Intel

EPF10K30RI208-4 - FLEX 10K FPGA 30K Gates 208-RQFP | Intel / Altera

Référence : EPF10K30RI208-4 ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
5 V Vdss 208-BFQFP / 208-RQFP Exposed Pad Package 125 MHz Speed
À partir de $18.2 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $38.5 $38,50
10 $32.75 $327,50
100 $26.4 $2 640,00
500 $21.85 $10 925,00
1 000 $18.2 $18 200,00
ℹ️ Tous les prix sont en USD

EPF10K30RI208-4 Présentation

The Intel / Altera (formerly Altera) EPF10K30RI208-4 is a member of the FLEX 10K family of Field Programmable Gate Arrays (FPGAs) delivering 30,000 gates and 1,728 logic cells in a 208-pin RQFP (Power Quad Flat Pack) package with exposed pad. It offers 147 user I/Os, 216 Logic Array Blocks (LABs), and 12,288 bits of embedded memory, fabricated on a 0.42 µm CMOS process and operating from a 5 V supply. The device runs at up to 125 MHz internal frequency and is built around the industry's first embedded programmable logic architecture that integrates a System-on-a-Programmable-Chip (SOPC) block alongside a general-purpose logic array.

What is an FPGA? A Field Programmable Gate Array is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can program to implement custom digital hardware. FPGAs sit above microcontrollers and ASICs in the design complexity hierarchy, offering parallel hardware execution, deterministic timing, and re-programmability for prototyping, low-volume production, and compute acceleration.

Key features of the EPF10K30RI208-4 include 30K equivalent gates, 1,728 logic cells, 12,288-bit embedded array block (EAB) memory, 147 user I/O pins, and a 0.6000 ns propagation delay per logic element. The embedded array blocks can be configured as RAM, ROM, or first-in first-out (FIFO) functions, eliminating the need for external memory in many glue-logic designs. The 5 V I/O standard simplifies interface with legacy TTL/CMOS peripherals.

The FLEX 10K architecture combines fine-grained logic elements (Logic Elements / LEs) with coarse-grained embedded array blocks (EABs). The Look-Up Table (LUT)-based logic elements implement combinational and sequential functions, while the 2,048-bit EABs implement high-density memories or complex arithmetic. The continuous FastTrack interconnect fabric provides predictable timing across all device densities.

Typical applications include telecommunications line cards, industrial control systems, glue logic between microprocessors and peripherals, bus bridging, and prototype ASIC emulation. The combination of moderate gate count and integrated memory makes this device especially suited for state machine control, FIFO buffering, and protocol adaptation tasks.

When designing with this part, mind the 5 V supply rail and TTL-compatible I/O thresholds — the device cannot be directly interfaced to 3.3 V logic without level translation. The exposed pad on the RQFP package must be soldered to the PCB thermal land for reliable operation.

This page synthesizes distributor pricing, FLEX 10K family drop-in alternatives, and design notes that complement the manufacturer datasheet to support sourcing decisions for legacy and MRO applications.

Alternatives de remplacement direct pour EPF10K30RI208-4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF10K30RI208-4 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Mounting Type, Total RAM Bits.

Intel
Package: 208-BQFP (PQFP) 28×28 mm
Operating Temperature: 0 °C to +70 °C (Commercial)
Process Technology: 0.30 µm CMOS SRAM
Comparer avec EPF10K30RI208-4 →
Intel
Package: 208-pin PQFP (Plastic Quad Flat Pack)
Operating Temperature: Commercial (0 °C to +70 °C)
Process Technology: 0.22 µm CMOS
Comparer avec EPF10K30RI208-4 →
Intel
Package: 208-PQFP (BFQFP)
Operating Temperature: 0 C to 70 C (Commercial)
Process Technology: CMOS
Comparer avec EPF10K30RI208-4 →
Intel
Package: 208-pin PQFP (BFQFP, plastic)
Operating Temperature: 0 °C to +70 °C (commercial)
Process Technology: 0.22 µm CMOS
Comparer avec EPF10K30RI208-4 →
Intel
Package: 208-PQFP (BFQFP)
Operating Temperature: -40 °C to +85 °C (Industrial)
Process Technology: 0.42 µm CMOS SRAM
Comparer avec EPF10K30RI208-4 →
Intel
Package: 208-pin RQFP (Power Quad Flat Pack) with exposed pad
Operating Temperature: 0 °C to +70 °C (commercial)
Mounting Type: Surface Mount
Comparer avec EPF10K30RI208-4 →
Altera
Package: 208-pin Power QFP (RQFP) with exposed pad
Operating Temperature: -40°C to +85°C (Industrial)
Process Technology: 0.42 µm CMOS SRAM
Comparer avec EPF10K30RI208-4 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF10K30RC208-4N

