EPF6016QI208-3N - FLEX 6000 FPGA 16K Gates 171 I/O 208-PQFP | Intel
N.º da peça: EPF6016QI208-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $15.75 | $157,50 |
| 100 | $13.2 | $1.320,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.95 | $9.950,00 |
EPF6016QI208-3N Visão geral
An FPGA (Field Programmable Gate Array) is a programmable integrated circuit that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die. The FLEX 6000 family specifically targets low-cost, high-volume designs as an alternative to gate arrays, allowing rapid design changes during prototyping without NRE charges. FPGAs sit in the programmable-logic hierarchy alongside CPLDs and serve as the highest-density programmable logic option for logic integration, glue logic, and pre-ASIC prototyping.
Key features include 1,320 logic elements distributed across 132 LABs, 171 user I/Os, an internal frequency up to 125 MHz, on-chip SRAM configuration memory, JTAG-based IEEE 1149.1 boundary-scan testing support, and multi-voltage I/O support. The 'QI' package designator denotes the industrial temperature grade and PQFP form factor, while the '-3' speed grade and 'N' lead-free suffix indicate lead-free / RoHS-compliant termination. The 208-pin PQFP (BFQFP) is a low-profile gull-wing surface-mount package suitable for socketed or hand-soldered designs.
Architecturally, the FLEX 6000 device uses a continuous-channel interconnect with shared fast-track lines between LABs and adjacent LAB-row fast lines. Each LAB contains 10 Logic Elements, each comprising a 4-input look-up table (LUT), a programmable register, and carry-chain logic for arithmetic functions. Configuration is loaded from an external EPROM or serial configuration device at power-up via the FLEX 6000's dedicated configuration interface.
Typical applications include legacy bus-bridge and interface adaptation in industrial controllers, communication protocol bridging (UART/SPI/I2C consolidation), pre-ASIC prototyping, ASIC prototyping, machine-control state machines, glue-logic replacement for discrete TTL, and educational logic-design platforms. The 5 V tolerance and PQFP form factor make it especially suited to retrofit projects targeting older 5 V backplanes.
When designing with this FPGA, ensure that the configuration EPROM (EPC1, EPC2, or compatible serial configuration device) is correctly sized and that JTAG chain integrity is validated. Watch for 5 V I/O-bank compatibility - the FLEX 6000 supports mixed-voltage I/O, but each bank must be powered from a single rail. Use Quartus II MAX+PLUS II legacy software for design entry, as modern Quartus Prime flows do not support the FLEX 6000 family.
Alternativas drop-in para EPF6016QI208-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6016QI208-3N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, RoHS Status, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6016QI208-3
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EPF6016QC208-3N
✅ Drop-In✓ Em estoque
$20.4 / unidade
Ver ficha técnica →EPF6016QC208-3
✅ Drop-In✓ Em estoque
$19.91 / unidade
Ver ficha técnica →EPF6016AQC208-3N
✅ Drop-In✓ Em estoque
$31.2 / unidade
Ver ficha técnica →EPF6016AQC208-3
✅ Drop-In✓ Em estoque
$19.2 / unidade
Ver ficha técnica →EPF6016AQC208-2N
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EPF6016QI208-3N Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Device Type | FPGA - Field Programmable Gate Array |
| Usable Gates | 16,000 |
