EPF10K30EQC208-2 - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
Référence : EPF10K30EQC208-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.75 | $2 175,00 |
| 250 | $19.4 | $4 850,00 |
| 500 | $17.85 | $8 925,00 |
EPF10K30EQC208-2 Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic. Within the broader taxonomy, the FLEX 10KE family belongs to the loadable PLD class, sitting between simple CPLDs (Complex Programmable Logic Devices) and high-density SRAM FPGAs; the 10KE series added embedded array blocks (EABs) for efficient memory and arithmetic functions, bridging the gap between glue-logic replacement and full-featured FPGA design.
Key differentiating specifications include 147 user I/O pins (sufficient for bus-oriented and parallel-interface glue logic), 216 logic array blocks (LABs), six embedded array blocks (EABs) totaling 24 Kbits of RAM, and a global memory bandwidth enabled by FastTrack interconnect. The PQFP-208 footprint with 0.5 mm pitch and 30.6 mm × 30.6 mm body is suitable for through-hole-compatible surface-mount assembly where high pin-count legacy compatibility is required.
Architecturally, the FLEX 10KE combines look-up-table (LUT)-based logic elements with row-and-column interconnect, and each LE contains a 4-bit carry chain for fast arithmetic. Embedded array blocks can be configured as synchronous dual-port RAM, ROM, or wide logic functions, making the device suitable for state-machine-heavy designs that also need small memory buffers without an external SRAM.
Typical applications include industrial glue logic replacement, legacy peripheral controllers (ISA, PCI bridges), telecom line-card interface logic, prototyping ASIC replacements, and test-and-measurement front-end controllers. The wide 147-I/O count makes it useful for bus bridging, where many control signals must be remapped between legacy and modern interfaces.
When designing with this part, plan for the 2.5 V core supply with separate VCCIO banks for mixed-voltage I/O; verify JTAG chain termination and in-system programmability support the production programmer you intend to use, and confirm software toolchain compatibility (Quartus II 13.0 or earlier with FLEX 10KE device support).
This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives, and practical design notes that supplement the original Altera/Intel datasheet and reference manuals.
Alternatives de remplacement direct pour EPF10K30EQC208-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30EQC208-2 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Family, Operating Temperature, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30EQC208-1
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EPF10K30EQC208-1N
✅ Remplacement direct✓ En stock
$28.4 / unité
Voir la fiche technique →EPF10K30EQC208-1X
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EPF10K30EQC208-2N
✅ Remplacement direct✓ En stock
$19.75 / unité
Voir la fiche technique →EPF10K30AQC208-2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K30AQC208-1N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF10K30EQC208-2 Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (24 Kbits total) |
| Embedded Memory (bits) | 24,576 |
| Maximum User I/O | 147 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -2 |
| Température de fonctionnement | Commercial (0 °C to +70 °C) |
| Boîtier | 208-pin PQFP (Plastic Quad Flat Pack) |
| Package Dimensions | 30.60 mm × 30.60 mm, 0.50 mm pitch |
| Maximum Internal Frequency | 200 MHz |
| Type de montage | Surface Mount (gull-wing leads) |
| Programmability | SRAM-based, JTAG/ISP |
| Statut RoHS | Non-compliant (legacy PQFP package) |
Configuration des broches de EPF10K30EQC208-2
