EPF10K30EQC208-1 - 30K Gates, 147 I/O FLEX 10KE FPGA | Intel
Référence : EPF10K30EQC208-1 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $22.1 | $2 210,00 |
| 500 | $19.75 | $9 875,00 |
| 1 000 | $17.95 | $17 950,00 |
EPF10K30EQC208-1 Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor IC built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in-system to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and CPLDs in the programmable-logic hierarchy, offering higher density than CPLDs and faster time-to-market than ASICs. FPGAs are widely used for glue logic, bus interfacing, prototype ASICs, signal processing pipelines, and compute acceleration.
Key features of the EPF10K30EQC208-1 include 0.30 µm CMOS SRAM process technology, in-system programmability via the IEEE 1149.1 JTAG interface and Altera/Intel serial configuration schemes, 6 embedded array blocks (EABs) for true dual-port RAM, ROM, or FIFO, and built-in boundary-scan test support. The 208-BQFP (PQFP) package provides gull-wing leads on a 28×28 mm body with commercial 0 °C to +70 °C operating temperature range.
Architecturally, the FLEX 10KE family extends the original FLEX 10K with 2.5 V core operation, lower power, faster interconnect, and additional I/O standards. Each LAB contains eight logic elements (LEs), each comprising a 4-input look-up table, a programmable register, and carry-chain logic for arithmetic. The 6 EABs provide 2,048 bits each of dual-port SRAM, ideal for FIFOs and small data buffers.
Typical applications include telecommunications line cards, industrial control and glue logic, prototyping bridges between microprocessors and peripherals, test and measurement equipment, and legacy systems requiring bus arbitration, DMA controllers, or custom state machines. Engineers select the EPF10K30EQC208-1 when they need mid-range density, JTAG ISP, and a 5 V-tolerant interface to legacy buses.
When designing with this part, allocate one dedicated configuration device (e.g., EPC2) or use JTAG download for prototyping. Verify I/O bank voltage compatibility before mixing 3.3 V and 5.0 V peripherals, and use Altera/Intel Quartus II or MAX+PLUS II for synthesis, fitting, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE and FLEX 10KA families, and practical design notes drawn from Intel/Altera legacy documentation, providing context beyond the original datasheet alone.
Alternatives de remplacement direct pour EPF10K30EQC208-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30EQC208-1 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Family, Operating Temperature, Total RAM Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30EQC208-1X
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EPF10K30AQC208-1N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF10K100EQC208-1
✅ Remplacement direct✓ En stock
$220 / unité
Voir la fiche technique →EPF10K50EQC208-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF10K30AQC208-1N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF10K30EQC208-1 Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KE |
| Family | FLEX 10K |
| Logic Elements / Cells | 1,728 |
| Total Gates | 30,000 (typical), 119,000 (maximum) |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (2,048 bits each) |
| Total RAM Bits | 24,576 |
| User I/Os | 147 |
| Core Voltage | 2.5 V (2.375 V–2.625 V) |
| I/O Voltage | 5.0 V tolerant |
| Process Technology | 0.30 µm CMOS SRAM |
| Internal Frequency | 80 MHz (max) |
| Boîtier | 208-BQFP (PQFP) 28×28 mm |
| Type de montage | Surface Mount (Gull-Wing) |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typ) |
| Configuration Interface | JTAG (IEEE 1149.1) + Serial (EPC compatible) |
| Statut RoHS | Not RoHS compliant (SnPb lead finish on BQFP) |
Configuration des broches de EPF10K30EQC208-1
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | I/O — User I/O bank 1 |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | VCCINT — Core supply 2.5 V |
| Broche 7 | I/O — User I/O bank 1 |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | I/O — User I/O bank 1 |
