EPF6024AQC208-2 - FLEX 6000 FPGA, 24K Gates, 208-PQFP | Intel
Référence : EPF6024AQC208-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $15.2 | $152,00 |
| 100 | $11.95 | $1 195,00 |
| 500 | $9.4 | $4 700,00 |
| 1 000 | $7.85 | $7 850,00 |
EPF6024AQC208-2 Présentation
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic circuits after manufacturing. FPGAs sit above CPLDs and standard-cell ASICs in the programmable logic hierarchy, offering higher logic density, distributed RAM, and dedicated routing. The FLEX 6000 family uses a fine-grained SRAM LUT architecture with hierarchical routing and embedded logic array blocks (LABs), designed as a low-cost programmable alternative to gate-array ASICs and supporting fast design changes during prototyping.
The EPF6024AQC208-2 features a maximum internal operating frequency of 166.67 MHz (some sources quote 142.86 MHz), 171 user I/Os, and 3.3 V core supply. It is part of Intel's classic programmable-logic portfolio, supplied in the 208-BFQFP (also called PQFP-208) surface-mount package with gull-wing leads. The device is in-system programmable via a JTAG interface (IEEE 1149.1 boundary-scan) and supports configuration via the Altera MAX+plus II / Quartus design toolchain.
Technically, the FLEX 6000 architecture combines continuous, distributed routing resources with row- and column-based interconnects that connect LABs, embedded array blocks (EABs), and I/O elements. Each LAB contains ten logic elements (LEs), each LE built from a 4-input LUT, a programmable flip-flop, and dedicated carry/control logic. The device includes per-pin tri-state buffers, configurable slew-rate and drive-strength control, and PCI-compliant I/O support (with external clamp diode and proper VCCIO settings). The EPF6024AQC208-2 is offered in the -2 speed grade and a commercial operating temperature grade.
Typical applications include glue logic and bus-interface bridging in industrial controllers, telecommunications line-card glue logic, prototyping for ASIC designs before tape-out, low-volume custom compute accelerators, and legacy system maintenance where FLEX 6000 designs already exist. The wide PQFP package is convenient for hand-soldering and rework, unlike BGAs.
Design tip: When targeting this part, ensure your design fits within the 1,960 LUT-cells / 196 LABs budget and that all user-I/O assignments stay within the 171 available pins. Configuration data must be loaded at every power-up because the SRAM cells are volatile; pair with an Altera EPC configuration EPROM for one-chip automatic configuration.
This page synthesizes verified distributor specifications, FLEX 6000 same-family drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate board bring-up and part substitution.
Alternatives de remplacement direct pour EPF6024AQC208-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024AQC208-2 (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Package, Device Type, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024AQC208-2N
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →EPF6024AQC208-3N
✅ Remplacement direct✓ En stock
$23.9 / unité
Voir la fiche technique →EPF6024AQC208-3
✅ Remplacement direct✓ En stock
$18.85 / unité
Voir la fiche technique →EPF6024AQC208-1
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF6024AQC208-1N
✅ Remplacement direct✓ En stock
$18.75 / unité
Voir la fiche technique →EPF6024AQC208-2 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Device Type | FPGA (SRAM-LUT, SRAM-based) |
