EPF10K30RI240-4 - FLEX 10K FPGA 30K Gates 1728 Cells 240-RQFP | Intel
부품 번호: EPF10K30RI240-4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.2 | $332.00 |
| 100 | $26.8 | $2,680.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $19.95 | $19,950.00 |
EPF10K30RI240-4 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high integration of a gate array with the design flexibility of in-system programmability. Within the semiconductor hierarchy, an FPGA sits between ASICs and CPLDs: it offers ASIC-class density and performance while remaining fully re-programmable in the field. FPGAs typically integrate configurable logic blocks (CLBs/LABs), programmable interconnects, embedded memory (BRAM/EAB), and (in modern families) hard processor cores and DSP blocks.
Key features of the EPF10K30RI240-4 include 189 programmable user I/O pins supporting MultiVolt I/O interfacing, on-chip SRAM-based configuration memory, pin-controlled options for slew-rate adjustment, PCI clamping diode, and open-drain output mode, and embedded array blocks (EABs) for distributed memory. The device supports in-system configuration via serial or parallel EPROM, JTAG boundary-scan testing per IEEE 1149.1, and is offered in a commercial 0 °C to 70 °C operating temperature grade.
Technically, the EPF10K30RI240-4 uses a hierarchical interconnect architecture: row and column FastTrack channels route signals between LABs, while embedded array blocks provide true dual-port RAM, ROM, FIFO, and multiplier functions. The 5 V VCCINT supply and MultiVolt VCCIO rails (3.3 V / 5 V) make it compatible with both 5 V TTL and 3.3 V logic systems, simplifying mixed-voltage board design. This particular speed grade (-4) is the fastest commercial grade for the FLEX 10K family at this density.
Typical applications include telecommunications line cards, industrial control and instrumentation, glue-logic integration for embedded systems, prototyping of ASIC designs, image and signal processing front-ends, and legacy 5 V system upgrades. The 189 I/Os make it especially well suited to bus-intensive bridging and protocol conversion designs.
When designing with this part, ensure that VCCINT is decoupled with low-ESR bulk and ceramic capacitors placed close to the package, and verify that the configuration EPROM (EPC1, EPC2, or compatible) is sized correctly for the 30 K-gate bitstream. The exposed thermal pad must be soldered to a sufficient copper pour for heat dissipation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EPF10K30RI240-4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30RI240-4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Family, Process Technology, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K30RC240-4
