EPF10K30RI240-4 - FLEX 10K FPGA 30K Gates 1728 Cells 240-RQFP | Intel
N.º da peça: EPF10K30RI240-4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $26.8 | $2.680,00 |
| 500 | $22.4 | $11.200,00 |
| 1.000 | $19.95 | $19.950,00 |
EPF10K30RI240-4 Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high integration of a gate array with the design flexibility of in-system programmability. Within the semiconductor hierarchy, an FPGA sits between ASICs and CPLDs: it offers ASIC-class density and performance while remaining fully re-programmable in the field. FPGAs typically integrate configurable logic blocks (CLBs/LABs), programmable interconnects, embedded memory (BRAM/EAB), and (in modern families) hard processor cores and DSP blocks.
Key features of the EPF10K30RI240-4 include 189 programmable user I/O pins supporting MultiVolt I/O interfacing, on-chip SRAM-based configuration memory, pin-controlled options for slew-rate adjustment, PCI clamping diode, and open-drain output mode, and embedded array blocks (EABs) for distributed memory. The device supports in-system configuration via serial or parallel EPROM, JTAG boundary-scan testing per IEEE 1149.1, and is offered in a commercial 0 °C to 70 °C operating temperature grade.
Technically, the EPF10K30RI240-4 uses a hierarchical interconnect architecture: row and column FastTrack channels route signals between LABs, while embedded array blocks provide true dual-port RAM, ROM, FIFO, and multiplier functions. The 5 V VCCINT supply and MultiVolt VCCIO rails (3.3 V / 5 V) make it compatible with both 5 V TTL and 3.3 V logic systems, simplifying mixed-voltage board design. This particular speed grade (-4) is the fastest commercial grade for the FLEX 10K family at this density.
Typical applications include telecommunications line cards, industrial control and instrumentation, glue-logic integration for embedded systems, prototyping of ASIC designs, image and signal processing front-ends, and legacy 5 V system upgrades. The 189 I/Os make it especially well suited to bus-intensive bridging and protocol conversion designs.
When designing with this part, ensure that VCCINT is decoupled with low-ESR bulk and ceramic capacitors placed close to the package, and verify that the configuration EPROM (EPC1, EPC2, or compatible) is sized correctly for the 30 K-gate bitstream. The exposed thermal pad must be soldered to a sufficient copper pour for heat dissipation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EPF10K30RI240-4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K30RI240-4 (mesmo formato e footprint) — diferindo em Package, RoHS Status, Family, Process Technology, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K30RC240-4
✅ Drop-In✓ Em estoque
$61.75 / unidade
Ver ficha técnica →EPF10K30RC240-4N
✅ Drop-In✓ Em estoque
$99.75 / unidade
Ver ficha técnica →EPF10K30RC240-3
✅ Drop-In✓ Em estoque
$95 / unidade
Ver ficha técnica →EPF10K30RC240-3N
✅ Drop-In✓ Em estoque
$68.5 / unidade
Ver ficha técnica →EPF10K50VRI240-4N
✅ Drop-In✓ Em estoque
$49.95 / unidade
Ver ficha técnica →EPF10K30AQC240-1
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$65 / unidade