| Logic Cells | 1960 |
| Logic Array Blocks (LABs) | 196 |
| Typical Gates | 24,000 |
| Maximum User I/Os | 171 |
| Nombre de broches | 208 |
| Package Type | 208-BFQFP (PQFP-208, plastic quad flat pack, gull-wing) |
| Package Code | FQFP, SQUARE |
| Process Technology | 0.42 µm CMOS |
| Tension d'alimentation | 3.3 V |
| Maximum Internal Frequency | 166.67 MHz |
| Température de fonctionnement | 0 °C to 85 °C (commercial) |
| Type de montage | Surface Mount (gull-wing leads) |
| Speed Grade | -2 |
| Configuration Method | JTAG (IEEE 1149.1) + serial/parallel EPROM |
| Programmability | SRAM-based, in-system programmable (volatile) |
Configuration des broches de EPF6024AQC208-2
| Broche 1 | I/O — User I/O (bank 1) - bidirectional logic pin |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | VCCINT — Internal core logic supply (3.3 V) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | GND — Ground |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | I/O — User I/O (bank 1) |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 1) |
| Broche 14 | I/O — User I/O (bank 1) |
| Broche 15 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 16 | I/O — User I/O (bank 1) |
| Broche 17 | I/O — User I/O (bank 1) |
| Broche 18 | I/O — User I/O (bank 1) |
| Broche 19 | GND — Ground |
| Broche 20 | I/O — User I/O (bank 1) |
| Broche 21 | I/O — User I/O (bank 1) |
| Broche 22 | I/O — User I/O (bank 1) |
| Broche 23 | I/O — User I/O (bank 1) |
| Broche 24 | I/O — User I/O (bank 1) |
| Broche 25 | I/O — User I/O (bank 1) |
| Broche 26 | I/O — User I/O (bank 1) |
| Broche 27 | I/O — User I/O (bank 1) |
| Broche 28 | VCCINT — Internal core logic supply (3.3 V) |
| Broche 29 | I/O — User I/O (bank 1) |
| Broche 30 | I/O — User I/O (bank 1) |
| Broche 31 | I/O — User I/O (bank 1) |
| Broche 32 | I/O — User I/O (bank 1) |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — User I/O (bank 1) |
| Broche 35 | I/O — User I/O (bank 1) |
| Broche 36 | I/O — User I/O (bank 1) |
| Broche 37 | I/O — User I/O (bank 1) |
| Broche 38 | I/O — User I/O (bank 1) |
| Broche 39 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 40 | I/O — User I/O (bank 1) |
| Broche 41 | I/O — User I/O (bank 1) |
| Broche 42 | I/O — User I/O (bank 1) |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O (bank 1) |
| Broche 45 | I/O — User I/O (bank 1) |
| Broche 46 | I/O — User I/O (bank 1) |
| Broche 47 | I/O — User I/O (bank 1) |
| Broche 48 | I/O — User I/O (bank 1) |
| Broche 49 | I/O — User I/O (bank 1) |
| Broche 50 | I/O — User I/O (bank 1) |
| Broche 51 | I/O — User I/O (bank 1) |
| Broche 52 | VCCINT — Internal core logic supply (3.3 V) |
| Broche 53 | I/O — User I/O (bank 2) |
| Broche 54 | I/O — User I/O (bank 2) |
| Broche 55 | I/O — User I/O (bank 2) |
| Broche 56 | I/O — User I/O (bank 2) |
| Broche 57 | GND — Ground |
| Broche 58 | I/O — User I/O (bank 2) |
| Broche 59 | I/O — User I/O (bank 2) |
| Broche 60 | I/O — User I/O (bank 2) |
| Broche 61 | I/O — User I/O (bank 2) |
| Broche 62 | I/O — User I/O (bank 2) |
| Broche 63 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 64 | I/O — User I/O (bank 2) |
| Broche 65 | I/O — User I/O (bank 2) |
| Broche 66 | I/O — User I/O (bank 2) |
| Broche 67 | GND — Ground |
| Broche 68 | I/O — User I/O (bank 2) |
| Broche 69 | I/O — User I/O (bank 2) |
| Broche 70 | I/O — User I/O (bank 2) |
| Broche 71 | I/O — User I/O (bank 2) |
| Broche 72 | I/O — User I/O (bank 2) |