| Broche 1 | GND — Ground (per datasheet) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCINT — Core supply voltage (2.5 V) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | GND — Ground (per datasheet) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | TDI — JTAG test data input |
| Broche 16 | TMS — JTAG test mode select |
| Broche 17 | TCK — JTAG test clock |
| Broche 18 | nSTATUS — Configuration status (open-drain) |
| Broche 19 | nCONFIG — Configuration control input (active-low) |
| Broche 20 | DCLK — Configuration clock |
| Broche 21 | DATA0 — Configuration data input |
| Broche 22 | nCE — Chip enable (active-low) |
| Broche 23 | MSEL0 — Configuration mode select 0 |
| Broche 24 | MSEL1 — Configuration mode select 1 |
| Broche 25 | VCCIO — I/O supply voltage |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | GND — Ground (per datasheet) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | VCCINT — Core supply voltage (2.5 V) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | GND — Ground (per datasheet) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | VCCIO — I/O supply voltage |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | GND — Ground (per datasheet) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | VCCINT — Core supply voltage (2.5 V) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | I/O — User I/O pin (bank 3) |
| Broche 62 | I/O — User I/O pin (bank 3) |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | GND — Ground (per datasheet) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 3) |
| Broche 71 | I/O — User I/O pin (bank 3) |
| Broche 72 | VCCIO — I/O supply voltage |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | GND — Ground (per datasheet) |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | I/O — User I/O pin (bank 4) |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | VCCINT — Core supply voltage (2.5 V) |
| Broche 82 | I/O — User I/O pin (bank 4) |
| Broche 83 | I/O — User I/O pin (bank 4) |
| Broche 84 | I/O — User I/O pin (bank 4) |
| Broche 85 | I/O — User I/O pin (bank 4) |
| Broche 86 | I/O — User I/O pin (bank 4) |
| Broche 87 | GND — Ground (per datasheet) |
| Broche 88 | I/O — User I/O pin (bank 4) |
| Broche 89 | I/O — User I/O pin (bank 4) |
| Broche 90 | I/O — User I/O pin (bank 4) |
| Broche 91 | I/O — User I/O pin (bank 4) |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | I/O — User I/O pin (bank 4) |
| Broche 94 | I/O — User I/O pin (bank 4) |
| Broche 95 | VCCIO — I/O supply voltage |
| Broche 96 | I/O — User I/O pin (bank 5) |
| Broche 97 | GND — Ground (per datasheet) |
| Broche 98 | I/O — User I/O pin (bank 5) |
| Broche 99 | I/O — User I/O pin (bank 5) |
| Broche 100 | I/O — User I/O pin (bank 5) |
| Broche 101 | I/O — User I/O pin (bank 5) |
| Broche 102 | I/O — User I/O pin (bank 5) |
| Broche 103 | VCCINT — Core supply voltage (2.5 V) |
| Broche 104 | I/O — User I/O pin (bank 5) |
| Broche 105 | I/O — User I/O pin (bank 5) |
| Broche 106 | I/O — User I/O pin (bank 5) |
| Broche 107 | I/O — User I/O pin (bank 5) |
| Broche 108 | I/O — User I/O pin (bank 5) |
| Broche 109 | GND — Ground (per datasheet) |
| Broche 110 | I/O — User I/O pin (bank 5) |
| Broche 111 | I/O — User I/O pin (bank 5) |
| Broche 112 | I/O — User I/O pin (bank 5) |
| Broche 113 | I/O — User I/O pin (bank 5) |
| Broche 114 | I/O — User I/O pin (bank 5) |
| Broche 115 | I/O — User I/O pin (bank 5) |
| Broche 116 | VCCIO — I/O supply voltage |
| Broche 117 | I/O — User I/O pin (bank 6) |
| Broche 118 | I/O — User I/O pin (bank 6) |
| Broche 119 | GND — Ground (per datasheet) |
| Broche 120 | I/O — User I/O pin (bank 6) |
| Broche 121 | I/O — User I/O pin (bank 6) |
