EPF6016BC256-2 - FLEX 6000 FPGA, 16K Gates, 204 I/O | Altera
Référence : EPF6016BC256-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.95 | $1 395,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $10.85 | $10 850,00 |
EPF6016BC256-2 Présentation
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines programmable logic elements, configurable interconnect, and I/O blocks into a single silicon die. FPGAs sit above CPLDs in the programmable logic hierarchy and below ASICs in NRE cost; SRAM-based devices like the FLEX 6000 family are reconfigurable in-system, allowing rapid prototyping, field updates, and design reuse across product revisions without retooling.
Key features include up to 1320 logic elements, 204 user I/Os, embedded array blocks for memory implementation, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device operates across the commercial 0C to 85C temperature range and supports fast synchronous state machines, register-intensive datapaths, and glue-logic replacement.
The FLEX 6000 architecture is built on a 0.42-micron SRAM process with a four-input look-up table (LUT) per logic element and a continuous FastTrack interconnect. This delivers predictable timing, low static power, and deterministic place-and-route results - ideal for bus-interface bridging, peripheral controllers, and custom I/O expansion.
Typical applications include industrial glue-logic, communication bridging between legacy microcontrollers and modern peripherals, ASIC prototyping, low-volume custom controllers, and DSP co-processing front-ends. The 204 I/O count makes it well-suited for parallel bus interfacing and bus-width conversion.
When designing with this FPGA, ensure the 5V VCCIO and VCCINT rails share a clean power source and that decoupling follows the reference design. Quartus II (legacy) or MAX+PLUS II toolchains are used for place-and-route, and JTAG programming requires the ByteBlasterMV download cable.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone - providing engineers with the cross-reference intelligence needed to manage the FLEX 6000 lifecycle.
Alternatives de remplacement direct pour EPF6016BC256-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016BC256-2 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Device Type, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016AFC256-2
✅ Remplacement direct✓ En stock
$33.05 / unité
Voir la fiche technique →EPF6016AFC256-3
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →EPF6016BC256-2 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements | 1320 |
| Typical Gates | 16,000 |
| Maximum Logic Gates | 24,000 |
| User I/O Pins | 204 |
| Supply Voltage (VCCINT / VCCIO) | 4.75 V to 5.25 V |
| Boîtier | 256-FBGA (FineLine BGA, 17x17 mm) |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Speed Grade | -2 |
| Process Technology | 0.42 um SRAM |
| Programmability | SRAM-based, in-system reconfigurable |
| Configuration Interface | JTAG (IEEE 1149.1) + serial |
| Internal Memory | Embedded array blocks (EABs) |
| Type de montage | Surface Mount (BGA) |
Configuration des broches de EPF6016BC256-2
| Broche A1 | IO — User I/O ball (pin assignment depends on configuration) |
| Broche A2 | IO — User I/O ball |
| Broche A3 | IO — User I/O ball |
| Broche A4 | VCCINT — Core supply voltage (4.75-5.25V) |
| Broche A5 | GND — Ground |
| Broche A6 | VCCIO — I/O supply voltage (4.75-5.25V) |
| Broche A7 | IO — User I/O ball |
| Broche A8 | IO — User I/O ball |
| Broche B1 | IO — User I/O ball |
| Broche B2 | nCONFIG — Configuration control (active-low reset) |
| Broche B3 | IO — User I/O ball |
| Broche B4 | IO — User I/O ball |
| Broche B5 | IO — User I/O ball |
| Broche B6 | IO — User I/O ball |
| Broche B7 | nSTATUS — Configuration status (active-low) |
| Broche B8 | CONF_DONE — Configuration complete indicator |
| Broche C1 | IO — User I/O ball |
| Broche C2 | IO — User I/O ball |
| Broche C3 | TDI — JTAG Test Data In |
| Broche C4 | TCK — JTAG Test Clock |
| Broche C5 | TMS — JTAG Test Mode Select |
| Broche C6 | TDO — JTAG Test Data Out |
| Broche C7 | DCLK — Configuration clock input |
| Broche C8 | IO — User I/O ball |
| Broche D1 | IO — User I/O ball |
| Broche D2 | IO — User I/O ball |