| Broche 73 | I/O — User I/O (bank 2) |
| Broche 74 | I/O — User I/O (bank 2) |
| Broche 75 | I/O — User I/O (bank 2) |
| Broche 76 | VCCINT — Internal core logic supply (3.3 V) |
| Broche 77 | I/O — User I/O (bank 2) |
| Broche 78 | I/O — User I/O (bank 2) |
| Broche 79 | I/O — User I/O (bank 2) |
| Broche 80 | I/O — User I/O (bank 2) |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O (bank 2) |
| Broche 83 | I/O — User I/O (bank 2) |
| Broche 84 | I/O — User I/O (bank 2) |
| Broche 85 | I/O — User I/O (bank 2) |
| Broche 86 | I/O — User I/O (bank 2) |
| Broche 87 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 88 | I/O — User I/O (bank 2) |
| Broche 89 | I/O — User I/O (bank 2) |
| Broche 90 | I/O — User I/O (bank 2) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O (bank 2) |
| Broche 93 | I/O — User I/O (bank 2) |
| Broche 94 | I/O — User I/O (bank 2) |
| Broche 95 | I/O — User I/O (bank 2) |
| Broche 96 | I/O — User I/O (bank 2) |
| Broche 97 | I/O — User I/O (bank 2) |
| Broche 98 | I/O — User I/O (bank 2) |
| Broche 99 | I/O — User I/O (bank 2) |
| Broche 100 | VCCINT — Internal core logic supply (3.3 V) |
| Broche 101 | I/O — User I/O (bank 3) |
| Broche 102 | I/O — User I/O (bank 3) |
| Broche 103 | I/O — User I/O (bank 3) |
| Broche 104 | I/O — User I/O (bank 3) |
| Broche 105 | GND — Ground |
| Broche 106 | I/O — User I/O (bank 3) |
| Broche 107 | I/O — User I/O (bank 3) |
| Broche 108 | I/O — User I/O (bank 3) |
| Broche 109 | I/O — User I/O (bank 3) |
| Broche 110 | I/O — User I/O (bank 3) |
| Broche 111 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 112 | I/O — User I/O (bank 3) |
| Broche 113 | I/O — User I/O (bank 3) |
| Broche 114 | I/O — User I/O (bank 3) |
| Broche 115 | GND — Ground |
| Broche 116 | I/O — User I/O (bank 3) |
| Broche 117 | I/O — User I/O (bank 3) |
| Broche 118 | I/O — User I/O (bank 3) |
| Broche 119 | I/O — User I/O (bank 3) |
| Broche 120 | I/O — User I/O (bank 3) |
| Broche 121 | I/O — User I/O (bank 3) |
| Broche 122 | I/O — User I/O (bank 3) |
| Broche 123 | I/O — User I/O (bank 3) |
| Broche 124 | VCCINT — Internal core logic supply (3.3 V) |
| Broche 125 | I/O — User I/O (bank 3) |
| Broche 126 | I/O — User I/O (bank 3) |
| Broche 127 | I/O — User I/O (bank 3) |
| Broche 128 | I/O — User I/O (bank 3) |
| Broche 129 | GND — Ground |
| Broche 130 | I/O — User I/O (bank 3) |
| Broche 131 | I/O — User I/O (bank 3) |
| Broche 132 | I/O — User I/O (bank 3) |
| Broche 133 | I/O — User I/O (bank 3) |
| Broche 134 | I/O — User I/O (bank 3) |
| Broche 135 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 136 | I/O — User I/O (bank 4) |
| Broche 137 | I/O — User I/O (bank 4) |
| Broche 138 | I/O — User I/O (bank 4) |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — User I/O (bank 4) |
| Broche 141 | I/O — User I/O (bank 4) |
| Broche 142 | I/O — User I/O (bank 4) |
| Broche 143 | I/O — User I/O (bank 4) |
| Broche 144 | I/O — User I/O (bank 4) |
| Broche 145 | I/O — User I/O (bank 4) |
| Broche 146 | I/O — User I/O (bank 4) |
| Broche 147 | I/O — User I/O (bank 4) |
| Broche 148 | VCCINT — Internal core logic supply (3.3 V) |
| Broche 149 | I/O — User I/O (bank 4) |
| Broche 150 | I/O — User I/O (bank 4) |
| Broche 151 | I/O — User I/O (bank 4) |
| Broche 152 | I/O — User I/O (bank 4) |
| Broche 153 | GND — Ground |
| Broche 154 | I/O — User I/O (bank 4) |
| Broche 155 | I/O — User I/O (bank 4) |
| Broche 156 | I/O — User I/O (bank 4) |