✅ 드롭인✓ 재고 있음
$61.75 / 개
데이터시트 보기 →EPF10K30RC240-4N
✅ 드롭인✓ 재고 있음
$99.75 / 개
데이터시트 보기 →EPF10K30RC240-3
✅ 드롭인✓ 재고 있음
$95 / 개
데이터시트 보기 →EPF10K30RC240-3N
✅ 드롭인✓ 재고 있음
$68.5 / 개
데이터시트 보기 →EPF10K50VRI240-4N
✅ 드롭인✓ 재고 있음
$49.95 / 개
데이터시트 보기 →EPF10K30AQC240-1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$65 / 개
데이터시트 보기 →EPF10K30RI240-4 최대 정격 & 전기적 특성
| Family | FLEX 10K |
| Typical Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 12 kbit |
| User I/Os | 189 |
| Propagation Delay | 0.6 ns |
| Internal Frequency (max) | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage VCCINT | 5 V |
| MultiVolt I/O (VCCIO) | 3.3 V / 5 V |
| 패키지 | 240-pin RQFP (Power QFP) with exposed pad |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 °C to +70 °C (commercial) |
| Configuration Mode | Serial / Parallel EPROM, JTAG |
| RoHS 상태 | Non-compliant (legacy 5 V device) |
| Lead-Free | No (SnPb finish on legacy parts) |
EPF10K30RI240-4 핀 구성
| 핀 1 | I/O — User I/O pin (bank 1) — programmable input/output |
| 핀 2 | I/O — User I/O pin (bank 1) |
| 핀 3 | I/O — User I/O pin (bank 1) |
| 핀 4 | I/O — User I/O pin (bank 1) |
| 핀 5 | VCCINT — 5 V core supply |
| 핀 6 | GND — Ground |
| 핀 7 | I/O — User I/O pin (bank 1) |
| 핀 8 | I/O — User I/O pin (bank 1) |
| 핀 9 | I/O — User I/O pin (bank 1) |
| 핀 10 | I/O — User I/O pin (bank 1) |
| 핀 11 | I/O — User I/O pin (bank 1) |
| 핀 12 | I/O — User I/O pin (bank 1) |
| 핀 13 | I/O — User I/O pin (bank 1) |
| 핀 14 | I/O — User I/O pin (bank 1) |
| 핀 15 | I/O — User I/O pin (bank 1) |
| 핀 16 | I/O — User I/O pin (bank 1) |
| 핀 17 | I/O — User I/O pin (bank 1) |
| 핀 18 | I/O — User I/O pin (bank 1) |
| 핀 19 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| 핀 20 | GND — Ground |
| 핀 21 | I/O — User I/O pin (bank 2) |
| 핀 22 | I/O — User I/O pin (bank 2) |
| 핀 23 | I/O — User I/O pin (bank 2) |
| 핀 24 | I/O — User I/O pin (bank 2) |
| 핀 25 | I/O — User I/O pin (bank 2) |
| 핀 26 | I/O — User I/O pin (bank 2) |
| 핀 27 | I/O — User I/O pin (bank 2) |
| 핀 28 | I/O — User I/O pin (bank 2) |
| 핀 29 | I/O — User I/O pin (bank 2) |
| 핀 30 | I/O — User I/O pin (bank 2) |
| 핀 31 | I/O — User I/O pin (bank 2) |
| 핀 32 | I/O — User I/O pin (bank 2) |
| 핀 33 | I/O — User I/O pin (bank 2) |
| 핀 34 | I/O — User I/O pin (bank 2) |
| 핀 35 | I/O — User I/O pin (bank 2) |
| 핀 36 | I/O — User I/O pin (bank 2) |
| 핀 37 | I/O — User I/O pin (bank 2) |
| 핀 38 | I/O — User I/O pin (bank 2) |
| 핀 39 | VCCINT — 5 V core supply |
| 핀 40 | GND — Ground |
| 핀 41 | I/O — User I/O pin (bank 3) |
| 핀 42 | I/O — User I/O pin (bank 3) |
| 핀 43 | I/O — User I/O pin (bank 3) |
| 핀 44 | I/O — User I/O pin (bank 3) |
| 핀 45 | I/O — User I/O pin (bank 3) |
