EPF10K250EBC600-1 - 250K Gate FLEX 10KE FPGA | Intel | BGA-600
Référence : EPF10K250EBC600-1 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2 450,00 |
| 100 | $198.5 | $19 850,00 |
| 250 | $172 | $43 000,00 |
| 500 | $155 | $77 500,00 |
EPF10K250EBC600-1 Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit at the top of the programmable logic hierarchy - more flexible than CPLDs and more integration-dense than discrete glue logic. The FLEX 10KE family belongs to the legacy Altera SRAM-based architecture now owned by Intel's Programmable Solutions Group, bridging classic look-up-table (LUT) logic blocks with on-chip embedded array blocks (EABs) used as RAM, ROM, or multiplier functions.
Key features of the EPF10K250EBC600-1 include 250K typical gates (110K usable gates), 40,960 RAM bits distributed across EABs, 6 PLLs for clock management, and MultiVolt I/O supporting 3.3V/5.0V interfacing. The 600-ball BGA package provides high I/O density suitable for data-path, telecom, and DSP-prototype designs. The device is in-system programmable via JTAG, supports ByteBlaster configuration, and includes built-in boundary-scan.
The FLEX 10KE architecture uses a continuous interconnect fabric with each logic element containing a 4-input LUT, programmable register, and dedicated carry chain. Six EABs provide up to 40,960 bits of dual-port RAM - sufficient for FIFO buffers, register files, and coefficient storage in FIR filters. PLLs generate up to six derived clocks from a single reference, simplifying timing closure.
Typical applications include telecommunications line cards, industrial control ASIC prototyping, DSP algorithm acceleration, and legacy MMI replacement for end-of-life fixed-logic ICs. Engineers commonly pair the EPF10K250EBC600-1 with SRAM, Flash PROM (EPC2/EPC8) for boot memory, and LVDS/TTL interface devices.
When designing with this part, mind the 5V core supply requirement - it cannot use modern 1.2V-3.3V rails without discrete LDO regulators. The BGA package requires X-ray or BGA rework for prototyping, and board designers should allocate dedicated ground and VCCIO planes.
This page synthesizes distributor stock levels, parametric alternatives, and design notes not aggregated on individual distributor listings.
Alternatives de remplacement direct pour EPF10K250EBC600-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K250EBC600-1 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Embedded Array Blocks (EABs), Speed Grade, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K250EBC600-2
✅ Remplacement direct✓ En stock
$392 / unité
Voir la fiche technique →EPF10K250EBC600-3
✅ Remplacement direct✓ En stock
$205 / unité
Voir la fiche technique →EPF10K250EBI600-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF10K250EBI600-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF10K250EQC240-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF10K250EBC600-1 Valeurs maximales et caractéristiques électriques
| Manufacturer | Intel / Altera |
| Family | FLEX 10KE |
| Logic Elements | 12,160 |
| Typical Gates | 250,000 |
| Usable Gates | 110,000 |
| Embedded Array Blocks (EABs) | 6 |
| Maximum RAM Bits | 40,960 |
| Number of PLLs | 6 |
| Core Voltage | 5.0 V |
| Température de fonctionnement | 0°C to +70°C (Commercial) |
| Process Technology | 0.22 µm SRAM |
| Boîtier | 600-BGA FineLine BGA |
| Speed Grade | -1 |
| Configuration Method | JTAG / ByteBlaster / EPC-series PROM |
| Programmable I/O Voltage | 3.3 V / 5.0 V (MultiVolt I/O) |
Guide de configuration des broches du EPF10K250EBC600-1 600-bga fineline bga
Configuration des broches du EPF10K250EBC600-1 (boîtier 600-bga fineline bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPF10K250EBC600-1.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPF10K250EBC600-1 convient pour 6 applications: Telecom Line Card Interface Logic, Industrial ASIC Prototyping, DSP Algorithm Acceleration, Bridge / Glue Logic Replacement, Legacy Avionics Display Controller, Test & Measurement Instrumentation Backplane.
Telecom Line Card Interface Logic
Replaces legacy TTL/CMOS gate arrays on E1/T1 and SDH/SONET line cards where 250K gates of state-machine logic implement framing, channel-association, and HDLC controllers. The EPF10K250EBC600-1's 6 EABs deliver 40,960 RAM bits - sufficient for 16-byte look-up tables, framing pattern generators, and small receive FIFOs at STS-1/STM-0 rates. The 6 PLLs provide independent clocks for the receive, transmit, and backplane domains, eliminating external clock-buffer chips. Compared to ASIC redesign, this FLEX 10KE FPGA allows in-system JTAG updates to fix framing bugs found during field deployment.
Recommandé
Industrial ASIC Prototyping
Acts as a vehicle to validate gate-level netlists destined for mask-programmed ASICs in factory-automation controllers. The 250K usable gates on the EPF10K250EBC600-1 closely emulate ASIC density, while JTAG-based in-system programming cuts prototype iteration from weeks to hours. MultiVolt I/O supports 3.3V peripheral buses and 5V legacy opto-isolated I/O in the same design. Designers map ASIC scan chains directly to the FLEX 10KE JTAG boundary-scan pins, easing transition to production silicon.
