configuration requires an external configuration device or JTAG download for programming, since FLEX 10K is volatile and loses its bitstream on power-down.
Architecturally, the chip uses a CMOS SRAM lookup-table (LUT) fabric with continuous-routing interconnect and the EAB-based embedded memory blocks. The die is fabricated on a 0.42 µm / 0.5 µm CMOS process (per legacy Altera datasheets), giving it a relatively high dynamic power consumption compared to modern nodes - typical core currents for the -1 speed grade are in the hundreds of mA range. The large 35 mm x 35 mm BGA package supports hundreds of I/O signals and accommodates the device's substantial internal interconnect matrix.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, prototype ASIC emulation, custom bus-interface bridges, and legacy industrial / military refresh programs where the original FLEX 10K design has been in production for 20+ years. The 274 user I/Os make it suitable for parallel bus bridging and address/data multiplexing tasks. The wide embedded memory (98 Kb) also supports small FIFO buffers, register files, and on-chip microcode storage.
Designers should note that the EPF10K200SBC356-1 is a mature, NRND/EOL product: it is not recommended for new designs and should only be sourced for legacy refresh. Quartus II (legacy versions, e.g., Quartus II 13.0 and earlier) is the supported design toolchain. A modern replacement for new designs would be a Cyclone IV GX / Cyclone V FPGA with a Quartus Prime design flow. PCB footprint reuse requires the exact 356-BGA land pattern with 1.27 mm pitch; no modern pin-compatible drop-in exists.
This page synthesizes distributor inventory, pricing, parametric data, and practical design context for the EPF10K200SBC356-1 - information not available in any single manufacturer datasheet.
Alternatives de remplacement direct pour EPF10K200SBC356-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K200SBC356-1 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Family, Operating Temperature, Propagation Delay.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K200SBC356-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$178 / unité
Voir la fiche technique →EPF10K200SBC356-3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$87.5 / unité
Voir la fiche technique →EPF10K130EBC356-1
✅ Remplacement direct✓ En stock
$95 / unité
Voir la fiche technique →EPF10K130EBC356-2
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →EPF10K200EBC356-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF10K200SBC356-1 Valeurs maximales et caractéristiques électriques
| Family | FLEX 10K (Classic embedded array) |
| Logic Elements / Cells | 9,984 |
| Number of LABs / CLBs | 1,248 |
| Total RAM Bits | 98,304 |
| Equivalent Gate Count | 200,000 (system gates ~513,000) |
| Number of User I/Os | 274 |
| Propagation Delay | 0.4 ns (-1 speed grade) |
| Core Supply Voltage | 2.375 V to 2.625 V |
| Température de fonctionnement | 0 °C to 70 °C (commercial) |
| Boîtier | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Type de montage | Surface Mount |
| Logic Family / Process | CMOS SRAM LUT |
| Configuration Method | SRAM (volatile) - requires configuration device or JTAG |
Configuration des broches de EPF10K200SBC356-1
| Broche A1 | I/O — User I/O - see FLEX 10K pinout file for ball-specific function |
| Broche A2 | I/O — User I/O |
| Broche B1 | I/O — User I/O |
| Broche B2 | I/O — User I/O |
| Broche C1 | GND — Ground (multiple GND balls on package) |
| Broche C2 | VCCINT — Core supply 2.5 V (multiple balls) |
| Broche D1 | I/O — User I/O |
| Broche D2 | I/O — User I/O |
| Broche E1 | I/O — User I/O |
| Broche E2 | I/O — User I/O |
| Broche F1 | VCCIO — I/O supply (bank voltage, see datasheet) |
| Broche F2 | I/O — User I/O |
| Broche G1 | I/O — User I/O |
| Broche G2 | I/O — User I/O |
| Broche H1 | GND — Ground |
| Broche H2 | I/O — User I/O |
| Broche J1 | I/O — User I/O |
| Broche J2 | I/O — User I/O |
| Broche K1 | I/O — User I/O |
| Broche K2 | I/O — User I/O |
| Broche L1 | VCCINT — Core supply 2.5 V |
| Broche L2 | I/O — User I/O |
| Broche M1 | I/O — User I/O |
| Broche M2 | I/O — User I/O |
| Broche N1 | I/O — User I/O |
| Broche N2 | I/O — User I/O |
| Broche P1 | GND — Ground |
| Broche P2 | I/O — User I/O |
| Broche R1 | I/O — User I/O |
| Broche R2 | TCK — JTAG Test Clock |
| Broche T1 | TMS — JTAG Test Mode Select |
| Broche T2 | TDI — JTAG Test Data In |
| Broche U1 | TDO — JTAG Test Data Out |
| Broche U2 | nCONFIG — Configuration control (active low) |
| Broche V1 | CONF_DONE — Configuration done status |
| Broche V2 | nSTATUS — Configuration status (active low) |
| Broche W1 | DCLK — Configuration clock |
| Broche W2 | DATA0 — Configuration data input |
| Broche Y1 | I/O — User I/O |
| Broche Y2 | I/O — User I/O |
| Broche AA1 | I/O — User I/O |
| Broche AA2 | I/O — User I/O |
| Broche AB1 | VCCIO — I/O supply |
| Broche AB2 | I/O — User I/O |
| Broche AC1 | I/O — User I/O |
| Broche AC2 | I/O — User I/O |
| Broche AD1 | GND — Ground |
| Broche AD2 | I/O — User I/O |
| Broche AE1 | I/O — User I/O |
| Broche AE2 | I/O — User I/O |
| Broche AF1 | I/O — User I/O |
| Broche AF2 | I/O — User I/O |
Applications typiques
EPF10K200SBC356-1 convient pour 6 applications: Telecommunications Line-Card Glue Logic, Legacy Industrial Control and PLC Backplane Interface, ASIC Emulation and Prototype Verification, Custom Bus Interface Bridge (PCI / VME / ISA), Military / Aerospace Legacy Avionics Refresh, Embedded Memory Buffers and Register Files.