Ver ficha técnica →EPF10K30RI240-4 Classificações máximas e características elétricas
| Family | FLEX 10K |
| Typical Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 12 kbit |
| User I/Os | 189 |
| Propagation Delay | 0.6 ns |
| Internal Frequency (max) | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage VCCINT | 5 V |
| MultiVolt I/O (VCCIO) | 3.3 V / 5 V |
| Encapsulamento | 240-pin RQFP (Power QFP) with exposed pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 °C to +70 °C (commercial) |
| Configuration Mode | Serial / Parallel EPROM, JTAG |
| Status RoHS | Non-compliant (legacy 5 V device) |
| Lead-Free | No (SnPb finish on legacy parts) |
Configuração de pinos do EPF10K30RI240-4
| Pino 1 | I/O — User I/O pin (bank 1) — programmable input/output |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | VCCINT — 5 V core supply |
| Pino 6 | GND — Ground |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | I/O — User I/O pin (bank 1) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | I/O — User I/O pin (bank 1) |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pino 20 | GND — Ground |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | I/O — User I/O pin (bank 2) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | I/O — User I/O pin (bank 2) |
| Pino 39 | VCCINT — 5 V core supply |
| Pino 40 | GND — Ground |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | I/O — User I/O pin (bank 3) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | I/O — User I/O pin (bank 3) |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | I/O — User I/O pin (bank 3) |
| Pino 59 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pino 60 | GND — Ground |
| Pino 61 | CLK0 — Dedicated clock input 0 |
| Pino 62 | CLK1 — Dedicated clock input 1 |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | I/O — User I/O pin (bank 4) |
| Pino 66 | I/O — User I/O pin (bank 4) |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | I/O — User I/O pin (bank 4) |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | I/O — User I/O pin (bank 4) |
| Pino 79 | I/O — User I/O pin (bank 4) |
| Pino 80 | I/O — User I/O pin (bank 4) |
| Pino 81 | VCCINT — 5 V core supply |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O pin (bank 5) |
| Pino 84 | I/O — User I/O pin (bank 5) |
| Pino 85 | I/O — User I/O pin (bank 5) |
| Pino 86 | I/O — User I/O pin (bank 5) |
| Pino 87 | I/O — User I/O pin (bank 5) |
| Pino 88 | I/O — User I/O pin (bank 5) |
| Pino 89 | I/O — User I/O pin (bank 5) |
| Pino 90 | I/O — User I/O pin (bank 5) |
| Pino 91 | I/O — User I/O pin (bank 5) |
| Pino 92 | I/O — User I/O pin (bank 5) |
| Pino 93 | I/O — User I/O pin (bank 5) |
| Pino 94 | I/O — User I/O pin (bank 5) |
| Pino 95 | I/O — User I/O pin (bank 5) |
| Pino 96 | I/O — User I/O pin (bank 5) |
| Pino 97 | I/O — User I/O pin (bank 5) |
| Pino 98 | I/O — User I/O pin (bank 5) |
| Pino 99 | I/O — User I/O pin (bank 5) |
| Pino 100 | I/O — User I/O pin (bank 5) |
| Pino 101 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pino 102 | GND — Ground |
| Pino 103 | I/O — User I/O pin (bank 6) |