| Broche 122 | I/O — User I/O pin (bank 6) |
| Broche 123 | I/O — User I/O pin (bank 6) |
| Broche 124 | I/O — User I/O pin (bank 6) |
| Broche 125 | VCCINT — Core supply voltage (2.5 V) |
| Broche 126 | I/O — User I/O pin (bank 6) |
| Broche 127 | I/O — User I/O pin (bank 6) |
| Broche 128 | I/O — User I/O pin (bank 6) |
| Broche 129 | I/O — User I/O pin (bank 6) |
| Broche 130 | I/O — User I/O pin (bank 6) |
| Broche 131 | GND — Ground (per datasheet) |
| Broche 132 | I/O — User I/O pin (bank 6) |
| Broche 133 | I/O — User I/O pin (bank 6) |
| Broche 134 | I/O — User I/O pin (bank 6) |
| Broche 135 | I/O — User I/O pin (bank 6) |
| Broche 136 | I/O — User I/O pin (bank 6) |
| Broche 137 | I/O — User I/O pin (bank 6) |
| Broche 138 | I/O — User I/O pin (bank 6) |
| Broche 139 | VCCIO — I/O supply voltage |
| Broche 140 | I/O — User I/O pin (bank 7) |
| Broche 141 | GND — Ground (per datasheet) |
| Broche 142 | I/O — User I/O pin (bank 7) |
| Broche 143 | I/O — User I/O pin (bank 7) |
| Broche 144 | I/O — User I/O pin (bank 7) |
| Broche 145 | I/O — User I/O pin (bank 7) |
| Broche 146 | I/O — User I/O pin (bank 7) |
| Broche 147 | VCCINT — Core supply voltage (2.5 V) |
| Broche 148 | I/O — User I/O pin (bank 7) |
| Broche 149 | I/O — User I/O pin (bank 7) |
| Broche 150 | I/O — User I/O pin (bank 7) |
| Broche 151 | I/O — User I/O pin (bank 7) |
| Broche 152 | I/O — User I/O pin (bank 7) |
| Broche 153 | GND — Ground (per datasheet) |
| Broche 154 | I/O — User I/O pin (bank 7) |
| Broche 155 | I/O — User I/O pin (bank 7) |
| Broche 156 | I/O — User I/O pin (bank 7) |
| Broche 157 | I/O — User I/O pin (bank 7) |
| Broche 158 | I/O — User I/O pin (bank 7) |
| Broche 159 | I/O — User I/O pin (bank 7) |
| Broche 160 | I/O — User I/O pin (bank 7) |
| Broche 161 | VCCIO — I/O supply voltage |
| Broche 162 | I/O — User I/O pin (bank 8) |
| Broche 163 | I/O — User I/O pin (bank 8) |
| Broche 164 | GND — Ground (per datasheet) |
| Broche 165 | I/O — User I/O pin (bank 8) |
| Broche 166 | I/O — User I/O pin (bank 8) |
| Broche 167 | I/O — User I/O pin (bank 8) |
| Broche 168 | I/O — User I/O pin (bank 8) |
| Broche 169 | I/O — User I/O pin (bank 8) |
| Broche 170 | VCCINT — Core supply voltage (2.5 V) |
| Broche 171 | I/O — User I/O pin (bank 8) |
| Broche 172 | I/O — User I/O pin (bank 8) |
| Broche 173 | I/O — User I/O pin (bank 8) |
| Broche 174 | I/O — User I/O pin (bank 8) |
| Broche 175 | I/O — User I/O pin (bank 8) |
| Broche 176 | GND — Ground (per datasheet) |
| Broche 177 | I/O — User I/O pin (bank 8) |
| Broche 178 | I/O — User I/O pin (bank 8) |
| Broche 179 | I/O — User I/O pin (bank 8) |
| Broche 180 | I/O — User I/O pin (bank 8) |
| Broche 181 | I/O — User I/O pin (bank 8) |
| Broche 182 | I/O — User I/O pin (bank 8) |
| Broche 183 | I/O — User I/O pin (bank 8) |
| Broche 184 | I/O — User I/O pin (bank 8) |
| Broche 185 | VCCIO — I/O supply voltage |
| Broche 186 | I/O — User I/O pin (bank 8) |
| Broche 187 | GND — Ground (per datasheet) |
| Broche 188 | I/O — User I/O pin (bank 8) |
| Broche 189 | I/O — User I/O pin (bank 8) |
| Broche 190 | I/O — User I/O pin (bank 8) |
| Broche 191 | I/O — User I/O pin (bank 8) |
| Broche 192 | I/O — User I/O pin (bank 8) |
| Broche 193 | VCCINT — Core supply voltage (2.5 V) |
| Broche 194 | I/O — User I/O pin (bank 8) |
| Broche 195 | I/O — User I/O pin (bank 8) |
| Broche 196 | I/O — User I/O pin (bank 8) |
| Broche 197 | I/O — User I/O pin (bank 8) |
| Broche 198 | I/O — User I/O pin (bank 8) |
| Broche 199 | GND — Ground (per datasheet) |
| Broche 200 | I/O — User I/O pin (bank 8) |
| Broche 201 | I/O — User I/O pin (bank 8) |
| Broche 202 | I/O — User I/O pin (bank 8) |