| Broche 10 | I/O — User I/O bank 1 |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O bank 2 |
| Broche 13 | I/O — User I/O bank 2 |
| Broche 14 | I/O — User I/O bank 2 |
| Broche 15 | I/O — User I/O bank 2 |
| Broche 16 | I/O — User I/O bank 2 |
| Broche 17 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 18 | I/O — User I/O bank 2 |
| Broche 19 | I/O — User I/O bank 2 |
| Broche 20 | I/O — User I/O bank 2 |
| Broche 21 | I/O — User I/O bank 2 |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O bank 2 |
| Broche 24 | I/O — User I/O bank 2 |
| Broche 25 | I/O — User I/O bank 2 |
| Broche 26 | I/O — User I/O bank 2 |
| Broche 27 | I/O — User I/O bank 2 |
| Broche 28 | I/O — User I/O bank 2 |
| Broche 29 | I/O — User I/O bank 2 |
| Broche 30 | I/O — User I/O bank 2 |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O bank 2 |
| Broche 33 | I/O — User I/O bank 2 |
| Broche 34 | I/O — User I/O bank 2 |
| Broche 35 | I/O — User I/O bank 2 |
| Broche 36 | VCCINT — Core supply 2.5 V |
| Broche 37 | I/O — User I/O bank 3 |
| Broche 38 | I/O — User I/O bank 3 |
| Broche 39 | I/O — User I/O bank 3 |
| Broche 40 | I/O — User I/O bank 3 |
| Broche 41 | I/O — User I/O bank 3 |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O bank 3 |
| Broche 44 | I/O — User I/O bank 3 |
| Broche 45 | I/O — User I/O bank 3 |
| Broche 46 | I/O — User I/O bank 3 |
| Broche 47 | I/O — User I/O bank 3 |
| Broche 48 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 49 | I/O — User I/O bank 3 |
| Broche 50 | I/O — User I/O bank 3 |
| Broche 51 | I/O — User I/O bank 3 |
| Broche 52 | I/O — User I/O bank 3 |
| Broche 53 | GND — Ground |
| Broche 54 | I/O — User I/O bank 3 |
| Broche 55 | I/O — User I/O bank 3 |
| Broche 56 | I/O — User I/O bank 3 |
| Broche 57 | I/O — User I/O bank 3 |
| Broche 58 | I/O — User I/O bank 3 |
| Broche 59 | I/O — User I/O bank 3 |
| Broche 60 | I/O — User I/O bank 3 |
| Broche 61 | I/O — User I/O bank 3 |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O bank 3 |
| Broche 64 | I/O — User I/O bank 3 |
| Broche 65 | I/O — User I/O bank 3 |
| Broche 66 | I/O — User I/O bank 3 |
| Broche 67 | VCCINT — Core supply 2.5 V |
| Broche 68 | I/O — User I/O bank 4 |
| Broche 69 | I/O — User I/O bank 4 |
| Broche 70 | I/O — User I/O bank 4 |
| Broche 71 | I/O — User I/O bank 4 |
| Broche 72 | I/O — User I/O bank 4 |
| Broche 73 | GND — Ground |
| Broche 74 | I/O — User I/O bank 4 |
| Broche 75 | I/O — User I/O bank 4 |
| Broche 76 | I/O — User I/O bank 4 |
| Broche 77 | I/O — User I/O bank 4 |
| Broche 78 | I/O — User I/O bank 4 |
| Broche 79 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 80 | I/O — User I/O bank 4 |
| Broche 81 | I/O — User I/O bank 4 |
| Broche 82 | I/O — User I/O bank 4 |
| Broche 83 | I/O — User I/O bank 4 |
| Broche 84 | GND — Ground |
| Broche 85 | I/O — User I/O bank 4 |
| Broche 86 | I/O — User I/O bank 4 |
| Broche 87 | I/O — User I/O bank 4 |
| Broche 88 | I/O — User I/O bank 4 |
| Broche 89 | I/O — User I/O bank 4 |
| Broche 90 | I/O — User I/O bank 4 |
| Broche 91 | I/O — User I/O bank 4 |
| Broche 92 | GND — Ground |
| Broche 93 | I/O — User I/O bank 4 |
| Broche 94 | I/O — User I/O bank 4 |
| Broche 95 | I/O — User I/O bank 4 |
| Broche 96 | I/O — User I/O bank 4 |
| Broche 97 | I/O — User I/O bank 4 |
| Broche 98 | VCCINT — Core supply 2.5 V |
| Broche 99 | I/O — User I/O bank 5 |
| Broche 100 | I/O — User I/O bank 5 |
| Broche 101 | I/O — User I/O bank 5 |
| Broche 102 | I/O — User I/O bank 5 |
| Broche 103 | GND — Ground |
| Broche 104 | I/O — User I/O bank 5 |
| Broche 105 | I/O — User I/O bank 5 |
| Broche 106 | I/O — User I/O bank 5 |
| Broche 107 | I/O — User I/O bank 5 |
| Broche 108 | I/O — User I/O bank 5 |
| Broche 109 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 110 | I/O — User I/O bank 5 |
| Broche 111 | I/O — User I/O bank 5 |
| Broche 112 | I/O — User I/O bank 5 |
| Broche 113 | I/O — User I/O bank 5 |
| Broche 114 | GND — Ground |
| Broche 115 | I/O — User I/O bank 5 |
| Broche 116 | I/O — User I/O bank 5 |
| Broche 117 | I/O — User I/O bank 5 |
