EPF10K30RI208-4 - FLEX 10K FPGA 30K Gates 208-RQFP | Intel / Altera
Référence : EPF10K30RI208-4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $26.4 | $2 640,00 |
| 500 | $21.85 | $10 925,00 |
| 1 000 | $18.2 | $18 200,00 |
EPF10K30RI208-4 Présentation
What is an FPGA? A Field Programmable Gate Array is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can program to implement custom digital hardware. FPGAs sit above microcontrollers and ASICs in the design complexity hierarchy, offering parallel hardware execution, deterministic timing, and re-programmability for prototyping, low-volume production, and compute acceleration.
Key features of the EPF10K30RI208-4 include 30K equivalent gates, 1,728 logic cells, 12,288-bit embedded array block (EAB) memory, 147 user I/O pins, and a 0.6000 ns propagation delay per logic element. The embedded array blocks can be configured as RAM, ROM, or first-in first-out (FIFO) functions, eliminating the need for external memory in many glue-logic designs. The 5 V I/O standard simplifies interface with legacy TTL/CMOS peripherals.
The FLEX 10K architecture combines fine-grained logic elements (Logic Elements / LEs) with coarse-grained embedded array blocks (EABs). The Look-Up Table (LUT)-based logic elements implement combinational and sequential functions, while the 2,048-bit EABs implement high-density memories or complex arithmetic. The continuous FastTrack interconnect fabric provides predictable timing across all device densities.
Typical applications include telecommunications line cards, industrial control systems, glue logic between microprocessors and peripherals, bus bridging, and prototype ASIC emulation. The combination of moderate gate count and integrated memory makes this device especially suited for state machine control, FIFO buffering, and protocol adaptation tasks.
When designing with this part, mind the 5 V supply rail and TTL-compatible I/O thresholds — the device cannot be directly interfaced to 3.3 V logic without level translation. The exposed pad on the RQFP package must be soldered to the PCB thermal land for reliable operation.
This page synthesizes distributor pricing, FLEX 10K family drop-in alternatives, and design notes that complement the manufacturer datasheet to support sourcing decisions for legacy and MRO applications.
Alternatives de remplacement direct pour EPF10K30RI208-4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30RI208-4 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Mounting Type, Total RAM Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30RC208-4N
✅ Remplacement direct✓ En stock
$24.9 / unité
Voir la fiche technique →EPF10K30RC208-4N
✅ Remplacement direct✓ En stock
$24.9 / unité
Voir la fiche technique →EPF10K30EQC208-1
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EPF10K30EQC208-2
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPF10K30EQC208-3
✅ Remplacement direct✓ En stock
$26.1 / unité
Voir la fiche technique →EPF10K30EQC208-3N
✅ Remplacement direct✓ En stock
$49.1 / unité
Voir la fiche technique →EPF10K30EQI208-2
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF10K30RI208-4 Valeurs maximales et caractéristiques électriques
| Series | FLEX 10K |
| Manufacturer | Intel (formerly Altera) |
| Logic Cells | 1728 |
| Equivalent Gates | 30,000 |
| Number of LABs/CLBs | 216 |
| Total RAM Bits | 12288 |
| Number of I/O | 147 |
| Tension d'alimentation | 5 V |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency (max) | 125 MHz |
| Propagation Delay | 0.6 ns |
| Boîtier | 208-BFQFP / 208-RQFP Exposed Pad |
| Package Code | HFQFP / RQFP |
| Nombre de broches | 208 |
| Type de montage | Surface Mount (Gull Wing) |
| Température de fonctionnement | 0 °C to 70 °C (Commercial) |
| Speed Grade | -4 |
Configuration des broches de EPF10K30RI208-4
| Broche 1 | I/O — User I/O pin (dedicated to I/O bank per configuration) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | I/O — User I/O pin |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | VCC — 5 V core supply |
| Broche 21 | I/O — User I/O pin |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | VCC — 5 V I/O supply |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | GND — Ground |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | VCC — 5 V core supply |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | I/O — User I/O pin |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | GND — Ground |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | VCC — 5 V I/O supply |