| Pino 104 | I/O — User I/O pin (bank 6) |
| Pino 105 | I/O — User I/O pin (bank 6) |
| Pino 106 | I/O — User I/O pin (bank 6) |
| Pino 107 | I/O — User I/O pin (bank 6) |
| Pino 108 | I/O — User I/O pin (bank 6) |
| Pino 109 | I/O — User I/O pin (bank 6) |
| Pino 110 | I/O — User I/O pin (bank 6) |
| Pino 111 | I/O — User I/O pin (bank 6) |
| Pino 112 | I/O — User I/O pin (bank 6) |
| Pino 113 | I/O — User I/O pin (bank 6) |
| Pino 114 | I/O — User I/O pin (bank 6) |
| Pino 115 | I/O — User I/O pin (bank 6) |
| Pino 116 | I/O — User I/O pin (bank 6) |
| Pino 117 | I/O — User I/O pin (bank 6) |
| Pino 118 | I/O — User I/O pin (bank 6) |
| Pino 119 | I/O — User I/O pin (bank 6) |
| Pino 120 | I/O — User I/O pin (bank 6) |
| Pino 121 | VCCINT — 5 V core supply |
| Pino 122 | GND — Ground |
| Pino 123 | nCONFIG — Configuration control (active-low) |
| Pino 124 | nSTATUS — Configuration status (active-low) |
| Pino 125 | CONF_DONE — Configuration complete (open-drain) |
| Pino 126 | MSEL0 — Configuration mode select 0 |
| Pino 127 | MSEL1 — Configuration mode select 1 |
| Pino 128 | MSEL2 — Configuration mode select 2 |
| Pino 129 | DCLK — Configuration clock |
| Pino 130 | DATA0 — Configuration data input |
| Pino 131 | I/O — User I/O pin (bank 7) |
| Pino 132 | I/O — User I/O pin (bank 7) |
| Pino 133 | I/O — User I/O pin (bank 7) |
| Pino 134 | I/O — User I/O pin (bank 7) |
| Pino 135 | I/O — User I/O pin (bank 7) |
| Pino 136 | I/O — User I/O pin (bank 7) |
| Pino 137 | I/O — User I/O pin (bank 7) |
| Pino 138 | I/O — User I/O pin (bank 7) |
| Pino 139 | I/O — User I/O pin (bank 7) |
| Pino 140 | I/O — User I/O pin (bank 7) |
| Pino 141 | I/O — User I/O pin (bank 7) |
| Pino 142 | I/O — User I/O pin (bank 7) |
| Pino 143 | I/O — User I/O pin (bank 7) |
| Pino 144 | I/O — User I/O pin (bank 7) |
| Pino 145 | I/O — User I/O pin (bank 7) |
| Pino 146 | I/O — User I/O pin (bank 7) |
| Pino 147 | I/O — User I/O pin (bank 7) |
| Pino 148 | I/O — User I/O pin (bank 7) |
| Pino 149 | I/O — User I/O pin (bank 7) |
| Pino 150 | I/O — User I/O pin (bank 7) |
| Pino 151 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pino 152 | GND — Ground |
| Pino 153 | CLK2 — Dedicated clock input 2 |
| Pino 154 | CLK3 — Dedicated clock input 3 |
| Pino 155 | I/O — User I/O pin (bank 8) |
| Pino 156 | I/O — User I/O pin (bank 8) |
| Pino 157 | I/O — User I/O pin (bank 8) |
| Pino 158 | I/O — User I/O pin (bank 8) |
| Pino 159 | I/O — User I/O pin (bank 8) |
| Pino 160 | I/O — User I/O pin (bank 8) |
| Pino 161 | I/O — User I/O pin (bank 8) |
| Pino 162 | I/O — User I/O pin (bank 8) |
| Pino 163 | I/O — User I/O pin (bank 8) |
| Pino 164 | I/O — User I/O pin (bank 8) |
| Pino 165 | I/O — User I/O pin (bank 8) |
| Pino 166 | I/O — User I/O pin (bank 8) |
| Pino 167 | I/O — User I/O pin (bank 8) |
| Pino 168 | I/O — User I/O pin (bank 8) |
| Pino 169 | I/O — User I/O pin (bank 8) |
| Pino 170 | I/O — User I/O pin (bank 8) |
| Pino 171 | I/O — User I/O pin (bank 8) |
| Pino 172 | I/O — User I/O pin (bank 8) |
| Pino 173 | I/O — User I/O pin (bank 8) |
| Pino 174 | I/O — User I/O pin (bank 8) |