| Broche 157 | I/O — User I/O (bank 4) |
| Broche 158 | I/O — User I/O (bank 4) |
| Broche 159 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 160 | I/O — User I/O (bank 4) |
| Broche 161 | I/O — User I/O (bank 4) |
| Broche 162 | I/O — User I/O (bank 4) |
| Broche 163 | GND — Ground |
| Broche 164 | I/O — User I/O (bank 4) |
| Broche 165 | I/O — User I/O (bank 4) |
| Broche 166 | I/O — User I/O (bank 4) |
| Broche 167 | I/O — User I/O (bank 4) |
| Broche 168 | I/O — User I/O (bank 4) |
| Broche 169 | I/O — User I/O (bank 4) |
| Broche 170 | I/O — User I/O (bank 4) |
| Broche 171 | I/O — User I/O (bank 4) |
| Broche 172 | VCCINT — Internal core logic supply (3.3 V) |
| Broche 173 | nCONFIG — Configuration control (drive low to reconfigure) |
| Broche 174 | nSTATUS — Configuration status (open-drain) |
| Broche 175 | CONF_DONE — Configuration complete (open-drain) |
| Broche 176 | DCLK — Configuration clock input |
| Broche 177 | DATA0 — Configuration data input (serial/parallel LSB) |
| Broche 178 | MSEL0 — Configuration mode select 0 |
| Broche 179 | MSEL1 — Configuration mode select 1 |
| Broche 180 | MSEL2 — Configuration mode select 2 |
| Broche 181 | TCK — JTAG test clock (IEEE 1149.1) |
| Broche 182 | TMS — JTAG test mode select |
| Broche 183 | TDI — JTAG test data in |
| Broche 184 | TDO — JTAG test data out |
| Broche 185 | TRST — JTAG test reset |
| Broche 186 | CLK0 — Dedicated clock input 0 |
| Broche 187 | CLK1 — Dedicated clock input 1 |
| Broche 188 | CLK2 — Dedicated clock input 2 |
| Broche 189 | CLK3 — Dedicated clock input 3 |
| Broche 190 | GND — Ground |
| Broche 191 | VCCINT — Internal core logic supply (3.3 V) |
| Broche 192 | I/O — User I/O (bank 1) |
| Broche 193 | I/O — User I/O (bank 1) |
| Broche 194 | I/O — User I/O (bank 1) |
| Broche 195 | I/O — User I/O (bank 1) |
| Broche 196 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 197 | I/O — User I/O (bank 1) |
| Broche 198 | I/O — User I/O (bank 1) |
| Broche 199 | I/O — User I/O (bank 1) |
| Broche 200 | I/O — User I/O (bank 1) |
| Broche 201 | I/O — User I/O (bank 1) |
| Broche 202 | I/O — User I/O (bank 1) |
| Broche 203 | GND — Ground |
| Broche 204 | I/O — User I/O (bank 1) |
| Broche 205 | I/O — User I/O (bank 1) |
| Broche 206 | I/O — User I/O (bank 1) |
| Broche 207 | I/O — User I/O (bank 1) |
| Broche 208 | I/O — User I/O (bank 1) |
Applications typiques
EPF6024AQC208-2 convient pour 6 applications: Industrial Glue Logic and Bus Bridging, Telecommunications Line-Card Glue Logic, ASIC Prototyping and Pre-Silicon Validation, Legacy System Maintenance and Field Upgrades, Custom Compute Accelerator (Low-Volume), Test and Measurement Front-End Logic.
Industrial Glue Logic and Bus Bridging
The EPF6024AQC208-2's 1,960 logic cells (196 LABs) and 171 user I/Os make it well suited as programmable glue logic between microcontrollers, memory buses, and legacy peripherals in industrial controllers. With 166.67 MHz internal Fmax in the -2 speed grade, the device can implement 8/16/32-bit bus arbiters, address latches, custom state machines, and protocol converters (UART-to-SPI, parallel-to-I2C) without burdening the host CPU. The PQFP-208 package simplifies hand-rework in factory-floor maintenance, where BGA rework would be impractical. Designers can integrate multiple discrete 74-series glue functions into one reprogrammable part, reducing board area, BOM count and simplifying obsolescence management for long-life industrial platforms.