| Broche 203 | I/O — User I/O pin (bank 8) |
| Broche 204 | I/O — User I/O pin (bank 8) |
| Broche 205 | I/O — User I/O pin (bank 8) |
| Broche 206 | I/O — User I/O pin (bank 8) |
| Broche 207 | TDO — JTAG test data output |
| Broche 208 | DEV_CLRn — Device clear (active-low, optional) |
Applications typiques
EPF10K30EQC208-2 convient pour 6 applications: Industrial Glue Logic Replacement, Legacy Peripheral Bus Bridge, Telecom Line-Card Interface Logic, ASIC Replacement Prototyping, Test & Measurement Front-End Controller, Avionics Legacy Retrofit.
Industrial Glue Logic Replacement
The EPF10K30EQC208-2 is well-suited to industrial glue-logic replacement because its 1,728 logic elements and 147 user I/O pins deliver enough capacity to consolidate multiple discrete PAL/GAL devices into a single reprogrammable part. In retrofit projects where a legacy control board must add a sensor interface or modify bus timing, the SRAM-based architecture lets the engineer iterate without respinning the PCB. The 2.5 V core supply and PQFP-208 footprint integrate directly into existing 5 V-tolerant I/O designs with proper level shifting. Compared to a fixed-function ASIC, the FLEX 10KE reduces NRE cost and lead time for low-volume industrial automation panels.
Recommandé
Legacy Peripheral Bus Bridge
With 147 user I/O pins and 216 LABs, the EPF10K30EQC208-2 can implement a complete ISA-to-PCI or parallel-port-to-LPC bridge on a single chip. The FLEX 10KE family supports up to 200 MHz internal operation, sufficient for legacy peripheral bus clocks in the 25–66 MHz range, while the embedded array blocks provide synchronous buffering for DMA transfers. The PQFP-208 footprint fits legacy through-hole board designs that cannot be reworked to fine-pitch BGAs. Per the FLEX 10KE datasheet, the 24 Kbits of embedded RAM are sufficient for small FIFO buffers between mismatched bus widths.
Recommandé
Telecom Line-Card Interface Logic
The EPF10K30EQC208-2 is commonly deployed in telecom line cards for T1/E1 framing, HDLC controllers, and time-slot interchangers where deterministic logic and moderate memory depth are required. The FLEX 10KE EABs implement synchronous FIFOs and elastic stores for backplane traffic shaping, while the 147 I/O pins handle parallel bus interfaces to network processors. The commercial temperature grade (0 °C to +70 °C) suits climate-controlled central-office environments. Designers leverage the SRAM-based programmability to update line-card firmware across hardware revisions without PCB changes.
Recommandé
ASIC Replacement Prototyping
The EPF10K30EQC208-2 serves as a prototyping vehicle for ASIC designs in the 10K–30K-gate density range, allowing functional verification before committing to mask costs. The FLEX 10KE pinout, JTAG chain, and Quartus II 13.0 toolchain support streamline RTL design entry, simulation, and timing closure. Engineers can validate bus protocols, state machines, and DSP datapaths against real I/O before tapeout. Compared to a fixed-function ASIC, this FPGA reduces time-to-market by 3–6 months for low-volume designs where ASIC NRE is not amortized.
Recommandé
Test & Measurement Front-End Controller
In test and measurement equipment, the EPF10K30EQC208-2 sequences relays, generates trigger pulses, and counts events on parallel buses thanks to its 200 MHz internal performance and 147 programmable I/O. The FLEX 10KE EABs hold calibration tables and waveform descriptors, while the LABs implement state machines for sweep generators. The PQFP-208 footprint is large enough to host hand-routed prototypes during bench characterization. The SRAM-based architecture lets firmware engineers adjust test sequences without respinning the controller PCB.
