EPF10K30RI240-4 - FLEX 10K FPGA 30K Gates 1728 Cells 240-RQFP | Intel
Référence : EPF10K30RI240-4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $26.8 | $2 680,00 |
| 500 | $22.4 | $11 200,00 |
| 1 000 | $19.95 | $19 950,00 |
EPF10K30RI240-4 Présentation
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high integration of a gate array with the design flexibility of in-system programmability. Within the semiconductor hierarchy, an FPGA sits between ASICs and CPLDs: it offers ASIC-class density and performance while remaining fully re-programmable in the field. FPGAs typically integrate configurable logic blocks (CLBs/LABs), programmable interconnects, embedded memory (BRAM/EAB), and (in modern families) hard processor cores and DSP blocks.
Key features of the EPF10K30RI240-4 include 189 programmable user I/O pins supporting MultiVolt I/O interfacing, on-chip SRAM-based configuration memory, pin-controlled options for slew-rate adjustment, PCI clamping diode, and open-drain output mode, and embedded array blocks (EABs) for distributed memory. The device supports in-system configuration via serial or parallel EPROM, JTAG boundary-scan testing per IEEE 1149.1, and is offered in a commercial 0 °C to 70 °C operating temperature grade.
Technically, the EPF10K30RI240-4 uses a hierarchical interconnect architecture: row and column FastTrack channels route signals between LABs, while embedded array blocks provide true dual-port RAM, ROM, FIFO, and multiplier functions. The 5 V VCCINT supply and MultiVolt VCCIO rails (3.3 V / 5 V) make it compatible with both 5 V TTL and 3.3 V logic systems, simplifying mixed-voltage board design. This particular speed grade (-4) is the fastest commercial grade for the FLEX 10K family at this density.
Typical applications include telecommunications line cards, industrial control and instrumentation, glue-logic integration for embedded systems, prototyping of ASIC designs, image and signal processing front-ends, and legacy 5 V system upgrades. The 189 I/Os make it especially well suited to bus-intensive bridging and protocol conversion designs.
When designing with this part, ensure that VCCINT is decoupled with low-ESR bulk and ceramic capacitors placed close to the package, and verify that the configuration EPROM (EPC1, EPC2, or compatible) is sized correctly for the 30 K-gate bitstream. The exposed thermal pad must be soldered to a sufficient copper pour for heat dissipation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EPF10K30RI240-4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30RI240-4 (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Family, Process Technology, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30RC240-4
✅ Remplacement direct✓ En stock
$61.75 / unité
Voir la fiche technique →EPF10K30RC240-4N
✅ Remplacement direct✓ En stock
$99.75 / unité
Voir la fiche technique →EPF10K30RC240-3
✅ Remplacement direct✓ En stock
$95 / unité
Voir la fiche technique →EPF10K30RC240-3N
✅ Remplacement direct✓ En stock
$68.5 / unité
Voir la fiche technique →EPF10K50VRI240-4N
✅ Remplacement direct✓ En stock
$49.95 / unité
Voir la fiche technique →EPF10K30AQC240-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$65 / unité
Voir la fiche technique →EPF10K30RI240-4 Valeurs maximales et caractéristiques électriques
| Family | FLEX 10K |
| Typical Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 12 kbit |
| User I/Os | 189 |
| Propagation Delay | 0.6 ns |
| Internal Frequency (max) | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage VCCINT | 5 V |
| MultiVolt I/O (VCCIO) | 3.3 V / 5 V |
| Boîtier | 240-pin RQFP (Power QFP) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 °C to +70 °C (commercial) |
| Configuration Mode | Serial / Parallel EPROM, JTAG |
| Statut RoHS | Non-compliant (legacy 5 V device) |
| Lead-Free | No (SnPb finish on legacy parts) |
Configuration des broches de EPF10K30RI240-4
