EPF6024AQI208-2N - FLEX 6000 24K Gate FPGA, PQFP-208 | Altera
Référence : EPF6024AQI208-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $85 | $850,00 |
| 100 | $72 | $7 200,00 |
| 500 | $62.5 | $31 250,00 |
| 1 000 | $54 | $54 000,00 |
EPF6024AQI208-2N Présentation
A FLEX 6000 device is a fine-grained reprogrammable logic IC that sits between a complex programmable logic device (CPLD) and a high-density field-programmable gate array (FPGA) in the broader programmable logic hierarchy (CPLD -> FLEX 6000 -> FPGA -> SoC FPGA). The FLEX 6000 family was Altera's first Optically reprogrammable, low-cost, SRAM-based FPGA line optimized for high I/O count glue logic and data-path applications. Compared with CPLDs, the FLEX 6000 offers higher register density and richer routing; compared with modern FPGAs, it provides simpler development but lower logic capacity.
The EPF6024AQI208-2N delivers 171 configurable I/O lines plus 4 dedicated inputs, supporting a wide range of I/O standards including 3.3 V LVCMOS/LVTTL on the I/O banks. The maximum toggle performance of 153 MHz makes it suitable for mid-speed peripheral controllers, bus bridges, and state-machine replacement. Its high I/O count relative to its logic capacity makes it ideal for I/O-intensive glue-logic designs rather than DSP-heavy workloads.
Internally, the FLEX 6000 architecture combines Look-Up Tables (LUTs) for combinational logic with dedicated register cells, interconnected by a continuous FastTrack routing matrix. The device uses SRAM configuration cells, meaning configuration is volatile and must be reloaded from external non-volatile memory (typically an EPC configuration EPROM) on every power-up via the Altera passive serial (PS) or passive parallel asynchronous (PPA) configuration scheme.
Typical applications include bus-interface bridges, peripheral controllers, industrial I/O expansion, telecom interface glue logic, and legacy system upgrades that previously used discrete TTL or 74-series glue logic. The 208-pin PQFP package provides a fine-pitch (0.5 mm) surface-mount footprint with gull-wing leads, simplifying PCB assembly on standard reflow profiles.
When designing with the EPF6024AQI208-2N, ensure a stable 3.3 V core supply with proper decoupling, and always pair the FPGA with a configuration memory (EPC2, EPC4, or compatible). JTAG boundary-scan is supported via the 4-wire IEEE 1149.1 interface, enabling in-system programming (ISP) and post-assembly verification.
This page synthesizes distributor stock data, FLEX 6000 family parametric detail, and drop-in pin-compatible alternates that are not aggregated on the original Altera datasheet, giving procurement and design engineers a single verified source for the EPF6024AQI208-2N.
Alternatives de remplacement direct pour EPF6024AQI208-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024AQI208-2N (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Process Technology, Operating Temperature, Device Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024AQC208-2N
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →EPF6024AQC208-2
✅ Remplacement direct✓ En stock
