EPF6016QI208-3N - FLEX 6000 FPGA 16K Gates 171 I/O 208-PQFP | Intel
Référence : EPF6016QI208-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $15.75 | $157,50 |
| 100 | $13.2 | $1 320,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $9.95 | $9 950,00 |
EPF6016QI208-3N Présentation
An FPGA (Field Programmable Gate Array) is a programmable integrated circuit that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die. The FLEX 6000 family specifically targets low-cost, high-volume designs as an alternative to gate arrays, allowing rapid design changes during prototyping without NRE charges. FPGAs sit in the programmable-logic hierarchy alongside CPLDs and serve as the highest-density programmable logic option for logic integration, glue logic, and pre-ASIC prototyping.
Key features include 1,320 logic elements distributed across 132 LABs, 171 user I/Os, an internal frequency up to 125 MHz, on-chip SRAM configuration memory, JTAG-based IEEE 1149.1 boundary-scan testing support, and multi-voltage I/O support. The 'QI' package designator denotes the industrial temperature grade and PQFP form factor, while the '-3' speed grade and 'N' lead-free suffix indicate lead-free / RoHS-compliant termination. The 208-pin PQFP (BFQFP) is a low-profile gull-wing surface-mount package suitable for socketed or hand-soldered designs.
Architecturally, the FLEX 6000 device uses a continuous-channel interconnect with shared fast-track lines between LABs and adjacent LAB-row fast lines. Each LAB contains 10 Logic Elements, each comprising a 4-input look-up table (LUT), a programmable register, and carry-chain logic for arithmetic functions. Configuration is loaded from an external EPROM or serial configuration device at power-up via the FLEX 6000's dedicated configuration interface.
Typical applications include legacy bus-bridge and interface adaptation in industrial controllers, communication protocol bridging (UART/SPI/I2C consolidation), pre-ASIC prototyping, ASIC prototyping, machine-control state machines, glue-logic replacement for discrete TTL, and educational logic-design platforms. The 5 V tolerance and PQFP form factor make it especially suited to retrofit projects targeting older 5 V backplanes.
When designing with this FPGA, ensure that the configuration EPROM (EPC1, EPC2, or compatible serial configuration device) is correctly sized and that JTAG chain integrity is validated. Watch for 5 V I/O-bank compatibility - the FLEX 6000 supports mixed-voltage I/O, but each bank must be powered from a single rail. Use Quartus II MAX+PLUS II legacy software for design entry, as modern Quartus Prime flows do not support the FLEX 6000 family.
Alternatives de remplacement direct pour EPF6016QI208-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016QI208-3N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, RoHS Status, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016QI208-3
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPF6016QC208-3N
✅ Remplacement direct✓ En stock
$20.4 / unité
Voir la fiche technique →EPF6016QC208-3
✅ Remplacement direct✓ En stock
$19.91 / unité
Voir la fiche technique →EPF6016AQC208-3N
✅ Remplacement direct✓ En stock
$31.2 / unité
Voir la fiche technique →EPF6016AQC208-3
✅ Remplacement direct✓ En stock
$19.2 / unité
Voir la fiche technique →EPF6016AQC208-2N
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EPF6016QI208-3N Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Device Type | FPGA - Field Programmable Gate Array |
| Usable Gates | 16,000 |