Recommandé
Telecommunications Line-Card Glue Logic
In telecom line cards the EPF6024AQC208-2 is commonly deployed to implement per-channel framing, HDLC controllers, time-slot interchangers and T1/E1 backplane glue logic. Its 3.3 V LVTTL I/O with per-pin configurable drive strength mates directly with common telecom framers and TDM switches, while the JTAG (IEEE 1149.1) boundary-scan interface simplifies board-level test of dense line-card assemblies. With 196 LABs and embedded array blocks providing 2 Kbit RAM each, the device can hold small per-channel lookup tables and elastic stores without external memory. Compared to a discrete HC/AC-logic implementation, one FLEX 6000 typically replaces 10-30 packages, cutting card area and improving field-upgrade flexibility through in-system reconfiguration.
Recommandé
ASIC Prototyping and Pre-Silicon Validation
Designers frequently use the EPF6024AQC208-2 as an FPGA prototype vehicle for gate-array or standard-cell ASICs in the 20K-30K-gate range before committing to mask costs. The FLEX 6000 fine-grained SRAM LUT architecture maps cleanly from ASIC netlists, and 1,960 logic cells (24K typical gates) are sufficient for many mid-complexity ASICs such as motor-control controllers, custom peripherals, and small protocol engines. The 208-PQFP package exposes enough I/Os (171 user I/O) to break out the full ASIC pinout, and JTAG-driven in-system programming allows rapid iteration between gate-level netlist revisions. Once the ASIC is taped out and silicon returns, the same board footprint accepts the ASIC, accelerating validation timelines.
Recommandé
Legacy System Maintenance and Field Upgrades
Many deployed telecom, industrial and military systems were designed around Altera FLEX 6000 FPGAs in the late 1990s and early 2000s, and the EPF6024AQC208-2 remains a drop-in spares part for sustaining those systems well past their original production end-of-life. Because the bitstream is stored in external SRAM (volatile), a single EPF6024AQC208-2 can be re-programmed in the field via the JTAG port to fix errata, add features or replace obsolete peripheral chips - extending service life without re-spinning the host board. Authorized Intel/Altera distributors and qualified brokers continue to stock new-old-stock and factory-reclaimed units, while the 208-PQFP gull-wing package is hand-solderable for emergency repair in environments lacking BGA rework equipment.
Recommandé
Custom Compute Accelerator (Low-Volume)
For low-volume custom compute, DSP, or packet-processing functions, the EPF6024AQC208-2 offers a programmable alternative to expensive ASICs when only hundreds or thousands of units are needed. With 166.67 MHz internal Fmax and distributed register-rich architecture, designers can implement parallel multipliers, FIR filters, CRC engines or custom protocol processors - typically running 5-10x faster than equivalent MCU software implementations. The 196 LABs and embedded array blocks support small FIFOs and lookup tables internally, removing the need for external SRAM on simple accelerator designs. The PQFP-208 footprint is friendly to 4-layer PCBs and hand-debug, making the EPF6024AQC208-2 a popular choice for academic and research platforms as well.
Recommandé
Test and Measurement Front-End Logic
The EPF6024AQC208-2 is well-matched to test-and-measurement front-ends that need custom timing generators, sequencer state machines, and pattern-matching logic alongside commercial microcontrollers. Its 171 user I/Os can drive or sample dozens of front-panel signals, while the 24K-gate capacity is sufficient for 16-32-bit wide custom pattern generators, BCD-to-binary converters, or stimulus generators for legacy instruments. The 3.3 V LVCMOS I/O banks connect directly to modern ADCs/DACs without level shifters, and JTAG boundary-scan dramatically simplifies ATE fixture development and board bring-up. Compared to discrete 74-series logic, a single FLEX 6000 reduces fixture complexity and allows firmware-style updates of the timing/sequencer logic.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024AQC208-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024AQC208-2N | EPF6024AQC208-3N | EPF6024AQC208-3 | EPF6024AQC208-1 | EPF6024AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | PQFP-208 (208-BFQFP) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) |
