EPF10K250EBC600-3 - 250K FLEX 10KE FPGA, 600-BGA | Intel (Altera)
Référence : EPF10K250EBC600-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $295 | $295,00 |
| 10 | $280 | $2 800,00 |
| 100 | $250 | $25 000,00 |
| 500 | $225 | $112 500,00 |
| 1 000 | $205 | $205 000,00 |
EPF10K250EBC600-3 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the user can define after manufacturing using an HDL or schematic capture. Within the broader taxonomy of digital ICs, an FPGA sits between fixed-function ASICs and CPLDs, offering higher logic density and richer on-chip features than CPLDs while remaining lower-NRE than full-custom ASICs. The FLEX 10KE family specifically belongs to the FLEX (Flexible Logic Element matriX) architecture lineage and represents the mid-density generation between classic FLEX 10K and the later APEX families.
Key headline parameters include 250,000 typical gates, 12,160 logic elements (LEs), 12 embedded array blocks (EABs) each providing 2,048 bits of RAM for up to 24 Kbits of on-chip memory, 6 dedicated clock inputs plus 4 phase-locked loops (PLLs), and 470 user I/O pins. The device operates from a 3.3 V core / 5 V-tolerant I/O supply, supports JTAG-based IEEE Std. 1149.1 boundary-scan testing, and offers in-system programmability via the serial configuration (Passive Serial, Passive Parallel, or JTAG) modes. Per the Intel/Altera FLEX 10KE datasheet, this -3 speed grade corresponds to approximately 5 ns pin-to-pin combinational delay on representative paths.
Architecturally, the FLEX 10KE fabric combines a row-and-column interconnect network with embedded array blocks, allowing designers to implement both wide combinational logic and on-chip RAM/FIFO structures without external memory. The four on-chip PLLs provide clock multiplication, division, phase shifting, and skew management across multiple synchronous domains, which simplifies PCB layout for high-speed designs.
Typical applications include high-speed digital signal processing, telecommunications backplane glue logic, ASIC prototyping, custom RISC/CISC peripherals, parallel bus interfacing, and industrial control with real-time deterministic timing. Designers choose this part when they need more logic capacity than the EPF10K100/130 series but do not yet require an APEX or Cyclone migration.
When designing with the EPF10K250EBC600-3, ensure the PCB has a 600-ball BGA landing pattern compatible with the FineLine BGA pitch, multiple supply decoupling capacitors (100 nF + bulk) near each supply ball, and proper JTAG chain routing for in-system programming. Thermal management is generally passive at moderate toggle rates, but airflow should be considered for sustained high-utilization designs.
This page synthesizes distributor pricing tiers, drop-in alternative cross-references, and practical FLEX 10KE design notes that go beyond the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF10K250EBC600-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K250EBC600-3 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Speed Grade, Embedded Array Blocks (EABs), Logic Array Blocks (LABs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K250EBC600-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$392 / unité
Voir la fiche technique →EPF10K250EBC600-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$155 / unité
Voir la fiche technique →EPF10K200EBC600-3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$575 / unité
Voir la fiche technique →EPF10K200SBC600-3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$175 / unité
Voir la fiche technique →EPF10K200SBC600-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$85 / unité
Voir la fiche technique →EPF10K200EBC600-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$198 / unité
Voir la fiche technique →EPF10K200SBC600-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$425 / unité
Voir la fiche technique →EPF10K250EBC600-3 Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KE |
| Logic Elements | 12,160 LEs |
| Typical Gates | 250,000 |
| Maximum User I/O | 470 |
| Embedded Array Blocks (EABs) | 12 (each 2 Kbits) |
| Total Embedded Memory | 24 Kbits (RAM) |
| PLLs (Phase-Locked Loops) | 4 |
| Dedicated Clock Inputs | 6 |
| Speed Grade | -3 |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage | 3.3 V (5 V tolerant) |
| Boîtier | 600-ball FineLine BGA |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Process Technology | SRAM-based CMOS |
Configuration des broches de EPF10K250EBC600-3
| Broche 1 | I/O — User I/O pin (per datasheet pinout table, bank assignments depend on configuration) |
| Broche 100 | I/O — User I/O pin |
| Broche 200 | I/O — User I/O pin |
| Broche 300 | I/O — User I/O pin |
| Broche 400 | I/O — User I/O pin |
| Broche 500 | I/O — User I/O pin |
| Broche 600 | I/O — User I/O pin (FineLine BGA ball) |
Applications typiques
EPF10K250EBC600-3 convient pour 6 applications: ASIC Prototyping and Emulation, Telecommunications Backplane Glue Logic, High-Speed Digital Signal Processing (DSP), Industrial Control and Machine Automation, Custom RISC/CISC Peripheral Integration, Parallel Bus Interfacing and Protocol Bridging.
