EPF10K30AQC208-1N - 30K Gate FLEX-10KA FPGA, 208-PQFP | Altera
Référence : EPF10K30AQC208-1N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.75 | $2 875,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $21.4 | $21 400,00 |
EPF10K30AQC208-1N Présentation
A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit in the programmable-logic hierarchy above PLDs/CPLDs and below fixed-function ASICs, and are widely used for glue logic, prototyping, DSP, and high-speed interface bridging. The FLEX 10KA family from Altera was the industry's first embedded programmable logic family providing System-on-a-Programmable-Chip (SOPC) integration through an embedded array block (EAB) architecture, allowing designers to mix dedicated RAM/ROM with LUT-based logic on a single die.
Key features of the EPF10K30AQC208-1N include 1,728 logic elements, 12 Kbits of embedded memory, 147 user I/Os, an internal frequency up to 80 MHz, and SRAM-based configuration that supports rapid prototyping and field updates. The '-1N' speed grade targets the commercial temperature range with standard timing closure. The 208-PQFP surface-mount package uses gull-wing leads, making it compatible with conventional SMT assembly lines and rework processes.
The FLEX 10KA architecture combines a coarse-grained Embedded Array Block (EAB) used to implement memory and complex arithmetic functions with a fine-grained Logic Array Block (LAB) used for general-purpose logic. The EPF10K30A places 6 EABs alongside 216 LABs on a 0.42 µm CMOS process, with each LAB containing 8 LEs. This hybrid fabric is efficient for datapath-heavy designs where distributed RAM and lookup tables coexist.
Typical applications for the EPF10K30AQC208-1N include telecom interface bridging, industrial control glue logic, legacy peripheral bus adaptation (PCI, ISA, VME), high-speed prototyping of ASIC replacements, and embedded memory buffering. Its 3.3 V core, 147 user I/Os, and SRAM programmability also make it attractive for educational platforms and FPGA training kits where the PQFP package simplifies hand-soldering.
Designers should plan a 3.3 V rail with adequate decoupling, route 147 user I/Os across four I/O banks with consistent bank voltage references, and select the correct configuration device (EPC2 or compatible) for SRAM configuration at power-up. Compared to modern flash-based FPGAs, the EPF10K30AQC208-1N requires an external configuration memory and is not 5 V tolerant on I/Os at the core's 3.3 V CMOS levels.
This page synthesizes distributor stock levels, cross-family FLEX 10KA drop-in options, application-specific companion parts, and practical design notes that go beyond what the original Altera datasheet provides alone.
Alternatives de remplacement direct pour EPF10K30AQC208-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30AQC208-1N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Family, Operating Temperature, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30AQC208-2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K30AQC208-1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K10AQC208-3N
✅ Remplacement direct✓ En stock
$49.9 / unité
Voir la fiche technique →EPF10K30AQC208-3N
✅ Remplacement direct✓ En stock
$19.1 / unité
Voir la fiche technique →EPF10K30AQC208-1N Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KA |
| Family | FLEX-10KA |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 12288 |
| Number of LABs | 216 |
| Number of EABs | 6 |
| User I/Os | 147 |
| Number of Gates (typical) | 30000 |
| Supply Voltage (Vccint) | 3.0 V to 3.6 V |
| Internal Frequency (max) | 80 MHz |
| Propagation Delay | 0.6 ns |
| Température de fonctionnement | 0 °C to 70 °C (commercial) |
| Type de montage | Surface Mount |
| Boîtier / Format | 208-BFQFP (208-PQFP, 28x28 mm) |
| Supplier Device Package | 208-PQFP (28x28) |
| Configuration | SRAM-based, requires external config device |
| Lead Form | Gull-wing |
| Statut RoHS | ROHS3 Compliant |
| Process Technology | 0.42 µm CMOS |
| Operating Voltage Grade | 3.3 V (Commercial 'C' grade) |
Configuration des broches de EPF10K30AQC208-1N
| Broche 1 | I/O — User I/O pin (bank-dependent) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
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| Broche 146 | I/O — User I/O pin |
| Broche 147 | I/O — User I/O pin |
| Broche 148 | VCCINT — Core supply 3.3 V (per FLEX 10KA datasheet) |
| Broche 149 | VCCIO — I/O supply reference |
| Broche 150 | GND — Ground |
| Broche 151 | I/O — User I/O pin |
| Broche 152 | I/O — User I/O pin |
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Applications typiques
EPF10K30AQC208-1N convient pour 6 applications: Telecom Interface Bridging, Industrial Control Glue Logic, Legacy Peripheral Bus Adaptation, ASIC Prototyping Platform, Embedded Memory Buffer / Datapath Engine, FPGA Education and Training Platforms.