| Broche 91 | I/O — User I/O pin |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | I/O — User I/O pin |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | I/O — User I/O pin |
| Broche 96 | I/O — User I/O pin |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | I/O — User I/O pin |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
| Broche 101 | GND — Ground |
| Broche 102 | I/O — User I/O pin |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | I/O — User I/O pin |
| Broche 105 | I/O — User I/O pin |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | I/O — User I/O pin |
| Broche 108 | I/O — User I/O pin |
| Broche 109 | I/O — User I/O pin |
| Broche 110 | I/O — User I/O pin |
| Broche 111 | I/O — User I/O pin |
| Broche 112 | I/O — User I/O pin |
| Broche 113 | VCC — 5 V core supply |
| Broche 114 | I/O — User I/O pin |
| Broche 115 | I/O — User I/O pin |
| Broche 116 | I/O — User I/O pin |
| Broche 117 | I/O — User I/O pin |
| Broche 118 | I/O — User I/O pin |
| Broche 119 | I/O — User I/O pin |
| Broche 120 | I/O — User I/O pin |
| Broche 121 | I/O — User I/O pin |
| Broche 122 | I/O — User I/O pin |
| Broche 123 | I/O — User I/O pin |
| Broche 124 | GND — Ground |
| Broche 125 | I/O — User I/O pin |
| Broche 126 | I/O — User I/O pin |
| Broche 127 | I/O — User I/O pin |
| Broche 128 | I/O — User I/O pin |
| Broche 129 | I/O — User I/O pin |
| Broche 130 | I/O — User I/O pin |
| Broche 131 | I/O — User I/O pin |
| Broche 132 | I/O — User I/O pin |
| Broche 133 | I/O — User I/O pin |
| Broche 134 | I/O — User I/O pin |
| Broche 135 | I/O — User I/O pin |
| Broche 136 | VCC — 5 V I/O supply |
| Broche 137 | I/O — User I/O pin |
| Broche 138 | I/O — User I/O pin |
| Broche 139 | I/O — User I/O pin |
| Broche 140 | I/O — User I/O pin |
| Broche 141 | I/O — User I/O pin |
| Broche 142 | I/O — User I/O pin |
| Broche 143 | I/O — User I/O pin |
| Broche 144 | I/O — User I/O pin |
| Broche 145 | I/O — User I/O pin |
| Broche 146 | I/O — User I/O pin |
| Broche 147 | GND — Ground |
| Broche 148 | I/O — User I/O pin |
| Broche 149 | I/O — User I/O pin |
| Broche 150 | I/O — User I/O pin |
| Broche 151 | I/O — User I/O pin |
| Broche 152 | I/O — User I/O pin |
| Broche 153 | I/O — User I/O pin |
| Broche 154 | I/O — User I/O pin |
| Broche 155 | I/O — User I/O pin |
| Broche 156 | I/O — User I/O pin |
| Broche 157 | I/O — User I/O pin |
| Broche 158 | I/O — User I/O pin |
| Broche 159 | VCC — 5 V core supply |
| Broche 160 | I/O — User I/O pin |
| Broche 161 | I/O — User I/O pin |
| Broche 162 | I/O — User I/O pin |
| Broche 163 | I/O — User I/O pin |
| Broche 164 | I/O — User I/O pin |
| Broche 165 | I/O — User I/O pin |
| Broche 166 | I/O — User I/O pin |
| Broche 167 | I/O — User I/O pin |
| Broche 168 | I/O — User I/O pin |
| Broche 169 | I/O — User I/O pin |
| Broche 170 | GND — Ground |
| Broche 171 | MSEL0 — Configuration mode select |
| Broche 172 | MSEL1 — Configuration mode select |
| Broche 173 | nSTATUS — Configuration status (open-drain) |
| Broche 174 | nCONFIG — Configuration control input (active low) |
| Broche 175 | DCLK — Configuration clock input |
| Broche 176 | DATA0 — Configuration data input |
| Broche 177 | CONF_DONE — Configuration done status (open-drain) |
| Broche 178 | TDI — JTAG test data in |
| Broche 179 | TMS — JTAG test mode select |
| Broche 180 | TCK — JTAG test clock |
| Broche 181 | TDO — JTAG test data out |
| Broche 182 | I/O — User I/O pin |
| Broche 183 | I/O — User I/O pin |
| Broche 184 | I/O — User I/O pin |
| Broche 185 | I/O — User I/O pin |
| Broche 186 | I/O — User I/O pin |
| Broche 187 | I/O — User I/O pin |
| Broche 188 | I/O — User I/O pin |
| Broche 189 | I/O — User I/O pin |
| Broche 190 | VCC — 5 V I/O supply |
| Broche 191 | I/O — User I/O pin |
| Broche 192 | I/O — User I/O pin |
| Broche 193 | I/O — User I/O pin |
| Broche 194 | I/O — User I/O pin |
| Broche 195 | I/O — User I/O pin |
| Broche 196 | I/O — User I/O pin |
| Broche 197 | I/O — User I/O pin |
| Broche 198 | I/O — User I/O pin |
| Broche 199 | I/O — User I/O pin |
| Broche 200 | I/O — User I/O pin |
| Broche 201 | GND — Ground |
| Broche 202 | I/O — User I/O pin |
| Broche 203 | I/O — User I/O pin |
| Broche 204 | I/O — User I/O pin |
| Broche 205 | I/O — User I/O pin |
| Broche 206 | I/O — User I/O pin |
| Broche 207 | I/O — User I/O pin |
| Broche 208 | I/O — User I/O pin |
Applications typiques
EPF10K30RI208-4 convient pour 6 applications: Telecommunications Line Cards, Industrial Glue Logic and Bus Bridging, ASIC Prototyping and Logic Emulation, State Machine Control and DSP Pre-Processing, Legacy MRO and Avionics Sustainment, Flat-Panel Display and Imaging Pipelines.
