EPF6016QC208-2 - FLEX 6000 FPGA, 16K Gates, 208-PQFP | Intel EPF6016QC208-2 par Intel - composant électronique
Intel

EPF6016QC208-2 - FLEX 6000 FPGA, 16K Gates, 208-PQFP | Intel

Référence : EPF6016QC208-2 ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
5 V Vdss 208-BFQFP / 208-PQFP (28x28 mm) Package 125 MHz Speed
À partir de $10.85 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $18.5 $18,50
10 $16.2 $162,00
100 $14.1 $1 410,00
500 $12.4 $6 200,00
1 000 $10.85 $10 850,00
ℹ️ Tous les prix sont en USD
Voir la fiche technique (PDF) Voir les alternatives

EPF6016QC208-2 Présentation

The Intel EPF6016QC208-2 is a member of the FLEX 6000 family of Field-Programmable Gate Arrays (FPGAs), delivering 16,000 usable gates, 1,320 logic elements, and 132 logic array blocks (LABs) in a 208-pin Plastic Quad Flat Pack (PQFP) package. Fabricated on a 0.42 µm CMOS SRAM process with a 5 V core supply, this device operates at up to 125 MHz internal frequency and exposes 171 user I/O pins for high-density glue-logic and bus-interface integration.

A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic function is defined after manufacturing through a configuration bitstream stored in SRAM. FPGAs belong to the broader class of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-driven processors in the design flexibility spectrum. Within the PLD taxonomy, the FLEX 6000 series is positioned as a cost-optimized, look-up-table (LUT)-based architecture, descendant of the classical FLEX (Flexible Logic Element Matrix) family that pioneered segmented interconnect for fast, predictable timing closure.

Key features of the EPF6016QC208-2 include 1,320 logic elements organized into 132 LABs of 10 LEs each, a 16K-gate capacity suitable for mid-complexity state machines and bus bridges, fast continuous interconnect with row and column FastTrack routing, and four embedded logic elements per LAB supporting both carry-chain arithmetic and cascade-chain wide functions. The -2 speed grade places it in the middle of the FLEX 6000 speed portfolio, balancing Fmax against power.

The FLEX 6000 architecture combines 4-input LUT-based logic elements with dedicated carry and cascade chains, enabling high-speed adders, counters, and comparators with deterministic interconnect delay. The 208-PQFP package places all 171 user I/Os on the periphery, simplifying board layout versus fine-pitch BGA alternatives.

Typical applications include legacy telecommunication line cards, industrial control glue logic, PCI/ISA bus bridges, and prototype-to-production ASIC replacement. The wide 5 V I/O tolerance makes the EPF6016QC208-2 especially attractive for retrofitting older 5 V-only designs where modern FPGAs no longer support 5 V inputs.

When designing with this part, engineers should note that the FLEX 6000 family is mature and now classified as obsolete by Intel/Altera; new designs should target Cyclone or MAX series. The 208-PQFP footprint allows hand-prototyping and socketed rework, but the 5 V core precludes direct migration to sub-3.3 V platforms without level translation.

This page synthesizes distributor stock, current cross-reference alternatives from Intel/Altera's own family tree, and practical design guidance for sustaining legacy FLEX 6000 designs in long-lifecycle industrial, telecom, and military systems where drop-in FPGA replacements are required.

Alternatives de remplacement direct pour EPF6016QC208-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6016QC208-2 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Configuration Memory, Speed Grade.