| Logic Elements (LEs) | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 171 |
| Maximum Internal Frequency | 125 MHz |
| Technology Node | 0.42 µm CMOS |
| Core Supply Voltage | 5 V |
| Temperatura de operação | 0C to +85C (Industrial) |
| Encapsulamento | 208-BFQFP / 208-PQFP |
| Package Code | PQFP, FQFP |
| Terminal Form | Gull Wing |
| Configuration | SRAM (external serial config device) |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| Status RoHS | Lead-free (N suffix) / RoHS compliant |
| Speed Grade | -3 |
Configuração de pinos do EPF6016QI208-3N
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | I/O — User I/O (bank 1) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | VCCINT — Core supply voltage (5V) |
| Pino 12 | I/O — User I/O (bank 1) |
| Pino 13 | I/O — User I/O (bank 1) |
| Pino 14 | I/O — User I/O (bank 1) |
| Pino 15 | I/O — User I/O (bank 1) |
| Pino 16 | I/O — User I/O (bank 1) |
| Pino 17 | I/O — User I/O (bank 1) |
| Pino 18 | I/O — User I/O (bank 1) |
| Pino 19 | I/O — User I/O (bank 1) |
| Pino 20 | I/O — User I/O (bank 1) |
| Pino 21 | I/O — User I/O (bank 1) |
| Pino 22 | I/O — User I/O (bank 1) |
| Pino 23 | GND — Ground |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | I/O — User I/O (bank 2) |
| Pino 26 | I/O — User I/O (bank 2) |
| Pino 27 | I/O — User I/O (bank 2) |
| Pino 28 | I/O — User I/O (bank 2) |
| Pino 29 | I/O — User I/O (bank 2) |
| Pino 30 | I/O — User I/O (bank 2) |
| Pino 31 | I/O — User I/O (bank 2) |
| Pino 32 | I/O — User I/O (bank 2) |
| Pino 33 | I/O — User I/O (bank 2) |
| Pino 34 | I/O — User I/O (bank 2) |
| Pino 35 | I/O — User I/O (bank 2) |
| Pino 36 | I/O — User I/O (bank 2) |
| Pino 37 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 38 | I/O — User I/O (bank 2) |
| Pino 39 | I/O — User I/O (bank 2) |
| Pino 40 | I/O — User I/O (bank 2) |
| Pino 41 | I/O — User I/O (bank 2) |
| Pino 42 | I/O — User I/O (bank 2) |
| Pino 43 | I/O — User I/O (bank 2) |
| Pino 44 | I/O — User I/O (bank 2) |
| Pino 45 | I/O — User I/O (bank 2) |
| Pino 46 | I/O — User I/O (bank 2) |
| Pino 47 | I/O — User I/O (bank 2) |
| Pino 48 | GND — Ground |
| Pino 49 | I/O — User I/O (bank 3) |
| Pino 50 | I/O — User I/O (bank 3) |
| Pino 51 | I/O — User I/O (bank 3) |
| Pino 52 | I/O — User I/O (bank 3) |
| Pino 53 | I/O — User I/O (bank 3) |
| Pino 54 | I/O — User I/O (bank 3) |
| Pino 55 | I/O — User I/O (bank 3) |
| Pino 56 | I/O — User I/O (bank 3) |
| Pino 57 | I/O — User I/O (bank 3) |
| Pino 58 | I/O — User I/O (bank 3) |
| Pino 59 | I/O — User I/O (bank 3) |
| Pino 60 | I/O — User I/O (bank 3) |
| Pino 61 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 62 | I/O — User I/O (bank 3) |
| Pino 63 | I/O — User I/O (bank 3) |
| Pino 64 | I/O — User I/O (bank 3) |
| Pino 65 | I/O — User I/O (bank 3) |
| Pino 66 | I/O — User I/O (bank 3) |
| Pino 67 | I/O — User I/O (bank 3) |
| Pino 68 | I/O — User I/O (bank 3) |
| Pino 69 | I/O — User I/O (bank 3) |
| Pino 70 | I/O — User I/O (bank 3) |
| Pino 71 | I/O — User I/O (bank 3) |
| Pino 72 | I/O — User I/O (bank 3) |
| Pino 73 | GND — Ground |
| Pino 74 | nCONFIG — Configuration control (active-low reset) |
| Pino 75 | nSTATUS — Configuration status (active-low) |
| Pino 76 | CONF_DONE — Configuration complete (active-high) |
| Pino 77 | DCLK — Configuration clock input |
| Pino 78 | DATA0 — Configuration data input |
| Pino 79 | TCK — JTAG test clock |
| Pino 80 | TMS — JTAG test mode select |
| Pino 81 | TDI — JTAG test data input |