Telecommunications Line Cards
The EPF10K30RI208-4 is well suited to legacy telecom line-card designs where moderate gate count, integrated EAB memory, and 5 V TTL I/O simplify interface to legacy bus standards such as H.110, SCSA, and MVIP. Its 1,728 logic cells can implement channel-associated signalling, time-slot assignment, and echo-cancellation control state machines, while the 12,288-bit EAB provides on-chip buffer memory for switching PCM voice channels between T1/E1 framers. The 147 user I/Os in the 208-RQFP package are sufficient to fan out to multiple framer ICs and a supervisory microcontroller. Designers value the deterministic 0.6 ns propagation delay for serial protocol timing.
Recommandé
Industrial Glue Logic and Bus Bridging
For industrial control systems needing to bridge legacy 5 V TTL peripherals to a modern 3.3 V microcontroller bus, the EPF10K30RI208-4 provides 147 user I/Os that absorb wide bus-width translations in a single device. Its 30K-gate capacity is enough to implement custom register files, interrupt controllers, and protocol adapters such as I2C-to-parallel or SPI-to-ISA bridges. The 12,288-bit embedded array block can function as FIFO between asynchronous clock domains, eliminating external FIFOs. Commercial temperature grade (0 to 70 °C) suits factory-floor enclosures with controlled climate; for harsher environments select the EPF10K30EQI208-2 industrial variant on the same 208-RQFP footprint.
Recommandé
ASIC Prototyping and Logic Emulation
ASIC prototyping is a classic FLEX 10K use case: engineers map gate-level netlists of an ASIC design onto the EPF10K30RI208-4 to validate functionality before committing to silicon. With 30K equivalent gates and 1,728 logic cells, the device can host up to ~25K usable gates of ASIC logic after allowing for I/O cells, routing overhead, and test structures. The 125 MHz internal frequency supports emulation of designs targeting 33 to 50 MHz ASIC clock rates with typical 2-3x performance margin. Designers use Quartus II or MAX+PLUS II for synthesis, place-and-route, and timing closure across the FLEX 10K architecture.
Recommandé
State Machine Control and DSP Pre-Processing
The FLEX 10K architecture combines fast 0.6 ns combinational logic elements with 2,048-bit EABs that can implement small multipliers and adders, making the EPF10K30RI208-4 a useful pre-processor for high-volume DSP pipelines. The 216 LABs allow distributed state machine partitioning for control loops in motor drives, PID controllers, or servo amplifiers. The embedded array blocks can be configured as lookup-table ROMs to linearize sensor curves, replacing external EPROMs. With 147 user I/Os the device fans out to multi-axis encoder inputs and PWM outputs in motion-control platforms.
Recommandé
Legacy MRO and Avionics Sustainment
Many long-life avionics, military, and railway systems built in the late 1990s and early 2000s use FLEX 10K FPGAs and remain in service decades later. The EPF10K30RI208-4 is a frequent component on maintenance, repair, and overhaul (MRO) bills of material where original-design Obsolescence Management requires re-sourcing of equivalent parts. Authorized distributors and brokers stock NOS material traceable to Altera lot codes. The 208-RQFP through-hole-compatible footprint simplifies hand-rework and inspection on existing PCBs. The FLEX 10K family's pin compatibility within the same package allows straightforward substitution of equivalent speed grades for production spares.