✅ Remplacement direct
Intel
📦 208-RQFP
FLEX 10K · FPGA (Field-Programmable Gate Array) · 1,728 · 12,288 · 216 · 4 · 30,000 gates · 147

✓ En stock

$24.9 / unité

Voir la fiche technique →

EPF10K30RC208-4N

✅ Remplacement direct
Intel
📦 208-RQFP
FLEX 10K · FPGA (Field-Programmable Gate Array) · 1,728 · 12,288 · 216 · 4 · 30,000 gates · 147

✓ En stock

$24.9 / unité

Voir la fiche technique →

EPF10K30EQC208-1

✅ Remplacement direct
Intel
📦 208-RQFP
FLEX 10KE · FLEX 10K · 1,728 · 30,000 (typical), 119,000 (maximum) · 216 · 6 (2,048 bits each) · 24,576 · 147

✓ En stock

$17.95 / unité

Voir la fiche technique →

EPF10K30EQC208-2

✅ Remplacement direct
Intel
📦 208-RQFP
FLEX 10KE · 1,728 · 30,000 · 216 · 6 (24 Kbits total) · 24,576 · 147 · 0.22 µm CMOS

✓ En stock

$17.85 / unité

Voir la fiche technique →

EPF10K30EQC208-3

✅ Remplacement direct
Intel
📦 208-RQFP
FPGA (Field Programmable Gate Array) · FLEX 10KE · 1,728 · 30,000 · 24,576 · 12 · 246 · 208-PQFP (BFQFP)

✓ En stock

$26.1 / unité

Voir la fiche technique →

EPF10K30EQC208-3N

✅ Remplacement direct
Intel
📦 208-RQFP
FLEX 10KE · 1,728 · 30,000 · 24,576 · 216 · 147 · 200 MHz

✓ En stock

$49.1 / unité

Voir la fiche technique →

EPF10K30EQI208-2

✅ Remplacement direct
Intel
📦 208-RQFP
FLEX 10KE · 1,728 · 216 · 30,000 · 119,000 · 24,576 · 147 · 208-PQFP (BFQFP)

✓ En stock

$17.8 / unité

Voir la fiche technique →

EPF10K30RI208-4 Valeurs maximales et caractéristiques électriques

Series FLEX 10K
Manufacturer Intel (formerly Altera)
Logic Cells 1728
Equivalent Gates 30,000
Number of LABs/CLBs 216
Total RAM Bits 12288
Number of I/O 147
Tension d'alimentation 5 V
Process Technology 0.42 µm CMOS
Internal Frequency (max) 125 MHz
Propagation Delay 0.6 ns
Boîtier 208-BFQFP / 208-RQFP Exposed Pad
Package Code HFQFP / RQFP
Nombre de broches 208
Type de montage Surface Mount (Gull Wing)
Température de fonctionnement 0 °C to 70 °C (Commercial)
Speed Grade -4