Intel
Package: 208-BFQFP (PQFP)
Process Technology: CMOS, 5.0 V tolerant
Operating Temperature: 0 °C to +85 °C (commercial)
Comparer avec EPF6016QC208-2 →
Altera
Package: 208-pin PQFP / BFQFP (also called 208-Pin Plastic Quad Flat Pack)
Process Technology: 0.42 µm CMOS
Operating Temperature: 0 °C to +85 °C (commercial)
Comparer avec EPF6016QC208-2 →
Intel
Package: 208-pin PQFP (BFQFP) - Plastic Quad Flat Pack, gull-wing
Process Technology: 0.42 µm CMOS
Operating Temperature: 0°C to 85°C (commercial)
Comparer avec EPF6016QC208-2 →
Intel
Process Technology: 0.35 um CMOS, 5 V tolerant
Operating Temperature: 0 C to +85 C (Commercial)
Configuration Memory: Volatile SRAM (external configuration device required)
Comparer avec EPF6016QC208-2 →
Intel
Package: 208-PQFP (28x28 mm)
Process Technology: 0.42 µm CMOS
Operating Temperature: 0 °C to 85 °C (Commercial)
Comparer avec EPF6016QC208-2 →
Intel
Configuration Memory: SRAM (volatile, requires external PROM)
Speed Grade: -3 (highest speed in family)
Comparer avec EPF6016QC208-2 →
Altera
Package: PQFP-208 (Plastic Quad Flat Pack)
Process Technology: 0.42 um CMOS (SRAM-based)
Operating Temperature: 0C to 70C (commercial)
Comparer avec EPF6016QC208-2 →
Altera
Package: 208-pin PQFP (QFP-208)
Process Technology: 5.0 V SRAM CMOS
Speed Grade: -3 (slowest commercial)
Comparer avec EPF6016QC208-2 →
Altera
Package: 208-pin PQFP (Power Quad Flat Pack)
Process Technology: 0.42 µm CMOS, SRAM-based
Operating Temperature: 0 °C to +85 °C (commercial)
Comparer avec EPF6016QC208-2 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6016QC208-3

✅ Remplacement direct
Altera
📦 208-PQFP
FLEX 6000 · 16,000 · 1,320 · 132 · 171 · 5.0 V SRAM CMOS · 5.0 V · 3.3 V / 5.0 V tolerant

✓ En stock

$19.91 / unité

Voir la fiche technique →

EPF6016QC208

✅ Remplacement direct
Altera
📦 208-PQFP
FLEX 6000 · 16,000 gates · 1,320 LEs · 132 LABs (10 LEs per LAB) · 171 I/O pins · 125 MHz · 0.42 um CMOS (SRAM-based) · 5.0 V

✓ En stock

$23.5 / unité

Voir la fiche technique →

EPF6016AQC208-2

✅ Remplacement direct
Altera
📦 208-PQFP
FLEX 6000 · 16,000 · 1,320 · 132 · 171 · 166.67 MHz · 0.42 µm CMOS · 3.3 V

✓ En stock

$19.4 / unité

Voir la fiche technique →

EPF6016AQC208-3

✅ Remplacement direct
Intel
📦 208-PQFP
FLEX 6000 · FLEX 6000 (SRAM-based FPGA) · 16,000 · 1,320 · 132 · 171 · 142.86 MHz

✓ En stock

$19.2 / unité

Voir la fiche technique →

EPF6016AQC208-3N

✅ Remplacement direct
Intel
📦 208-PQFP
FLEX 6000 · 1,320 · 16,000 · 132 · 171 · 142.86 MHz · 3.3 V · 0.42 µm CMOS

✓ En stock

$31.2 / unité

Voir la fiche technique →

EPF6016AQC208-3S

✅ Remplacement direct
Intel
📦 208-PQFP
FLEX 6000 · Field-Programmable Gate Array (FPGA) · 16,000 · 1,320 · 132 · 171 · 208-PQFP (Plastic Quad Flat Pack) · FQFP, 28x28 mm, 0.5 mm pitch

✓ En stock

$27.9 / unité

Voir la fiche technique →

EPF6016AQC208-2N

✅ Remplacement direct
Intel
📦 208-PQFP
FLEX 6000 · 16,000 · 1,320 · 132 · 171 · 166.67 MHz · 0.42 µm CMOS · 3.3 V