Telecom Interface Bridging
The EPF10K30AQC208-1N's 1,728 logic elements and 147 user I/Os make it a good fit for telecom interface bridging applications where E1/T1 or legacy serial buses must be adapted to modern framers or backplane connectors. The 12 Kbits of embedded RAM, distributed across 6 EABs, are sufficient for small FIFO buffers used in rate-adaptation logic. With 80 MHz internal frequency and 0.6 ns propagation delay, the device meets the timing budget of TDM (time-division multiplexing) interfaces at 8.192 MHz and lower. Commercial 0 °C to 70 °C temperature grade matches typical indoor telecom-closet operating ranges. Designers typically pair the FPGA with an EPC2 or EPC4 configuration memory and place 33 Ω series-termination resistors on the 147 user I/Os to control edge rates.
Recommandé
Industrial Control Glue Logic
In industrial control systems, the EPF10K30AQC208-1N serves as flexible glue logic between microcontrollers, motor drivers, and sensor arrays. The 147 user I/Os distributed across multiple I/O banks handle parallel sensor buses and PWM lines, while 12 Kbits of embedded RAM implement lookup tables for sensor linearization and PID coefficients. The 208-PQFP package is friendly to conventional SMT assembly lines used in industrial PCBA. At 3.3 V supply, the device fits modern low-power industrial designs, but engineers should add external level-shifters when interfacing 5 V logic, because the EPF10K30AQC208-1N I/Os are not 5 V tolerant. The FLEX 10KA hybrid EAB+LAB architecture is well suited to combinational control logic mixed with small RAM-based state machines.
Recommandé
Legacy Peripheral Bus Adaptation
The EPF10K30AQC208-1N is widely deployed in legacy peripheral bus adapters that bridge ISA, VME, PCI, or PC/104 buses to modern peripheral chipsets. With 1,728 LEs and 12 Kbits of RAM, the device comfortably fits a 32-bit bus arbiter plus DMA state machine in a single FPGA. The 208-PQFP's 147 user I/Os provide enough pins for full 32-bit address and 32-bit data buses plus parity and sideband signals. The 0.6 ns propagation delay and 80 MHz fMAX support PCI 33 MHz clock-domain timing with margin. For long-lifecycle industrial retrofits, the commercial temperature grade and RoHS3 compliance of the 'N' suffix simplify inventory management. This role is increasingly common in industrial-automation retrofits where legacy controllers must connect to modern sensors.
Recommandé
ASIC Prototyping Platform
For ASIC prototyping in 2026, the EPF10K30AQC208-1N remains a useful FLEX 10KA target for designs originally architected for the 30K-gate class. The 1,728 logic elements and 6 EABs (12 Kbits of RAM) mirror the typical ASIC prototyping envelope of small glue-logic ASICs, allowing RTL verification on real hardware. Engineers use the 208-PQFP for easy probing and logic-analyzer attachment during bring-up. The SRAM-based configuration lets iterations complete in seconds via the Altera ByteBlaster or USB-Blaster programming chain. However, the 80 MHz fMAX ceiling is a constraint for very high-speed designs - in those cases engineers typically move to multiple FLEX 10KA devices or step up to a modern Cyclone IV prototype board.
Recommandé
Embedded Memory Buffer / Datapath Engine
The six EABs in the EPF10K30AQC208-1N total 12 Kbits of dual-port RAM that can be partitioned into independent FIFOs, lookup tables, or small CAM blocks. This makes the device a good fit as a dedicated embedded memory buffer or small datapath engine feeding a downstream DSP or microcontroller. At 80 MHz internal frequency, the EABs support synchronous FIFO depths up to 2 Kbits per block with full read/write clock-domain independence. The 147 user I/Os accommodate a 16-bit datapath plus control signals, while the 0.6 ns propagation delay ensures register-to-EAB timing closes at 80 MHz with margin. Designers typically use the FLEX 10KA architecture to consolidate what would otherwise be two SRAM chips plus a CPLD into a single FPGA.