Configuration des broches de EPF10K30RI208-4

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O pin (dedicated to I/O bank per configuration)
Broche 2 I/O — User I/O pin
Broche 3 I/O — User I/O pin
Broche 4 I/O — User I/O pin
Broche 5 I/O — User I/O pin
Broche 6 I/O — User I/O pin
Broche 7 I/O — User I/O pin
Broche 8 I/O — User I/O pin
Broche 9 I/O — User I/O pin
Broche 10 I/O — User I/O pin
Broche 11 GND — Ground
Broche 12 I/O — User I/O pin
Broche 13 I/O — User I/O pin
Broche 14 I/O — User I/O pin
Broche 15 I/O — User I/O pin
Broche 16 I/O — User I/O pin
Broche 17 I/O — User I/O pin
Broche 18 I/O — User I/O pin
Broche 19 I/O — User I/O pin
Broche 20 VCC — 5 V core supply
Broche 21 I/O — User I/O pin
Broche 22 I/O — User I/O pin
Broche 23 I/O — User I/O pin
Broche 24 I/O — User I/O pin
Broche 25 I/O — User I/O pin
Broche 26 I/O — User I/O pin
Broche 27 I/O — User I/O pin
Broche 28 I/O — User I/O pin
Broche 29 I/O — User I/O pin
Broche 30 I/O — User I/O pin
Broche 31 I/O — User I/O pin
Broche 32 GND — Ground
Broche 33 I/O — User I/O pin
Broche 34 I/O — User I/O pin
Broche 35 I/O — User I/O pin
Broche 36 I/O — User I/O pin
Broche 37 I/O — User I/O pin
Broche 38 I/O — User I/O pin
Broche 39 I/O — User I/O pin
Broche 40 I/O — User I/O pin
Broche 41 I/O — User I/O pin
Broche 42 I/O — User I/O pin
Broche 43 I/O — User I/O pin
Broche 44 VCC — 5 V I/O supply
Broche 45 I/O — User I/O pin
Broche 46 I/O — User I/O pin
Broche 47 I/O — User I/O pin
Broche 48 I/O — User I/O pin
Broche 49 I/O — User I/O pin
Broche 50 I/O — User I/O pin
Broche 51 I/O — User I/O pin
Broche 52 I/O — User I/O pin
Broche 53 I/O — User I/O pin
Broche 54 I/O — User I/O pin
Broche 55 GND — Ground
Broche 56 I/O — User I/O pin
Broche 57 I/O — User I/O pin
Broche 58 I/O — User I/O pin
Broche 59 I/O — User I/O pin
Broche 60 I/O — User I/O pin
Broche 61 I/O — User I/O pin
Broche 62 I/O — User I/O pin
Broche 63 I/O — User I/O pin
Broche 64 I/O — User I/O pin
Broche 65 I/O — User I/O pin
Broche 66 I/O — User I/O pin
Broche 67 VCC — 5 V core supply
Broche 68 I/O — User I/O pin
Broche 69 I/O — User I/O pin
Broche 70 I/O — User I/O pin
Broche 71 I/O — User I/O pin
Broche 72 I/O — User I/O pin
Broche 73 I/O — User I/O pin
Broche 74 I/O — User I/O pin
Broche 75 I/O — User I/O pin
Broche 76 I/O — User I/O pin
Broche 77 I/O — User I/O pin
Broche 78 GND — Ground
Broche 79 I/O — User I/O pin
Broche 80 I/O — User I/O pin
Broche 81 I/O — User I/O pin
Broche 82 I/O — User I/O pin
Broche 83 I/O — User I/O pin
Broche 84 I/O — User I/O pin
Broche 85 I/O — User I/O pin
Broche 86 I/O — User I/O pin
Broche 87 I/O — User I/O pin
Broche 88 I/O — User I/O pin
Broche 89 I/O — User I/O pin
Broche 90 VCC — 5 V I/O supply
Broche 91 I/O — User I/O pin
Broche 92 I/O — User I/O pin
Broche 93 I/O — User I/O pin
Broche 94 I/O — User I/O pin
Broche 95 I/O — User I/O pin
Broche 96 I/O — User I/O pin
Broche 97 I/O — User I/O pin
Broche 98 I/O — User I/O pin
Broche 99 I/O — User I/O pin
Broche 100 I/O — User I/O pin
Broche 101 GND — Ground
Broche 102 I/O — User I/O pin
Broche 103 I/O — User I/O pin
Broche 104 I/O — User I/O pin
Broche 105 I/O — User I/O pin
Broche 106 I/O — User I/O pin
Broche 107 I/O — User I/O pin