| Logic Elements (LEs) | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 171 |
| Maximum Internal Frequency | 125 MHz |
| Technology Node | 0.42 µm CMOS |
| Core Supply Voltage | 5 V |
| Température de fonctionnement | 0C to +85C (Industrial) |
| Boîtier | 208-BFQFP / 208-PQFP |
| Package Code | PQFP, FQFP |
| Terminal Form | Gull Wing |
| Configuration | SRAM (external serial config device) |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| Statut RoHS | Lead-free (N suffix) / RoHS compliant |
| Speed Grade | -3 |
Configuration des broches de EPF6016QI208-3N
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | VCCINT — Core supply voltage (5V) |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 1) |
| Broche 14 | I/O — User I/O (bank 1) |
| Broche 15 | I/O — User I/O (bank 1) |
| Broche 16 | I/O — User I/O (bank 1) |
| Broche 17 | I/O — User I/O (bank 1) |
| Broche 18 | I/O — User I/O (bank 1) |
| Broche 19 | I/O — User I/O (bank 1) |
| Broche 20 | I/O — User I/O (bank 1) |
| Broche 21 | I/O — User I/O (bank 1) |
| Broche 22 | I/O — User I/O (bank 1) |
| Broche 23 | GND — Ground |
| Broche 24 | I/O — User I/O (bank 2) |
| Broche 25 | I/O — User I/O (bank 2) |
| Broche 26 | I/O — User I/O (bank 2) |
| Broche 27 | I/O — User I/O (bank 2) |
| Broche 28 | I/O — User I/O (bank 2) |
| Broche 29 | I/O — User I/O (bank 2) |
| Broche 30 | I/O — User I/O (bank 2) |
| Broche 31 | I/O — User I/O (bank 2) |
| Broche 32 | I/O — User I/O (bank 2) |
| Broche 33 | I/O — User I/O (bank 2) |
| Broche 34 | I/O — User I/O (bank 2) |
| Broche 35 | I/O — User I/O (bank 2) |
| Broche 36 | I/O — User I/O (bank 2) |
| Broche 37 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 38 | I/O — User I/O (bank 2) |
| Broche 39 | I/O — User I/O (bank 2) |
| Broche 40 | I/O — User I/O (bank 2) |
| Broche 41 | I/O — User I/O (bank 2) |
| Broche 42 | I/O — User I/O (bank 2) |
| Broche 43 | I/O — User I/O (bank 2) |
| Broche 44 | I/O — User I/O (bank 2) |
| Broche 45 | I/O — User I/O (bank 2) |
| Broche 46 | I/O — User I/O (bank 2) |
| Broche 47 | I/O — User I/O (bank 2) |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — User I/O (bank 3) |
| Broche 50 | I/O — User I/O (bank 3) |
| Broche 51 | I/O — User I/O (bank 3) |
| Broche 52 | I/O — User I/O (bank 3) |
| Broche 53 | I/O — User I/O (bank 3) |
| Broche 54 | I/O — User I/O (bank 3) |
| Broche 55 | I/O — User I/O (bank 3) |
| Broche 56 | I/O — User I/O (bank 3) |
| Broche 57 | I/O — User I/O (bank 3) |
| Broche 58 | I/O — User I/O (bank 3) |
| Broche 59 | I/O — User I/O (bank 3) |
| Broche 60 | I/O — User I/O (bank 3) |
| Broche 61 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 62 | I/O — User I/O (bank 3) |
| Broche 63 | I/O — User I/O (bank 3) |
| Broche 64 | I/O — User I/O (bank 3) |
| Broche 65 | I/O — User I/O (bank 3) |
| Broche 66 | I/O — User I/O (bank 3) |
| Broche 67 | I/O — User I/O (bank 3) |
| Broche 68 | I/O — User I/O (bank 3) |
| Broche 69 | I/O — User I/O (bank 3) |
| Broche 70 | I/O — User I/O (bank 3) |
| Broche 71 | I/O — User I/O (bank 3) |
| Broche 72 | I/O — User I/O (bank 3) |
| Broche 73 | GND — Ground |
| Broche 74 | nCONFIG — Configuration control (active-low reset) |
| Broche 75 | nSTATUS — Configuration status (active-low) |
| Broche 76 | CONF_DONE — Configuration complete (active-high) |
| Broche 77 | DCLK — Configuration clock input |
| Broche 78 | DATA0 — Configuration data input |
| Broche 79 | TCK — JTAG test clock |
| Broche 80 | TMS — JTAG test mode select |
| Broche 81 | TDI — JTAG test data input |
| Broche 82 | TDO — JTAG test data output |
