EPF10K30AQC208-3N - 30K Gates FLEX 10KA FPGA, 208-PQFP | Intel / Altera
Référence : EPF10K30AQC208-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $26.8 | $2 680,00 |
| 500 | $22.45 | $11 225,00 |
| 1 000 | $19.1 | $19 100,00 |
EPF10K30AQC208-3N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic function is defined by user-loaded configuration memory rather than hard-wired mask layers. FPGAs sit in the programmable-logic hierarchy between simple Complex Programmable Logic Devices (CPLDs) and high-density Application-Specific Integrated Circuits (ASICs), giving engineers hardware-reconfigurable glue logic, datapath acceleration, and bus-interface bridging without any NRE charges. The FLEX 10KA family was Intel / Altera’s first generation to embed dedicated array blocks (EABs) for efficient RAM and DSP megafunctions, marking the transition from pure glue logic to System-on-a-Programmable-Chip (SOPC) integration.
Key features of the EPF10K30AQC208-3N include 216 Logic Array Blocks (LABs) organised in rows and columns, embedded array blocks for dual-port RAM and ROM, MultiVolt I/O allowing mixed-voltage interfacing on the same die, pin-controlled PCI-clamping diodes, slew-rate control, and open-drain output options. The PLICE antifuse-style configuration scheme is replaced here by an SRAM configuration cell, supporting in-system reconfigurability via the serial or parallel configuration port. The exposed MultiVolt interface simplifies bridging between 3.3 V cores and 5.0 V or 2.5 V peripherals.
Typical applications include PCI bus controllers, telecommunications line cards, industrial glue logic, protocol bridging (UART, I²C, SPI bridges), legacy ASIC replacement, and parallel DSP datapath prototyping. The combination of 12 Kbit embedded memory, 147 I/Os and 125 MHz Fmax makes it well-suited to mid-density control-plane designs where cost per gate dominates over raw performance.
When designing with this part, allocate the configuration PROM or microcontroller interface early in the schematic because FLEX 10KA devices do not retain their configuration when power is removed. The MultiVolt VCCIO rail must be tied before or simultaneously with VCCINT to avoid latch-up. Use the Quartus / MAX+PLUS II Legacy device libraries and observe the 208-PQFP thermal envelope (θJA ≈ 35 °C/W typical) when calculating airflow in dense line-card layouts.
This page synthesises distributor pricing, drop-in same-package alternatives and practical design notes that go beyond the marketing datasheet, so procurement engineers and FPGA designers can make a confident selection.
Alternatives de remplacement direct pour EPF10K30AQC208-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30AQC208-3N (même facteur de forme et même empreinte) — différant par Family, Process Technology, Package, Speed Grade, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30AQC208-3
✅ Remplacement direct✓ En stock
$15.4 / unité
Voir la fiche technique →EPF10K30AQC208-2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K30AQC208-1N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF10K30AQI208-3N
✅ Remplacement direct✓ En stock
$28.9 / unité
Voir la fiche technique →EPF10K10AQC208-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$49.9 / unité
Voir la fiche technique →EPF10K30AQC208-3N Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KA |
| Family | FLEX-10KA |
| Number of Logic Elements / Cells | 1728 |
| Total RAM Bits | 12288 bits |
| Number of Logic Array Blocks (LABs) | 216 |
| Number of Gates (typical) | 30000 |
| Number of I/O Pins | 147 |
| Supply Voltage Core (VCCINT) | 3.3 V |
| Technology / Process | 0.3 µm CMOS |
| Maximum Operating Frequency | 125 MHz |
| Boîtier / Format | 208-BFQFP (PQFP-208) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 °C to +70 °C (commercial) |
| Speed Grade | -3 |
| Configuration Method | SRAM-based, serial or parallel |
Configuration des broches de EPF10K30AQC208-3N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | VCCIO1 — I/O bank 1 supply voltage (MultiVolt) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | VCCINT — Core supply voltage (3.3 V) |