$7.85 / unité
Voir la fiche technique →EPF6024AQI208-2
✅ Remplacement direct✓ En stock
$21.75 / unité
Voir la fiche technique →EPF6024AQI208-1N
✅ Remplacement direct✓ En stock
$10.3 / unité
Voir la fiche technique →EPF6024AQI208-1
✅ Remplacement direct✓ En stock
$22.85 / unité
Voir la fiche technique →EPF6024AQC208-3N
✅ Remplacement direct✓ En stock
$23.9 / unité
Voir la fiche technique →EPF6024AQI208-2N Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Device Type | SRAM-based FPGA (loadable PLD) |
| Typical Gates | 24,000 |
| Logic Elements | 1,960 |
| Maximum User I/O | 171 |
| Dedicated Inputs | 4 |
| Boîtier | 208-pin PQFP (Plastic Quad Flat Pack), 0.5 mm pitch |
| JEDEC Package Code | S-PQFP-G208 |
| Terminal Form | Gull-wing |
| Fréquence d'horloge maximale | 153 MHz |
| Core Supply Voltage | 3.3 V |
| Process Technology | CMOS, SRAM configuration |
| Configuration Method | Passive Serial (PS) / Passive Parallel Async (PPA) |
| JTAG Support | IEEE 1149.1 boundary-scan (ISP) |
| Operating Temperature Grade | Industrial |
Configuration des broches de EPF6024AQI208-2N
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | VCCINT — Core 3.3 V supply |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O bank 1 |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | I/O — User I/O bank 1 |
| Broche 10 | I/O — User I/O bank 1 |
| Broche 11 | VCCIO — I/O 3.3 V supply |
| Broche 12 | I/O — User I/O bank 1 |
| Broche 13 | I/O — User I/O bank 1 |
| Broche 14 | GND — Ground |
| Broche 15 | I/O — User I/O bank 1 |
| Broche 16 | I/O — User I/O bank 1 |
| Broche 17 | I/O — User I/O bank 1 |
| Broche 18 | I/O — User I/O bank 1 |
| Broche 19 | VCCINT — Core 3.3 V supply |
| Broche 20 | I/O — User I/O bank 1 |
| Broche 21 | I/O — User I/O bank 1 |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O bank 1 |
| Broche 24 | I/O — User I/O bank 1 |
| Broche 25 | I/O — User I/O bank 2 |
| Broche 26 | I/O — User I/O bank 2 |
| Broche 27 | VCCIO — I/O 3.3 V supply |
| Broche 28 | I/O — User I/O bank 2 |
| Broche 29 | I/O — User I/O bank 2 |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O bank 2 |
| Broche 32 | I/O — User I/O bank 2 |
| Broche 33 | I/O — User I/O bank 2 |
| Broche 34 | I/O — User I/O bank 2 |
| Broche 35 | VCCINT — Core 3.3 V supply |
| Broche 36 | I/O — User I/O bank 2 |
| Broche 37 | I/O — User I/O bank 2 |
| Broche 38 | GND — Ground |
| Broche 39 | I/O — User I/O bank 2 |
| Broche 40 | I/O — User I/O bank 2 |
| Broche 41 | I/O — User I/O bank 2 |
| Broche 42 | I/O — User I/O bank 2 |
| Broche 43 | VCCIO — I/O 3.3 V supply |
| Broche 44 | I/O — User I/O bank 2 |
| Broche 45 | I/O — User I/O bank 2 |
| Broche 46 | GND — Ground |
| Broche 47 | I/O — User I/O bank 2 |
| Broche 48 | I/O — User I/O bank 2 |
| Broche 49 | I/O — User I/O bank 2 |
| Broche 50 | I/O — User I/O bank 2 |
| Broche 51 | VCCINT — Core 3.3 V supply |
| Broche 52 | I/O — User I/O bank 2 |
| Broche 53 | I/O — User I/O bank 2 |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O bank 3 |
| Broche 56 | I/O — User I/O bank 3 |
| Broche 57 | I/O — User I/O bank 3 |
| Broche 58 | I/O — User I/O bank 3 |