| Broche 83 | I/O — User I/O (bank 4) |
| Broche 84 | I/O — User I/O (bank 4) |
| Broche 85 | I/O — User I/O (bank 4) |
| Broche 86 | I/O — User I/O (bank 4) |
| Broche 87 | I/O — User I/O (bank 4) |
| Broche 88 | I/O — User I/O (bank 4) |
| Broche 89 | I/O — User I/O (bank 4) |
| Broche 90 | I/O — User I/O (bank 4) |
| Broche 91 | I/O — User I/O (bank 4) |
| Broche 92 | I/O — User I/O (bank 4) |
| Broche 93 | I/O — User I/O (bank 4) |
| Broche 94 | I/O — User I/O (bank 4) |
| Broche 95 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 96 | I/O — User I/O (bank 4) |
| Broche 97 | I/O — User I/O (bank 4) |
| Broche 98 | I/O — User I/O (bank 4) |
| Broche 99 | I/O — User I/O (bank 4) |
| Broche 100 | I/O — User I/O (bank 4) |
| Broche 101 | I/O — User I/O (bank 4) |
| Broche 102 | I/O — User I/O (bank 4) |
| Broche 103 | I/O — User I/O (bank 4) |
| Broche 104 | I/O — User I/O (bank 4) |
| Broche 105 | I/O — User I/O (bank 4) |
| Broche 106 | I/O — User I/O (bank 4) |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O (bank 5) |
| Broche 109 | I/O — User I/O (bank 5) |
| Broche 110 | I/O — User I/O (bank 5) |
| Broche 111 | I/O — User I/O (bank 5) |
| Broche 112 | I/O — User I/O (bank 5) |
| Broche 113 | I/O — User I/O (bank 5) |
| Broche 114 | I/O — User I/O (bank 5) |
| Broche 115 | I/O — User I/O (bank 5) |
| Broche 116 | I/O — User I/O (bank 5) |
| Broche 117 | I/O — User I/O (bank 5) |
| Broche 118 | I/O — User I/O (bank 5) |
| Broche 119 | I/O — User I/O (bank 5) |
| Broche 120 | I/O — User I/O (bank 5) |
| Broche 121 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 122 | I/O — User I/O (bank 5) |
| Broche 123 | I/O — User I/O (bank 5) |
| Broche 124 | I/O — User I/O (bank 5) |
| Broche 125 | I/O — User I/O (bank 5) |
| Broche 126 | I/O — User I/O (bank 5) |
| Broche 127 | I/O — User I/O (bank 5) |
| Broche 128 | I/O — User I/O (bank 5) |
| Broche 129 | I/O — User I/O (bank 5) |
| Broche 130 | I/O — User I/O (bank 5) |
| Broche 131 | I/O — User I/O (bank 5) |
| Broche 132 | I/O — User I/O (bank 5) |
| Broche 133 | GND — Ground |
| Broche 134 | I/O — User I/O (bank 6) |
| Broche 135 | I/O — User I/O (bank 6) |
| Broche 136 | I/O — User I/O (bank 6) |
| Broche 137 | I/O — User I/O (bank 6) |
| Broche 138 | I/O — User I/O (bank 6) |
| Broche 139 | I/O — User I/O (bank 6) |
| Broche 140 | I/O — User I/O (bank 6) |
| Broche 141 | I/O — User I/O (bank 6) |
| Broche 142 | I/O — User I/O (bank 6) |
| Broche 143 | I/O — User I/O (bank 6) |
| Broche 144 | I/O — User I/O (bank 6) |
| Broche 145 | I/O — User I/O (bank 6) |
| Broche 146 | I/O — User I/O (bank 6) |
| Broche 147 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 148 | I/O — User I/O (bank 6) |
| Broche 149 | I/O — User I/O (bank 6) |
| Broche 150 | I/O — User I/O (bank 6) |
| Broche 151 | I/O — User I/O (bank 6) |
| Broche 152 | I/O — User I/O (bank 6) |
| Broche 153 | I/O — User I/O (bank 6) |
| Broche 154 | I/O — User I/O (bank 6) |
| Broche 155 | I/O — User I/O (bank 6) |
| Broche 156 | I/O — User I/O (bank 6) |
| Broche 157 | I/O — User I/O (bank 6) |
| Broche 158 | I/O — User I/O (bank 6) |
| Broche 159 | GND — Ground |
| Broche 160 | I/O — User I/O (bank 7) |
| Broche 161 | I/O — User I/O (bank 7) |
| Broche 162 | I/O — User I/O (bank 7) |
| Broche 163 | I/O — User I/O (bank 7) |
| Broche 164 | I/O — User I/O (bank 7) |
| Broche 165 | I/O — User I/O (bank 7) |
| Broche 166 | I/O — User I/O (bank 7) |
| Broche 167 | I/O — User I/O (bank 7) |
| Broche 168 | I/O — User I/O (bank 7) |
| Broche 169 | I/O — User I/O (bank 7) |
| Broche 170 | I/O — User I/O (bank 7) |