| 핀 46 | I/O — User I/O pin (bank 3) |
| 핀 47 | I/O — User I/O pin (bank 3) |
| 핀 48 | I/O — User I/O pin (bank 3) |
| 핀 49 | I/O — User I/O pin (bank 3) |
| 핀 50 | I/O — User I/O pin (bank 3) |
| 핀 51 | I/O — User I/O pin (bank 3) |
| 핀 52 | I/O — User I/O pin (bank 3) |
| 핀 53 | I/O — User I/O pin (bank 3) |
| 핀 54 | I/O — User I/O pin (bank 3) |
| 핀 55 | I/O — User I/O pin (bank 3) |
| 핀 56 | I/O — User I/O pin (bank 3) |
| 핀 57 | I/O — User I/O pin (bank 3) |
| 핀 58 | I/O — User I/O pin (bank 3) |
| 핀 59 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| 핀 60 | GND — Ground |
| 핀 61 | CLK0 — Dedicated clock input 0 |
| 핀 62 | CLK1 — Dedicated clock input 1 |
| 핀 63 | I/O — User I/O pin (bank 4) |
| 핀 64 | I/O — User I/O pin (bank 4) |
| 핀 65 | I/O — User I/O pin (bank 4) |
| 핀 66 | I/O — User I/O pin (bank 4) |
| 핀 67 | I/O — User I/O pin (bank 4) |
| 핀 68 | I/O — User I/O pin (bank 4) |
| 핀 69 | I/O — User I/O pin (bank 4) |
| 핀 70 | I/O — User I/O pin (bank 4) |
| 핀 71 | I/O — User I/O pin (bank 4) |
| 핀 72 | I/O — User I/O pin (bank 4) |
| 핀 73 | I/O — User I/O pin (bank 4) |
| 핀 74 | I/O — User I/O pin (bank 4) |
| 핀 75 | I/O — User I/O pin (bank 4) |
| 핀 76 | I/O — User I/O pin (bank 4) |
| 핀 77 | I/O — User I/O pin (bank 4) |
| 핀 78 | I/O — User I/O pin (bank 4) |
| 핀 79 | I/O — User I/O pin (bank 4) |
| 핀 80 | I/O — User I/O pin (bank 4) |
| 핀 81 | VCCINT — 5 V core supply |
| 핀 82 | GND — Ground |
| 핀 83 | I/O — User I/O pin (bank 5) |
| 핀 84 | I/O — User I/O pin (bank 5) |
| 핀 85 | I/O — User I/O pin (bank 5) |
| 핀 86 | I/O — User I/O pin (bank 5) |
| 핀 87 | I/O — User I/O pin (bank 5) |
| 핀 88 | I/O — User I/O pin (bank 5) |
| 핀 89 | I/O — User I/O pin (bank 5) |
| 핀 90 | I/O — User I/O pin (bank 5) |
| 핀 91 | I/O — User I/O pin (bank 5) |
| 핀 92 | I/O — User I/O pin (bank 5) |
| 핀 93 | I/O — User I/O pin (bank 5) |
| 핀 94 | I/O — User I/O pin (bank 5) |
| 핀 95 | I/O — User I/O pin (bank 5) |
| 핀 96 | I/O — User I/O pin (bank 5) |
| 핀 97 | I/O — User I/O pin (bank 5) |
| 핀 98 | I/O — User I/O pin (bank 5) |
| 핀 99 | I/O — User I/O pin (bank 5) |
| 핀 100 | I/O — User I/O pin (bank 5) |
| 핀 101 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| 핀 102 | GND — Ground |
| 핀 103 | I/O — User I/O pin (bank 6) |
| 핀 104 | I/O — User I/O pin (bank 6) |
| 핀 105 | I/O — User I/O pin (bank 6) |
| 핀 106 | I/O — User I/O pin (bank 6) |
| 핀 107 | I/O — User I/O pin (bank 6) |
| 핀 108 | I/O — User I/O pin (bank 6) |
| 핀 109 | I/O — User I/O pin (bank 6) |
| 핀 110 | I/O — User I/O pin (bank 6) |
| 핀 111 | I/O — User I/O pin (bank 6) |
| 핀 112 | I/O — User I/O pin (bank 6) |
| 핀 113 | I/O — User I/O pin (bank 6) |
| 핀 114 | I/O — User I/O pin (bank 6) |