| Pino 175 | I/O — User I/O pin (bank 8) |
| Pino 176 | I/O — User I/O pin (bank 8) |
| Pino 177 | I/O — User I/O pin (bank 8) |
| Pino 178 | I/O — User I/O pin (bank 8) |
| Pino 179 | I/O — User I/O pin (bank 8) |
| Pino 180 | I/O — User I/O pin (bank 8) |
| Pino 181 | VCCINT — 5 V core supply |
| Pino 182 | GND — Ground |
| Pino 183 | TDI — JTAG test data input |
| Pino 184 | TMS — JTAG test mode select |
| Pino 185 | TCK — JTAG test clock |
| Pino 186 | TDO — JTAG test data output |
| Pino 187 | nCE — Chip enable (active-low, for multi-device chain) |
| Pino 188 | I/O — User I/O pin (bank 1) |
| Pino 189 | I/O — User I/O pin (bank 1) |
| Pino 190 | I/O — User I/O pin (bank 1) |
| Pino 191 | I/O — User I/O pin (bank 1) |
| Pino 192 | I/O — User I/O pin (bank 1) |
| Pino 193 | I/O — User I/O pin (bank 1) |
| Pino 194 | I/O — User I/O pin (bank 1) |
| Pino 195 | I/O — User I/O pin (bank 1) |
| Pino 196 | I/O — User I/O pin (bank 1) |
| Pino 197 | I/O — User I/O pin (bank 1) |
| Pino 198 | I/O — User I/O pin (bank 1) |
| Pino 199 | I/O — User I/O pin (bank 1) |
| Pino 200 | I/O — User I/O pin (bank 1) |
| Pino 201 | I/O — User I/O pin (bank 1) |
| Pino 202 | I/O — User I/O pin (bank 1) |
| Pino 203 | I/O — User I/O pin (bank 1) |
| Pino 204 | I/O — User I/O pin (bank 1) |
| Pino 205 | I/O — User I/O pin (bank 1) |
| Pino 206 | I/O — User I/O pin (bank 1) |
| Pino 207 | I/O — User I/O pin (bank 1) |
| Pino 208 | I/O — User I/O pin (bank 1) |
| Pino 209 | I/O — User I/O pin (bank 1) |
| Pino 210 | I/O — User I/O pin (bank 1) |
| Pino 211 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pino 212 | GND — Ground |
| Pino 213 | I/O — User I/O pin (bank 2) |
| Pino 214 | I/O — User I/O pin (bank 2) |
| Pino 215 | I/O — User I/O pin (bank 2) |
| Pino 216 | I/O — User I/O pin (bank 2) |
| Pino 217 | I/O — User I/O pin (bank 2) |
| Pino 218 | I/O — User I/O pin (bank 2) |
| Pino 219 | I/O — User I/O pin (bank 2) |
| Pino 220 | I/O — User I/O pin (bank 2) |
| Pino 221 | I/O — User I/O pin (bank 2) |
| Pino 222 | I/O — User I/O pin (bank 2) |
| Pino 223 | I/O — User I/O pin (bank 2) |
| Pino 224 | I/O — User I/O pin (bank 2) |
| Pino 225 | I/O — User I/O pin (bank 2) |
| Pino 226 | I/O — User I/O pin (bank 2) |
| Pino 227 | I/O — User I/O pin (bank 2) |
| Pino 228 | I/O — User I/O pin (bank 2) |
| Pino 229 | I/O — User I/O pin (bank 2) |
| Pino 230 | I/O — User I/O pin (bank 2) |
| Pino 231 | I/O — User I/O pin (bank 2) |
| Pino 232 | I/O — User I/O pin (bank 2) |
| Pino 233 | I/O — User I/O pin (bank 2) |
| Pino 234 | I/O — User I/O pin (bank 2) |
| Pino 235 | I/O — User I/O pin (bank 2) |
| Pino 236 | I/O — User I/O pin (bank 2) |
| Pino 237 | I/O — User I/O pin (bank 2) |
| Pino 238 | I/O — User I/O pin (bank 2) |
| Pino 239 | VCCINT — 5 V core supply |
| Pino 240 | GND — Ground / exposed thermal pad bond |
Aplicações típicas
EPF10K30RI240-4 é adequado para 6 aplicaçãos: Telecommunications Line Cards, Industrial Control and Instrumentation, ASIC Prototyping and Emulation, Glue Logic Integration for Embedded Systems, Image and Signal Processing Front-Ends, Legacy 5 V System Upgrades and Drop-in Replacement.