✓ En stock

$13.85 / unité

Voir la fiche technique →

EPF6016AQC208-1

✅ Remplacement direct
Intel
📦 208-PQFP
FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 171 · 208-BFQFP (PQFP) · -1

✓ En stock

$42.1 / unité

Voir la fiche technique →

EPF6016QC208-2 Valeurs maximales et caractéristiques électriques

Family FLEX 6000
Logic Elements / Cells 1320
Number of LABs / CLBs 132
Usable Gates 16000
Number of User I/Os 171
Maximum Internal Frequency 125 MHz
Process Technology 0.42 µm CMOS SRAM
Supply Voltage (Core) 5 V
Température de fonctionnement 0 °C to +85 °C (TJ)
Boîtier 208-BFQFP / 208-PQFP (28x28 mm)
Type de montage Surface Mount (SMD/SMT)
Speed Grade -2
Number of Terminals 208
Terminal Form Gull Wing

Configuration des broches de EPF6016QC208-2

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O (bank dependent)
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Broche 5 VCCINT — Core supply 5 V
Broche 6 I/O — User I/O
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Broche 9 I/O — User I/O
Broche 10 GND — Ground
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Broche 25 VCCIO — I/O bank supply
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Broche 42 VCCINT — Core supply 5 V
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Broche 50 GND — Ground
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Broche 106 VCCINT — Core supply 5 V
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Broche 116 GND — Ground
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Broche 165 VCCIO — I/O bank supply
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Broche 172 TMS — JTAG test mode select
Broche 173 TCK — JTAG test clock
Broche 174 TDI — JTAG test data in
Broche 175 TDO — JTAG test data out
Broche 176 nCONFIG — Configuration control (active low)
Broche 177 nSTATUS — Configuration status (active low)
Broche 178 CONF_DONE — Configuration done flag
Broche 179 DCLK — Configuration clock
Broche 180 DATA0 — Configuration data input
Broche 181 I/O — User I/O
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Broche 191 GND — Ground
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Broche 201 VCCINT — Core supply 5 V
Broche 202 I/O — User I/O
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Broche 206 I/O — User I/O
Broche 207 I/O — User I/O
Broche 208 I/O — User I/O (pin 208 final)

Applications typiques

EPF6016QC208-2 convient pour 6 applications: Legacy 5 V Glue Logic Replacement, PCI / ISA Bus Bridge, Telecommunication Line Card Glue Logic, ASIC Prototype Validation Platform, Industrial Control and Factory Automation, Military / Aerospace Retrofit Boards.

🏭

Legacy 5 V Glue Logic Replacement

The EPF6016QC208-2's 5 V-tolerant I/O banks and 16K-gate capacity make it a drop-in upgrade for legacy TTL/CMOS glue-logic clusters in industrial controllers, where modern FPGAs require 3.3 V or 1.8 V supplies and would force board-level redesign. Its 1,320 logic elements and 132 LABs comfortably absorb state machines, decoded-chip-select arrays, and bus-arbitration logic previously scattered across 74-series MSI parts. The 208-PQFP footprint preserves the original PCB land pattern, so retrofits do not require re-spinning the board. Sustained Fmax around 125 MHz meets typical industrial control-loop timing. Designers migrating from discrete logic save both PCB area and BOM complexity.

Recommandé

EPF6016AQC208-2 · Altera EPF6016QC208-3 · Altera
🖥️

PCI / ISA Bus Bridge

The EPF6016QC208-2 is well-suited for bridging legacy 5 V PCI and ISA buses to modern peripherals. With 171 user I/Os across four banks, designers can dedicate separate banks to 5 V PCI signaling and 3.3 V peripheral logic, eliminating external level shifters. The 16K-gate capacity supports address decoding, bus arbitration, FIFO buffering, and interrupt steering logic in a single device. The FLEX 6000 carry chain accelerates address-comparator functions critical to bus-cycle timing. The 208-PQFP package's generous 0.5 mm pitch remains compatible with hand-rework for low-volume bridge boards.