| 핀 115 | I/O — User I/O pin (bank 6) |
| 핀 116 | I/O — User I/O pin (bank 6) |
| 핀 117 | I/O — User I/O pin (bank 6) |
| 핀 118 | I/O — User I/O pin (bank 6) |
| 핀 119 | I/O — User I/O pin (bank 6) |
| 핀 120 | I/O — User I/O pin (bank 6) |
| 핀 121 | VCCINT — 5 V core supply |
| 핀 122 | GND — Ground |
| 핀 123 | nCONFIG — Configuration control (active-low) |
| 핀 124 | nSTATUS — Configuration status (active-low) |
| 핀 125 | CONF_DONE — Configuration complete (open-drain) |
| 핀 126 | MSEL0 — Configuration mode select 0 |
| 핀 127 | MSEL1 — Configuration mode select 1 |
| 핀 128 | MSEL2 — Configuration mode select 2 |
| 핀 129 | DCLK — Configuration clock |
| 핀 130 | DATA0 — Configuration data input |
| 핀 131 | I/O — User I/O pin (bank 7) |
| 핀 132 | I/O — User I/O pin (bank 7) |
| 핀 133 | I/O — User I/O pin (bank 7) |
| 핀 134 | I/O — User I/O pin (bank 7) |
| 핀 135 | I/O — User I/O pin (bank 7) |
| 핀 136 | I/O — User I/O pin (bank 7) |
| 핀 137 | I/O — User I/O pin (bank 7) |
| 핀 138 | I/O — User I/O pin (bank 7) |
| 핀 139 | I/O — User I/O pin (bank 7) |
| 핀 140 | I/O — User I/O pin (bank 7) |
| 핀 141 | I/O — User I/O pin (bank 7) |
| 핀 142 | I/O — User I/O pin (bank 7) |
| 핀 143 | I/O — User I/O pin (bank 7) |
| 핀 144 | I/O — User I/O pin (bank 7) |
| 핀 145 | I/O — User I/O pin (bank 7) |
| 핀 146 | I/O — User I/O pin (bank 7) |
| 핀 147 | I/O — User I/O pin (bank 7) |
| 핀 148 | I/O — User I/O pin (bank 7) |
| 핀 149 | I/O — User I/O pin (bank 7) |
| 핀 150 | I/O — User I/O pin (bank 7) |
| 핀 151 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| 핀 152 | GND — Ground |
| 핀 153 | CLK2 — Dedicated clock input 2 |
| 핀 154 | CLK3 — Dedicated clock input 3 |
| 핀 155 | I/O — User I/O pin (bank 8) |
| 핀 156 | I/O — User I/O pin (bank 8) |
| 핀 157 | I/O — User I/O pin (bank 8) |
| 핀 158 | I/O — User I/O pin (bank 8) |
| 핀 159 | I/O — User I/O pin (bank 8) |
| 핀 160 | I/O — User I/O pin (bank 8) |
| 핀 161 | I/O — User I/O pin (bank 8) |
| 핀 162 | I/O — User I/O pin (bank 8) |
| 핀 163 | I/O — User I/O pin (bank 8) |
| 핀 164 | I/O — User I/O pin (bank 8) |
| 핀 165 | I/O — User I/O pin (bank 8) |
| 핀 166 | I/O — User I/O pin (bank 8) |
| 핀 167 | I/O — User I/O pin (bank 8) |
| 핀 168 | I/O — User I/O pin (bank 8) |
| 핀 169 | I/O — User I/O pin (bank 8) |
| 핀 170 | I/O — User I/O pin (bank 8) |
| 핀 171 | I/O — User I/O pin (bank 8) |
| 핀 172 | I/O — User I/O pin (bank 8) |
| 핀 173 | I/O — User I/O pin (bank 8) |
| 핀 174 | I/O — User I/O pin (bank 8) |
| 핀 175 | I/O — User I/O pin (bank 8) |
| 핀 176 | I/O — User I/O pin (bank 8) |
| 핀 177 | I/O — User I/O pin (bank 8) |
| 핀 178 | I/O — User I/O pin (bank 8) |
| 핀 179 | I/O — User I/O pin (bank 8) |
| 핀 180 | I/O — User I/O pin (bank 8) |