Recommandé
Avionics Legacy Retrofit
Although commercial-grade, the EPF10K30EQC208-2 is also used in retrofitting legacy avionics subsystems where existing harness and connector designs dictate PQFP-208 retention. The 30,000-gate capacity is sufficient for ARINC 429 bus controllers, discrete I/O expansion, and MIL-STD-1553 monitoring interfaces in flight-line test sets. Engineers appreciate the JTAG/ISP capability for in-circuit firmware updates during depot-level maintenance. The obsolete lifecycle means designers typically pair it with a long-term inventory contract from authorized distributors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30EQC208-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30EQC208-1 | EPF10K30EQC208-1N | EPF10K30EQC208-2N | EPF10K30AQC208-2 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-PQFP (30.6×30.6 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KA | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (bits) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | Distributed RAM only (no EAB) | Distributed RAM only (no EAB) |
| Maximum User I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -2 (faster) | -1 (slower) | -1 (slower) | -2 (faster) | -2 | -1 |
| RoHS / Lead-Free | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Pb-free (RoHS) | Pb-free (RoHS) | Non-RoHS (SnPb) | Pb-free (RoHS) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Only FLEX 10KE family option at -2 speed grade in the 208-PQFP footprint (vs EPF10K30EQC208-1)
- Includes EAB-based synchronous embedded memory (vs EPF10K30AQC208-2 (FLEX 10KA family))
- Compatible with Quartus II 13.0 (last FLEX 10KE-supported release) (vs Newer Cyclone II/III families)
Notes de conception
Estimated: at 200 MHz toggle activity across 50% of LEs (approximately 864 LEs active) with 3.3 V VCCIO, the EPF10K30EQC208-2 can draw up to 0.5 A from VCCINT (2.5 V) and 0.3 A from VCCIO, giving roughly 2.25 W total dissipation. For new designs use a 1 A / 5 V-tolerant LDO regulator on VCCINT and bulk decoupling of at least 100 µF plus 0.1 µF ceramic per VCCINT/VCCIO pin pair. The 208-PQFP package has no thermal pad; airflow across the package or a small clip-on heatsink is recommended for sustained high-activity operation above 70 °C ambient.
Route all VCCINT (2.5 V) and VCCIO (3.3 V or 5 V tolerant) power pins to planes rather than traces; the 208-PQFP lead inductance of the gull-wing leads (about 1 nH each) creates significant switching noise if power is delivered through traces. Place 0.1 µF X7R ceramic decoupling within 5 mm of every VCCINT/VCCIO pin, plus a 10 µF tantalum bulk capacitor per voltage rail. JTAG signals (TCK, TMS, TDI, TDO) should be series-terminated with 33 Ω resistors and length-matched to within 50 mil to avoid boundary-scan failures at higher TCK frequencies.
Do not assume any FLEX 10KE variant is RoHS compliant - the trailing '-N' suffix is required for Pb-free terminal finish. Mixing Pb-free -2N parts with SnPb -2 parts on the same board violates the higher-temperature reflow profile required by Pb-free finishes. Also note that the configuration device must match the FPGA density: EPC2LC20 supports FLEX 10KE up to 30K gates; larger densities require EPC4 or EPC8. Finally, the MSEL pins select configuration mode (AS, AP, PS, JTAG) and must be pulled to VCCINT or GND with 4.7 kΩ resistors - leaving them floating causes configuration failures.
Informations de conformité
Original EPF10K30EQC208-2 is SnPb terminal finish (non-RoHS); RoHS-compliant variants use the trailing '-N' suffix (EPF10K30EQC208-2N). Not AEC-Q100 qualified. Halogen-free status not stated in available datasheet excerpts. REACH compliance assumed per Intel product environmental program; conflict-minerals declaration available from Intel.