Recommandé

EPF6016AQC208-2 · Altera EPF6016QC208 · Altera
🌐

Telecommunication Line Card Glue Logic

The EPF6016QC208-2 historically served telecom line cards as the central glue-logic hub connecting framer ICs, TDM time-slot crossbars, and control processors. Its 132 LABs handle T1/E1 framing, alarm-scan logic, and HDLC channel aggregation in a single device. The 5 V tolerance preserves direct interface to legacy line-interface units without level translators. The 125 MHz internal Fmax supports high-speed time-slot interchange. Long product lifecycles in telecom switching infrastructure make the obsolete-but-available EPF6016QC208-2 desirable for sustaining in-service equipment.

Recommandé

EPF6016AQC208-2N · Intel EPF6016AQC208-3 · Intel
🔧

ASIC Prototype Validation Platform

The EPF6016QC208-2 is used as a hardware-equivalent prototype vehicle for verifying ASIC RTL before mask commitment. Engineers map RTL blocks onto the 1,320 LUT-based logic elements, exercising real-world timing closure and I/O behavior months before silicon return. The 5 V core and 208-PQFP package support breadboard-friendly prototyping on through-hole adapter boards. The Quartus II design flow (legacy) supports FLEX 6000 synthesis, place-and-route, and timing simulation. Drop-in speed-grade variants (-1, -2, -3) let designers characterize timing margin without respinning the FPGA board.

Recommandé

EPF6016AQC208-1 · Intel EPF6016AQC208-2 · Altera
🏭

Industrial Control and Factory Automation

The EPF6016QC208-2 is deployed in factory-floor controllers, motor-drive interface boards, and process-control front-ends requiring 5 V I/O tolerance to interface with industrial sensors and actuators. The 171 user I/Os multiplex multiple encoder inputs, PWM generation channels, and isolated digital I/O banks. Industrial-grade 0-85 °C operating temperature accommodates cabinet-internal ambient conditions. The 16K-gate capacity supports IEC 61131-3 style ladder-logic emulators and soft-PLC cores. The 208-PQFP remains serviceable with hand-rework tools in the field, valuable for long-life factory installations.

Recommandé

EPF6016AQC208-2 · Altera EPF6016QC208-3 · Altera
✈️

Military / Aerospace Retrofit Boards

The EPF6016QC208-2 supports long-lifecycle military and aerospace retrofit programs where the original FLEX 6000 design must be sustained for decades. Its mature qualification data, established supply history, and 5 V I/O tolerance make it preferred over modern replacements that lack 5 V support. Special-screening variants (e.g., EPF6016AQC208-3S) provide extended-temperature and burn-in options for avionics. The 208-PQFP package allows depot-level rework without BGA reballing equipment. For new defense programs, however, Intel recommends migrating to radiation-tolerant or secure-device alternatives.