| Broche 1 | I/O — User I/O pin (bank 1) — programmable input/output |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | VCCINT — 5 V core supply |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Broche 20 | GND — Ground |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | VCCINT — 5 V core supply |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Broche 60 | GND — Ground |
| Broche 61 | CLK0 — Dedicated clock input 0 |
| Broche 62 | CLK1 — Dedicated clock input 1 |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | I/O — User I/O pin (bank 4) |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | VCCINT — 5 V core supply |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O pin (bank 5) |
| Broche 84 | I/O — User I/O pin (bank 5) |
| Broche 85 | I/O — User I/O pin (bank 5) |
| Broche 86 | I/O — User I/O pin (bank 5) |
| Broche 87 | I/O — User I/O pin (bank 5) |
| Broche 88 | I/O — User I/O pin (bank 5) |
| Broche 89 | I/O — User I/O pin (bank 5) |
| Broche 90 | I/O — User I/O pin (bank 5) |
| Broche 91 | I/O — User I/O pin (bank 5) |
| Broche 92 | I/O — User I/O pin (bank 5) |
| Broche 93 | I/O — User I/O pin (bank 5) |
| Broche 94 | I/O — User I/O pin (bank 5) |
| Broche 95 | I/O — User I/O pin (bank 5) |
| Broche 96 | I/O — User I/O pin (bank 5) |
| Broche 97 | I/O — User I/O pin (bank 5) |
| Broche 98 | I/O — User I/O pin (bank 5) |
| Broche 99 | I/O — User I/O pin (bank 5) |
| Broche 100 | I/O — User I/O pin (bank 5) |
| Broche 101 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Broche 102 | GND — Ground |
| Broche 103 | I/O — User I/O pin (bank 6) |
| Broche 104 | I/O — User I/O pin (bank 6) |
| Broche 105 | I/O — User I/O pin (bank 6) |
| Broche 106 | I/O — User I/O pin (bank 6) |
| Broche 107 | I/O — User I/O pin (bank 6) |
| Broche 108 | I/O — User I/O pin (bank 6) |
| Broche 109 | I/O — User I/O pin (bank 6) |
| Broche 110 | I/O — User I/O pin (bank 6) |
| Broche 111 | I/O — User I/O pin (bank 6) |
| Broche 112 | I/O — User I/O pin (bank 6) |
| Broche 113 | I/O — User I/O pin (bank 6) |
| Broche 114 | I/O — User I/O pin (bank 6) |
| Broche 115 | I/O — User I/O pin (bank 6) |
| Broche 116 | I/O — User I/O pin (bank 6) |
| Broche 117 | I/O — User I/O pin (bank 6) |
| Broche 118 | I/O — User I/O pin (bank 6) |
| Broche 119 | I/O — User I/O pin (bank 6) |
| Broche 120 | I/O — User I/O pin (bank 6) |
| Broche 121 | VCCINT — 5 V core supply |
| Broche 122 | GND — Ground |
| Broche 123 | nCONFIG — Configuration control (active-low) |
| Broche 124 | nSTATUS — Configuration status (active-low) |
| Broche 125 | CONF_DONE — Configuration complete (open-drain) |
| Broche 126 | MSEL0 — Configuration mode select 0 |
| Broche 127 | MSEL1 — Configuration mode select 1 |
| Broche 128 | MSEL2 — Configuration mode select 2 |
| Broche 129 | DCLK — Configuration clock |
| Broche 130 | DATA0 — Configuration data input |
| Broche 131 | I/O — User I/O pin (bank 7) |
| Broche 132 | I/O — User I/O pin (bank 7) |
| Broche 133 | I/O — User I/O pin (bank 7) |
| Broche 134 | I/O — User I/O pin (bank 7) |
| Broche 135 | I/O — User I/O pin (bank 7) |
| Broche 136 | I/O — User I/O pin (bank 7) |
| Broche 137 | I/O — User I/O pin (bank 7) |
| Broche 138 | I/O — User I/O pin (bank 7) |
| Broche 139 | I/O — User I/O pin (bank 7) |
| Broche 140 | I/O — User I/O pin (bank 7) |
| Broche 141 | I/O — User I/O pin (bank 7) |
| Broche 142 | I/O — User I/O pin (bank 7) |
| Broche 143 | I/O — User I/O pin (bank 7) |
| Broche 144 | I/O — User I/O pin (bank 7) |
| Broche 145 | I/O — User I/O pin (bank 7) |
| Broche 146 | I/O — User I/O pin (bank 7) |
| Broche 147 | I/O — User I/O pin (bank 7) |
| Broche 148 | I/O — User I/O pin (bank 7) |
| Broche 149 | I/O — User I/O pin (bank 7) |
| Broche 150 | I/O — User I/O pin (bank 7) |
| Broche 151 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Broche 152 | GND — Ground |
| Broche 153 | CLK2 — Dedicated clock input 2 |
| Broche 154 | CLK3 — Dedicated clock input 3 |
| Broche 155 | I/O — User I/O pin (bank 8) |
| Broche 156 | I/O — User I/O pin (bank 8) |
| Broche 157 | I/O — User I/O pin (bank 8) |
| Broche 158 | I/O — User I/O pin (bank 8) |