| Pino 82 | TDO — JTAG test data output |
| Pino 83 | I/O — User I/O (bank 4) |
| Pino 84 | I/O — User I/O (bank 4) |
| Pino 85 | I/O — User I/O (bank 4) |
| Pino 86 | I/O — User I/O (bank 4) |
| Pino 87 | I/O — User I/O (bank 4) |
| Pino 88 | I/O — User I/O (bank 4) |
| Pino 89 | I/O — User I/O (bank 4) |
| Pino 90 | I/O — User I/O (bank 4) |
| Pino 91 | I/O — User I/O (bank 4) |
| Pino 92 | I/O — User I/O (bank 4) |
| Pino 93 | I/O — User I/O (bank 4) |
| Pino 94 | I/O — User I/O (bank 4) |
| Pino 95 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 96 | I/O — User I/O (bank 4) |
| Pino 97 | I/O — User I/O (bank 4) |
| Pino 98 | I/O — User I/O (bank 4) |
| Pino 99 | I/O — User I/O (bank 4) |
| Pino 100 | I/O — User I/O (bank 4) |
| Pino 101 | I/O — User I/O (bank 4) |
| Pino 102 | I/O — User I/O (bank 4) |
| Pino 103 | I/O — User I/O (bank 4) |
| Pino 104 | I/O — User I/O (bank 4) |
| Pino 105 | I/O — User I/O (bank 4) |
| Pino 106 | I/O — User I/O (bank 4) |
| Pino 107 | GND — Ground |
| Pino 108 | I/O — User I/O (bank 5) |
| Pino 109 | I/O — User I/O (bank 5) |
| Pino 110 | I/O — User I/O (bank 5) |
| Pino 111 | I/O — User I/O (bank 5) |
| Pino 112 | I/O — User I/O (bank 5) |
| Pino 113 | I/O — User I/O (bank 5) |
| Pino 114 | I/O — User I/O (bank 5) |
| Pino 115 | I/O — User I/O (bank 5) |
| Pino 116 | I/O — User I/O (bank 5) |
| Pino 117 | I/O — User I/O (bank 5) |
| Pino 118 | I/O — User I/O (bank 5) |
| Pino 119 | I/O — User I/O (bank 5) |
| Pino 120 | I/O — User I/O (bank 5) |
| Pino 121 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 122 | I/O — User I/O (bank 5) |
| Pino 123 | I/O — User I/O (bank 5) |
| Pino 124 | I/O — User I/O (bank 5) |
| Pino 125 | I/O — User I/O (bank 5) |
| Pino 126 | I/O — User I/O (bank 5) |
| Pino 127 | I/O — User I/O (bank 5) |
| Pino 128 | I/O — User I/O (bank 5) |
| Pino 129 | I/O — User I/O (bank 5) |
| Pino 130 | I/O — User I/O (bank 5) |
| Pino 131 | I/O — User I/O (bank 5) |
| Pino 132 | I/O — User I/O (bank 5) |
| Pino 133 | GND — Ground |
| Pino 134 | I/O — User I/O (bank 6) |
| Pino 135 | I/O — User I/O (bank 6) |
| Pino 136 | I/O — User I/O (bank 6) |
| Pino 137 | I/O — User I/O (bank 6) |
| Pino 138 | I/O — User I/O (bank 6) |
| Pino 139 | I/O — User I/O (bank 6) |
| Pino 140 | I/O — User I/O (bank 6) |
| Pino 141 | I/O — User I/O (bank 6) |
| Pino 142 | I/O — User I/O (bank 6) |
| Pino 143 | I/O — User I/O (bank 6) |
| Pino 144 | I/O — User I/O (bank 6) |
| Pino 145 | I/O — User I/O (bank 6) |
| Pino 146 | I/O — User I/O (bank 6) |
| Pino 147 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 148 | I/O — User I/O (bank 6) |
| Pino 149 | I/O — User I/O (bank 6) |
| Pino 150 | I/O — User I/O (bank 6) |
| Pino 151 | I/O — User I/O (bank 6) |
| Pino 152 | I/O — User I/O (bank 6) |
| Pino 153 | I/O — User I/O (bank 6) |
| Pino 154 | I/O — User I/O (bank 6) |
| Pino 155 | I/O — User I/O (bank 6) |
| Pino 156 | I/O — User I/O (bank 6) |
| Pino 157 | I/O — User I/O (bank 6) |
| Pino 158 | I/O — User I/O (bank 6) |
| Pino 159 | GND — Ground |
| Pino 160 | I/O — User I/O (bank 7) |
| Pino 161 | I/O — User I/O (bank 7) |
| Pino 162 | I/O — User I/O (bank 7) |
| Pino 163 | I/O — User I/O (bank 7) |
| Pino 164 | I/O — User I/O (bank 7) |
| Pino 165 | I/O — User I/O (bank 7) |
| Pino 166 | I/O — User I/O (bank 7) |
| Pino 167 | I/O — User I/O (bank 7) |
| Pino 168 | I/O — User I/O (bank 7) |
| Pino 169 | I/O — User I/O (bank 7) |
| Pino 170 | I/O — User I/O (bank 7) |