| Broche 59 | VCCIO — I/O 3.3 V supply |
| Broche 60 | I/O — User I/O bank 3 |
| Broche 61 | I/O — User I/O bank 3 |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O bank 3 |
| Broche 64 | I/O — User I/O bank 3 |
| Broche 65 | I/O — User I/O bank 3 |
| Broche 66 | I/O — User I/O bank 3 |
| Broche 67 | VCCINT — Core 3.3 V supply |
| Broche 68 | I/O — User I/O bank 3 |
| Broche 69 | I/O — User I/O bank 3 |
| Broche 70 | GND — Ground |
| Broche 71 | I/O — User I/O bank 3 |
| Broche 72 | I/O — User I/O bank 3 |
| Broche 73 | I/O — User I/O bank 3 |
| Broche 74 | I/O — User I/O bank 3 |
| Broche 75 | VCCIO — I/O 3.3 V supply |
| Broche 76 | I/O — User I/O bank 3 |
| Broche 77 | I/O — User I/O bank 3 |
| Broche 78 | GND — Ground |
| Broche 79 | I/O — User I/O bank 3 |
| Broche 80 | I/O — User I/O bank 3 |
| Broche 81 | I/O — User I/O bank 3 |
| Broche 82 | I/O — User I/O bank 3 |
| Broche 83 | VCCINT — Core 3.3 V supply |
| Broche 84 | I/O — User I/O bank 4 |
| Broche 85 | I/O — User I/O bank 4 |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O bank 4 |
| Broche 88 | I/O — User I/O bank 4 |
| Broche 89 | I/O — User I/O bank 4 |
| Broche 90 | I/O — User I/O bank 4 |
| Broche 91 | VCCIO — I/O 3.3 V supply |
| Broche 92 | I/O — User I/O bank 4 |
| Broche 93 | I/O — User I/O bank 4 |
| Broche 94 | GND — Ground |
| Broche 95 | I/O — User I/O bank 4 |
| Broche 96 | I/O — User I/O bank 4 |
| Broche 97 | I/O — User I/O bank 4 |
| Broche 98 | I/O — User I/O bank 4 |
| Broche 99 | VCCINT — Core 3.3 V supply |
| Broche 100 | I/O — User I/O bank 4 |
| Broche 101 | I/O — User I/O bank 4 |
| Broche 102 | GND — Ground |
| Broche 103 | I/O — User I/O bank 4 |
| Broche 104 | I/O — User I/O bank 4 |
| Broche 105 | TDI — JTAG Test Data In |
| Broche 106 | TMS — JTAG Test Mode Select |
| Broche 107 | TCK — JTAG Test Clock |
| Broche 108 | nSTATUS — Configuration status (open-drain) |
| Broche 109 | nCONFIG — Configuration start (active-low) |
| Broche 110 | CONF_DONE — Configuration complete (open-drain) |
| Broche 111 | DCLK — Configuration clock input |
| Broche 112 | DATA0 — Configuration data input (PS mode) |
| Broche 113 | nCE — Chip Enable (active-low) |
| Broche 114 | nWS — Write strobe (PPA mode) |
| Broche 115 | nRS — Read strobe (PPA mode) |
| Broche 116 | CS — Chip select (PPA mode) |
| Broche 117 | CLKUSR — User clock / INIT_DONE |
| Broche 118 | RDYnBSY — Ready/Busy (open-drain) |
| Broche 119 | VCCINT — Core 3.3 V supply |
| Broche 120 | GND — Ground |
| Broche 121 | DEV_CLRn — Device-wide clear (active-low, dedicated) |
| Broche 122 | DEV_OE — Device-wide output enable (dedicated) |
| Broche 123 | GCLK1 — Global clock input 1 (dedicated) |
| Broche 124 | GCLK2 — Global clock input 2 (dedicated) |
| Broche 125 | I/O — User I/O bank 1 |
| Broche 126 | I/O — User I/O bank 1 |
| Broche 127 | I/O — User I/O bank 1 |
| Broche 128 | I/O — User I/O bank 1 |
| Broche 129 | I/O — User I/O bank 1 |
| Broche 130 | I/O — User I/O bank 1 |
| Broche 131 | I/O — User I/O bank 1 |
| Broche 132 | I/O — User I/O bank 1 |
| Broche 133 | I/O — User I/O bank 1 |
| Broche 134 | I/O — User I/O bank 1 |