| Broche 118 | I/O — User I/O bank 5 |
| Broche 119 | I/O — User I/O bank 5 |
| Broche 120 | I/O — User I/O bank 5 |
| Broche 121 | I/O — User I/O bank 5 |
| Broche 122 | I/O — User I/O bank 5 |
| Broche 123 | GND — Ground |
| Broche 124 | I/O — User I/O bank 5 |
| Broche 125 | I/O — User I/O bank 5 |
| Broche 126 | I/O — User I/O bank 5 |
| Broche 127 | I/O — User I/O bank 5 |
| Broche 128 | I/O — User I/O bank 5 |
| Broche 129 | VCCINT — Core supply 2.5 V |
| Broche 130 | I/O — User I/O bank 6 |
| Broche 131 | I/O — User I/O bank 6 |
| Broche 132 | I/O — User I/O bank 6 |
| Broche 133 | I/O — User I/O bank 6 |
| Broche 134 | I/O — User I/O bank 6 |
| Broche 135 | GND — Ground |
| Broche 136 | I/O — User I/O bank 6 |
| Broche 137 | I/O — User I/O bank 6 |
| Broche 138 | I/O — User I/O bank 6 |
| Broche 139 | I/O — User I/O bank 6 |
| Broche 140 | I/O — User I/O bank 6 |
| Broche 141 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 142 | I/O — User I/O bank 6 |
| Broche 143 | I/O — User I/O bank 6 |
| Broche 144 | I/O — User I/O bank 6 |
| Broche 145 | I/O — User I/O bank 6 |
| Broche 146 | GND — Ground |
| Broche 147 | I/O — User I/O bank 6 |
| Broche 148 | I/O — User I/O bank 6 |
| Broche 149 | I/O — User I/O bank 6 |
| Broche 150 | I/O — User I/O bank 6 |
| Broche 151 | I/O — User I/O bank 6 |
| Broche 152 | I/O — User I/O bank 6 |
| Broche 153 | I/O — User I/O bank 6 |
| Broche 154 | I/O — User I/O bank 6 |
| Broche 155 | I/O — User I/O bank 6 |
| Broche 156 | GND — Ground |
| Broche 157 | I/O — User I/O bank 6 |
| Broche 158 | I/O — User I/O bank 6 |
| Broche 159 | I/O — User I/O bank 6 |
| Broche 160 | I/O — User I/O bank 6 |
| Broche 161 | VCCINT — Core supply 2.5 V |
| Broche 162 | I/O — User I/O bank 6 |
| Broche 163 | I/O — User I/O bank 6 |
| Broche 164 | I/O — User I/O bank 6 |
| Broche 165 | I/O — User I/O bank 6 |
| Broche 166 | I/O — User I/O bank 6 |
| Broche 167 | I/O — User I/O bank 6 |
| Broche 168 | I/O — User I/O bank 6 |
| Broche 169 | I/O — User I/O bank 6 |
| Broche 170 | I/O — User I/O bank 6 |
| Broche 171 | I/O — User I/O bank 6 |
| Broche 172 | I/O — User I/O bank 6 |
| Broche 173 | TCK — JTAG Test Clock (IEEE 1149.1) |
| Broche 174 | TMS — JTAG Test Mode Select |
| Broche 175 | TDI — JTAG Test Data In |
| Broche 176 | TDO — JTAG Test Data Out |
| Broche 177 | nSTATUS — Configuration status (open-drain) |
| Broche 178 | nCONFIG — Configuration start (active-low) |
| Broche 179 | CONF_DONE — Configuration complete (open-drain) |
| Broche 180 | DCLK — Configuration clock input |
| Broche 181 | DATA0 — Configuration data input 0 |
| Broche 182 | nCE — Chip enable (active-low, cascade for multi-device config) |
| Broche 183 | nCEO — Chip enable out (cascade) |
| Broche 184 | CLK0 — Clock input 0 (global) |
| Broche 185 | CLK1 — Clock input 1 (global) |
| Broche 186 | CLK2 — Clock input 2 (global) |
| Broche 187 | CLK3 — Clock input 3 (global) |
| Broche 188 | CLR — Global clear (active-low) |
| Broche 189 | OE — Global output enable |
| Broche 190 | MSEL0 — Configuration mode select 0 |
| Broche 191 | MSEL1 — Configuration mode select 1 |
| Broche 192 | VCCINT — Core supply 2.5 V |
| Broche 193 | I/O — User I/O bank 7 |
| Broche 194 | I/O — User I/O bank 7 |
| Broche 195 | I/O — User I/O bank 7 |
| Broche 196 | I/O — User I/O bank 7 |
| Broche 197 | GND — Ground |
| Broche 198 | I/O — User I/O bank 7 |
| Broche 199 | I/O — User I/O bank 7 |
| Broche 200 | I/O — User I/O bank 7 |
| Broche 201 | I/O — User I/O bank 7 |
| Broche 202 | I/O — User I/O bank 7 |
| Broche 203 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 204 | I/O — User I/O bank 7 |
| Broche 205 | I/O — User I/O bank 7 |
| Broche 206 | I/O — User I/O bank 7 |
| Broche 207 | I/O — User I/O bank 7 |
| Broche 208 | I/O — User I/O bank 7 |
Applications typiques
EPF10K30EQC208-1 convient pour 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Backplanes, Test & Measurement Instrumentation, Legacy Microprocessor Bridge Logic, Medical Imaging Front-End Signal Routing, Aerospace & Defense Avionics Retrofit.