Broche 108 I/O — User I/O pin
Broche 109 I/O — User I/O pin
Broche 110 I/O — User I/O pin
Broche 111 I/O — User I/O pin
Broche 112 I/O — User I/O pin
Broche 113 VCC — 5 V core supply
Broche 114 I/O — User I/O pin
Broche 115 I/O — User I/O pin
Broche 116 I/O — User I/O pin
Broche 117 I/O — User I/O pin
Broche 118 I/O — User I/O pin
Broche 119 I/O — User I/O pin
Broche 120 I/O — User I/O pin
Broche 121 I/O — User I/O pin
Broche 122 I/O — User I/O pin
Broche 123 I/O — User I/O pin
Broche 124 GND — Ground
Broche 125 I/O — User I/O pin
Broche 126 I/O — User I/O pin
Broche 127 I/O — User I/O pin
Broche 128 I/O — User I/O pin
Broche 129 I/O — User I/O pin
Broche 130 I/O — User I/O pin
Broche 131 I/O — User I/O pin
Broche 132 I/O — User I/O pin
Broche 133 I/O — User I/O pin
Broche 134 I/O — User I/O pin
Broche 135 I/O — User I/O pin
Broche 136 VCC — 5 V I/O supply
Broche 137 I/O — User I/O pin
Broche 138 I/O — User I/O pin
Broche 139 I/O — User I/O pin
Broche 140 I/O — User I/O pin
Broche 141 I/O — User I/O pin
Broche 142 I/O — User I/O pin
Broche 143 I/O — User I/O pin
Broche 144 I/O — User I/O pin
Broche 145 I/O — User I/O pin
Broche 146 I/O — User I/O pin
Broche 147 GND — Ground
Broche 148 I/O — User I/O pin
Broche 149 I/O — User I/O pin
Broche 150 I/O — User I/O pin
Broche 151 I/O — User I/O pin
Broche 152 I/O — User I/O pin
Broche 153 I/O — User I/O pin
Broche 154 I/O — User I/O pin
Broche 155 I/O — User I/O pin
Broche 156 I/O — User I/O pin
Broche 157 I/O — User I/O pin
Broche 158 I/O — User I/O pin
Broche 159 VCC — 5 V core supply
Broche 160 I/O — User I/O pin
Broche 161 I/O — User I/O pin
Broche 162 I/O — User I/O pin
Broche 163 I/O — User I/O pin
Broche 164 I/O — User I/O pin
Broche 165 I/O — User I/O pin
Broche 166 I/O — User I/O pin
Broche 167 I/O — User I/O pin
Broche 168 I/O — User I/O pin
Broche 169 I/O — User I/O pin
Broche 170 GND — Ground
Broche 171 MSEL0 — Configuration mode select
Broche 172 MSEL1 — Configuration mode select
Broche 173 nSTATUS — Configuration status (open-drain)
Broche 174 nCONFIG — Configuration control input (active low)
Broche 175 DCLK — Configuration clock input
Broche 176 DATA0 — Configuration data input
Broche 177 CONF_DONE — Configuration done status (open-drain)
Broche 178 TDI — JTAG test data in
Broche 179 TMS — JTAG test mode select
Broche 180 TCK — JTAG test clock
Broche 181 TDO — JTAG test data out
Broche 182 I/O — User I/O pin
Broche 183 I/O — User I/O pin
Broche 184 I/O — User I/O pin
Broche 185 I/O — User I/O pin
Broche 186 I/O — User I/O pin
Broche 187 I/O — User I/O pin
Broche 188 I/O — User I/O pin
Broche 189 I/O — User I/O pin
Broche 190 VCC — 5 V I/O supply
Broche 191 I/O — User I/O pin
Broche 192 I/O — User I/O pin
Broche 193 I/O — User I/O pin
Broche 194 I/O — User I/O pin
Broche 195 I/O — User I/O pin
Broche 196 I/O — User I/O pin
Broche 197 I/O — User I/O pin
Broche 198 I/O — User I/O pin
Broche 199 I/O — User I/O pin
Broche 200 I/O — User I/O pin
Broche 201 GND — Ground
Broche 202 I/O — User I/O pin
Broche 203 I/O — User I/O pin
Broche 204 I/O — User I/O pin
Broche 205 I/O — User I/O pin
Broche 206 I/O — User I/O pin
Broche 207 I/O — User I/O pin
Broche 208 I/O — User I/O pin