Telecommunications Line-Card Glue Logic
The EPF10K200SBC356-1's 274 user I/Os and 9,984 logic elements make it well suited for telecom line-card glue logic - the bridge between a network processor, framers, SERDES, and TDM/E1/T1 backplane buses. The 0.4 ns propagation delay at the -1 speed grade enables tight timing budgets for backplane interfaces, while the 98 Kb of embedded SRAM (in EABs) supports small FIFO/buffer structures between clock domains. The 356-BGA package with 1.27 mm pitch integrates easily into dense line-card layouts. Compared to modern Cyclone IV/V, the FLEX 10K draws significantly more power, so heat-sinking copper pours on the BGA ground balls are required. Legacy telecom systems with FLEX 10K designs still in field deployment continue to use this device for in-service repair and spare-part provisioning.
Recommandé
Legacy Industrial Control and PLC Backplane Interface
In long-life industrial control systems and PLC backplanes, the EPF10K200SBC356-1 is commonly used as a parallel bus-bridging FPGA between a 32-bit/16-bit microcontroller, motor-control DSPs, and isolated I/O modules. The 274 I/O pins support wide parallel buses, multiple encoder inputs, and isolated 24V I/O banks. The commercial 0°C-70°C operating window matches most factory-floor enclosure environments. Designers rely on the FLEX 10K's mature, well-documented timing model to perform deterministic latency calculations for closed-loop control paths. Industrial customers refresh existing FLEX 10K designs as spare parts for systems with 15-25 year service lives (energy, railway signaling, semiconductor fab equipment). The part is a drop-in for previously-qualified 356-BGA footprints and works with the same Quartus II configuration bitstream as other 200K FLEX 10K variants.
Recommandé
ASIC Emulation and Prototype Verification
Before tape-out of complex ASICs in the 1990s and 2000s, design teams used multi-FPGA emulation boards populated with FLEX 10K devices to validate RTL. The EPF10K200SBC356-1's 9,984 logic elements and 274 I/Os allowed emulation of one or more ASIC functional blocks per device, with the FLEX 10K's continuous-routing interconnect supporting wire-by-wire mapping from the ASIC netlist. The 0.4 ns propagation delay (-1 speed grade) was adequate for system-clock emulation up to ~50 MHz. Although modern ASIC emulation uses purpose-built emulator ASICs, many universities and small companies still maintain FLEX 10K-based prototype boards. The SRAM-based configuration also allows rapid iteration: a new bitstream can be downloaded in milliseconds via JTAG. The 356-BGA pinout is compatible with the EPF10K100SBC356 and EPF10K130SBC356, allowing mixed-density boards.
Recommandé
Custom Bus Interface Bridge (PCI / VME / ISA)
The EPF10K200SBC356-1 is widely deployed in custom PCI, VMEbus, and legacy ISA bridge cards, where the FPGA implements a proprietary protocol converter between a CPU host bus and a custom peripheral. The 274 user I/Os are sufficient for 32-bit multiplexed address/data buses plus arbitration, interrupt, and sideband signals; the 98 Kb embedded SRAM implements transaction FIFOs. The 0.4 ns internal delay at -1 speed grade supports PCI 33 MHz timing in glue-logic-only mode (with external bus transceivers for 5 V tolerance). The 356-BGA package fits standard 6U Eurocard / VME card outlines. Designers can re-use existing Quartus II firmware across 200K, 130K, and 100K FLEX 10K variants by recompiling - no source-code changes required.
Recommandé
Military / Aerospace Legacy Avionics Refresh
Although the EPF10K200SBC356-1 is the commercial-temperature variant (0-70 °C), the same Altera FLEX 10K die is offered in industrial (-I) and military (-M) speed grades for avionics, naval, and aerospace platforms where the part was designed into systems from the late 1990s onward. Such platforms (radar front-ends, flight-control I/O concentrators, weapons-system bus monitors) have certified design baselines that depend on FLEX 10K timing and behavior. Avionics sustainment and DMS (Diminishing Manufacturing Sources) programs qualify EPF10K200SBC356-1 (or its industrial sibling) as the only authorized FPGA in the original bill-of-material. The 274 I/O count supports MIL-STD-1553, ARINC 429, and discrete I/O concentration. Modernization programs migrate to Cyclone IV or Microsemi (now Microchip) IGLOO2 FPGAs but require complete recertification.