| 핀 181 | VCCINT — 5 V core supply |
| 핀 182 | GND — Ground |
| 핀 183 | TDI — JTAG test data input |
| 핀 184 | TMS — JTAG test mode select |
| 핀 185 | TCK — JTAG test clock |
| 핀 186 | TDO — JTAG test data output |
| 핀 187 | nCE — Chip enable (active-low, for multi-device chain) |
| 핀 188 | I/O — User I/O pin (bank 1) |
| 핀 189 | I/O — User I/O pin (bank 1) |
| 핀 190 | I/O — User I/O pin (bank 1) |
| 핀 191 | I/O — User I/O pin (bank 1) |
| 핀 192 | I/O — User I/O pin (bank 1) |
| 핀 193 | I/O — User I/O pin (bank 1) |
| 핀 194 | I/O — User I/O pin (bank 1) |
| 핀 195 | I/O — User I/O pin (bank 1) |
| 핀 196 | I/O — User I/O pin (bank 1) |
| 핀 197 | I/O — User I/O pin (bank 1) |
| 핀 198 | I/O — User I/O pin (bank 1) |
| 핀 199 | I/O — User I/O pin (bank 1) |
| 핀 200 | I/O — User I/O pin (bank 1) |
| 핀 201 | I/O — User I/O pin (bank 1) |
| 핀 202 | I/O — User I/O pin (bank 1) |
| 핀 203 | I/O — User I/O pin (bank 1) |
| 핀 204 | I/O — User I/O pin (bank 1) |
| 핀 205 | I/O — User I/O pin (bank 1) |
| 핀 206 | I/O — User I/O pin (bank 1) |
| 핀 207 | I/O — User I/O pin (bank 1) |
| 핀 208 | I/O — User I/O pin (bank 1) |
| 핀 209 | I/O — User I/O pin (bank 1) |
| 핀 210 | I/O — User I/O pin (bank 1) |
| 핀 211 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| 핀 212 | GND — Ground |
| 핀 213 | I/O — User I/O pin (bank 2) |
| 핀 214 | I/O — User I/O pin (bank 2) |
| 핀 215 | I/O — User I/O pin (bank 2) |
| 핀 216 | I/O — User I/O pin (bank 2) |
| 핀 217 | I/O — User I/O pin (bank 2) |
| 핀 218 | I/O — User I/O pin (bank 2) |
| 핀 219 | I/O — User I/O pin (bank 2) |
| 핀 220 | I/O — User I/O pin (bank 2) |
| 핀 221 | I/O — User I/O pin (bank 2) |
| 핀 222 | I/O — User I/O pin (bank 2) |
| 핀 223 | I/O — User I/O pin (bank 2) |
| 핀 224 | I/O — User I/O pin (bank 2) |
| 핀 225 | I/O — User I/O pin (bank 2) |
| 핀 226 | I/O — User I/O pin (bank 2) |
| 핀 227 | I/O — User I/O pin (bank 2) |
| 핀 228 | I/O — User I/O pin (bank 2) |
| 핀 229 | I/O — User I/O pin (bank 2) |
| 핀 230 | I/O — User I/O pin (bank 2) |
| 핀 231 | I/O — User I/O pin (bank 2) |
| 핀 232 | I/O — User I/O pin (bank 2) |
| 핀 233 | I/O — User I/O pin (bank 2) |
| 핀 234 | I/O — User I/O pin (bank 2) |
| 핀 235 | I/O — User I/O pin (bank 2) |
| 핀 236 | I/O — User I/O pin (bank 2) |
| 핀 237 | I/O — User I/O pin (bank 2) |
| 핀 238 | I/O — User I/O pin (bank 2) |
| 핀 239 | VCCINT — 5 V core supply |
| 핀 240 | GND — Ground / exposed thermal pad bond |
일반적인 애플리케이션
EPF10K30RI240-4 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Industrial Control and Instrumentation, ASIC Prototyping and Emulation, Glue Logic Integration for Embedded Systems, Image and Signal Processing Front-Ends, Legacy 5 V System Upgrades and Drop-in Replacement.