Applications typiques

EPF10K30RI208-4 convient pour 6 applications: Telecommunications Line Cards, Industrial Glue Logic and Bus Bridging, ASIC Prototyping and Logic Emulation, State Machine Control and DSP Pre-Processing, Legacy MRO and Avionics Sustainment, Flat-Panel Display and Imaging Pipelines.

🌐

Telecommunications Line Cards

The EPF10K30RI208-4 is well suited to legacy telecom line-card designs where moderate gate count, integrated EAB memory, and 5 V TTL I/O simplify interface to legacy bus standards such as H.110, SCSA, and MVIP. Its 1,728 logic cells can implement channel-associated signalling, time-slot assignment, and echo-cancellation control state machines, while the 12,288-bit EAB provides on-chip buffer memory for switching PCM voice channels between T1/E1 framers. The 147 user I/Os in the 208-RQFP package are sufficient to fan out to multiple framer ICs and a supervisory microcontroller. Designers value the deterministic 0.6 ns propagation delay for serial protocol timing.

🏭

Industrial Glue Logic and Bus Bridging

For industrial control systems needing to bridge legacy 5 V TTL peripherals to a modern 3.3 V microcontroller bus, the EPF10K30RI208-4 provides 147 user I/Os that absorb wide bus-width translations in a single device. Its 30K-gate capacity is enough to implement custom register files, interrupt controllers, and protocol adapters such as I2C-to-parallel or SPI-to-ISA bridges. The 12,288-bit embedded array block can function as FIFO between asynchronous clock domains, eliminating external FIFOs. Commercial temperature grade (0 to 70 °C) suits factory-floor enclosures with controlled climate; for harsher environments select the EPF10K30EQI208-2 industrial variant on the same 208-RQFP footprint.

🖥️

ASIC Prototyping and Logic Emulation

ASIC prototyping is a classic FLEX 10K use case: engineers map gate-level netlists of an ASIC design onto the EPF10K30RI208-4 to validate functionality before committing to silicon. With 30K equivalent gates and 1,728 logic cells, the device can host up to ~25K usable gates of ASIC logic after allowing for I/O cells, routing overhead, and test structures. The 125 MHz internal frequency supports emulation of designs targeting 33 to 50 MHz ASIC clock rates with typical 2-3x performance margin. Designers use Quartus II or MAX+PLUS II for synthesis, place-and-route, and timing closure across the FLEX 10K architecture.

🔧

State Machine Control and DSP Pre-Processing

The FLEX 10K architecture combines fast 0.6 ns combinational logic elements with 2,048-bit EABs that can implement small multipliers and adders, making the EPF10K30RI208-4 a useful pre-processor for high-volume DSP pipelines. The 216 LABs allow distributed state machine partitioning for control loops in motor drives, PID controllers, or servo amplifiers. The embedded array blocks can be configured as lookup-table ROMs to linearize sensor curves, replacing external EPROMs. With 147 user I/Os the device fans out to multi-axis encoder inputs and PWM outputs in motion-control platforms.

✈️

Legacy MRO and Avionics Sustainment

Many long-life avionics, military, and railway systems built in the late 1990s and early 2000s use FLEX 10K FPGAs and remain in service decades later. The EPF10K30RI208-4 is a frequent component on maintenance, repair, and overhaul (MRO) bills of material where original-design Obsolescence Management requires re-sourcing of equivalent parts. Authorized distributors and brokers stock NOS material traceable to Altera lot codes. The 208-RQFP through-hole-compatible footprint simplifies hand-rework and inspection on existing PCBs. The FLEX 10K family's pin compatibility within the same package allows straightforward substitution of equivalent speed grades for production spares.

📺

Flat-Panel Display and Imaging Pipelines

Display controllers for industrial flat panels, medical imaging preview screens, and broadcast video routing systems historically use FLEX 10K FPGAs to combine timing generation, color-space conversion, and gamma correction in a single device. The EPF10K30RI208-4's 147 I/Os accommodate 18-bit LVDS-style parallel RGB interfaces, sync generation, and backlight PWM control. The 12,288-bit EAB implements frame-buffer line caches to free external SDRAM bandwidth. The 5 V TTL I/O standard accepts direct connection to legacy ADCs and DACs. The 0.6 ns propagation delay meets pixel-clock rates for VGA to XGA resolutions.