| Broche D3 | IO — User I/O ball |
| Broche D4 | GND — Ground |
| Broche D5 | VCCINT — Core supply voltage |
| Broche D6 | GND — Ground |
| Broche D7 | IO — User I/O ball |
| Broche D8 | IO — User I/O ball |
| Broche E1 | IO — User I/O ball |
| Broche E2 | IO — User I/O ball |
| Broche E3 | IO — User I/O ball |
| Broche E4 | VCCIO — I/O supply voltage |
| Broche E5 | GND — Ground |
| Broche E6 | VCCIO — I/O supply voltage |
| Broche E7 | IO — User I/O ball |
| Broche E8 | IO — User I/O ball |
| Broche F1 | IO — User I/O ball |
| Broche F2 | IO — User I/O ball |
| Broche F3 | IO — User I/O ball |
| Broche F4 | GND — Ground |
| Broche F5 | VCCINT — Core supply voltage |
| Broche F6 | GND — Ground |
| Broche F7 | IO — User I/O ball |
| Broche F8 | IO — User I/O ball |
| Broche G1 | IO — User I/O ball |
| Broche G2 | IO — User I/O ball |
| Broche G3 | IO — User I/O ball |
| Broche G4 | VCCIO — I/O supply voltage |
| Broche G5 | GND — Ground |
| Broche G6 | VCCIO — I/O supply voltage |
| Broche G7 | IO — User I/O ball |
| Broche G8 | IO — User I/O ball |
| Broche H1 | IO — User I/O ball |
| Broche H2 | IO — User I/O ball |
| Broche H3 | IO — User I/O ball |
| Broche H4 | GND — Ground |
| Broche H5 | VCCINT — Core supply voltage |
| Broche H6 | GND — Ground |
| Broche H7 | IO — User I/O ball |
| Broche H8 | IO — User I/O ball |
Applications typiques
EPF6016BC256-2 convient pour 6 applications: Industrial Glue Logic Replacement, Legacy Communication Bus Bridging, ASIC Prototyping and Validation, DSP Front-End Co-Processing, Low-Volume Custom Controllers, Test and Measurement Equipment.
Industrial Glue Logic Replacement
The EPF6016BC256-2 replaces multiple discrete 74-series logic ICs (gates, muxes, latches, buffers) on legacy industrial PCBs. With 1320 logic elements and 204 user I/Os in the 256-FBGA package, it absorbs up to ~50 standard-logic chips into one device, drastically reducing board area, BOM count, and assembly cost. The 5V tolerant I/O makes it ideal for industrial 5V backplanes. Designers typically describe their logic in VHDL/Verilog using MAX+PLUS II, then synthesize to the FLEX 6000 LUT-based architecture, replacing 7400-series glue logic and freeing PCB real estate for new functionality.
Recommandé
Legacy Communication Bus Bridging
The EPF6016BC256-2 is widely used as a bridge between legacy parallel buses (ISA, PC/104, VME) and modern high-speed serial interfaces. Its 204 I/Os comfortably handle 16-bit and 32-bit wide bus widths plus handshaking signals, while internal logic elements implement protocol conversion state machines. The 1320-LE fabric fits typical bridge designs with margin for debug logic. The 5V VCCIO directly interfaces legacy 5V peripherals without level shifters, simplifying PCB design and reducing BOM. Speed grade -2 supports bus clocks up to 60 MHz typical, sufficient for most legacy bus applications.
Recommandé
ASIC Prototyping and Validation
Designers use the EPF6016BC256-2 as a low-cost prototyping vehicle for ASIC designs targeting 5V-rail industrial or consumer ASICs. Its 1320 logic elements are sufficient to validate control logic, glue logic, and basic datapath blocks before committing to mask costs. FPGAs in the FLEX 6000 family have predictable timing that closely emulates ASIC behavior for control-dominated designs, and JTAG-based in-system reconfigurability enables rapid iteration. The 204 I/Os expose enough test points for real-time logic-analyzer probing of internal nets, making FPGA prototypes a powerful validation step before silicon spin.
Recommandé
DSP Front-End Co-Processing
The EPF6016BC256-2 can serve as a co-processor for DSP front-end tasks including FIR filtering, FFT preprocessing, and digital up/down-conversion in cost-sensitive applications. Its embedded array blocks (EABs) implement small distributed RAMs for coefficient storage, and the LUT-based logic elements run parallel multiply-accumulate structures. The 256-FBGA package's short traces preserve signal integrity at DSP clock rates, and the 204 I/Os provide enough bandwidth for parallel data paths. While modern designs use dedicated DSP blocks in Cyclone/Stratix families, FLEX 6000 remains viable for legacy DSP subsystems.