Recommandé

EPF6016AQC208-3S · Intel EPF6016AQC208-3N · Intel

Récapitulatif des produits recommandés

EPF6016AQC208-2 Altera Utilisé dans : Legacy 5 V Glue Logic Replacement, PCI / ISA Bus Bridge, ASIC Prototype Validation Platform, Industrial Control and Factory Automation EPF6016QC208-3 Altera Utilisé dans : Legacy 5 V Glue Logic Replacement, Industrial Control and Factory Automation EPF6016QC208 Altera Utilisé dans : PCI / ISA Bus Bridge EPF6016AQC208-2N Intel Utilisé dans : Telecommunication Line Card Glue Logic EPF6016AQC208-3 Intel Utilisé dans : Telecommunication Line Card Glue Logic EPF6016AQC208-1 Intel Utilisé dans : ASIC Prototype Validation Platform EPF6016AQC208-3S Intel Utilisé dans : Military / Aerospace Retrofit Boards EPF6016AQC208-3N Intel Utilisé dans : Military / Aerospace Retrofit Boards
What is the EPF6016QC208-2?
The EPF6016QC208-2 is an obsolete Intel/Altera FLEX 6000 family FPGA with 1,320 logic elements, 132 LABs, 16K usable gates, and 171 user I/Os in a 208-pin PQFP package, fabricated on a 0.42 µm 5 V CMOS SRAM process. It is intended for sustaining legacy 5 V-tolerant glue-logic designs where modern low-voltage FPGAs are not pin-compatible substitutes.
How many logic elements and LABs does the EPF6016QC208-2 have?
The EPF6016QC208-2 contains 1,320 logic elements (LEs) organized into 132 logic array blocks (LABs) of 10 LEs per LAB. Each LE uses a 4-input look-up table (LUT) with dedicated carry-chain and cascade-chain paths for high-speed arithmetic and wide-function implementation, per the FLEX 6000 datasheet architecture description.
Is the EPF6016QC208-2 still in production?
No, the EPF6016QC208-2 is classified as obsolete (EOL) by Intel/Altera, with no new wafer production. Remaining supply comes solely from authorized distributor inventory and aftermarket brokers; lead times may extend when existing stock is depleted. For new designs, Intel recommends the Cyclone series.
Where can I buy the EPF6016QC208-2?
Authorized distributors such as DigiKey, Mouser, Win Source, and Octopart-listed resellers (Xecor, Vyrian, Veswin) carry limited EPF6016QC208-2 stock. Pricing fluctuates with remaining inventory levels. Always verify authenticity via lot trace documentation for obsolete FPGA purchases.
What is the price of the EPF6016QC208-2?
As of 2026-09-11, EPF6016QC208-2 unit pricing starts around 18.50 USD at qty 1 and decreases to approximately 10.85 USD at qty 1000, based on aggregated DigiKey/Mouser distributor data. Obsolete FPGAs typically see price inflation as stock dwindles; obtain a current quote before committing to a design.
What is the lead time for the EPF6016QC208-2?
Lead time for the obsolete EPF6016QC208-2 ranges from immediate-ship (in-stock distributor lots) to 12-16 weeks for broker-resourced parts. Because the part is end-of-life, expect longer waits and minimum-order-quantity requirements; consider qualifying a same-package replacement in parallel.
What is the difference between EPF6016QC208-2 and EPF6016QC208-3?
The EPF6016QC208-2 is the -2 speed grade of the FLEX 6000 family, while the EPF6016QC208-3 is the -3 (slower) speed grade offering lower power at reduced Fmax. Both share the same 208-PQFP package, identical 1,320 LE / 132 LAB resources, and pin-for-pin compatibility, making them drop-in selectable per design timing budget.
Is the EPF6016AQC208-2 a drop-in replacement for EPF6016QC208-2?
Yes, the EPF6016AQC208-2 (FLEX 6000A revision) is a drop-in replacement for EPF6016QC208-2 in the same 208-PQFP package. Both share identical pinout, 1,320 LEs, and 132 LABs; the 'A' suffix denotes a die-shrink improvement offering higher internal Fmax and lower power at the same -2 speed grade.
Where do I download the EPF6016QC208-2 datasheet?
The official EPF6016QC208-2 datasheet is hosted on Intel's programmable logic literature archive. Search 'FLEX 6000 datasheet' on intel.com or use the legacy Altera URL https://www.altera.com/literature/ds/dsf6000.pdf to retrieve the device family data sheet covering pinout, electrical specs, and configuration guidelines.
What is the pinout of the EPF6016QC208-2?
The EPF6016QC208-2 uses a 208-pin PQFP (28x28 mm body) package with pin-1 marking at the top-left dot. The pin assignment includes 171 user I/O, dedicated JTAG pins (TMS, TCK, TDI, TDO), configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK), VCCINT (5 V core), and VCCIO bank supplies, per the FLEX 6000 datasheet pin tables.
Can the EPF6016QC208-2 be replaced by a Cyclone FPGA?
No, the Cyclone series is not pin-compatible with the EPF6016QC208-2 — Cyclone uses 1.5 V core and TQFP/BGA packages with completely different pin assignments. Cyclone is a footprint redesign, not a drop-in replacement. For drop-in 208-PQFP compatibility, stay within the FLEX 6000 / FLEX 6000A families.
How many user I/O pins does the EPF6016QC208-2 expose?
The EPF6016QC208-2 exposes 171 user I/O pins across four I/O banks, supporting 5 V LVTTL/LVCMOS and 3.3 V PCI-compliant interfaces. Each I/O cell contains a tri-state buffer, input register, and output enable/register, allowing flexible per-pin direction and registered I/O for synchronous designs.
What applications is the EPF6016QC208-2 used in?
The EPF6016QC208-2 is used in legacy 5 V-tolerant glue logic, PCI/ISA bus bridges, telecommunication line cards, industrial control boards, military/aerospace retrofit, and ASIC prototype validation. Its 5 V tolerance makes it especially valuable for sustaining older systems where modern FPGAs require level-shifting interfaces.
What is the maximum operating frequency of the EPF6016QC208-2?
The EPF6016QC208-2 (speed grade -2) supports a maximum internal frequency up to 125 MHz, sufficient for mid-complexity state machines, FIFO controllers, and bus-interface logic. Actual Fmax varies with routing density, fan-out, and I/O standard selection — consult the FLEX 6000 timing model for design-specific closure.
Is the EPF6016QC208-2 RoHS compliant?
RoHS compliance status for the EPF6016QC208-2 is not consistently documented in public sources because the part predates formal RoHS transition programs in many cases; verify the lead-finish code on the device marking. For new RoHS-compliant designs in the same footprint, consider the EPF6016AQC208-2 (FLEX 6000A revision).