Recommandé
Flat-Panel Display and Imaging Pipelines
Display controllers for industrial flat panels, medical imaging preview screens, and broadcast video routing systems historically use FLEX 10K FPGAs to combine timing generation, color-space conversion, and gamma correction in a single device. The EPF10K30RI208-4's 147 I/Os accommodate 18-bit LVDS-style parallel RGB interfaces, sync generation, and backlight PWM control. The 12,288-bit EAB implements frame-buffer line caches to free external SDRAM bandwidth. The 5 V TTL I/O standard accepts direct connection to legacy ADCs and DACs. The 0.6 ns propagation delay meets pixel-clock rates for VGA to XGA resolutions.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30RI208-4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30RC208-4 | EPF10K30RC208-4N | EPF10K30EQC208-1 | EPF10K30EQC208-2 | EPF10K30EQC208-3 |
|---|---|---|---|---|---|---|
| Package | 208-RQFP (BFQFP) | 208-RQFP | 208-RQFP | 208-RQFP | 208-RQFP | 208-RQFP |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Cells | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| Total RAM Bits (EAB) | 12,288 | 12,288 | 12,288 | 24,576 | 12,288 | 12,288 |
| User I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -4 | -4 (same) | -4 (same) | -1 (faster) | -2 (faster) | -3 (faster) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| RoHS Compliance | No (SnPb) | No (SnPb) | Yes (lead-free) | No (SnPb) | No (SnPb) | No (SnPb) |
| Operating Temperature | 0 to 70 °C | 0 to 70 °C | 0 to 70 °C | 0 to 70 °C | 0 to 70 °C | 0 to 70 °C |
Principaux différenciateurs
- RoHS-compliant drop-in upgrade via the -4N variant (vs EPF10K30RC208-4 (standard leaded))
- Higher EAB memory density in faster speed grade (vs EPF10K30EQC208-1)
- Industrial temperature grade available on same footprint (vs EPF10K30EQI208-2)
Notes de conception
Estimated: at 125 MHz with all 147 I/O toggling and 75% logic utilization, ICC may reach ~250 mA on the 5 V core. Place one 0.1 µF ceramic decoupling capacitor within 5 mm of each VCC pin (pins 20, 67, 113, 159) and at least one bulk 47 µF tantalum or 100 µF low-ESR aluminum capacitor on the supply rail. Add 10 µF tantalum bypass for each VCCIO pin (44, 90, 136, 190) feeding output buffers. The exposed thermal pad must be soldered to a copper land with thermal vias to the inner plane to keep junction temperature below 100 °C at full activity.
The 208-RQFP gull-wing lead pitch is 0.5 mm; route all signal traces on inner layers with 0.15 mm width and use microvia-in-pad if escape routing requires it. Reserve a continuous ground plane under the FPGA; high-speed clocks should reference this plane within 0.5 mm. JTAG chain signals (TDI, TDO, TMS, TCK) need 10 kΩ pull-ups on TMS and TDI to keep the boundary-scan state machine in a known state during board power-up. Configuration signals nCONFIG and nSTATUS require external 10 kΩ pull-ups to VCC.
Do not interface 3.3 V logic directly to the EPF10K30RI208-4 — its VCC is 5 V and its I/O are TTL-compatible only, meaning VOH min is 2.4 V but VIH min is 2.0 V. A 3.3 V driver sits below VIH in the indeterminate region and may be misread. Use a 74HCT245 or dedicated level translator for 3.3 V buses. Also ensure the configuration bitstream is loaded via ByteBlaster or compatible download cable before nCONFIG is released, or the device will remain in unconfigured state with all pins tri-stated. For hot-swap designs, gate VCC with a load switch controlled by nCONFIG.
Estimated: the 0.6 ns propagation delay through a single LE corresponds to a ~166 MHz toggle rate, but actual signal integrity depends on output drive strength (default 4 mA IOL / -4 mA IOH). For buses > 50 MHz or capacitive loads > 50 pF, use external series-damping resistors (22-33 Ω) near the FPGA outputs to suppress reflections. Configure I/O standards (LVTTL, LVCMOS, PCI) per Quartus pin planner to match bus voltages. Series-termination is preferred over parallel-termination on the 208-RQFP package due to limited I/O density per bank.
Informations de conformité
EPF10K30RI208-4 uses SnPb (tin-lead) finish; not RoHS compliant. The -4N variant is lead-free / RoHS compliant. REACH compliance per Altera product declaration. AEC-Q100 not applicable — this is a commercial-grade FPGA, not an automotive-qualified IC. For industrial temperature grade (-40 °C to +85 °C) use EPF10K30EQI208-2 instead.