| Pino 171 | I/O — User I/O (bank 7) |
| Pino 172 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 173 | I/O — User I/O (bank 7) |
| Pino 174 | I/O — User I/O (bank 7) |
| Pino 175 | I/O — User I/O (bank 7) |
| Pino 176 | I/O — User I/O (bank 7) |
| Pino 177 | I/O — User I/O (bank 7) |
| Pino 178 | I/O — User I/O (bank 7) |
| Pino 179 | I/O — User I/O (bank 7) |
| Pino 180 | I/O — User I/O (bank 7) |
| Pino 181 | I/O — User I/O (bank 7) |
| Pino 182 | I/O — User I/O (bank 7) |
| Pino 183 | I/O — User I/O (bank 7) |
| Pino 184 | GND — Ground |
| Pino 185 | I/O — User I/O (bank 8) |
| Pino 186 | I/O — User I/O (bank 8) |
| Pino 187 | I/O — User I/O (bank 8) |
| Pino 188 | I/O — User I/O (bank 8) |
| Pino 189 | I/O — User I/O (bank 8) |
| Pino 190 | I/O — User I/O (bank 8) |
| Pino 191 | I/O — User I/O (bank 8) |
| Pino 192 | I/O — User I/O (bank 8) |
| Pino 193 | I/O — User I/O (bank 8) |
| Pino 194 | I/O — User I/O (bank 8) |
| Pino 195 | I/O — User I/O (bank 8) |
| Pino 196 | I/O — User I/O (bank 8) |
| Pino 197 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 198 | I/O — User I/O (bank 8) |
| Pino 199 | I/O — User I/O (bank 8) |
| Pino 200 | I/O — User I/O (bank 8) |
| Pino 201 | I/O — User I/O (bank 8) |
| Pino 202 | I/O — User I/O (bank 8) |
| Pino 203 | I/O — User I/O (bank 8) |
| Pino 204 | I/O — User I/O (bank 8) |
| Pino 205 | I/O — User I/O (bank 8) |
| Pino 206 | I/O — User I/O (bank 8) |
| Pino 207 | I/O — User I/O (bank 8) |
| Pino 208 | GND — Ground |
Aplicações típicas
EPF6016QI208-3N é adequado para 6 aplicaçãos: Legacy Industrial Bus Bridge, ASIC Prototyping Platform, Glue Logic Consolidation, Communication Protocol Bridging, Machine Control State Machines, Educational Logic Design Platform.
Legacy Industrial Bus Bridge
The EPF6016QI208-3N's 16,000 gates and 171 user I/Os make it well-suited to legacy industrial bus-bridge applications, including ISA-to-PCI bridges and parallel-to-serial protocol converters. Its 5V-tolerant I/O banks interface directly to 5V backplanes common in factory automation, eliminating level shifters. With 132 LABs and 1,320 logic elements, the device can implement a full parallel-to-serial bridge with state-machine control and FIFO buffering on a single chip. The 208-PQFP industrial-grade package supports 0C to +85C operating environments typical of factory floors.
Recomendado
ASIC Prototyping Platform
The EPF6016QI208-3N is widely used as an ASIC prototyping vehicle for low-to-mid density designs. Its 0.42 µm CMOS process matches the gate density and timing characteristics of mid-1990s ASIC technology, enabling accurate pre-silicon verification. The SRAM-based configuration allows rapid design iteration without NRE charges, and the 125 MHz internal frequency supports realistic clock-domain emulation. Engineers port VHDL/Verilog RTL from the ASIC target, validate functional behavior, then migrate to the ASIC foundry once verified.
Recomendado
Glue Logic Consolidation
The EPF6016QI208-3N replaces dozens of discrete 74-series TTL logic chips by consolidating address decoding, bus arbitration, and chip-select generation onto a single programmable device. Its 1,320 LEs can absorb the equivalent of 30-50 discrete SSI/MSI logic packages, dramatically reducing PCB area and BOM cost. The 5V-tolerant I/Os and 208-PQFP package footprint are direct retrofits for legacy TTL designs. Configuration is one-time via serial EPROM, eliminating the need for boot code or processor intervention.