Données de référence d'ingénierie pour EPF6016QC208-2 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6016QC208-2 when you need an established FLEX 6000 FPGA with -2 mid-tier speed grade for general 5 V glue logic. If your timing margins are tight and power budget allows, prefer the EPF6016AQC208-2 (FLEX 6000A revision, higher Fmax, same package, recompile-only migration). If thermal headroom is the limiting factor, drop down to EPF6016QC208-3 for lower dynamic current at modest Fmax cost. For new RoHS-aligned production runs, choose the EPF6016AQC208-2N (lead-free FLEX 6000A). For military / aerospace programs needing special screening, the EPF6016AQC208-3S variant provides burn-in and extended-temperature options. All listed alternatives share the same 208-PQFP footprint, so PCB land pattern decisions are identical across the family.

Comparaison avec les alternatives

Paramètre Ce produit EPF6016QC208-3 EPF6016QC208 EPF6016AQC208-2 EPF6016AQC208-3 EPF6016AQC208-3N
Brand Intel Intel Intel Intel Intel Intel
Package 208-PQFP (28x28 mm) 208-PQFP - same 208-PQFP - same 208-PQFP - same 208-PQFP - same 208-PQFP - same
Logic Elements 1320 1320 1320 1320 1320 1320
Number of LABs 132 132 132 132 132 132
Usable Gates 16000 16000 16000 16000 16000 16000
User I/O Count 171 171 171 171 171 171
Core Voltage 5 V 5 V 5 V 5 V 5 V 5 V
Speed Grade -2 (mid) -3 (slower) unspecified -2 (FLEX 6000A) -3 (FLEX 6000A) -3 (FLEX 6000A, lead-free)
Architecture Revision FLEX 6000 (original) FLEX 6000 (original) FLEX 6000 (original) FLEX 6000A (improved) FLEX 6000A (improved) FLEX 6000A (improved)

Principaux différenciateurs

  • FLEX 6000A architecture upgrade path with no footprint change (vs EPF6016AQC208-2)
  • Lower-power speed grade option for thermal-constrained retrofits (vs EPF6016QC208-3)
  • RoHS-aligned lead-free variant with full footprint compatibility (vs EPF6016AQC208-2N)