| Broche 159 | I/O — User I/O pin (bank 8) |
| Broche 160 | I/O — User I/O pin (bank 8) |
| Broche 161 | I/O — User I/O pin (bank 8) |
| Broche 162 | I/O — User I/O pin (bank 8) |
| Broche 163 | I/O — User I/O pin (bank 8) |
| Broche 164 | I/O — User I/O pin (bank 8) |
| Broche 165 | I/O — User I/O pin (bank 8) |
| Broche 166 | I/O — User I/O pin (bank 8) |
| Broche 167 | I/O — User I/O pin (bank 8) |
| Broche 168 | I/O — User I/O pin (bank 8) |
| Broche 169 | I/O — User I/O pin (bank 8) |
| Broche 170 | I/O — User I/O pin (bank 8) |
| Broche 171 | I/O — User I/O pin (bank 8) |
| Broche 172 | I/O — User I/O pin (bank 8) |
| Broche 173 | I/O — User I/O pin (bank 8) |
| Broche 174 | I/O — User I/O pin (bank 8) |
| Broche 175 | I/O — User I/O pin (bank 8) |
| Broche 176 | I/O — User I/O pin (bank 8) |
| Broche 177 | I/O — User I/O pin (bank 8) |
| Broche 178 | I/O — User I/O pin (bank 8) |
| Broche 179 | I/O — User I/O pin (bank 8) |
| Broche 180 | I/O — User I/O pin (bank 8) |
| Broche 181 | VCCINT — 5 V core supply |
| Broche 182 | GND — Ground |
| Broche 183 | TDI — JTAG test data input |
| Broche 184 | TMS — JTAG test mode select |
| Broche 185 | TCK — JTAG test clock |
| Broche 186 | TDO — JTAG test data output |
| Broche 187 | nCE — Chip enable (active-low, for multi-device chain) |
| Broche 188 | I/O — User I/O pin (bank 1) |
| Broche 189 | I/O — User I/O pin (bank 1) |
| Broche 190 | I/O — User I/O pin (bank 1) |
| Broche 191 | I/O — User I/O pin (bank 1) |
| Broche 192 | I/O — User I/O pin (bank 1) |
| Broche 193 | I/O — User I/O pin (bank 1) |
| Broche 194 | I/O — User I/O pin (bank 1) |
| Broche 195 | I/O — User I/O pin (bank 1) |
| Broche 196 | I/O — User I/O pin (bank 1) |
| Broche 197 | I/O — User I/O pin (bank 1) |
| Broche 198 | I/O — User I/O pin (bank 1) |
| Broche 199 | I/O — User I/O pin (bank 1) |
| Broche 200 | I/O — User I/O pin (bank 1) |
| Broche 201 | I/O — User I/O pin (bank 1) |
| Broche 202 | I/O — User I/O pin (bank 1) |
| Broche 203 | I/O — User I/O pin (bank 1) |
| Broche 204 | I/O — User I/O pin (bank 1) |
| Broche 205 | I/O — User I/O pin (bank 1) |
| Broche 206 | I/O — User I/O pin (bank 1) |
| Broche 207 | I/O — User I/O pin (bank 1) |
| Broche 208 | I/O — User I/O pin (bank 1) |
| Broche 209 | I/O — User I/O pin (bank 1) |
| Broche 210 | I/O — User I/O pin (bank 1) |
| Broche 211 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Broche 212 | GND — Ground |
| Broche 213 | I/O — User I/O pin (bank 2) |
| Broche 214 | I/O — User I/O pin (bank 2) |
| Broche 215 | I/O — User I/O pin (bank 2) |
| Broche 216 | I/O — User I/O pin (bank 2) |
| Broche 217 | I/O — User I/O pin (bank 2) |
| Broche 218 | I/O — User I/O pin (bank 2) |
| Broche 219 | I/O — User I/O pin (bank 2) |
| Broche 220 | I/O — User I/O pin (bank 2) |
| Broche 221 | I/O — User I/O pin (bank 2) |
| Broche 222 | I/O — User I/O pin (bank 2) |
| Broche 223 | I/O — User I/O pin (bank 2) |
| Broche 224 | I/O — User I/O pin (bank 2) |
| Broche 225 | I/O — User I/O pin (bank 2) |
| Broche 226 | I/O — User I/O pin (bank 2) |
| Broche 227 | I/O — User I/O pin (bank 2) |
| Broche 228 | I/O — User I/O pin (bank 2) |
| Broche 229 | I/O — User I/O pin (bank 2) |
| Broche 230 | I/O — User I/O pin (bank 2) |
| Broche 231 | I/O — User I/O pin (bank 2) |
| Broche 232 | I/O — User I/O pin (bank 2) |
| Broche 233 | I/O — User I/O pin (bank 2) |
| Broche 234 | I/O — User I/O pin (bank 2) |
| Broche 235 | I/O — User I/O pin (bank 2) |
| Broche 236 | I/O — User I/O pin (bank 2) |
| Broche 237 | I/O — User I/O pin (bank 2) |
| Broche 238 | I/O — User I/O pin (bank 2) |
| Broche 239 | VCCINT — 5 V core supply |
| Broche 240 | GND — Ground / exposed thermal pad bond |
Applications typiques
EPF10K30RI240-4 convient pour 6 applications: Telecommunications Line Cards, Industrial Control and Instrumentation, ASIC Prototyping and Emulation, Glue Logic Integration for Embedded Systems, Image and Signal Processing Front-Ends, Legacy 5 V System Upgrades and Drop-in Replacement.