Telecommunications Line Cards
The EPF10K30RI240-4 is well suited for legacy telecommunications line-card designs because its 189 user I/Os and 1,728 logic cells (30 K typical gates) can absorb bus-aggregation, protocol-conversion, and framing glue logic on a single device, while the 5 V VCCINT and MultiVolt 3.3 V / 5 V I/O rails integrate directly into established 5 V backplane designs. The 12 kbit of embedded array block (EAB) memory supports distributed FIFO buffers between TDM streams. The 240-pin RQFP package with exposed pad provides a robust surface-mount footprint suitable for telecom board assembly, and the 125 MHz internal frequency is sufficient for T1/E1, ISDN, and lower-speed Ethernet bridging. Modern engineers migrating from this part typically route new designs to Cyclone IV/V or Lattice ECP5 equivalents.
Recomendado
Industrial Control and Instrumentation
Industrial control systems benefit from the EPF10K30RI240-4 because its 189 user I/O pins can directly interface to many 24 V opto-isolated sensors, encoder inputs, and PWM outputs through external level shifters, while the 1,728 logic cells implement PID loops, motion-control state machines, and signal-conditioning glue logic. The MultiVolt I/O supports both 5 V and 3.3 V peripheral devices on the same board, reducing component count. The 12 kbit embedded EAB memory provides distributed register banks and lookup tables for calibration data. The commercial 0-70 °C temperature grade suits cabinet-mounted equipment, and the exposed-pad RQFP package handles moderate thermal loads in fan-cooled enclosures. For harsh environments, the -N / industrial-grade variants of the EPF10K30 family extend the temperature range.
Recomendado
ASIC Prototyping and Emulation
The EPF10K30RI240-4 served historically as an ASIC prototyping vehicle because its 30 K-gate density, in-system programmability via JTAG or EPROM, and full 189 I/O visibility allowed engineers to validate RTL designs before committing to mask tooling. The 0.6 ns propagation delay and 125 MHz internal frequency emulate mid-range CMOS ASIC performance, while the EAB-based 12 kbit embedded memory models register files and small RAMs. Design iteration via JTAG reconfiguration shortened development cycles significantly compared to gate-array or cell-based ASIC flows. Modern ASIC prototypes now favor larger FPGAs from the Cyclone or Stratix families, but FLEX 10K parts remain in use for legacy IP validation and educational environments. Pin-compatible migration paths exist within the EPF10K30 family.
Recomendado
Glue Logic Integration for Embedded Systems
Embedded-system motherboards frequently integrate the EPF10K30RI240-4 as a glue-logic consolidation device, replacing dozens of 74-series TTL parts with a single programmable device that handles address decoding, bus arbitration, interrupt prioritization, and custom peripheral interfacing. The 1,728 logic cells easily accommodate complex state machines for bus bridges between microprocessors, memory, and peripherals, while the 189 user I/Os provide ample fan-out for multi-master buses. The 5 V VCCINT and MultiVolt I/O allow direct interfacing to legacy 5 V microcontrollers (8051, 68k) alongside 3.3 V peripherals. EAB-based dual-port RAM enables shared-memory designs between processor and DMA channels. The exposed-pad 240-pin RQFP keeps the design in a single surface-mount component on a 4-layer PCB.
Recomendado
Image and Signal Processing Front-Ends
Front-end image and signal processing systems can leverage the EPF10K30RI240-4 for pixel-pipeline pre-processing, where the 189 user I/Os accept parallel data streams from image sensors or ADC banks, and the 1,728 logic cells implement histogram accumulation, thresholding, or simple FIR filters in hardware. The 12 kbit EAB memory provides line buffers for video-rate processing, and the 125 MHz internal frequency supports standard CIF/VGA pixel rates. The exposed-pad 240-RQFP package simplifies thermal layout in compact camera modules and DSP front-end cards. While insufficient for full HD video pipelines, the part excels at lower-resolution imaging tasks, instrumentation pre-processing, and educational DSP platforms. Modern migrations favor Cyclone IV / Lattice ECP5 for higher DSP throughput.