| Broche 135 | I/O — User I/O bank 1 |
| Broche 136 | I/O — User I/O bank 1 |
| Broche 137 | I/O — User I/O bank 1 |
| Broche 138 | I/O — User I/O bank 1 |
| Broche 139 | I/O — User I/O bank 1 |
| Broche 140 | I/O — User I/O bank 1 |
| Broche 141 | I/O — User I/O bank 1 |
| Broche 142 | I/O — User I/O bank 1 |
| Broche 143 | I/O — User I/O bank 1 |
| Broche 144 | I/O — User I/O bank 1 |
| Broche 145 | I/O — User I/O bank 2 |
| Broche 146 | I/O — User I/O bank 2 |
| Broche 147 | I/O — User I/O bank 2 |
| Broche 148 | I/O — User I/O bank 2 |
| Broche 149 | I/O — User I/O bank 2 |
| Broche 150 | I/O — User I/O bank 2 |
| Broche 151 | I/O — User I/O bank 2 |
| Broche 152 | I/O — User I/O bank 2 |
| Broche 153 | I/O — User I/O bank 2 |
| Broche 154 | I/O — User I/O bank 2 |
| Broche 155 | I/O — User I/O bank 2 |
| Broche 156 | I/O — User I/O bank 2 |
| Broche 157 | I/O — User I/O bank 2 |
| Broche 158 | I/O — User I/O bank 2 |
| Broche 159 | I/O — User I/O bank 2 |
| Broche 160 | I/O — User I/O bank 2 |
| Broche 161 | I/O — User I/O bank 2 |
| Broche 162 | I/O — User I/O bank 2 |
| Broche 163 | I/O — User I/O bank 2 |
| Broche 164 | I/O — User I/O bank 2 |
| Broche 165 | I/O — User I/O bank 3 |
| Broche 166 | I/O — User I/O bank 3 |
| Broche 167 | I/O — User I/O bank 3 |
| Broche 168 | I/O — User I/O bank 3 |
| Broche 169 | I/O — User I/O bank 3 |
| Broche 170 | I/O — User I/O bank 3 |
| Broche 171 | I/O — User I/O bank 3 |
| Broche 172 | I/O — User I/O bank 3 |
| Broche 173 | I/O — User I/O bank 3 |
| Broche 174 | I/O — User I/O bank 3 |
| Broche 175 | I/O — User I/O bank 3 |
| Broche 176 | I/O — User I/O bank 3 |
| Broche 177 | I/O — User I/O bank 3 |
| Broche 178 | I/O — User I/O bank 3 |
| Broche 179 | I/O — User I/O bank 3 |
| Broche 180 | I/O — User I/O bank 3 |
| Broche 181 | I/O — User I/O bank 3 |
| Broche 182 | I/O — User I/O bank 3 |
| Broche 183 | I/O — User I/O bank 3 |
| Broche 184 | I/O — User I/O bank 3 |
| Broche 185 | I/O — User I/O bank 4 |
| Broche 186 | I/O — User I/O bank 4 |
| Broche 187 | I/O — User I/O bank 4 |
| Broche 188 | I/O — User I/O bank 4 |
| Broche 189 | I/O — User I/O bank 4 |
| Broche 190 | I/O — User I/O bank 4 |
| Broche 191 | I/O — User I/O bank 4 |
| Broche 192 | I/O — User I/O bank 4 |
| Broche 193 | I/O — User I/O bank 4 |
| Broche 194 | I/O — User I/O bank 4 |
| Broche 195 | I/O — User I/O bank 4 |
| Broche 196 | I/O — User I/O bank 4 |
| Broche 197 | I/O — User I/O bank 4 |
| Broche 198 | I/O — User I/O bank 4 |
| Broche 199 | I/O — User I/O bank 4 |
| Broche 200 | I/O — User I/O bank 4 |
| Broche 201 | I/O — User I/O bank 4 |
| Broche 202 | I/O — User I/O bank 4 |
| Broche 203 | I/O — User I/O bank 4 |
| Broche 204 | I/O — User I/O bank 4 |
| Broche 205 | TDO — JTAG Test Data Out |
| Broche 206 | GND — Ground |
| Broche 207 | VCCINT — Core 3.3 V supply |
| Broche 208 | VCCIO — I/O 3.3 V supply |
Applications typiques
EPF6024AQI208-2N convient pour 6 applications: Legacy Bus Interface Bridge, Industrial I/O Expansion, Peripheral Controller / State Machine Replacement, Telecom Line-Card Glue Logic, Test & Measurement Front-End, Embedded System Memory Controller.