Telecommunications Line Cards
The EPF10K30RI240-4 is well suited for legacy telecommunications line-card designs because its 189 user I/Os and 1,728 logic cells (30 K typical gates) can absorb bus-aggregation, protocol-conversion, and framing glue logic on a single device, while the 5 V VCCINT and MultiVolt 3.3 V / 5 V I/O rails integrate directly into established 5 V backplane designs. The 12 kbit of embedded array block (EAB) memory supports distributed FIFO buffers between TDM streams. The 240-pin RQFP package with exposed pad provides a robust surface-mount footprint suitable for telecom board assembly, and the 125 MHz internal frequency is sufficient for T1/E1, ISDN, and lower-speed Ethernet bridging. Modern engineers migrating from this part typically route new designs to Cyclone IV/V or Lattice ECP5 equivalents.
Recommandé
Industrial Control and Instrumentation
Industrial control systems benefit from the EPF10K30RI240-4 because its 189 user I/O pins can directly interface to many 24 V opto-isolated sensors, encoder inputs, and PWM outputs through external level shifters, while the 1,728 logic cells implement PID loops, motion-control state machines, and signal-conditioning glue logic. The MultiVolt I/O supports both 5 V and 3.3 V peripheral devices on the same board, reducing component count. The 12 kbit embedded EAB memory provides distributed register banks and lookup tables for calibration data. The commercial 0-70 °C temperature grade suits cabinet-mounted equipment, and the exposed-pad RQFP package handles moderate thermal loads in fan-cooled enclosures. For harsh environments, the -N / industrial-grade variants of the EPF10K30 family extend the temperature range.
Recommandé
ASIC Prototyping and Emulation
The EPF10K30RI240-4 served historically as an ASIC prototyping vehicle because its 30 K-gate density, in-system programmability via JTAG or EPROM, and full 189 I/O visibility allowed engineers to validate RTL designs before committing to mask tooling. The 0.6 ns propagation delay and 125 MHz internal frequency emulate mid-range CMOS ASIC performance, while the EAB-based 12 kbit embedded memory models register files and small RAMs. Design iteration via JTAG reconfiguration shortened development cycles significantly compared to gate-array or cell-based ASIC flows. Modern ASIC prototypes now favor larger FPGAs from the Cyclone or Stratix families, but FLEX 10K parts remain in use for legacy IP validation and educational environments. Pin-compatible migration paths exist within the EPF10K30 family.
Recommandé
Glue Logic Integration for Embedded Systems
Embedded-system motherboards frequently integrate the EPF10K30RI240-4 as a glue-logic consolidation device, replacing dozens of 74-series TTL parts with a single programmable device that handles address decoding, bus arbitration, interrupt prioritization, and custom peripheral interfacing. The 1,728 logic cells easily accommodate complex state machines for bus bridges between microprocessors, memory, and peripherals, while the 189 user I/Os provide ample fan-out for multi-master buses. The 5 V VCCINT and MultiVolt I/O allow direct interfacing to legacy 5 V microcontrollers (8051, 68k) alongside 3.3 V peripherals. EAB-based dual-port RAM enables shared-memory designs between processor and DMA channels. The exposed-pad 240-pin RQFP keeps the design in a single surface-mount component on a 4-layer PCB.