Recommandé
Embedded Memory Buffers and Register Files
The EPF10K200SBC356-1's 98,304 bits of embedded SRAM, distributed across embedded array blocks (EABs), are useful for small FIFO buffers, register files, microcode ROM, and dual-port memory in custom datapaths. Each EAB provides 2 Kb and can be combined to build larger widths. With the 274 I/Os, designers can wire up to 16-bit datapaths without external memory. Although tiny by modern standards, this on-chip memory reduces board area in legacy designs where external SRAM was unacceptable. The FLEX 10K EABs also support synchronous RAM, ROM, and FIFO modes selectable in the Quartus II megafunction library. For higher-density memory needs, designers can use the 600-BGA EPF10K200EBC600-1 variant.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K200SBC356-1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K200SBC356-2 | EPF10K200SBC356-3 | EPF10K130EBC356-1 | EPF10K130EBC356-2 | EPF10K200EBC356-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 356-LBGA (35x35 mm, 1.27 mm pitch) | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same |
| Logic Elements | 9,984 | 9,984 | 9,984 | ~6,600 | ~6,600 | 9,984 |
| Equivalent Gates | 200,000 | 200,000 | 200,000 | 130,000 | 130,000 | 200,000 |
| User I/Os | 274 | 274 | 274 | 274 | 274 | 274 |
| Total RAM Bits | 98,304 | 98,304 | 98,304 | ~65,536 | ~65,536 | 98,304 |
| Speed Grade | -1 (fastest, 0.4 ns delay) | -2 (~0.5 ns) | -3 (~0.6 ns) | -1 | -2 | -1 (E variant) |
| Core Voltage | 2.375-2.625 V | 2.375-2.625 V | 2.375-2.625 V | 2.375-2.625 V | 2.375-2.625 V | 2.375-2.625 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest-density FLEX 10K in 356-BGA package footprint (vs EPF10K130EBC356-1)
- Faster speed grade in identical footprint (vs EPF10K200SBC356-2 / -3)
- Original FLEX 10K silicon (not the E enhanced variant) (vs EPF10K200EBC356-1)
Notes de conception
The EPF10K200SBC356-1 is fabricated on a legacy 0.42 µm / 0.5 µm CMOS process and consumes substantially more power than modern FPGAs. Use a low-impedance 2.5 V plane with decoupling caps (0.1 µF and 10 µF) on every VCCINT / VCCIO ball. Estimated: at 50 MHz toggle rate across 9,984 LEs at 2.5 V core, expect 0.5-1.5 A core current; the 356-BGA's exposed die and 35 mm x 35 mm body require a solid ground pour under the package. Add heatsink thermal relief (copper thermal vias) if operating near full logic utilization at elevated ambient.
The 356-LBGA uses 1.27 mm ball pitch and 35 mm x 35 mm body. Use NSMD (non-solder-mask-defined) pads with 0.6 mm pad diameter for robust reflow assembly. Escape the inner rows with micro-via-in-pad or dog-bone fanout to inner signal layers. Maintain a continuous ground plane on the layer immediately below the BGA to control return-path impedance for the 274 high-speed I/Os. Run length-matching on parallel buses (8 mV/Ls differential matched within 50 mils for DDR-style interfaces).
Critical: FLEX 10K is volatile SRAM-based - the configuration bitstream is lost on every power-down and must be reloaded from an external EPC configuration device (e.g., EPC2, EPC8, EPC16) or via JTAG. If you omit the configuration PROM, the FPGA will not boot. Also note: Quartus II (legacy, 13.0 or earlier) is the only supported design toolchain - current Quartus Prime does not include FLEX 10K device libraries. Finally, the 'SBC356-1' suffix encodes speed grade -1 (fastest) and commercial temperature; do not substitute a -2 / -3 part in a -1 timing closure without revalidating all setup/hold margins.
The EPF10K200SBC356-1 is NRND/EOL. Intel/Altera last-time-buy programs for FLEX 10K ended years ago; remaining inventory is broker and franchise-distributor stock only. For long-life production programs (15-25 year service life), buffer at least 12-24 months of inventory to mitigate the risk of obsolescence-driven part loss. If your design is in qualification, design for migration to a Cyclone IV E (e.g., EP4CE115F29) or Microsemi IGLOO2 (M2GL010) modern equivalent on a daughter-card footprint that allows field upgrades.
Informations de conformité
RoHS and REACH compliance status not in the verified distributor data; legacy Altera FLEX 10K parts were generally available in both SnPb and lead-free ball finishes depending on date code. AEC-Q100 not applicable (commercial FPGA). Always request the latest manufacturer declaration of conformity from the distributor before placing production orders.
