EPF10K30EQI208-2N - 30K-Gate FLEX 10KE FPGA, 208-PQFP | Altera
Référence : EPF10K30EQI208-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2 890,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $20.75 | $20 750,00 |
EPF10K30EQI208-2N Présentation
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and configurable I/O cells, all controlled by bits stored in on-chip SRAM. FPGAs are used to implement arbitrary digital logic without the cost and lead-time of an ASIC. Within the broader semiconductor taxonomy, FPGAs sit under programmable logic devices (PLDs) alongside CPLDs, and historically represent the high-density end of that family - capable of holding entire processor subsystems, interface bridges, or DSP pipelines. The FLEX 10KE generation (circa late-1990s) was Altera's mainstream 2.5 V SRAM-based family before the Stratix/Cyclone families replaced it.
Key features of the EPF10K30EQI208-2N include up to 24,576 RAM bits distributed across embedded array blocks, an internal operating frequency around 200 MHz (process-dependent), an industrial temperature grade (-40 °C to +85 °C), and JTAG (IEEE Std 1149.1) boundary-scan support. The 208-pin PQFP exposes 147 user I/Os and supports common single-ended I/O standards of its era (LVTTL, LVCMOS, PCI). SameFrame pin-migration is documented for compatible FLEX 10KE devices in the same package, allowing designers to swap density variants without re-laying the PCB.
Typical applications for this device include industrial control and instrumentation, telecom line-card glue, legacy ASIC prototyping, motor and process control, and embedded DSP front-ends - particularly where existing FLEX 10KE firmware is being maintained or where a second-source-qualified footprint is required. Designers planning new designs are instead routed to the Cyclone or MAX families; this part is therefore of greatest interest on legacy platforms and EOL re-designs.
When designing with the EPF10K30EQI208-2N, note that JTAG and CONFIG_DONE pull-ups and a configuration device (EPC2/EPC4 or compatible) must be provided - the device is SRAM-based and reconfigures on every power-up. Observe the 2.5 V VCCINT supply requirement and provide adequate decoupling around the PQFP perimeter to keep simultaneous-switching-noise (SSN) under control.
This page synthesizes distributor stock and pricing, drop-in-compatible FLEX 10KE alternatives in the same 208-PQFP footprint, and practical design notes that go beyond what the bare datasheet provides - giving procurement, reliability, and design engineers a single decision-ready view of the part.
Alternatives de remplacement direct pour EPF10K30EQI208-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30EQI208-2N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Mounting Type, Propagation Delay.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30EQI208-2
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF10K30EQC208-3
✅ Remplacement direct✓ En stock
$26.1 / unité
Voir la fiche technique →EPF10K30EQC208-3N
✅ Remplacement direct✓ En stock
$49.1 / unité
Voir la fiche technique →EPF10K30EQC208-2N
✅ Remplacement direct✓ En stock
$19.75 / unité
Voir la fiche technique →EPF10K30EQC208-2
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPF10K30EQC208-1
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EPF10K30EQI208-2N Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KE |
| Logic Elements / Cells | 1,728 |
| Typical Gates | 30,000 |
| Maximum User I/Os | 147 |
| On-chip RAM Bits | 24,576 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage Standards | LVTTL, LVCMOS, PCI (per datasheet) |
| Internal Frequency (typical) | 200 MHz |
| JTAG Support | IEEE Std 1149.1 (boundary-scan) |
| Operating Temperature Grade | Industrial (-40 °C to +85 °C) |
| Boîtier | 208-pin BFQFP / PQFP (gull-wing) |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Per SKU suffix; check lot documentation |
| Statut du cycle de vie | Obsolete (last-time-buy exhausted at major distributors) |
| Configuration Device | External EPC2 / EPC4 series required |
Configuration des broches de EPF10K30EQI208-2N
| Broche 1 | I/O — User I/O - bank 1 |
| Broche 2 | I/O — User I/O - bank 1 |
| Broche 3 | VCCIO — I/O supply voltage |
| Broche 4 | I/O — User I/O - bank 1 |
| Broche 5 | I/O — User I/O - bank 1 |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O - bank 1 |
| Broche 8 | I/O — User I/O - bank 1 |
| Broche 9 | VCCINT — Core 2.5 V supply |
| Broche 10 | I/O — User I/O - bank 2 |
| Broche 11 | I/O — User I/O - bank 2 |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O - bank 2 |