| Broche 16 | GND — Ground |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | I/O — User I/O pin (bank 1) |
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| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | I/O — User I/O pin (bank 1) |
| Broche 27 | I/O — User I/O pin (bank 1) |
| Broche 28 | I/O — User I/O pin (bank 1) |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | I/O — User I/O pin (bank 1) |
| Broche 34 | I/O — User I/O pin (bank 1) |
| Broche 35 | I/O — User I/O pin (bank 1) |
| Broche 36 | I/O — User I/O pin (bank 1) |
| Broche 37 | GND — Ground |
| Broche 38 | VCCINT — Core supply voltage (3.3 V) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | VCCIO2 — I/O bank 2 supply voltage (MultiVolt) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | I/O — User I/O pin (bank 2) |
| Broche 53 | I/O — User I/O pin (bank 2) |
| Broche 54 | I/O — User I/O pin (bank 2) |
| Broche 55 | I/O — User I/O pin (bank 2) |
| Broche 56 | I/O — User I/O pin (bank 2) |
| Broche 57 | I/O — User I/O pin (bank 2) |
| Broche 58 | I/O — User I/O pin (bank 2) |
| Broche 59 | I/O — User I/O pin (bank 2) |
| Broche 60 | I/O — User I/O pin (bank 2) |
| Broche 61 | I/O — User I/O pin (bank 2) |
| Broche 62 | I/O — User I/O pin (bank 2) |
| Broche 63 | I/O — User I/O pin (bank 2) |
| Broche 64 | I/O — User I/O pin (bank 2) |
| Broche 65 | I/O — User I/O pin (bank 2) |
| Broche 66 | I/O — User I/O pin (bank 2) |
| Broche 67 | I/O — User I/O pin (bank 2) |
| Broche 68 | I/O — User I/O pin (bank 2) |
| Broche 69 | GND — Ground |
| Broche 70 | VCCINT — Core supply voltage (3.3 V) |
| Broche 71 | I/O — User I/O pin (bank 3) |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | VCCIO3 — I/O bank 3 supply voltage (MultiVolt) |
| Broche 76 | I/O — User I/O pin (bank 3) |
| Broche 77 | I/O — User I/O pin (bank 3) |
| Broche 78 | I/O — User I/O pin (bank 3) |
| Broche 79 | I/O — User I/O pin (bank 3) |
| Broche 80 | I/O — User I/O pin (bank 3) |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | I/O — User I/O pin (bank 3) |
| Broche 83 | I/O — User I/O pin (bank 3) |
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| Broche 85 | I/O — User I/O pin (bank 3) |
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| Broche 87 | I/O — User I/O pin (bank 3) |
| Broche 88 | I/O — User I/O pin (bank 3) |
| Broche 89 | I/O — User I/O pin (bank 3) |
| Broche 90 | I/O — User I/O pin (bank 3) |
| Broche 91 | I/O — User I/O pin (bank 3) |
| Broche 92 | I/O — User I/O pin (bank 3) |
| Broche 93 | I/O — User I/O pin (bank 3) |
| Broche 94 | I/O — User I/O pin (bank 3) |
| Broche 95 | I/O — User I/O pin (bank 3) |
| Broche 96 | I/O — User I/O pin (bank 3) |
| Broche 97 | I/O — User I/O pin (bank 3) |
| Broche 98 | I/O — User I/O pin (bank 3) |
| Broche 99 | I/O — User I/O pin (bank 3) |
| Broche 100 | I/O — User I/O pin (bank 3) |
| Broche 101 | I/O — User I/O pin (bank 3) |
| Broche 102 | GND — Ground |
| Broche 103 | VCCINT — Core supply voltage (3.3 V) |
| Broche 104 | I/O — User I/O pin (bank 4) |
| Broche 105 | I/O — User I/O pin (bank 4) |
| Broche 106 | I/O — User I/O pin (bank 4) |
| Broche 107 | I/O — User I/O pin (bank 4) |
| Broche 108 | I/O — User I/O pin (bank 4) |
| Broche 109 | I/O — User I/O pin (bank 4) |
| Broche 110 | VCCIO4 — I/O bank 4 supply voltage (MultiVolt) |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | I/O — User I/O pin (bank 4) |
| Broche 114 | I/O — User I/O pin (bank 4) |
| Broche 115 | I/O — User I/O pin (bank 4) |
| Broche 116 | I/O — User I/O pin (bank 4) |
| Broche 117 | I/O — User I/O pin (bank 4) |
| Broche 118 | I/O — User I/O pin (bank 4) |
| Broche 119 | I/O — User I/O pin (bank 4) |
| Broche 120 | I/O — User I/O pin (bank 4) |
| Broche 121 | I/O — User I/O pin (bank 4) |
| Broche 122 | I/O — User I/O pin (bank 4) |
| Broche 123 | I/O — User I/O pin (bank 4) |
| Broche 124 | I/O — User I/O pin (bank 4) |
| Broche 125 | I/O — User I/O pin (bank 4) |
| Broche 126 | I/O — User I/O pin (bank 4) |