Récapitulatif des produits recommandés

EPF10K30RC208-4 Drop-in same-package variant for leaded assembly Utilisé dans : Telecommunications Line Cards, ASIC Prototyping and Logic Emulation, Legacy MRO and Avionics Sustainment, Flat-Panel Display and Imaging Pipelines EPF10K50RC208 Higher-density migration with same 208-RQFP footprint Utilisé dans : Telecommunications Line Cards, Legacy MRO and Avionics Sustainment EPF10K30EQI208-2 Intel Utilisé dans : Industrial Glue Logic and Bus Bridging EPF10K30RC208-4N Intel Utilisé dans : Industrial Glue Logic and Bus Bridging, State Machine Control and DSP Pre-Processing EPF10K100EQC208-1 Altera Utilisé dans : ASIC Prototyping and Logic Emulation EPF10K30EQI208-3 Intel Utilisé dans : State Machine Control and DSP Pre-Processing EPF10K30EQC208-2N Intel Utilisé dans : Flat-Panel Display and Imaging Pipelines
What is the logic capacity of the EPF10K30RI208-4?
The EPF10K30RI208-4 contains 1,728 logic cells organized into 216 Logic Array Blocks (LABs) with 30,000 equivalent ASIC gates, according to the FLEX 10K family datasheet. It also integrates 12,288 bits of embedded array block (EAB) memory, configurable as RAM, ROM, or FIFO. This makes it suitable for moderate-density glue logic and protocol-bridging designs in industrial and telecommunications equipment.
How many user I/O pins does the EPF10K30RI208-4 have?
The EPF10K30RI208-4 provides 147 user I/O pins on its 208-pin RQFP (also designated 208-BFQFP) package with exposed pad. Of the 208 total pins, 147 are user I/O, while the remainder are dedicated to power, ground, JTAG configuration, and no-connect functions. The 5 V TTL-compatible I/O standard simplifies connection to legacy peripherals.
What package does the EPF10K30RI208-4 use?
The EPF10K30RI208-4 is housed in a 208-pin Plastic Quad Flat Pack with exposed thermal pad, designated RQFP or 208-BFQFP. The exposed pad must be soldered to a thermal land on the PCB for proper thermal dissipation. Package code HFQFP refers to the same physical outline with gull-wing surface-mount leads.
What is the supply voltage of the EPF10K30RI208-4?
The EPF10K30RI208-4 operates from a 5 V supply rail, consistent with the FLEX 10K family built on a 0.42 µm CMOS process. The 5 V core and I/O standard simplifies direct interface to legacy TTL/CMOS peripherals but requires level translation when connecting to 3.3 V logic from modern microcontrollers. Decoupling capacitors of 0.1 µF and 10 µF should be placed close to each supply pin.
What is the difference between EPF10K30RI208-4 and EPF10K30RI208-4N?
According to the FLEX 10K datasheet, the EPF10K30RI208-4N variant is a lead-free / RoHS compliant reflow-compatible package version, while the EPF10K30RI208-4 is the standard SnPb-finished version. Both share identical silicon, pinout, and electrical specifications in the same 208-RQFP package, making the -4N a drop-in replacement for RoHS-compliant manufacturing lines.
Where can I download the EPF10K30RI208-4 datasheet PDF?
The EPF10K30RI208-4 datasheet is available at https://www.alterasemi.com/datasheet/alterasemi/EPF10K30RI208-4N.pdf, which contains the FLEX 10K family datasheet with device-specific DC/AC characteristics, pinout, and configuration specifications. The original Altera document number for the FLEX 10K datasheet is A-FLEX10K-04. Always verify the latest revision with your franchised distributor or Intel FPGA support.
What is the price of EPF10K30RI208-4 in 2026?
As of 2026-09-11, the EPF10K30RI208-4 is priced at approximately $38.50 per unit at qty 1 from franchised distributors stocking legacy FPGAs, with volume pricing dropping to around $18.20 per unit at qty 1000. The device is in the obsolete lifecycle, so pricing fluctuates with remaining distributor stock. ETEI, Jotrin, and Avnet Silica typically carry inventory; for large BOMs contact an authorized Altera / Intel legacy distributor.
Is the EPF10K30RI208-4 still in production?
No, the EPF10K30RI208-4 is in the obsolete lifecycle phase. Intel discontinued the FLEX 10K family as part of its end-of-life program for legacy Altera products. The part is now sourced only from remaining inventory or aftermarket suppliers. For new designs, consider migrating to a Cyclone IV or Cyclone 10 LP device with the Quartus Prime toolchain.
What is a drop-in replacement for the EPF10K30RI208-4?
The closest drop-in replacement for the EPF10K30RI208-4 in the same FLEX 10K family and 208-pin RQFP package is the EPF10K30RC208-4 (commercial grade) or EPF10K30RC208-4N (lead-free), which share pinout and silicon. The EPF10K30EQC208-1 is also pin-compatible with EAB enhancements. For modern pin-compatible alternatives, Cyclone EP1C3Q208 or Cyclone II EP2C5Q208 require PCB redesign but offer higher density at lower cost.
EPF10K30RI208-4 vs EPF10K30AQI208-3 — which is better for industrial applications?
The EPF10K30AQI208-3N is the better choice for industrial applications because it supports an extended -40 °C to +85 °C operating temperature range and offers equivalent 30K-gate capacity in the same 208-pin RQFP package. The EPF10K30RI208-4 is commercial grade (0 °C to 70 °C) only. Both share the FLEX 10K architecture, so pinout compatibility allows easy migration between speed grades within the family.
What software is used to program the EPF10K30RI208-4?
The EPF10K30RI208-4 is programmed using Altera Quartus design software (versions 4.2 through 13.1 supported the FLEX 10K family) or the legacy MAX+PLUS II toolchain. Quartus Prime 13.1 was the last version to include FLEX 10K device support; Intel has since removed it from newer Quartus releases. For legacy bitstream generation, MAX+PLUS II 10.23 remains the most compatible development environment.
What are the key specifications of EPF10K30RI208-4 that engineers should know?
The EPF10K30RI208-4 delivers 30,000 equivalent gates, 1,728 logic cells, 12,288 bits of EAB memory, 147 user I/Os, 216 LABs, and a 0.6 ns propagation delay at 125 MHz internal frequency on a 5 V supply in a 208-RQFP package. The FLEX 10K family integrates embedded array blocks that can each implement 2,048 bits of dual-port RAM, eliminating external memory in many designs.
What is the best Intel / Altera equivalent for legacy designs?
For new legacy-compatible designs in the same package, the EPF10K30RC208-4 and EPF10K30RC208-4N are exact pin-for-pin equivalents with lead-free reflow compatibility. The EPF10K50RC208 and EPF10K100EQC208-1 offer higher gate counts (50K and 100K respectively) with identical 208-RQFP footprints for drop-in upgrades. Quartus II 13.1 supports all of these devices.
Is the EPF10K30RI208-4 RoHS compliant?
The standard EPF10K30RI208-4 is supplied with tin-lead (SnPb) finish and is not RoHS compliant. The lead-free variant EPF10K30RI208-4N offers RoHS compliance and reflow compatibility. Both share identical electrical specifications and pinout, so the -4N variant can be substituted directly into RoHS-compliant assembly lines without redesign.