Recommandé
Image and Signal Processing Front-Ends
Front-end image and signal processing systems can leverage the EPF10K30RI240-4 for pixel-pipeline pre-processing, where the 189 user I/Os accept parallel data streams from image sensors or ADC banks, and the 1,728 logic cells implement histogram accumulation, thresholding, or simple FIR filters in hardware. The 12 kbit EAB memory provides line buffers for video-rate processing, and the 125 MHz internal frequency supports standard CIF/VGA pixel rates. The exposed-pad 240-RQFP package simplifies thermal layout in compact camera modules and DSP front-end cards. While insufficient for full HD video pipelines, the part excels at lower-resolution imaging tasks, instrumentation pre-processing, and educational DSP platforms. Modern migrations favor Cyclone IV / Lattice ECP5 for higher DSP throughput.
Recommandé
Legacy 5 V System Upgrades and Drop-in Replacement
Engineers maintaining installed 5 V telecom, industrial, and military systems rely on the EPF10K30RI240-4 because its 240-pin RQFP footprint, 5 V VCCINT supply, and 189 programmable I/Os allow PCB-level replacement of older discrete TTL or gate-array logic with a single in-system-programmable device. The MultiVolt 3.3 V / 5 V I/O also supports bridging to newer 3.3 V peripherals added during incremental upgrades. Stock at distributors like Heisener (~5,808 pieces) supports maintenance and small-rebuild orders, with same-day shipping available. Designers verifying drop-in alternatives should select from the EPF10K30 family (RC240-4, RC240-4N, RI240-4N) which all share the same 240-RQFP pinout. Long-term, Intel recommends migration to Cyclone IV/V or MAX 10 for new designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30RI240-4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30RC240-4 | EPF10K30RC240-4N | EPF10K30RC240-3 | EPF10K30RC240-3N | EPF10K50VRI240-4N |
|---|---|---|---|---|---|---|
| Package | 240-pin RQFP | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 50,000 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
| Embedded Memory (EAB) | 12 kbit | 12 kbit | 12 kbit | 12 kbit | 12 kbit | 20 kbit |
| Speed Grade | -4 (fastest) | -4 (same) | -4 (same) | -3 (slower) | -3 (slower) | -4 (same) |
| Internal Frequency (max) | 125 MHz | 125 MHz | 125 MHz | 100 MHz | 100 MHz | 125 MHz |
| Supply Voltage | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Fastest speed grade in the EPF10K30 family at this package (vs EPF10K30RC240-3N)
- Industrial / lead-free finish option within the same family (vs EPF10K30RC240-4N)
- Direct FLEX 10K family pin-compatible migration to higher density (vs EPF10K50VRI240-4N)
Notes de conception
Estimated: at a typical design utilization of 60% logic cells toggling at 50 MHz with 5 V VCCINT, the EPF10K30RI240-4 core draws approximately 200-300 mA. Place one 100 µF tantalum bulk capacitor plus 0.1 µF and 0.01 µF ceramic decoupling caps adjacent to each VCCINT pin pair. VCCIO pins each require their own 0.1 µF ceramic decoupling cap to ground; VCCINT/VCCIO planes must be continuous and uninterrupted to avoid supply sag during high I/O switching events. The exposed thermal pad must be soldered to a copper pour connected to GND for mechanical and thermal relief.
The 240-pin RQFP package has 0.5 mm pitch gull-wing leads; route all signals on inner layers with the top layer reserved for short, direct breakout traces from the package. Use a 4-layer PCB stack-up with dedicated VCCINT (5 V), VCCIO (3.3 V or 5 V), GND, and signal layers. Keep configuration clock (DCLK) and JTAG (TCK, TMS, TDI, TDO) traces short and isolated from high-speed switching I/O. The exposed pad must have thermal vias to the internal GND plane for proper heat dissipation — at least nine 0.3 mm thermal vias are recommended.
Configuration failure is the most common EPF10K30RI240-4 board bring-up issue: verify that the configuration EPROM (EPC1, EPC2, EPC4, or compatible) is sized correctly for the 30 K-gate bitstream, that MSEL0/MSEL1/MSEL2 are strapped to the correct mode, and that nCONFIG is held low during power-up ramp before being released. JTAG chain integrity must be verified with the Altera Byteblaster or USB-Blaster before any configuration is attempted. The 5 V VCCINT must ramp monotonically; if the supply rises slowly, the device may enter an undefined configuration state requiring a power-cycle reset.
Informations de conformité
Legacy 5 V Altera / Intel FLEX 10K family part — non-RoHS due to SnPb finish on the -4 (commercial) grade. The -N suffix variants (EPF10K30RC240-4N, EPF10K30RC240-3N) offer lead-free finishes for RoHS compliance. AEC-Q100 not applicable for FPGAs in this family — not automotive qualified.