| Broche 171 | I/O — User I/O (bank 7) |
| Broche 172 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 173 | I/O — User I/O (bank 7) |
| Broche 174 | I/O — User I/O (bank 7) |
| Broche 175 | I/O — User I/O (bank 7) |
| Broche 176 | I/O — User I/O (bank 7) |
| Broche 177 | I/O — User I/O (bank 7) |
| Broche 178 | I/O — User I/O (bank 7) |
| Broche 179 | I/O — User I/O (bank 7) |
| Broche 180 | I/O — User I/O (bank 7) |
| Broche 181 | I/O — User I/O (bank 7) |
| Broche 182 | I/O — User I/O (bank 7) |
| Broche 183 | I/O — User I/O (bank 7) |
| Broche 184 | GND — Ground |
| Broche 185 | I/O — User I/O (bank 8) |
| Broche 186 | I/O — User I/O (bank 8) |
| Broche 187 | I/O — User I/O (bank 8) |
| Broche 188 | I/O — User I/O (bank 8) |
| Broche 189 | I/O — User I/O (bank 8) |
| Broche 190 | I/O — User I/O (bank 8) |
| Broche 191 | I/O — User I/O (bank 8) |
| Broche 192 | I/O — User I/O (bank 8) |
| Broche 193 | I/O — User I/O (bank 8) |
| Broche 194 | I/O — User I/O (bank 8) |
| Broche 195 | I/O — User I/O (bank 8) |
| Broche 196 | I/O — User I/O (bank 8) |
| Broche 197 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 198 | I/O — User I/O (bank 8) |
| Broche 199 | I/O — User I/O (bank 8) |
| Broche 200 | I/O — User I/O (bank 8) |
| Broche 201 | I/O — User I/O (bank 8) |
| Broche 202 | I/O — User I/O (bank 8) |
| Broche 203 | I/O — User I/O (bank 8) |
| Broche 204 | I/O — User I/O (bank 8) |
| Broche 205 | I/O — User I/O (bank 8) |
| Broche 206 | I/O — User I/O (bank 8) |
| Broche 207 | I/O — User I/O (bank 8) |
| Broche 208 | GND — Ground |
Applications typiques
EPF6016QI208-3N convient pour 6 applications: Legacy Industrial Bus Bridge, ASIC Prototyping Platform, Glue Logic Consolidation, Communication Protocol Bridging, Machine Control State Machines, Educational Logic Design Platform.
Legacy Industrial Bus Bridge
The EPF6016QI208-3N's 16,000 gates and 171 user I/Os make it well-suited to legacy industrial bus-bridge applications, including ISA-to-PCI bridges and parallel-to-serial protocol converters. Its 5V-tolerant I/O banks interface directly to 5V backplanes common in factory automation, eliminating level shifters. With 132 LABs and 1,320 logic elements, the device can implement a full parallel-to-serial bridge with state-machine control and FIFO buffering on a single chip. The 208-PQFP industrial-grade package supports 0C to +85C operating environments typical of factory floors.
Recommandé
ASIC Prototyping Platform
The EPF6016QI208-3N is widely used as an ASIC prototyping vehicle for low-to-mid density designs. Its 0.42 µm CMOS process matches the gate density and timing characteristics of mid-1990s ASIC technology, enabling accurate pre-silicon verification. The SRAM-based configuration allows rapid design iteration without NRE charges, and the 125 MHz internal frequency supports realistic clock-domain emulation. Engineers port VHDL/Verilog RTL from the ASIC target, validate functional behavior, then migrate to the ASIC foundry once verified.
Recommandé
Glue Logic Consolidation
The EPF6016QI208-3N replaces dozens of discrete 74-series TTL logic chips by consolidating address decoding, bus arbitration, and chip-select generation onto a single programmable device. Its 1,320 LEs can absorb the equivalent of 30-50 discrete SSI/MSI logic packages, dramatically reducing PCB area and BOM cost. The 5V-tolerant I/Os and 208-PQFP package footprint are direct retrofits for legacy TTL designs. Configuration is one-time via serial EPROM, eliminating the need for boot code or processor intervention.