Recommandé
Low-Volume Custom Controllers
For low-volume production runs (hundreds to a few thousand units) where ASIC NRE costs are prohibitive, the EPF6016BC256-2 delivers ASIC-like integration with FPGA programmability. Designers implement custom motor-control, sensor-fusion, or peripheral controllers in VHDL, burn the configuration into the SRAM via JTAG at production, and deploy. With 1320 logic elements and 204 I/Os, it supports substantial state-machine complexity plus multiple peripheral interfaces. The FLEX 6000 family's mature toolchain (MAX+PLUS II) and broad IP library shorten development time, while Altera/Intel's long-term supply program supports end-of-life bridging.
Recommandé
Test and Measurement Equipment
Test equipment manufacturers use the EPF6016BC256-2 to implement pattern generators, custom timing controllers, and signal-conditioning logic in bench-top instruments. Its 204 user I/Os drive multiple DUT parallel interfaces simultaneously, while 1320 logic elements implement timing/state-machine cores. The 5V VCCIO directly interfaces legacy instrumentation signal levels without level translation, simplifying the analog front-end design. SRAM-based reconfigurability allows field upgrades to add new test patterns or fix bugs without hardware recall - a major advantage over fixed-function ASIC solutions in T&M markets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016BC256-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016AFC256-2 | EPF6016AFC256-3 |
|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-FBGA FineLine (17x17 mm) | 256-FBGA FineLine - same | 256-FBGA FineLine - same |
| Logic Elements | 1320 | 1320 | 1320 |
| Typical Gates | 16,000 | 16,000 | 16,000 |
| User I/Os | 204 | 204 | 204 |
| Speed Grade | -2 (mid) | -2 (mid) | -3 (fastest) |
| Supply Voltage | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Drop-in Compatible | N/A (reference) | Yes (100% pin-compatible) | Yes (pin-compatible, faster fMAX) |
Principaux différenciateurs
- True second-source availability with identical silicon (vs EPF6016AFC256-2)
- Mid-tier speed grade balances cost and performance (vs EPF6016AFC256-3)
- 204 user I/Os versus smaller density competitors (vs EPF6016AQC208-2)
Notes de conception
The EPF6016BC256-2 requires separate VCCINT (core) and VCCIO (I/O) rails, both within 4.75V to 5.25V. Place 0.1uF ceramic decoupling capacitors adjacent to every pair of VCC/GND balls, with bulk 10uF tantalum or ceramic caps at board entry. Estimated: with 1320 LEs at 100% utilization and 50 MHz toggle, expect ICCINT ~150 mA and ICCIO ~100 mA - plan power budget and thermal dissipation accordingly. For mixed-voltage designs, drive 5V outputs into 3.3V loads only with series resistors or level shifters; the FLEX 6000 I/O is 5V tolerant but not 3.3V compatible without design care.
While the FLEX 6000 family is not high-power, sustained operation near the 85C commercial limit requires thermal management. Theta-JA for the 256-FBGA package is approximately 25 C/W typical with a JEDEC-standard test board. Estimated: at 1W total dissipation, junction temperature rise is ~25C above ambient. In enclosed industrial cabinets with ambient near 70C, consider 100 LFM airflow or a heat spreader to maintain reliability. Avoid placing the FPGA directly next to high-power components like DC-DC converters; route ground plane unbroken beneath the BGA for heat spreading.
Do not assume 3.3V peripherals work directly with the FLEX 6000 - the 5V VCCIO and TTL/CMOS-compatible I/O standards can damage 3.3V-only inputs. Use bidirectional level shifters (e.g., 74LVC245) when bridging to 3.3V devices. Also note: SRAM-based FPGAs require configuration at every power-up; ensure the JTAG chain is properly terminated and the ByteBlasterMV header is accessible for field updates. Estimated: in production, configure from a serial configuration PROM (e.g., EPC1) for one-time setup. Finally, this part is OBSOLETE - new designs should target Cyclone IV or Cyclone 10 LP for long-term supply.
Informations de conformité
RoHS and lead-free status not explicitly stated in verified distributor data; marked unknown. Commercial temperature grade (0C to 85C); no AEC-Q100 automotive qualification. For automotive or medical applications, verify compliance directly with Intel/Altera material declarations before design-in.