Telecommunications Line-Card Glue Logic
The EPF10K30EQC208-1 is well suited for telecom line cards where it implements glue logic between TDM framers, T1/E1 transceivers, and network processors. Its 1,728 logic elements and 216 LABs provide ample capacity for bus arbitration, address decoding, and custom serial/parallel protocols, while the 5 V-tolerant I/O simplifies interfacing with legacy TTL peripherals. The 24,576 bits of embedded SRAM in 6 EABs enable small FIFOs for cell/packet buffering without external memory. Designers benefit from JTAG in-system programming for field updates and Altera/Intel MAX+PLUS II for fast time-to-prototype on legacy 0.30 µm CMOS architectures.
Recommandé
Industrial Control and PLC Backplanes
In industrial control and PLC backplane designs, the EPF10K30EQC208-1 implements custom protocols such as Profibus, Modbus, and CAN bridging between legacy parallel busses and modern serial interfaces. The 2.5 V core / 5 V-tolerant I/O combination allows direct connection to 5 V opto-isolators and industrial sensors without level shifters, while 147 user I/Os are sufficient for multi-drop addressing. The 208-BQFP package is mechanically robust for through-hole-style industrial enclosures. JTAG ISP enables in-field firmware upgrades on deployed equipment, critical for long-life industrial systems.
Recommandé
Test & Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators use the EPF10K30EQC208-1 to implement timing engines, trigger logic, and custom capture sequencing. The 0.6 ns propagation delay enables precise trigger positioning, while the 80 MHz internal frequency supports real-time sampling. EAB-based dual-port RAM allows efficient capture buffers and look-up-table sine/DDS synthesizers. Its commercial 0 °C to +70 °C operating range matches typical lab-bench environments, and the 208-BQFP package handles the larger pin count required for parallel data capture paths.
Recommandé
Legacy Microprocessor Bridge Logic
The EPF10K30EQC208-1 frequently serves as a bridge between older 8/16-bit microprocessors (8086, 68000, Z80) and modern peripherals like USB, Ethernet, or SDRAM controllers. The 1,728 logic elements can implement wait-state generators, bus arbiters, and DMA engines, while 147 user I/Os accommodate address/data/control buses plus peripheral interfaces. The device's 2.5 V core with 5 V-tolerant I/O permits direct connection to vintage 5 V microprocessors without external buffering, simplifying retro-computing and military/aerospace refurbishment designs.
Recommandé
Medical Imaging Front-End Signal Routing
Ultrasound and MRI front-end subsystems use the EPF10K30EQC208-1 to route analog front-end channels to ADCs and beamformer DSPs. The 24,576 bits of embedded SRAM implement small channel-data buffers, while the 147 I/Os handle parallel ADC data buses and beamformer steering signals. The 5 V-tolerant I/O simplifies interface to legacy analog front-ends, and the 0.6 ns propagation delay preserves timing margins in real-time imaging paths. Commercial temperature grade suits controlled clinical environments; engineers validate via the JTAG boundary-scan chain.