| Broche 127 | I/O — User I/O pin (bank 4) |
| Broche 128 | I/O — User I/O pin (bank 4) |
| Broche 129 | I/O — User I/O pin (bank 4) |
| Broche 130 | I/O — User I/O pin (bank 4) |
| Broche 131 | I/O — User I/O pin (bank 4) |
| Broche 132 | I/O — User I/O pin (bank 4) |
| Broche 133 | I/O — User I/O pin (bank 4) |
| Broche 134 | I/O — User I/O pin (bank 4) |
| Broche 135 | GND — Ground |
| Broche 136 | VCCINT — Core supply voltage (3.3 V) |
| Broche 137 | I/O — User I/O pin (bank 4) |
| Broche 138 | I/O — User I/O pin (bank 4) |
| Broche 139 | I/O — User I/O pin (bank 4) |
| Broche 140 | I/O — User I/O pin (bank 4) |
| Broche 141 | I/O — User I/O pin (bank 4) |
| Broche 142 | I/O — User I/O pin (bank 4) |
| Broche 143 | I/O — User I/O pin (bank 4) |
| Broche 144 | I/O — User I/O pin (bank 4) |
| Broche 145 | I/O — User I/O pin (bank 4) |
| Broche 146 | I/O — User I/O pin (bank 4) |
| Broche 147 | I/O — User I/O pin (bank 4) |
| Broche 148 | I/O — User I/O pin (bank 4) |
| Broche 149 | I/O — User I/O pin (bank 4) |
| Broche 150 | I/O — User I/O pin (bank 4) |
| Broche 151 | I/O — User I/O pin (bank 4) |
| Broche 152 | I/O — User I/O pin (bank 4) |
| Broche 153 | TDI — JTAG Test Data In |
| Broche 154 | TMS — JTAG Test Mode Select |
| Broche 155 | TCK — JTAG Test Clock |
| Broche 156 | nSTATUS — Configuration status (open-drain) |
| Broche 157 | nCONFIG — Configuration control (active-low) |
| Broche 158 | CONF_DONE — Configuration done (open-drain) |
| Broche 159 | DCLK — Configuration clock |
| Broche 160 | DATA0 — Configuration data input |
| Broche 161 | VCCINT — Core supply voltage (3.3 V) |
| Broche 162 | GND — Ground |
| Broche 163 | I/O — User I/O pin (bank 1) |
| Broche 164 | I/O — User I/O pin (bank 1) |
| Broche 165 | I/O — User I/O pin (bank 1) |
| Broche 166 | I/O — User I/O pin (bank 1) |
| Broche 167 | I/O — User I/O pin (bank 1) |
| Broche 168 | I/O — User I/O pin (bank 1) |
| Broche 169 | I/O — User I/O pin (bank 1) |
| Broche 170 | I/O — User I/O pin (bank 1) |
| Broche 171 | I/O — User I/O pin (bank 1) |
| Broche 172 | I/O — User I/O pin (bank 1) |
| Broche 173 | I/O — User I/O pin (bank 1) |
| Broche 174 | I/O — User I/O pin (bank 1) |
| Broche 175 | I/O — User I/O pin (bank 1) |
| Broche 176 | I/O — User I/O pin (bank 1) |
| Broche 177 | VCCIO1 — I/O bank 1 supply voltage (MultiVolt) |
| Broche 178 | I/O — User I/O pin (bank 1) |
| Broche 179 | I/O — User I/O pin (bank 1) |
| Broche 180 | I/O — User I/O pin (bank 1) |
| Broche 181 | I/O — User I/O pin (bank 1) |
| Broche 182 | I/O — User I/O pin (bank 1) |
| Broche 183 | I/O — User I/O pin (bank 1) |
| Broche 184 | I/O — User I/O pin (bank 1) |
| Broche 185 | I/O — User I/O pin (bank 1) |
| Broche 186 | I/O — User I/O pin (bank 1) |
| Broche 187 | I/O — User I/O pin (bank 1) |
| Broche 188 | I/O — User I/O pin (bank 1) |
| Broche 189 | I/O — User I/O pin (bank 1) |
| Broche 190 | I/O — User I/O pin (bank 1) |
| Broche 191 | I/O — User I/O pin (bank 1) |
| Broche 192 | I/O — User I/O pin (bank 1) |
| Broche 193 | I/O — User I/O pin (bank 1) |
| Broche 194 | I/O — User I/O pin (bank 1) |
| Broche 195 | I/O — User I/O pin (bank 1) |
| Broche 196 | I/O — User I/O pin (bank 1) |
| Broche 197 | GND — Ground |
| Broche 198 | VCCINT — Core supply voltage (3.3 V) |
| Broche 199 | I/O — User I/O pin (bank 2) |
| Broche 200 | I/O — User I/O pin (bank 2) |
| Broche 201 | I/O — User I/O pin (bank 2) |
| Broche 202 | I/O — User I/O pin (bank 2) |
| Broche 203 | TDO — JTAG Test Data Out |
| Broche 204 | I/O — User I/O pin (bank 2) |
| Broche 205 | I/O — User I/O pin (bank 2) |
| Broche 206 | VCCIO2 — I/O bank 2 supply voltage (MultiVolt) |
| Broche 207 | I/O — User I/O pin (bank 2) |
| Broche 208 | I/O — User I/O pin (bank 2) |
Applications typiques
EPF10K30AQC208-3N convient pour 6 applications: PCI Bus Interface Controller, Telecommunications Line Card Glue Logic, Industrial Control and Machine I/O Bridging, Legacy ASIC Replacement and Mask-Set Rescue, Parallel DSP Datapath Prototyping, Test & Measurement Front-End Logic.