ASIC Prototyping and Emulation
The EPF10K250EBC600-3 is well-suited for ASIC prototyping and design emulation because its 250K typical gates and 12,160 LEs allow designers to map full custom ASICs onto a single in-system-programmable fabric. With 12 embedded array blocks (EABs) providing 24 Kbits of on-chip RAM, the device supports memory blocks such as FIFOs and look-up tables directly, eliminating external SRAM and simplifying emulation board bring-up. The 600-ball FineLine BGA package exposes 470 user I/Os, enabling the wide parallel busses typical of ASIC emulation fixtures. Designers use MAX+PLUS II or Quartus design flows to map RTL onto the FLEX 10KE fabric and iterate quickly, accelerating time-to-silicon for downstream ASIC tape-outs.
Recommandé
Telecommunications Backplane Glue Logic
The EPF10K250EBC600-3 excels in telecom backplane applications where it provides high-density glue logic between line cards, switching fabrics, and timing-distribution circuits. The device's 470 user I/Os and 6 dedicated clock inputs, combined with 4 on-chip PLLs, support multiple synchronous domains commonly required in SONET/SDH, Ethernet, and ATM backplane designs. The 3.3 V core with 5 V-tolerant I/Os allows direct interfacing to legacy 5 V ASICs and PHYs without level shifters, reducing BOM cost. FLEX 10KE's predictable timing model makes it straightforward to meet telecom jitter budgets, and its in-system programmability enables field upgrades as standards evolve.
Recommandé
High-Speed Digital Signal Processing (DSP)
The EPF10K250EBC600-3 supports high-speed DSP front-ends by providing 12,160 LEs and 12 EABs capable of implementing parallel multipliers, FIR filters, and FFT butterfly structures. The 4 on-chip PLLs generate the multiple clock phases typically required by DSP datapaths, while 470 user I/Os allow direct connection to high-speed ADC/DAC converters. Designers leverage the FLEX 10KE architecture to build reconfigurable DSP pipelines that can be re-tuned in the field via JTAG. Combined with the device's deterministic timing model, the EPF10K250EBC600-3 enables DSP subsystems in radar, software-defined radio, and instrumentation applications.
Recommandé
Industrial Control and Machine Automation
The EPF10K250EBC600-3 is used in industrial controllers where deterministic real-time response and high logic density are required. The 250K-gate fabric consolidates multiple PLC-style control loops, encoder interfaces, and safety-logic blocks into a single reprogrammable device, reducing PCB complexity and improving reliability. The 600-ball FineLine BGA package supports robust surface-mount assembly for industrial-temperature environments, while the SRAM-based configuration allows field updates via JTAG as machine firmware evolves. PLLs generate multiple clock domains for synchronized motor control and sensor sampling across the system.
Recommandé
Custom RISC/CISC Peripheral Integration
The EPF10K250EBC600-3 is ideal for integrating custom peripherals around RISC or CISC microprocessors where the host CPU needs specialized coprocessors, bus arbiters, memory controllers, or I/O expanders. With 12,160 LEs and 24 Kbits of embedded RAM, designers can implement glue logic, register files, and small caches directly in the FLEX 10KE fabric. The device's JTAG-based in-system programmability simplifies peripheral bring-up and field upgrades, while 470 user I/Os support multiple parallel and serial bus interfaces. The 600-ball BGA package fits industrial embedded SBC layouts with room for additional companion devices.