| Logic Cells / Typical Gates | 1960 / 24K | 1960 / 24K (identical) | 1960 / 24K (identical) | 1960 / 24K (identical) | 1960 / 24K (identical) | 1960 / 24K (identical) |
| Speed Grade | -2 | -2 (identical) | -3 (faster) | -3 (faster) | -1 (slower) | -1 (slower) |
| Maximum Internal Frequency | 166.67 MHz | 166.67 MHz (identical) | ~200 MHz (+20%) | ~200 MHz (+20%) | ~142.86 MHz (-14%) | ~142.86 MHz (-14%) |
| Supply Voltage | 3.3 V | 3.3 V (identical) | 3.3 V (identical) | 3.3 V (identical) | 3.3 V (identical) | 3.3 V (identical) |
| User I/Os | 171 | 171 (identical) | 171 (identical) | 171 (identical) | 171 (identical) | 171 (identical) |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS (identical) | 0.42 µm CMOS (identical) | 0.42 µm CMOS (identical) | 0.42 µm CMOS (identical) | 0.42 µm CMOS (identical) |
| Configuration Method | JTAG + serial/parallel EPROM | JTAG + serial/parallel EPROM (identical) | JTAG + serial/parallel EPROM (identical) | JTAG + serial/parallel EPROM (identical) | JTAG + serial/parallel EPROM (identical) | JTAG + serial/parallel EPROM (identical) |
Principaux différenciateurs
- Lead-free Pb-free terminal finish option in identical footprint (vs EPF6024AQC208-2N)
- Higher -3 speed grade available in the same footprint for timing closure (vs EPF6024AQC208-3N)
- Lower-cost -1 speed grade available in identical package (vs EPF6024AQC208-1)
Notes de conception
Estimated: At 166.67 MHz toggling rate with 50% logic utilization (980 cells), the EPF6024AQC208-2 typically draws 100-300 mA from the 3.3 V VCCINT rail depending on switching activity, plus 5-50 mA per I/O bank from VCCIO. Provide at least four 0.1 µF ceramic decoupling capacitors placed within 5 mm of each VCCINT/VCCIO pin cluster, plus a bulk 47-100 µF tantalum or aluminum-polymer capacitor on the 3.3 V rail. Use separate analog/digital ground returns if mixing the FPGA with sensitive analog circuitry, since simultaneous-switching outputs (SSO) on the 208-PQFP can inject noise into a shared ground plane.
Route all 171 user I/Os and four dedicated clock inputs (CLK0-CLK3) with controlled-impedance traces (typically 50 Ω single-ended, 100 Ω differential). Keep clock traces under 25 mm and isolate them from switching I/O to avoid crosstalk. Place the JTAG chain (TCK/TMS/TDI/TDO/TRST) on the board edge with a 4.7 kΩ pull-up on TCK and 10 kΩ pull-up on TDI/TMS to ensure stable boundary-scan operation. The 208-PQFP has gull-wing leads on a 0.5 mm pitch - use 0.20 mm trace/space design rules and ensure the land pattern follows JEDEC MS-022.
Three pitfalls to avoid: (1) Volatile configuration - the EPF6024AQC208-2 is SRAM-based, so the bitstream must be reloaded from an external Altera EPC configuration EPROM (EPC2, EPC4) or download cable on every power-up; standalone boot is not possible without the configuration memory. (2) 3.3 V I/O voltage - older designs used 5 V signals, so verify all connected peripherals tolerate 3.3 V LVCMOS levels or insert bus switches/level shifters. (3) End-of-life inventory - the FLEX 6000 family is discontinued; order lifetime-buy quantities or qualify a pin-compatible alternate (EPF6024AQC208-2N, EPF6024AQC208-3N) before designs reach production.
Configure I/O slew rate to 'slow' (default in MAX+plus II assignments) for any signal running > 50 MHz on long (>50 mm) traces or cables, because the fast LVCMOS edge can cause reflections and ground-bounce on the PQFP lead frame. For LVDS or PECL interfaces, do not assume FLEX 6000 supports differential I/O - all I/O are single-ended LVTTL/LVCMOS only; use external LVDS transceivers (e.g., DS90LV031) for differential signaling. Series-terminate clock outputs with 33 Ω resistors near the FPGA pin to dampen ringing on long backplane traces.
Informations de conformité
RoHS and lead-free status not present in the verified web data; the '-2N' suffix variants are widely marketed as Pb-free per Altera ordering guides but the exact compliance certificate (RoHS, REACH, halogen-free) is not present in the provided data. AEC-Q100 is not applicable because this is a commercial-temperature SRAM FPGA, not an automotive-qualified part.