PCI Bus Interface Controller
The EPF10K30AQC208-3N’s 30K gate capacity and 147 user I/Os are well matched to PCI 2.2 bus controllers and target/initiator bridges. With 125 MHz Fmax in the -3 speed grade, the device comfortably meets the 33 MHz PCI clock requirement while leaving room for state machines, FIFOs and sideband control logic. Designers typically implement the PAR/REQ/GNT logic, address decoding, and configuration-space registers inside the FPGA, then pair it with a 3.3 V 5 V-tolerant MultiVolt I/O bank to talk to legacy PCI slots. The on-chip 12,288-bit RAM is sufficient for small transaction FIFOs without resorting to external SRAM. The PQFP-208 footprint keeps the design retrofit-compatible with existing line-card layouts.
Recommandé
Telecommunications Line Card Glue Logic
Telecom line cards often need dozens of bus bridges, framer interfaces and timing-recovery glue, and the EPF10K30AQC208-3N is purpose-built for this role. Its 216 LABs and 1,728 logic elements provide enough capacity to bridge between T1/E1 framers, HDLC controllers and TDM backplanes, while the 147 I/Os let designers route wide parallel buses without external transceivers. The 125 MHz system clock supports 77.76 MHz STS-3 tributary rates with margin, and MultiVolt I/O enables direct interfacing to legacy 5 V framers alongside modern 3.3 V ASICs. The commercial temperature grade covers central-office deployments, while the EPF10K30AQI208-3N sibling covers outdoor enclosures.
Recommandé
Industrial Control and Machine I/O Bridging
Factory automation controllers frequently require a programmable bridge between PLC backplanes, sensor arrays and motor-drive front ends, and the EPF10K30AQC208-3N provides the right mix of I/O count and logic density. With 147 I/Os the device can fan out to dozens of 24 V opto-isolated inputs and PWM outputs while still implementing custom protocol stacks such as Modbus RTU, CANopen or EtherCAT slave logic. The 3.3 V core combined with MultiVolt I/O banks allows mixed interfacing with 5 V legacy sensors and 2.5 V modern MCUs. Engineers can prototype deterministic control loops on the FPGA fabric and migrate to a structured ASIC once volume justifies NRE.
Recommandé
Legacy ASIC Replacement and Mask-Set Rescue
When a mature ASIC goes end-of-life, the EPF10K30AQC208-3N is a proven drop-in replacement platform because its 30K gate capacity matches many 1990s-era gate-array designs. Engineers port the RTL to the FLEX 10KA fabric using MAX+PLUS II or Quartus legacy device libraries, then load the bitstream through the standard EPC configuration PROM chain. The 208-PQFP footprint aligns with the original ASIC land pattern on most legacy boards, eliminating expensive PCB rework. The 12 Kbit embedded RAM covers the FIFO and register-file needs of typical glue-logic ASICs, and the MultiVolt I/O eases migration from 5 V-only ASICs to mixed-voltage systems.
Recommandé
Parallel DSP Datapath Prototyping
Before committing to a structured ASIC, algorithm designers often prototype high-throughput DSP datapaths on FPGAs, and the EPF10K30AQC208-3N delivers adequate fabric and I/O bandwidth for filter and FFT pipelines up to a few MHz of sample rate. The 12,288 bits of distributed RAM provide coefficient storage for FIR filters, while the 1,728 logic elements are sufficient for 16-bit MAC arrays and address generators. At 125 MHz, the device sustains 250 MOPS for 16-bit fixed-point datapaths, suitable for audio, motor-control and instrumentation front ends. The MultiVolt I/O banks make it easy to interface to existing ADCs and DACs on the prototype board.