Recommandé
FPGA Education and Training Platforms
The EPF10K30AQC208-1N's 208-PQFP package is hand-solder-friendly and well supported by low-cost Altera programming tools, making it a popular FPGA for university curricula and training kits. With 1,728 LEs and 147 user I/Os, students can implement meaningful projects ranging from 8-bit CPUs to UART controllers and VGA generators. The 0 °C to 70 °C commercial temperature range matches typical lab environments. Educational boards typically include an EPC2 or EPC4 configuration memory, a 50 MHz oscillator, push-buttons, LEDs, and a 7-segment display. While newer Cyclone IV boards offer more logic capacity, instructors continue to choose the EPF10K30AQC208-1N for courses where the historical FLEX 10KA toolchain and Verilog/VHDL examples are still part of the syllabus.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30AQC208-1N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30AQC208-2N | EPF10K30AQC208-1 | EPF10K10AQC208-3N | EPF10K30AQC208-3N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 208-PQFP (28x28) | 208-PQFP (28x28) - same | 208-PQFP (28x28) - same | 208-PQFP (28x28) - same | 208-PQFP (28x28) - same |
| Logic Elements | 1728 | 1728 | 1728 | 576 | 1728 |
| Total RAM Bits | 12288 | 12288 | 12288 | 4096 | 12288 |
| User I/Os | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -1 (0.6 ns) | -2 (~0.5 ns, faster) | -1 (same) | -3 (slower) | -3 (~0.7 ns, slower) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | 0 °C to 70 °C (commercial) | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C |
| RoHS Compliance | ROHS3 Compliant (lead-free) | ROHS3 Compliant | SnPb (non-RoHS) | ROHS3 Compliant | ROHS3 Compliant |
Principaux différenciateurs
- Lead-free RoHS3 compliance while maintaining full FLEX 10KA drop-in compatibility (vs EPF10K30AQC208-1)
- Standard -1 speed grade (0.6 ns propagation delay) balances cost and performance (vs EPF10K30AQC208-2N)
- Maximum logic capacity within the 208-PQFP FLEX 10KA footprint (vs EPF10K10AQC208-3N)
Notes de conception
EPF10K30AQC208-1N requires a clean 3.3 V ±10% supply on VCCINT pins. Place 100 nF ceramic decoupling capacitors as close as possible to each VCCINT/GND pair, with bulk 10 µF tantalum or polymer caps on each supply rail. During configuration the device draws surge currents up to ~300 mA; the EPC2 or EPC4 configuration memory should share the same 3.3 V rail. A power-on-reset circuit is recommended to keep nCONFIG held low until the rail stabilizes. Estimated steady-state core current at 80 MHz with 50% LE toggle is approximately 200 mA, plus I/O contribution proportional to switching frequency.
The 208-PQFP package requires a 28x28 mm land pattern with 0.5 mm pitch gull-wing leads. Use a 4-layer PCB with continuous power and ground planes directly under the device; via stitching every 5 mm around the perimeter suppresses EMI from the 147 I/Os. Keep all 147 user I/O traces short (< 50 mm) and add 22-33 Ω series termination on high-speed outputs to control edge rates. Configuration pins (DCLK, DATA, nCONFIG, nSTATUS, CONF_DONE) should be routed as short stubs to the EPC2/EPC4 configuration memory. Provide a JTAG header (TCK, TMS, TDI, TDO, TRST) for in-system programming via ByteBlaster or USB-Blaster.
Common pitfalls when designing with EPF10K30AQC208-1N: (1) I/Os are NOT 5 V tolerant at 3.3 V VCCIO - external level-shifters are required for 5 V buses; (2) configuration data is volatile and lost at power-down - external EPC2/EPC4 is mandatory; (3) the '-1N' suffix is lead-free only - legacy SnPb builds use EPF10K30AQC208-1; (4) JTAG chain must include the EPC configuration memory in series for in-system programming; (5) VCCIO bank voltages must match connected peripherals or use internal clamping. Estimated thermal dissipation at full activity is ~0.7 W, well within the PQFP package's ~50 °C/W θJA rating.
Informations de conformité
ROHS3 compliant per Microchip USA listing. Lead-free per 'N' suffix. Commercial temperature grade only - no AEC-Q100 automotive qualification. Reach and conflict-minerals status assumed compliant per Altera/Intel product declarations; halogen-free status not specified in available data.