Telecommunications Line Cards
The EPF10K30RI240-4 is well suited for legacy telecommunications line-card designs because its 189 user I/Os and 1,728 logic cells (30 K typical gates) can absorb bus-aggregation, protocol-conversion, and framing glue logic on a single device, while the 5 V VCCINT and MultiVolt 3.3 V / 5 V I/O rails integrate directly into established 5 V backplane designs. The 12 kbit of embedded array block (EAB) memory supports distributed FIFO buffers between TDM streams. The 240-pin RQFP package with exposed pad provides a robust surface-mount footprint suitable for telecom board assembly, and the 125 MHz internal frequency is sufficient for T1/E1, ISDN, and lower-speed Ethernet bridging. Modern engineers migrating from this part typically route new designs to Cyclone IV/V or Lattice ECP5 equivalents.
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Industrial Control and Instrumentation
Industrial control systems benefit from the EPF10K30RI240-4 because its 189 user I/O pins can directly interface to many 24 V opto-isolated sensors, encoder inputs, and PWM outputs through external level shifters, while the 1,728 logic cells implement PID loops, motion-control state machines, and signal-conditioning glue logic. The MultiVolt I/O supports both 5 V and 3.3 V peripheral devices on the same board, reducing component count. The 12 kbit embedded EAB memory provides distributed register banks and lookup tables for calibration data. The commercial 0-70 °C temperature grade suits cabinet-mounted equipment, and the exposed-pad RQFP package handles moderate thermal loads in fan-cooled enclosures. For harsh environments, the -N / industrial-grade variants of the EPF10K30 family extend the temperature range.
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ASIC Prototyping and Emulation
The EPF10K30RI240-4 served historically as an ASIC prototyping vehicle because its 30 K-gate density, in-system programmability via JTAG or EPROM, and full 189 I/O visibility allowed engineers to validate RTL designs before committing to mask tooling. The 0.6 ns propagation delay and 125 MHz internal frequency emulate mid-range CMOS ASIC performance, while the EAB-based 12 kbit embedded memory models register files and small RAMs. Design iteration via JTAG reconfiguration shortened development cycles significantly compared to gate-array or cell-based ASIC flows. Modern ASIC prototypes now favor larger FPGAs from the Cyclone or Stratix families, but FLEX 10K parts remain in use for legacy IP validation and educational environments. Pin-compatible migration paths exist within the EPF10K30 family.
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Glue Logic Integration for Embedded Systems
Embedded-system motherboards frequently integrate the EPF10K30RI240-4 as a glue-logic consolidation device, replacing dozens of 74-series TTL parts with a single programmable device that handles address decoding, bus arbitration, interrupt prioritization, and custom peripheral interfacing. The 1,728 logic cells easily accommodate complex state machines for bus bridges between microprocessors, memory, and peripherals, while the 189 user I/Os provide ample fan-out for multi-master buses. The 5 V VCCINT and MultiVolt I/O allow direct interfacing to legacy 5 V microcontrollers (8051, 68k) alongside 3.3 V peripherals. EAB-based dual-port RAM enables shared-memory designs between processor and DMA channels. The exposed-pad 240-pin RQFP keeps the design in a single surface-mount component on a 4-layer PCB.
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Image and Signal Processing Front-Ends
Front-end image and signal processing systems can leverage the EPF10K30RI240-4 for pixel-pipeline pre-processing, where the 189 user I/Os accept parallel data streams from image sensors or ADC banks, and the 1,728 logic cells implement histogram accumulation, thresholding, or simple FIR filters in hardware. The 12 kbit EAB memory provides line buffers for video-rate processing, and the 125 MHz internal frequency supports standard CIF/VGA pixel rates. The exposed-pad 240-RQFP package simplifies thermal layout in compact camera modules and DSP front-end cards. While insufficient for full HD video pipelines, the part excels at lower-resolution imaging tasks, instrumentation pre-processing, and educational DSP platforms. Modern migrations favor Cyclone IV / Lattice ECP5 for higher DSP throughput.