Notes de conception

The EPF6016QC208-2 requires a stable 5 V ±5% VCCINT supply and per-bank VCCIO (3.3 V or 5 V depending on I/O standard). Place 100 µF bulk + 0.1 µF ceramic decoupling within 5 mm of every supply pin; the 208-PQFP exposes multiple VCCINT and VCCIO pins distributed around the package periphery to minimize supply loop inductance. Sequence power-up such that VCCINT reaches 4.5 V before JTAG or configuration logic accesses the device.

Estimated: at typical FLEX 6000 quiescent current around 5 mA plus dynamic I/O switching, junction temperature rise stays below 10 °C in the 208-PQFP when the PCB provides at least 4 square inches of unbroken ground plane beneath the package. The plastic PQFP has theta_JA around 35-40 C/W. For industrial 0-85 °C ambient operation this headroom is adequate; for extended-temperature applications consider the FLEX 6000A revision with lower power.

The 208-PQFP uses 0.5 mm pitch gull-wing leads with a 28x28 mm body. Allocate a 30x30 mm land pattern area with 0.27 mm wide pads and 0.4 mm gaps; use a 4-layer PCB with one dedicated ground plane for clean signal return paths. JTAG pins (TMS/TCK/TDI/TDO) require 10 kΩ pull-ups to VCCIO for boundary-scan reliability.

Do not migrate FLEX 6000 bitstreams to FLEX 6000A parts without recompiling in Quartus II — the architecture revision requires fresh place-and-route. Configuration modes (PS, AS, JTAG) must be selected via MSEL pins per the FLEX 6000 datasheet; incorrect MSEL strapping leaves the device in an indeterminate state. Always include the EPC2 or EPC16 configuration device on the board or a JTAG header for in-system programming.

Series-terminate high-speed outputs (clock, bus drivers) with 33 Ω resistors placed within 5 mm of the FPGA pin to dampen reflections on traces longer than 50 mm. The 5 V LVTTL I/O has typical edge rates around 2-3 ns; without termination, parallel-terminated buses above 20 MHz may show ringing. Use the Quartus II Timing Analyzer to verify setup/hold across PVT corners before committing layout.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
No
Sans halogène
Unknown
Minerais de conflit
Unknown

EPF6016QC208-2 is an obsolete FLEX 6000 family part predating formal RoHS transition. RoHS/REACH status not consistently documented in distributor datasheets; consult Intel's PCN archive or the device marking for specific lead-finish code. AEC-Q100 is not applicable — FPGAs are typically not AEC-Q100 qualified; for automotive designs consult Intel Cyclone family.

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF6016QC208-2 EPF6016QC208-2 datasheet Intel FLEX 6000 FPGA FLEX 6000 208-PQFP FPGA Altera EPF6016 obsolete replacement EPF6016QC208-2 vs EPF6016AQC208-2 buy EPF6016QC208-2 stock 5V tolerant FPGA 208 pin PQFP EPF6016QC208-2 drop-in replacement FLEX 6000 16K gates 1320 LEs PCI bus bridge FPGA legacy what is the difference between FLEX 6000 and FLEX 6000A EPF6016QC208-2 lead time 2026 FLEX 6000A pin compatible upgrade

Composants & termes associés

Intel Altera EPF6016QC208-2 EPF6016QC208-3 EPF6016QC208 EPF6016AQC208-2 EPF6016AQC208-2N EPF6016AQC208-3 EPF6016AQC208-3N FPGA Field Programmable Gate Array FLEX 6000 FLEX 6000A Logic Element (LE) Logic Array Block (LAB) PQFP 208-BFQFP Plastic Quad Flat Pack 0.42 µm CMOS SRAM 5V LVTTL JTAG boundary scan Quartus II PCI bus bridge ISA bus obsolete semiconductor lifecycle RoHS lead-free
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