| Broche 14 | I/O — User I/O - bank 2 |
| Broche 15 | TDI — JTAG test data in |
| Broche 16 | TMS — JTAG test mode select |
| Broche 17 | TCK — JTAG test clock |
| Broche 18 | nSTATUS — Configuration status (open-drain) |
| Broche 19 | nCONFIG — Configuration control (active-low) |
| Broche 20 | CONFIG_DONE — Configuration complete (open-drain) |
| Broche 21 | DCLK — Configuration clock (input from EPC) |
| Broche 22 | DATA0 — Configuration data bit 0 |
| Broche 23 | VCCINT — Core 2.5 V supply |
| Broche 24 | I/O — User I/O - bank 3 |
| Broche 25 | I/O — User I/O - bank 3 |
| Broche 26 | GND — Ground |
| Broche 27 | I/O — User I/O - bank 3 |
| Broche 28 | I/O — User I/O - bank 3 |
| Broche 29 | VCCIO — I/O supply voltage |
| Broche 30 | I/O — User I/O - bank 3 |
| Broche 31 | I/O — User I/O - bank 3 |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — User I/O - bank 4 |
| Broche 34 | I/O — User I/O - bank 4 |
| Broche 35 | VCCINT — Core 2.5 V supply |
| Broche 36 | I/O — User I/O - bank 4 |
| Broche 37 | I/O — User I/O - bank 4 |
| Broche 38 | GND — Ground |
| Broche 39 | I/O — User I/O - bank 4 |
| Broche 40 | I/O — User I/O - bank 4 |
| Broche 41 | VCCIO — I/O supply voltage |
| Broche 42 | I/O — User I/O - bank 5 |
| Broche 43 | I/O — User I/O - bank 5 |
| Broche 44 | GND — Ground |
| Broche 45 | I/O — User I/O - bank 5 |
| Broche 46 | I/O — User I/O - bank 5 |
| Broche 47 | VCCINT — Core 2.5 V supply |
| Broche 48 | I/O — User I/O - bank 5 |
| Broche 49 | I/O — User I/O - bank 5 |
| Broche 50 | GND — Ground |
| Broche 51 | TDO — JTAG test data out |
| Broche 52 | DEV_CLRn — Device clear (active-low) |
| Broche 53 | DEV_OE — Device output enable (active-high) |
| Broche 54 | I/O — User I/O - bank 6 |
| Broche 55 | I/O — User I/O - bank 6 |
| Broche 56 | VCCIO — I/O supply voltage |
| Broche 57 | I/O — User I/O - bank 6 |
| Broche 58 | I/O — User I/O - bank 6 |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O - bank 6 |
| Broche 61 | I/O — User I/O - bank 6 |
| Broche 62 | VCCINT — Core 2.5 V supply |
| Broche 63 | I/O — User I/O - bank 7 |
| Broche 64 | I/O — User I/O - bank 7 |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O - bank 7 |
| Broche 67 | I/O — User I/O - bank 7 |
| Broche 68 | VCCIO — I/O supply voltage |
| Broche 69 | I/O — User I/O - bank 7 |
| Broche 70 | I/O — User I/O - bank 7 |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O - bank 7 |
| Broche 73 | I/O — User I/O - bank 8 |
| Broche 74 | VCCINT — Core 2.5 V supply |
| Broche 75 | I/O — User I/O - bank 8 |
| Broche 76 | I/O — User I/O - bank 8 |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — User I/O - bank 8 |
| Broche 79 | I/O — User I/O - bank 8 |
| Broche 80 | VCCIO — I/O supply voltage |
| Broche 81 | I/O — User I/O - bank 8 |
| Broche 82 | I/O — User I/O - bank 8 |
| Broche 83 | GND — Ground |
| Broche 84 | I/O — User I/O - bank 8 |
| Broche 85-208 | I/O / VCCINT / VCCIO / GND — Remaining 124 pins alternate user I/Os and supplies per the 208-PQFP pin table in the FLEX 10KE datasheet |
Applications typiques
EPF10K30EQI208-2N convient pour 6 applications: Industrial Control & Process Automation, Telecom Line-Card Glue Logic, ASIC Prototyping & Emulation, Legacy DSP / Motor-Control Front-End, Military / Aerospace Retrofit (Legacy Only), Test & Measurement Instrumentation.
Industrial Control & Process Automation
The EPF10K30EQI208-2N is well suited to legacy industrial control backplanes where a 30K-gate fabric plus embedded EAB RAM is enough to implement glue logic, encoder counters, PID state machines, and Modbus / PROFIBUS interface bridges. Its 147 user I/Os absorb ample parallel field-bus signals, while the -40 °C to +85 °C industrial temperature grade handles cabinet and factory-floor environments. Designers integrating on existing FLEX 10KE firmware can reuse the Quartus II bitstream with no re-compile, and SameFrame pin migration allows upward scaling to EPF10K100E or EPF10K130E on the same PCB if logic grows.
Recommandé
Telecom Line-Card Glue Logic
The EPF10K30EQI208-2N was a common choice for telecom line-card glue - bus bridges, framing logic, and TDM time-slot switching. The 6 EABs deliver up to 24 Kb of synchronous RAM that can be carved into FIFOs for elastic buffers, while the 200 MHz internal fabric supports high-speed serial-parallel aggregation. The 2.5 V VCCINT and LVTTL/LVCMOS I/O align with the backplane logic levels of late-1990s / early-2000s central-office hardware. Same-die, same-footprint migration to EPF10K100EQI208-2N is supported by SameFrame pin compatibility.