Recommandé
DSP Algorithm Acceleration
Implements parallel FIR/IIR filters, FFT butterfly networks, and adaptive equalizers on the FLEX 10KE's LUT fabric. The 6 embedded EABs configure as coefficient ROM for 16-bit x 16-bit multipliers, eliminating external multiplier ICs. With the -1 speed grade, multiply-accumulate loops run up to ~80 MHz; upgrading to -2 or -3 lifts Fmax above 120 MHz. The 250K-gate density comfortably holds 256-tap FIR filters and 1024-point FFT datapaths for SDR baseband designs.
Recommandé
Bridge / Glue Logic Replacement
Consolidates 30-50 discrete 74-series TTL chips into a single FLEX 10KE to free board area and reduce BOM cost on legacy backplane designs. Each logic element replaces roughly 5-8 SSI gates, so 250K gates absorb hundreds of address-decoders, bus transceivers, and parity generators. The 5V-tolerant MultiVolt I/O interfaces directly to legacy 74LS/74ALS/74F peripherals without level shifters. Production boards stay in service decades after discrete logic becomes obsolete.
Recommandé
Legacy Avionics Display Controller
Drives cockpit LCD/LED displays and performs raster timing generation on older aircraft instrument panels. The EPF10K250EBC600-1's 6 PLLs generate pixel clock, sync timing, and backlight PWM frequencies from a single reference. Industrial-temperature EPF10K250EBI600-2 should be specified for true avionics deployments to meet -40°C to +85°C thermal requirements. The 600-BGA footprint suits conduction-cooled chassis where high-density packages are mandatory.
Recommandé
Test & Measurement Instrumentation Backplane
Routes multi-channel ADC/DAC data streams inside benchtop instruments such as oscilloscopes and logic analyzers. The 250K gates on the EPF10K250EBC600-1 implement cross-point switches, trigger sequencers, and on-screen display controllers; the 40,960-bit EAB RAM holds sample-rate conversion buffers. JTAG configuration allows factory calibration firmware to be updated via test fixtures without opening the enclosure. The 5V-tolerant I/O mates with precision 16-bit ADCs of the same era without level translation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K250EBC600-1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K250EBC600-2 | EPF10K250EBC600-3 | EPF10K250EBI600-2 | EPF10K250EBI600-1 |
|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 600-BGA (FineLine) | 600-BGA (FineLine) - same | 600-BGA (FineLine) - same | 600-BGA (FineLine) - same | 600-BGA (FineLine) - same |
| Speed Grade | -1 (slowest) | -2 (medium) | -3 (fastest) | -2 (industrial temp) | -1 (industrial temp) |
| Operating Temperature | 0°C to +70°C (Commercial) | 0°C to +70°C (Commercial) | 0°C to +70°C (Commercial) | -40°C to +85°C (Industrial) | -40°C to +85°C (Industrial) |
| Typical Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Usable Gates | 110,000 | 110,000 | 110,000 | 110,000 | 110,000 |
| Logic Elements | 12,160 | 12,160 | 12,160 | 12,160 | 12,160 |
| Embedded Array Blocks (EABs) | 6 | 6 | 6 | 6 | 6 |
| RAM Bits | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Same die in a faster speed grade for higher Fmax (vs EPF10K250EBC600-2)
- Industrial-temperature variant for harsh environments (vs EPF10K250EBI600-2)
- Full EAB density preserved across all speed grades (vs EPF10K200SBC600-1)
Notes de conception
Estimated: The EPF10K250EBC600-1 has 12,160 LEs across multiple VCCINT (5.0V) and VCCIO (3.3V/5.0V) rails. From the FLEX 10KE datasheet Iccint is typically 0.5-1.5 A depending on toggle rate; Vccio adds another 0.2-0.5 A per bank. A 5V LDO rated for 3 A continuous (e.g., LM1084) should feed VCCINT through a 4-layer PCB with a dedicated ground plane, plus a 100 µF bulk + 10 µF ceramic decoupling network at each VCC pin pair.
The 600-BGA FineLine package has 1.27 mm pitch - manufacturer requires 4-layer minimum stack-up with 50 Ω controlled-impedance traces for clock and JTAG nets. BGA fanout uses dogbone via-in-pad not recommended; instead, escape between balls with micro-vias (0.2 mm) on a 6-layer stack-up. Always include a JTAG header footprint (10-pin 0.1-inch) for ByteBlasterMV.
Volatile configuration: the FLEX 10KE loads bitstream from external EPC2/EPC8/EPC16 PROM at every power-up. Designs that boot without a PROM attached will not enumerate on the JTAG chain. Connect nCONFIG and nSTATUS to the PROM device and add 10 kΩ pull-ups. Also mind the 5V VCCINT - the device cannot share rails with 1.8V/2.5V/3.3V logic families without level shifters.
Informations de conformité
Original FLEX 10KE datasheet predates RoHS/REACH documentation. Part is obsolete; consult Intel/PSG lifetime-buy documentation for current compliance statements. Not AEC-Q100 qualified - for automotive use, request industrial-temperature EPF10K250EBI600-2 variant.