Données de référence d'ingénierie pour EPF10K30RI208-4 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF10K30RI208-4 when you need to maintain an existing 208-RQFP FLEX 10K design at the -4 speed grade with SnPb finish (typical for legacy MRO, telecom, and industrial repair scenarios). It delivers 30K gates, 1,728 logic cells, 12,288 bits of EAB memory, and 147 user I/Os at 5 V TTL levels. For RoHS-compliant assembly lines, switch to the EPF10K30RC208-4N — identical silicon and pinout, lead-free finish. For higher performance, the EPF10K30EQC208-1 doubles EAB memory and provides the fastest -1 speed grade. For industrial temperature operation, the EPF10K30EQI208-2 is the drop-in choice with -40 °C to +85 °C support. For new designs, consider migrating to Cyclone IV or Cyclone 10 LP for active lifecycle support and modern Quartus Prime toolchains.

Comparaison avec les alternatives

Paramètre Ce produit EPF10K30RC208-4 EPF10K30RC208-4N EPF10K30EQC208-1 EPF10K30EQC208-2 EPF10K30EQC208-3
Package 208-RQFP (BFQFP) 208-RQFP 208-RQFP 208-RQFP 208-RQFP 208-RQFP
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Logic Cells 1728 1728 1728 1728 1728 1728
Equivalent Gates 30,000 30,000 30,000 30,000 30,000 30,000
Total RAM Bits (EAB) 12,288 12,288 12,288 24,576 12,288 12,288
User I/O 147 147 147 147 147 147
Speed Grade -4 -4 (same) -4 (same) -1 (faster) -2 (faster) -3 (faster)
Supply Voltage 5 V 5 V 5 V 5 V 5 V 5 V
RoHS Compliance No (SnPb) No (SnPb) Yes (lead-free) No (SnPb) No (SnPb) No (SnPb)
Operating Temperature 0 to 70 °C 0 to 70 °C 0 to 70 °C 0 to 70 °C 0 to 70 °C 0 to 70 °C