Recommandé
ASIC Prototyping & Emulation
The EPF10K30EQI208-2N is still useful as a low-cost prototyping vehicle for legacy ASIC RTL, where 30K gates is enough to validate control paths and bus fabrics before committing to mask tooling. The Quartus II toolchain (now legacy) supports the part, and the 147 I/Os can be partitioned into clean emulation pads. Engineers prototyping mixed designs often chain multiple FLEX 10KE devices in JTAG mode to emulate multi-chip ASICs - the IEEE 1149.1 boundary-scan support on every E and A FLEX 10KE device makes this practical.
Recommandé
Legacy DSP / Motor-Control Front-End
The EPF10K30EQI208-2N fits motor-control front-ends where PWM generators, quadrature-decoder state machines, and encoder interfaces are implemented in fabric and pipelined into a downstream DSP. The 24 Kb of distributed EAB RAM supports small coefficient tables and look-up tables used in space-vector modulation, while the 200 MHz fabric comfortably absorbs the 50-200 kHz switching frequency of industrial drives multiplied by the per-edge logic depth. Industrial temperature grading suits closed-loop servo enclosures.
Recommandé
Military / Aerospace Retrofit (Legacy Only)
In retrofits of long-lifecycle aerospace and military systems, the EPF10K30EQI208-2N is sometimes still specified because the host platform's firmware and qualification artifacts are tied to the FLEX 10KE bitstream. The device's documented industrial operating range and proven long-term reliability in the field, combined with SameFrame pin migration across FLEX 10KE density points, allow the part to be used as a like-for-like replacement in obsolescence-management programs.
Recommandé
Test & Measurement Instrumentation
The EPF10K30EQI208-2N can serve as the timing-and-control fabric inside bench-top instruments - pattern generators, logic-analyzer pre-processors, and protocol exercisers. The 147 I/Os support parallel stimulus/response buses, while the 6 EABs allow per-channel buffering and timing-edge capture. The 200 MHz fabric supports pattern rates commonly required for legacy serial-bus stimulus. For new designs in test-and-measurement, however, modern Cyclone IV/V devices are preferred for cost and power reasons.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30EQI208-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30EQI208-2 | EPF10K30EQC208-3N | EPF10K30EQC208-2N |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-PQFP | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 |
| Temperature Grade | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) |
| Speed Grade | -2 | -2 | -3 (slower) | -2 |
| Lead Finish | Lead-free (N suffix) | Leaded | Lead-free (N suffix) | Lead-free (N suffix) |
| User I/Os | 147 | 147 | 147 | 147 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature grade (-40 to +85 C) versus commercial-grade same-footprint alternatives (vs EPF10K30EQC208-3N)
- Lead-free (Pb-free) terminal finish for RoHS-compliant assemblies (vs EPF10K30EQI208-2)
- Same-die, same-footprint backward compatibility with SameFrame pin migration (vs EPF10K100EQI208-2N)
Notes de conception
The EPF10K30EQI208-2N requires a clean 2.5 V ±5% rail on VCCINT and a separate VCCIO rail (3.3 V or 2.5 V per bank I/O standard). Place 0.1 µF + 10 µF decoupling pairs adjacent to every VCCINT and VCCIO pin and a single 47-100 µF bulk capacitor at the regulator output. Power-up sequencing: VCCINT must reach 2.5 V before or simultaneously with VCCIO to avoid I/O latch-up; both rails must stabilize within 100 ms to satisfy POR timing.
The 208-PQFP package has 0.5 mm pitch leads and a 28 mm × 28 mm body. Use a 4-layer PCB with a continuous ground plane under the device to control simultaneous-switching noise on the 147 I/Os. Route JTAG (TCK/TMS/TDI/TDO/nSTATUS/CONFIG_DONE) as a separate signal group with ground-shielded traces and 10 kΩ pull-ups on nSTATUS, nCONFIG and CONFIG_DONE.
The EPF10K30EQI208-2N is volatile - omitting the EPC2/EPC4 configuration EEPROM leaves the device unconfigured after every power-up. Pull nCONFIG high through 10 kΩ, route DCLK away from noisy I/O, and ensure the bitstream CRC check passes by selecting the Quartus II generated .sof/.pof that targets this exact device. Mixing bitstreams with different device IDs will fail configuration silently.
Informations de conformité
RoHS compliance inferred from the N suffix denoting lead-free terminal finish (per Altera ordering nomenclature). Halogen-free status not stated in available datasheets. Not AEC-Q100 qualified - this is a programmable logic device, not an automotive analog IC. Conflict-minerals compliance per Altera corporate policy.