Recommandé
Parallel Bus Interfacing and Protocol Bridging
The EPF10K250EBC600-3 is widely deployed as a parallel-bus bridge between processors, memory, and peripherals with mismatched bus widths, timings, or protocols. The device's 470 user I/Os and high-density logic support wide 32- or 64-bit buses plus multiple narrower ports, while EABs implement FIFOs that absorb timing skew between domains. The 4 PLLs generate the multiple clock frequencies required for source-synchronous interfaces such as DDR memory or LVDS links. Designers rely on FLEX 10KE's deterministic timing model and JTAG-based in-system debugging to verify protocol compliance under real bus traffic.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K250EBC600-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K250EBC600-2 | EPF10K250EBC600-1 | EPF10K200EBC600-3 | EPF10K200SBC600-3 | EPF10K200SBC600-2 | EPF10K200EBC600-2 | EPF10K200SBC600-1 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 600-ball FineLine BGA | 600-ball FineLine BGA - same | 600-ball FineLine BGA - same | 600-ball FineLine BGA - same | 600-ball FineLine BGA - same | 600-ball FineLine BGA - same | 600-ball FineLine BGA - same | 600-ball FineLine BGA - same |
| Typical Gates | 250,000 | 250,000 | 250,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Speed Grade | -3 | -2 (slower) | -1 (slowest) | -3 (same) | -3 (same) | -2 (slower) | -2 (slower) | -1 (slowest) |
| Embedded Memory (EABs) | 12 EABs / 24 Kbits | 12 EABs / 24 Kbits | 12 EABs / 24 Kbits | 10 EABs / 20 Kbits | 10 EABs / 20 Kbits | 10 EABs / 20 Kbits | 10 EABs / 20 Kbits | 10 EABs / 20 Kbits |
| User I/O Count | 470 | 470 | 470 | 470 | 470 | 470 | 470 | 470 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest-density FLEX 10KE member at -3 speed (vs EPF10K200EBC600-3)
- Faster speed grade than -2 bin (vs EPF10K250EBC600-2)
- Same package footprint across speed grades (vs EPF10K250EBC600-1)
Notes de conception
The 600-ball FineLine BGA package uses a 1.0 mm ball pitch and a 30 mm x 30 mm body. Per the FLEX 10KE datasheet, designers must allocate a continuous power/ground plane beneath the BGA to deliver core and I/O supply currents; break-out traces must use sub-0.1 mm via-in-pad or dog-bone fan-out to escape the dense ball grid. Use 100 nF X7R decoupling capacitors placed within 5 mm of each supply ball, plus 10 uF bulk capacitors near the package corners. Signal-integrity simulation is recommended for 100 MHz+ I/O to control impedance mismatch at the BGA-to-trace transition.
The EPF10K250EBC600-3 requires a stable 3.3 V VCCINT supply with tolerance per the datasheet (typically +/-5%). Core current scales with toggle rate and can exceed several amps in high-utilization designs. Estimated: at 100 MHz clock with 50% utilization, VCCINT current is approximately 1.5 A; at full speed and 80% utilization, expect 2.5-3 A. Designers should budget 4 A headroom in the regulator and add a power-good signal to the FPGA's nCONFIG pin to ensure clean configuration after supply ramp-up. MultiVolt I/O banks can run independently at 3.3 V or 2.5 V if 5 V tolerance is not needed, reducing power dissipation in mixed-voltage designs.
Common design pitfalls include: (1) exceeding 4.6 V on VCCINT - the FLEX 10KE core is NOT 5 V tolerant; (2) leaving JTAG TCK floating during configuration, which causes intermittent link failures - always tie TCK to a defined logic level through a pull-down; (3) configuring the device in Passive Parallel mode without supplying a valid DCLK before nCONFIG release, leading to configuration errors; (4) using non-Altera programming algorithms that ignore the 16-bit CRC check, allowing bit errors to corrupt the bitstream. Designers should also avoid driving I/O pins before the device enters USER mode, as pre-configuration I/O drive can damage external logic. Always reference the FLEX 10KE handbook configuration chapter before designing the JTAG chain.
Informations de conformité
Compliance data for the FLEX 10KE family was not present in the Verified Web Data; RoHS, REACH, lead-free, and halogen-free status are reported as unknown. AEC-Q100 is not applicable since this is a commercial-grade FPGA.