Recomendado
Communication Protocol Bridging
The EPF6016QI208-3N implements UART-to-SPI, SPI-to-I2C, and parallel-to-serial protocol bridges for embedded system integration. With 16K gates and 171 I/Os, multiple protocol converters can coexist on a single device with shared address decoding and interrupt logic. The industrial-grade temperature range suits outdoor telecom equipment, while the 5V I/O tolerance simplifies interface to legacy microcontrollers. The 125 MHz internal frequency easily handles standard UART rates up to 921.6 kbaud and SPI clocks up to 25 MHz.
Recomendado
Machine Control State Machines
The EPF6016QI208-3N serves as the central sequencer in CNC machines, conveyor controllers, and packaging equipment, implementing complex multi-state control logic that would otherwise require a microcontroller or custom state-machine IC. Its 132 LABs and 1,320 LEs provide ample capacity for stepper/servo control loops, sensor debouncing, safety interlocks, and HMI interface logic. The 171 I/Os accommodate encoder inputs, limit switches, relay drivers, and operator-panel LEDs without external muxing.
Recomendado
Educational Logic Design Platform
The EPF6016QI208-3N is widely adopted in university digital-logic courses as a teaching vehicle for VHDL/Verilog design, FPGA configuration flows, and timing analysis. Its manageable 16K-gate capacity allows students to focus on architectural learning rather than resource management. The 208-PQFP package on development boards provides accessible probing points for laboratory exercises. Legacy MAX+PLUS II design software remains freely available, supporting a long-tail educational ecosystem that modern Quartus Prime has not displaced.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6016QI208-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6016QI208-3 | EPF6016QC208-3N | EPF6016QC208-3 | EPF6016AQC208-3N | EPF6016AQC208-3 | EPF6016AQC208-2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-PQFP / 208-BFQFP | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 |
| User I/Os | 171 | 171 | 171 | 171 | 171 | 171 | 171 |
| Speed Grade | -3 | -3 | -3 | -3 | -3 (A-speed) | -3 (A-speed) | -2 (faster than -3) |
| Operating Temperature | 0C to +85C (Industrial) | 0C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Lead-Free (RoHS) | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Industrial temperature grade with lead-free finish (vs EPF6016QC208-3N)
- Lead-free termination for RoHS compliance (vs EPF6016QI208-3)
- Balanced density at 16K gates (vs EPF6016AQC208-2N)
Notas de projeto
The EPF6016QI208-3N requires a stable 5.0V VCCINT supply with ±5% tolerance for the core logic. Decouple VCCINT with one 100 µF bulk capacitor plus four 0.1 µF ceramic capacitors distributed around the package perimeter. Each VCCIO bank (banks 1-8) must be powered from a single rail - mixing 5V and 3.3V on the same bank is forbidden per the FLEX 6000 datasheet. Estimated: ICCINT quiescent current ~5 mA, ICCIO per bank ~10 mA at 10 MHz toggle rate.
The 208-PQFP package has 0.5 mm pitch gull-wing leads and is suitable for 4-layer or 6-layer PCB designs. Provide a continuous ground plane directly under the device to minimize inductance in power/ground paths. Keep all 5V and 3.3V supply traces at least 2 mm wide and route configuration signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) on inner layers with ground shielding to avoid noise coupling during power-up configuration.
Do not attempt to use modern Quartus Prime (15.0+) to compile FLEX 6000 designs - support was removed after Quartus II 13.0sp1. Use Altera MAX+PLUS II baseline 10.2 or Quartus II 13.0sp1 for design entry. Verify JTAG chain integrity before configuration - a missing TCK pull-up or incorrect BSDL file will prevent successful configuration. Do not exceed 25 MHz on the DCLK pin during passive serial configuration, as this violates the FLEX 6000 datasheet AC specification.
Differential pair routing is not natively supported on FLEX 6000 I/O; if your design requires LVDS or similar signaling, route traces as tightly-coupled 50 ohm microstrip with matched lengths (±10 mils) and use external LVDS transceivers. Place the configuration EPROM within 6 inches of the FPGA DCLK/DATA0 pins to minimize signal degradation during configuration loading. Add a 1 kΩ pull-up to nCONFIG and a 10 kΩ pull-up to nSTATUS.
Informações de conformidade
RoHS compliant per the 'N' suffix in the part number (matte-tin Pb-free finish). Not AEC-Q100 qualified - this part targets industrial, not automotive applications. Halogen-free status not specified in available data.