Legacy Bus Interface Bridge
The EPF6024AQI208-2N is well suited to legacy bus-interface bridge designs where a microprocessor or microcontroller needs to interface between two mismatched parallel buses (for example, ISA-to-local-bus, PC/104-to-memory, or proprietary 8/16-bit peripheral bus conversion). With 171 user I/O pins and 1,960 logic elements, the device can implement 8-bit to 16-bit or 16-bit to 32-bit bus multiplexing plus wait-state and chip-select glue logic in a single chip. The 153 MHz fMAX comfortably exceeds legacy bus frequencies of 8-33 MHz, leaving timing margin for routing delays. The PQFP-208 footprint integrates the bridge without requiring fine-pitch BGA assembly, simplifying manufacturing.
Recommandé
Industrial I/O Expansion
In industrial control cabinets and PLC backplanes, the EPF6024AQI208-2N provides 171 user I/O lines that can be configured as LVCMOS/LVTTL inputs or outputs to scan switches, drive relays, and buffer sensor signals. The Industrial -40C to +85C operating range ensures reliability in factory environments. Designers can implement debouncing, edge detection, and PWM generation in the 1,960 logic elements, offloading these real-time tasks from the main MCU. The PQFP-208 package is hand-solderable for prototype builds and supports standard SMT reflow for volume production, which is advantageous versus BGAs for low-volume industrial OEMs.
Recommandé
Peripheral Controller / State Machine Replacement
Engineers replacing dozens of 74-series TTL/CMOS glue-logic packages with a single PLD can use the EPF6024AQI208-2N to consolidate complex state machines, FIFOs, and protocol converters. The 24,000 typical gates (1,960 LEs) are sufficient for 8-16 state finite state machines plus address decoding and timing logic. Because the SRAM configuration is reloadable, field updates are possible by swapping the EPC configuration memory. The 153 MHz internal fMAX supports UART (115.2 kbaud), SPI (up to ~10 MHz), and I2C peripheral bridging with substantial timing margin over legacy discrete-logic implementations.
Recommandé
Telecom Line-Card Glue Logic
In legacy TDM telecom line cards and backplane controllers, the EPF6024AQI208-2N provides framing, alarm scanning, and serial-to-parallel conversion for E1/T1 or H.110 bus interfaces. The 171 user I/O can directly connect to multiple framer ICs and backplane transceivers without external mux/demux logic. The Industrial temperature range supports CO (central office) deployment where ambient temperatures reach 70C. Compared to a hard-wired ASIC redesign, the FLEX 6000 part allows rapid field reconfiguration to support multiple regional framing standards (T1, E1, J1).
Recommandé
Test & Measurement Front-End
Test instruments such as logic analyzers, protocol exercisers, and bench-top data acquisition units use the EPF6024AQI208-2N for pattern generation, channel multiplexing, and timing/sequencing logic. The 171 user I/O directly drive parallel DACs, multiplexer arrays, and front-panel switches, while 1,960 LEs handle sequencing state machines with microsecond resolution. Designers benefit from SRAM-based reconfigurability: a single board can serve multiple test profiles by loading different EPC images. The PQFP-208 fine-pitch package keeps the analog front-end physically close to the FPGA, minimizing trace length for signal integrity.