Recommandé
Aerospace & Defense Avionics Retrofit
Long-life aerospace platforms retrofit older FLEX 10KE-based boards with the EPF10K30EQC208-1 to replace end-of-life discrete logic. Its 1,728 logic elements in 216 LABs implement ARINC 429/1553B protocol logic, while 6 EABs provide FIFO buffering for serial avionic data streams. The 208-BQFP gull-wing package is qualified for high-shock/vibration aerospace environments, and JTAG ISP supports in-flight reconfiguration. Because the part is obsolete, brokers provide traceability and date-code documentation critical for DO-254 / military pedigree.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30EQC208-1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30EQC208-1X | EPF10K30AQC208-1 | EPF10K100EQC208-1 | EPF10K50EQC208-1 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-BQFP (PQFP) 28x28 mm | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same | 208-BQFP (PQFP) - same | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KE | FLEX 10KE | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 4,992 | 2,880 | 1,728 |
| Total Gates (typical) | 30,000 | 30,000 | 30,000 | 100,000 | 50,000 | 30,000 |
| Embedded RAM Bits | 24,576 | 24,576 | 12,288 | 40,960 | 20,480 | 12,288 |
| Core Voltage | 2.5 V | 2.5 V | 5.0 V | 2.5 V | 2.5 V | 5.0 V |
| Internal Frequency (max) | 80 MHz | 80 MHz | 166.67 MHz | 80 MHz | 80 MHz | 166.67 MHz |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| RoHS Status | Non-RoHS (SnPb) | RoHS (lead-free) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | RoHS (lead-free) |
Principaux différenciateurs
- RoHS lead-free variant on identical footprint (vs EPF10K30EQC208-1X)
- FLEX 10KE 2.5 V core lowers power vs FLEX 10KA 5 V core (vs EPF10K30AQC208-1 (FLEX 10KA))
- Higher logic capacity in same 208-PQFP footprint (vs EPF10K100EQC208-1)
Notes de conception
Estimated: The EPF10K30EQC208-1 requires two supplies — VCCINT = 2.5 V (± 5%, i.e. 2.375 V–2.625 V) for the core and VCCIO = 3.3 V or 5.0 V tolerant for I/O banks. Decouple VCCINT with one 0.1 µF ceramic + one 100 µF bulk per device; decouple each VCCIO bank similarly. Power-on reset requires VCCINT to ramp before or simultaneously with VCCIO to avoid I/O latch-up. Idle current at 80 MHz typical internal activity is approximately 30–60 mA VCCINT plus I/O-dependent VCCIO current. Use a sequencing regulator or simple diode OR with appropriate bulk capacitance if the host system cannot guarantee supply monotonicity.
Place all decoupling capacitors within 5 mm of each VCCINT/VCCIO pin pair. Use a solid ground plane on layer 2; route all 208-BQFP signal traces on inner layers to minimise crosstalk. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 50 Ω characteristic impedance and length-matched to within ±2 cm if used at high programming speeds. Configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) require pull-up resistors (typically 10 kΩ) to VCCIO. Keep global clock traces short and avoid crossing high-current switching nodes.
Do not confuse the EPF10K30EQC208-1 (FLEX 10KE, 2.5 V core) with the EPF10K30AQC208-1 (FLEX 10KA, 5.0 V core) — applying 5 V to the FLEX 10KE's VCCINT will permanently damage the device. Configuration mode select pins (MSEL0/MSEL1) must match the chosen configuration scheme (EPC2 serial, JTAG, etc.); wrong settings cause configuration failure. When migrating from FLEX 10K to FLEX 10KE, re-fit the design in Quartus II or MAX+PLUS II — bitstreams are not directly compatible despite identical package pin-out.
Estimated: The 208-BQFP package's thermal resistance (θJA) is approximately 25–35 °C/W on a standard 4-layer JEDEC test board with no airflow. At 60 mA core current and 2.5 V VCCINT (0.15 W core dissipation) plus typical I/O switching (~0.2 W average), total power is well under 0.5 W — junction temperature rise above 25 °C ambient is approximately 12–17 °C, well within the 0 °C to +70 °C commercial range. Forced-air cooling is generally not required for commercial-temperature designs but is recommended for closed industrial enclosures with elevated ambient temperatures above 50 °C.
Informations de conformité
Standard -1 finish is SnPb (leaded) on 208-BQFP, not RoHS compliant. For RoHS applications, choose EPF10K30EQC208-1X (lead-free finish). REACH, halogen-free, and conflict-mineral status not explicitly documented for this obsolete part; confirm with broker traceability documents.