Recommandé
Communication Protocol Bridging
The EPF6016QI208-3N implements UART-to-SPI, SPI-to-I2C, and parallel-to-serial protocol bridges for embedded system integration. With 16K gates and 171 I/Os, multiple protocol converters can coexist on a single device with shared address decoding and interrupt logic. The industrial-grade temperature range suits outdoor telecom equipment, while the 5V I/O tolerance simplifies interface to legacy microcontrollers. The 125 MHz internal frequency easily handles standard UART rates up to 921.6 kbaud and SPI clocks up to 25 MHz.
Recommandé
Machine Control State Machines
The EPF6016QI208-3N serves as the central sequencer in CNC machines, conveyor controllers, and packaging equipment, implementing complex multi-state control logic that would otherwise require a microcontroller or custom state-machine IC. Its 132 LABs and 1,320 LEs provide ample capacity for stepper/servo control loops, sensor debouncing, safety interlocks, and HMI interface logic. The 171 I/Os accommodate encoder inputs, limit switches, relay drivers, and operator-panel LEDs without external muxing.
Recommandé
Educational Logic Design Platform
The EPF6016QI208-3N is widely adopted in university digital-logic courses as a teaching vehicle for VHDL/Verilog design, FPGA configuration flows, and timing analysis. Its manageable 16K-gate capacity allows students to focus on architectural learning rather than resource management. The 208-PQFP package on development boards provides accessible probing points for laboratory exercises. Legacy MAX+PLUS II design software remains freely available, supporting a long-tail educational ecosystem that modern Quartus Prime has not displaced.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016QI208-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016QI208-3 | EPF6016QC208-3N | EPF6016QC208-3 | EPF6016AQC208-3N | EPF6016AQC208-3 | EPF6016AQC208-2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-PQFP / 208-BFQFP | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 |
| User I/Os | 171 | 171 | 171 | 171 | 171 | 171 | 171 |
| Speed Grade | -3 | -3 | -3 | -3 | -3 (A-speed) | -3 (A-speed) | -2 (faster than -3) |
| Operating Temperature | 0C to +85C (Industrial) | 0C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Lead-Free (RoHS) | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature grade with lead-free finish (vs EPF6016QC208-3N)
- Lead-free termination for RoHS compliance (vs EPF6016QI208-3)
- Balanced density at 16K gates (vs EPF6016AQC208-2N)
Notes de conception
The EPF6016QI208-3N requires a stable 5.0V VCCINT supply with ±5% tolerance for the core logic. Decouple VCCINT with one 100 µF bulk capacitor plus four 0.1 µF ceramic capacitors distributed around the package perimeter. Each VCCIO bank (banks 1-8) must be powered from a single rail - mixing 5V and 3.3V on the same bank is forbidden per the FLEX 6000 datasheet. Estimated: ICCINT quiescent current ~5 mA, ICCIO per bank ~10 mA at 10 MHz toggle rate.
The 208-PQFP package has 0.5 mm pitch gull-wing leads and is suitable for 4-layer or 6-layer PCB designs. Provide a continuous ground plane directly under the device to minimize inductance in power/ground paths. Keep all 5V and 3.3V supply traces at least 2 mm wide and route configuration signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) on inner layers with ground shielding to avoid noise coupling during power-up configuration.
Do not attempt to use modern Quartus Prime (15.0+) to compile FLEX 6000 designs - support was removed after Quartus II 13.0sp1. Use Altera MAX+PLUS II baseline 10.2 or Quartus II 13.0sp1 for design entry. Verify JTAG chain integrity before configuration - a missing TCK pull-up or incorrect BSDL file will prevent successful configuration. Do not exceed 25 MHz on the DCLK pin during passive serial configuration, as this violates the FLEX 6000 datasheet AC specification.
Differential pair routing is not natively supported on FLEX 6000 I/O; if your design requires LVDS or similar signaling, route traces as tightly-coupled 50 ohm microstrip with matched lengths (±10 mils) and use external LVDS transceivers. Place the configuration EPROM within 6 inches of the FPGA DCLK/DATA0 pins to minimize signal degradation during configuration loading. Add a 1 kΩ pull-up to nCONFIG and a 10 kΩ pull-up to nSTATUS.
Informations de conformité
RoHS compliant per the 'N' suffix in the part number (matte-tin Pb-free finish). Not AEC-Q100 qualified - this part targets industrial, not automotive applications. Halogen-free status not specified in available data.