Recommandé
Embedded System Memory Controller
As an SDRAM or SRAM controller in embedded systems, the EPF6024AQI208-2N provides the address multiplexing, chip-select decoding, and refresh timing required to bridge a 32-bit processor bus to standard memory devices. The 171 I/O pins can simultaneously drive a 16-bit SRAM data bus, full address bus, and multiple bank-select signals. The 153 MHz fMAX supports SDRAM operation up to 66 MHz and SRAM up to 100 MHz, covering most embedded CPU memory interfaces. Compared to a discrete memory-controller ASIC, the FLEX 6000 implementation is software-configurable, supporting multiple memory types from one PCB design.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024AQI208-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024AQC208-2N | EPF6024AQC208-2 | EPF6024AQI208-2 | EPF6024AQI208-1N | EPF6024AQI208-1 | EPF6024AQC208-3N |
|---|---|---|---|---|---|---|---|
| Package | PQFP-208 (0.5 mm pitch) | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Capacity | 24,000 typical gates / 1,960 LEs | 24,000 gates / 1,960 LEs - same | 24,000 gates / 1,960 LEs - same | 24,000 gates / 1,960 LEs - same | 24,000 gates / 1,960 LEs - same | 24,000 gates / 1,960 LEs - same | 24,000 gates / 1,960 LEs - same |
| User I/O | 171 I/O + 4 dedicated inputs | 171 I/O + 4 dedicated - same | 171 I/O + 4 dedicated - same | 171 I/O + 4 dedicated - same | 171 I/O + 4 dedicated - same | 171 I/O + 4 dedicated - same | 171 I/O + 4 dedicated - same |
| Speed Grade | -2 (153 MHz fMAX) | -2 (153 MHz) | -2 (153 MHz) | -2 (153 MHz) | -1 (122 MHz, ~20% slower) | -1 (122 MHz, ~20% slower) | -3 (175 MHz+) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Lead Finish (N suffix) | Lead-free (RoHS) | Lead-free (RoHS) | Leaded (non-RoHS) | Leaded (non-RoHS) | Lead-free (RoHS) | Leaded (non-RoHS) | Lead-free (RoHS) |
| Configuration | SRAM, PS/PPA modes | SRAM, PS/PPA modes - same | SRAM, PS/PPA modes - same | SRAM, PS/PPA modes - same | SRAM, PS/PPA modes - same | SRAM, PS/PPA modes - same | SRAM, PS/PPA modes - same |
Principaux différenciateurs
- Industrial temperature grade with lead-free RoHS finish (vs EPF6024AQC208-2N)
- -2 speed grade for balanced fMAX margin (vs EPF6024AQI208-1N)
- Lead-free N suffix for global RoHS compliance (vs EPF6024AQI208-2)
- PQFP-208 fine-pitch SMD package for hand-reworkable designs (vs EPF6024ABC256-3 (BGA-256))
Notes de conception
The EPF6024AQI208-2N requires a stable 3.3 V VCCINT supply with decoupling of at least 0.1 uF and 10 uF ceramic capacitors near every VCCINT/GND pair (pins 3/6, 19/22, 35/38, etc.). The I/O banks also require a separate VCCIO rail at 3.3 V; if 5 V inputs are present, use external series resistors or level shifters. Estimated core current draw for a fully-utilized design at 100 MHz is approximately 50-100 mA; design the regulator with at least 30% headroom. During configuration, the FPGA pulls transient current bursts up to 200 mA - bulk decoupling on the 3.3 V rail is recommended.
The PQFP-208 package has a 0.5 mm lead pitch, requiring PCB land patterns designed per IPC-7351 guidelines with proper solder mask slivers. Maintain at least 4 oz copper on power planes for VCCINT/VCCIO to handle switching currents. Keep configuration clock (DCLK) trace length under 50 mm and route it away from high-speed switching signals to avoid jitter-induced configuration errors. Provide a ground plane directly under the device for thermal dissipation; the PQFP-208 has a typical theta_JA of approximately 25-30 C/W in still air, but adequate copper pours are still required.
Estimated power-on configuration timing: the FLEX 6000 device enters configuration mode within 5 us of nCONFIG rising; ensure the host controller or EPC memory holds nSTATUS high during this window. A common mistake is leaving the nCONFIG pin floating - this can cause intermittent configuration failures. Always tie nCONFIG to VCCIO through a 10 kohm resistor if not actively driven. Also verify CONF_DONE has a proper pull-up (typically 10 kohm to VCCIO) - without it, the host cannot detect successful configuration completion.
Separate analog and digital ground returns where possible; the 171 user I/O switching edges create ground bounce that can couple into adjacent sensitive analog inputs. Series-terminate output traces longer than 50 mm with a 33-ohm resistor to control overshoot. Place the EPC configuration memory in the same quadrant as the FPGA to minimize DCLK skew. JTAG chain integrity requires TCK termination to ground near the FPGA and short TCK-to-TDI/TMS trace stubs (under 5 mm) to avoid ringback on the scan chain.
Informations de conformité
N suffix denotes lead-free RoHS finish per Altera ordering information. AEC-Q100 is not applicable as the part is not marketed for automotive. REACH and halogen-free declarations were not present in the verified web data; engineers should request the IPC-1752 material declaration from the distributor.