Recommandé
Test & Measurement Front-End Logic
Bench instruments such as logic analysers, protocol exercisers and production ATE fixtures use mid-density FPGAs to capture, multiplex and timestamp high-speed signals, and the EPF10K30AQC208-3N is a strong fit. Its 147 I/Os handle 32- or 48-channel acquisition buses, while the 125 MHz fabric implements state machines for trigger sequencing, pattern generation and pass/fail comparison. The MultiVolt I/O allows the same FPGA to interface to 1.8 V, 2.5 V, 3.3 V and 5 V targets without level shifters, simplifying fixture design. The 12 Kbit embedded RAM provides elastic buffer storage for asynchronous sample streams.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30AQC208-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30AQC208-3 | EPF10K30AQC208-2N | EPF10K30AQC208-1N | EPF10K30AQI208-3N | EPF10K10AQC208-3N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 208-PQFP (BFQFP) | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same |
| Logic Elements / Cells | 1728 | 1728 | 1728 | 1728 | 1728 | 576 (-67%) |
| Total Gates | 30K | 30K | 30K | 30K | 30K | 10K (-67%) |
| Speed Grade | -3 | -3 | -2 (slower) | -1 (slowest) | -3 | -3 |
| Operating Temperature | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | 0 C to +70 C (commercial) |
| Embedded RAM | 12288 bits | 12288 bits | 12288 bits | 12288 bits | 12288 bits | 4096 bits (-67%) |
| Lead-Free / Finish | Lead-free (N suffix) | SnPb finish (non-N) | Lead-free | Lead-free | Lead-free | Lead-free |
| User I/O Pins | 147 | 147 | 147 | 147 | 147 | 134 (-9%) |
Principaux différenciateurs
- Pb-free lead finish with full speed grade (vs EPF10K30AQC208-3)
- Highest commercial-temperature speed grade (vs EPF10K30AQC208-2N)
- Industrial temperature option in identical footprint (vs EPF10K30AQI208-3N)
- 2x logic density of the smaller EPF10K10A in same package (vs EPF10K10AQC208-3N)
Notes de conception
The EPF10K30AQC208-3N requires two supply rails: a 3.3 V VCCINT for the core logic and a separate VCCIO (per I/O bank) for the MultiVolt interface. According to the Altera FLEX 10KA datasheet, VCCIO must reach its operating level before or simultaneously with VCCINT during power-up to prevent the I/O buffers from back-powering the core through ESD diodes. Decouple each VCCINT pin with a 0.1 µF ceramic plus a 10 µF tantalum bulk cap, and place 0.1 µF ceramics on every VCCIO pin within 5 mm of the package.
Because FLEX 10KA devices are SRAM-based, they lose configuration when power is removed. A non-volatile configuration source (Altera EPC8QC100 serial PROM, parallel byte-wide flash, or a microcontroller) must be connected to the configuration interface (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0). For JTAG programming, tie TMS and TDI high through 10 kΩ pull-ups and use a JTAG header compatible with Altera ByteBlaster or USB-Blaster download cables.
Estimated: at maximum utilisation, the 208-PQFP package dissipates roughly 1.5-2.0 W. With a typical theta_JA of 35 °C/W on a 4-layer JEDEC test board, the junction rises 50-70 °C above ambient. For continuous full-load operation, provide at least 200 LFM of airflow or attach a clip-on heatsink on the package top. Avoid mounting the PQFP in a vertical orientation that traps heat under the leads.
Keep the configuration clock (DCLK) trace short and length-matched to within 25 mm of DATA0 to avoid setup/hold violations at 33 MHz configuration rates. Place the configuration PROM within 50 mm of the FPGA and route its outputs over a continuous ground reference. MultiVolt I/O banks should be grouped on the schematic so that VCCIO pins are tied to a single supply per bank, simplifying the PCB power plane cut-out.
Common pitfalls include (1) forgetting to pull nCONFIG high through 10 kΩ during normal operation, (2) mixing 5 V and 3.3 V signals on the same VCCIO bank, (3) using the non-N finish part on a RoHS-compliant board, and (4) trying to fit more than 147 I/Os in the user I/O budget. Designers should also enable the Quartus / MAX+PLUS II PCI-clamping-diode and slew-rate-control logic options on PCI pins to meet the PCI 2.2 AC specification.
Informations de conformité
The -N suffix indicates lead-free (Pb-free) matte-tin lead finish, RoHS-compliant. AEC-Q100 not applicable (commercial/industrial-grade FPGA, not automotive-qualified). Halogen-free status not explicitly stated in verified web data.