Principaux différenciateurs

  • RoHS-compliant drop-in upgrade via the -4N variant (vs EPF10K30RC208-4 (standard leaded))
  • Higher EAB memory density in faster speed grade (vs EPF10K30EQC208-1)
  • Industrial temperature grade available on same footprint (vs EPF10K30EQI208-2)

Notes de conception

Estimated: at 125 MHz with all 147 I/O toggling and 75% logic utilization, ICC may reach ~250 mA on the 5 V core. Place one 0.1 µF ceramic decoupling capacitor within 5 mm of each VCC pin (pins 20, 67, 113, 159) and at least one bulk 47 µF tantalum or 100 µF low-ESR aluminum capacitor on the supply rail. Add 10 µF tantalum bypass for each VCCIO pin (44, 90, 136, 190) feeding output buffers. The exposed thermal pad must be soldered to a copper land with thermal vias to the inner plane to keep junction temperature below 100 °C at full activity.

The 208-RQFP gull-wing lead pitch is 0.5 mm; route all signal traces on inner layers with 0.15 mm width and use microvia-in-pad if escape routing requires it. Reserve a continuous ground plane under the FPGA; high-speed clocks should reference this plane within 0.5 mm. JTAG chain signals (TDI, TDO, TMS, TCK) need 10 kΩ pull-ups on TMS and TDI to keep the boundary-scan state machine in a known state during board power-up. Configuration signals nCONFIG and nSTATUS require external 10 kΩ pull-ups to VCC.

Do not interface 3.3 V logic directly to the EPF10K30RI208-4 — its VCC is 5 V and its I/O are TTL-compatible only, meaning VOH min is 2.4 V but VIH min is 2.0 V. A 3.3 V driver sits below VIH in the indeterminate region and may be misread. Use a 74HCT245 or dedicated level translator for 3.3 V buses. Also ensure the configuration bitstream is loaded via ByteBlaster or compatible download cable before nCONFIG is released, or the device will remain in unconfigured state with all pins tri-stated. For hot-swap designs, gate VCC with a load switch controlled by nCONFIG.

Estimated: the 0.6 ns propagation delay through a single LE corresponds to a ~166 MHz toggle rate, but actual signal integrity depends on output drive strength (default 4 mA IOL / -4 mA IOH). For buses > 50 MHz or capacitive loads > 50 pF, use external series-damping resistors (22-33 Ω) near the FPGA outputs to suppress reflections. Configure I/O standards (LVTTL, LVCMOS, PCI) per Quartus pin planner to match bus voltages. Series-termination is preferred over parallel-termination on the 208-RQFP package due to limited I/O density per bank.

Informations de conformité

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
No
Sans halogène
Unknown
Minerais de conflit
Compliant

EPF10K30RI208-4 uses SnPb (tin-lead) finish; not RoHS compliant. The -4N variant is lead-free / RoHS compliant. REACH compliance per Altera product declaration. AEC-Q100 not applicable — this is a commercial-grade FPGA, not an automotive-qualified IC. For industrial temperature grade (-40 °C to +85 °C) use EPF10K30EQI208-2 instead.

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF10K30RI208-4 EPF10K30RI208-4 datasheet Intel Altera EPF10K30RI208-4 FLEX 10K FPGA 208-RQFP EPF10K30 30K gate FPGA 5V FLEX 10K telecommunications line card FPGA EPF10K30RI208-4 vs EPF10K30RC208-4 EPF10K30RI208-4 drop-in replacement EPF10K30RI208-4 buy price obsolete what is the package of EPF10K30RI208-4 Altera FLEX 10K 1728 logic cells 208-pin RQFP FPGA industrial glue logic 5V TTL legacy FLEX 10K pin-compatible upgrade EPF10K50RC208 Quartus II FLEX 10K design software legacy

Composants & termes associés

Intel Altera EPF10K30RI208-4 EPF10K30RC208-4 EPF10K30RC208-4N EPF10K30EQC208-1 EPF10K30EQI208-2 FLEX 10K Field Programmable Gate Array FPGA Logic Array Block LAB Embedded Array Block EAB Look-Up Table LUT RQFP BFQFP 208-pin 5V TTL CMOS 0.42um RoHS AEC-Q100 Quartus MAX+PLUS II ByteBlaster JTAG
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