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Legacy 5 V System Upgrades and Drop-in Replacement
Engineers maintaining installed 5 V telecom, industrial, and military systems rely on the EPF10K30RI240-4 because its 240-pin RQFP footprint, 5 V VCCINT supply, and 189 programmable I/Os allow PCB-level replacement of older discrete TTL or gate-array logic with a single in-system-programmable device. The MultiVolt 3.3 V / 5 V I/O also supports bridging to newer 3.3 V peripherals added during incremental upgrades. Stock at distributors like Heisener (~5,808 pieces) supports maintenance and small-rebuild orders, with same-day shipping available. Designers verifying drop-in alternatives should select from the EPF10K30 family (RC240-4, RC240-4N, RI240-4N) which all share the same 240-RQFP pinout. Long-term, Intel recommends migration to Cyclone IV/V or MAX 10 for new designs.
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추천 제품 요약
엔지니어링 참조 데이터: EPF10K30RI240-4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K30RC240-4 | EPF10K30RC240-4N | EPF10K30RC240-3 | EPF10K30RC240-3N | EPF10K50VRI240-4N |
|---|---|---|---|---|---|---|
| Package | 240-pin RQFP | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 50,000 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
| Embedded Memory (EAB) | 12 kbit | 12 kbit | 12 kbit | 12 kbit | 12 kbit | 20 kbit |
| Speed Grade | -4 (fastest) | -4 (same) | -4 (same) | -3 (slower) | -3 (slower) | -4 (same) |
| Internal Frequency (max) | 125 MHz | 125 MHz | 125 MHz | 100 MHz | 100 MHz | 125 MHz |
| Supply Voltage | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Fastest speed grade in the EPF10K30 family at this package (vs EPF10K30RC240-3N)
- Industrial / lead-free finish option within the same family (vs EPF10K30RC240-4N)
- Direct FLEX 10K family pin-compatible migration to higher density (vs EPF10K50VRI240-4N)
설계 노트
Estimated: at a typical design utilization of 60% logic cells toggling at 50 MHz with 5 V VCCINT, the EPF10K30RI240-4 core draws approximately 200-300 mA. Place one 100 µF tantalum bulk capacitor plus 0.1 µF and 0.01 µF ceramic decoupling caps adjacent to each VCCINT pin pair. VCCIO pins each require their own 0.1 µF ceramic decoupling cap to ground; VCCINT/VCCIO planes must be continuous and uninterrupted to avoid supply sag during high I/O switching events. The exposed thermal pad must be soldered to a copper pour connected to GND for mechanical and thermal relief.
The 240-pin RQFP package has 0.5 mm pitch gull-wing leads; route all signals on inner layers with the top layer reserved for short, direct breakout traces from the package. Use a 4-layer PCB stack-up with dedicated VCCINT (5 V), VCCIO (3.3 V or 5 V), GND, and signal layers. Keep configuration clock (DCLK) and JTAG (TCK, TMS, TDI, TDO) traces short and isolated from high-speed switching I/O. The exposed pad must have thermal vias to the internal GND plane for proper heat dissipation — at least nine 0.3 mm thermal vias are recommended.
Configuration failure is the most common EPF10K30RI240-4 board bring-up issue: verify that the configuration EPROM (EPC1, EPC2, EPC4, or compatible) is sized correctly for the 30 K-gate bitstream, that MSEL0/MSEL1/MSEL2 are strapped to the correct mode, and that nCONFIG is held low during power-up ramp before being released. JTAG chain integrity must be verified with the Altera Byteblaster or USB-Blaster before any configuration is attempted. The 5 V VCCINT must ramp monotonically; if the supply rises slowly, the device may enter an undefined configuration state requiring a power-cycle reset.
규정 준수 정보
Legacy 5 V Altera / Intel FLEX 10K family part — non-RoHS due to SnPb finish on the -4 (commercial) grade. The -N suffix variants (EPF10K30RC240-4N, EPF10K30RC240-3N) offer lead-free finishes for RoHS compliance. AEC-Q100 not applicable for FPGAs in this family — not automotive qualified.