Recomendado
Legacy 5 V System Upgrades and Drop-in Replacement
Engineers maintaining installed 5 V telecom, industrial, and military systems rely on the EPF10K30RI240-4 because its 240-pin RQFP footprint, 5 V VCCINT supply, and 189 programmable I/Os allow PCB-level replacement of older discrete TTL or gate-array logic with a single in-system-programmable device. The MultiVolt 3.3 V / 5 V I/O also supports bridging to newer 3.3 V peripherals added during incremental upgrades. Stock at distributors like Heisener (~5,808 pieces) supports maintenance and small-rebuild orders, with same-day shipping available. Designers verifying drop-in alternatives should select from the EPF10K30 family (RC240-4, RC240-4N, RI240-4N) which all share the same 240-RQFP pinout. Long-term, Intel recommends migration to Cyclone IV/V or MAX 10 for new designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K30RI240-4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K30RC240-4 | EPF10K30RC240-4N | EPF10K30RC240-3 | EPF10K30RC240-3N | EPF10K50VRI240-4N |
|---|---|---|---|---|---|---|
| Package | 240-pin RQFP | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 50,000 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
| Embedded Memory (EAB) | 12 kbit | 12 kbit | 12 kbit | 12 kbit | 12 kbit | 20 kbit |
| Speed Grade | -4 (fastest) | -4 (same) | -4 (same) | -3 (slower) | -3 (slower) | -4 (same) |
| Internal Frequency (max) | 125 MHz | 125 MHz | 125 MHz | 100 MHz | 100 MHz | 125 MHz |
| Supply Voltage | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Fastest speed grade in the EPF10K30 family at this package (vs EPF10K30RC240-3N)
- Industrial / lead-free finish option within the same family (vs EPF10K30RC240-4N)
- Direct FLEX 10K family pin-compatible migration to higher density (vs EPF10K50VRI240-4N)
Notas de projeto
Estimated: at a typical design utilization of 60% logic cells toggling at 50 MHz with 5 V VCCINT, the EPF10K30RI240-4 core draws approximately 200-300 mA. Place one 100 µF tantalum bulk capacitor plus 0.1 µF and 0.01 µF ceramic decoupling caps adjacent to each VCCINT pin pair. VCCIO pins each require their own 0.1 µF ceramic decoupling cap to ground; VCCINT/VCCIO planes must be continuous and uninterrupted to avoid supply sag during high I/O switching events. The exposed thermal pad must be soldered to a copper pour connected to GND for mechanical and thermal relief.
The 240-pin RQFP package has 0.5 mm pitch gull-wing leads; route all signals on inner layers with the top layer reserved for short, direct breakout traces from the package. Use a 4-layer PCB stack-up with dedicated VCCINT (5 V), VCCIO (3.3 V or 5 V), GND, and signal layers. Keep configuration clock (DCLK) and JTAG (TCK, TMS, TDI, TDO) traces short and isolated from high-speed switching I/O. The exposed pad must have thermal vias to the internal GND plane for proper heat dissipation — at least nine 0.3 mm thermal vias are recommended.
Configuration failure is the most common EPF10K30RI240-4 board bring-up issue: verify that the configuration EPROM (EPC1, EPC2, EPC4, or compatible) is sized correctly for the 30 K-gate bitstream, that MSEL0/MSEL1/MSEL2 are strapped to the correct mode, and that nCONFIG is held low during power-up ramp before being released. JTAG chain integrity must be verified with the Altera Byteblaster or USB-Blaster before any configuration is attempted. The 5 V VCCINT must ramp monotonically; if the supply rises slowly, the device may enter an undefined configuration state requiring a power-cycle reset.
Informações de conformidade
Legacy 5 V Altera / Intel FLEX 10K family part — non-RoHS due to SnPb finish on the -4 (commercial) grade. The -N suffix variants (EPF10K30RC240-4N, EPF10K30RC240-3N) offer lead-free finishes for RoHS compliance. AEC-Q100 not applicable for FPGAs in this family — not automotive qualified.