EPF6024AQI240-2N - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Altera
Référence : EPF6024AQI240-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $21.2 | $2 120,00 |
| 500 | $18.9 | $9 450,00 |
| 1 000 | $16.4 | $16 400,00 |
EPF6024AQI240-2N Présentation
A FLEX 6000-series FPGA is a SRAM-based programmable logic device that combines look-up-table (LUT) based logic elements with a continuous routing architecture, sitting in the broader taxonomy of programmable logic devices (PLD) -> field-programmable gate array (FPGA) -> logic IC -> integrated circuit (IC) -> semiconductor. Unlike mask-programmed gate arrays, FPGAs are reprogrammable in-system, allowing iterative hardware design and in-field firmware updates.
Key features include 1,960 logic elements, 199 user I/O pins, 4 dedicated inputs, embedded SRAM-based configuration memory, and an industrial operating temperature range of -40C to +85C. The 'AQI240' suffix denotes the plastic QFP package and industrial temperature grade, while '-2N' indicates the speed grade and lead-free (Pb-free) finish.
Technically, the device uses a 5.0V-tolerant CMOS SRAM configuration cell with an EEPROM-less, ISP-capable architecture that loads bitstreams from external PROMs or microcontrollers. Its continuous routing fabric and FastTrack interconnect minimize routing congestion, while per-LE flip-flops and dedicated carry chains support efficient arithmetic and state-machine implementation.
Typical applications include industrial glue logic, peripheral bus bridges (ISA-to-PCI glue, UART expansion), motor-control co-processors, telecom line cards, and legacy embedded-system replacement. The wide 199 I/O count makes it suitable for parallel-bus interfaces and high-pin-count control planes.
When designing with this device, ensure an external configuration memory (EPC1/EPC2 or compatible PROM) is provided for SRAM cell loading on power-up, and respect the JTAG boundary-scan chain (IEEE 1149.1) for in-system programming. Plan PCB thermal dissipation because PQFP-240 packages have higher junction-to-ambient thermal resistance than BGA equivalents.
This page synthesizes distributor pricing, same-brand Altera/Intel drop-in alternatives (all in the FLEX 6000 family), and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF6024AQI240-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024AQI240-2N (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Process Technology, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024AQI240-2
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPF6024AQI240-1N
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPF6024AQI240-1
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →EPF6024AQC240-2N
✅ Remplacement direct✓ En stock
$26.1 / unité
Voir la fiche technique →EPF6024AQC240-2
✅ Remplacement direct✓ En stock
$23.1 / unité
Voir la fiche technique →EPF6024AQI240-2N Valeurs maximales et caractéristiques électriques
| Product Type | FPGA (Field-Programmable Gate Array) |
| Series | FLEX 6000 |
| Logic Elements | 1,960 |
| Typical Gate Count | 24,000 gates |
| User I/O Pins | 199 |
| Dedicated Inputs | 4 |
| Maximum Internal Clock Frequency | 153 MHz |
| Boîtier | 240-pin PQFP (QFP-240, 0.500 mm pitch) |
| Plage de température de fonctionnement | -40C to +85C (industrial) |
| Configuration Memory | SRAM (external PROMs: EPC1/EPC2 or compatible) |
| Process Technology | CMOS SRAM-based |
| Type de montage | Surface Mount (Gull-wing) |
| JEDEC Package Code | S-PQFP-G240 |
Configuration des broches de EPF6024AQI240-2N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
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| Broche 59 | I/O — User I/O pin (bank 1) |
| Broche 60 | I/O — User I/O pin (bank 1) |
| Broche 61 | GND — Ground |
| Broche 62 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 63 | VCCINT — Internal core supply voltage |
| Broche 64 | I/O — User I/O pin (bank 2) |
| Broche 65 | I/O — User I/O pin (bank 2) |
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| Broche 120 | I/O — User I/O pin (bank 2) |
| Broche 121 | GND — Ground |
| Broche 122 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 123 | VCCINT — Internal core supply voltage |
| Broche 124 | I/O — User I/O pin (bank 3) |
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| Broche 179 | I/O — User I/O pin (bank 3) |
| Broche 180 | I/O — User I/O pin (bank 3) |
| Broche 181 | GND — Ground |
| Broche 182 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 183 | VCCINT — Internal core supply voltage |
| Broche 184 | DCLK — Configuration clock (Dedicated input) |
| Broche 185 | DATA0 — Configuration data input (Dedicated input) |
| Broche 186 | nCONFIG — Configuration start (Dedicated input, active-low) |
| Broche 187 | nSTATUS — Configuration status (Dedicated input) |
| Broche 188 | CONF_DONE — Configuration complete (Dedicated input) |
| Broche 189 | I/O — User I/O pin (bank 4) |
| Broche 190 | I/O — User I/O pin (bank 4) |
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| Broche 199 | I/O — User I/O pin (bank 4) |
| Broche 200 | I/O — User I/O pin (bank 4) |
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| Broche 240 | I/O — User I/O pin (bank 4) |
Applications typiques
EPF6024AQI240-2N convient pour 6 applications: Industrial Glue Logic, Peripheral Bus Bridge (ISA-to-PCI, UART Expansion), Telecom Line Card Glue Logic, Motor Control Co-Processor, Legacy Embedded System Replacement, Test & Measurement Front-End Logic.
Industrial Glue Logic
The EPF6024AQI240-2N is well suited to industrial glue logic because it offers 1,960 LEs and 199 user I/O pins in a single 240-PQFP package, allowing it to replace multiple discrete 74-series logic ICs and small PAL/GAL devices on a compact board. The 153 MHz internal Fmax (speed grade -2) easily handles typical glue-logic toggle rates of 25-100 MHz for control-plane signals, while the -40C to +85C industrial temperature range supports factory-floor and outdoor enclosures without thermal derating. Power sequencing and reset distribution are simplified by integrating the logic in reprogrammable SRAM, which also enables late-stage design changes via in-system JTAG programming. Designers should pair the device with an EPC1 or EPC2 configuration PROM and respect the FLEX 6000 I/O standard drive-strength settings.
Recommandé
Peripheral Bus Bridge (ISA-to-PCI, UART Expansion)
The 1,960 logic elements and 199 I/O pins of the EPF6024AQI240-2N are sufficient to implement a transparent bus-bridge state machine between legacy ISA buses and PCI peripherals, or to multiplex multiple UART channels in industrial backplanes. The high I/O count allows parallel capture of address/data buses (e.g., 16-bit address + 16-bit data + 8 control lines) without external bus transceivers, reducing BOM and signal-integrity risk on long ribbon cables. The -2 speed grade supports up to 33 MHz PCI bus operation when timing closure is met. Trade-off: PQFP-240 has longer lead inductance than BGA equivalents, so designers must keep bus traces short and use series damping where bus speeds exceed 25 MHz to control reflections.
Recommandé
Telecom Line Card Glue Logic
In telecom line cards, the EPF6024AQI240-2N serves as glue logic between framers, TDM switches, and control processors, taking advantage of its 199 I/O count to absorb the wide parallel bus widths common in T1/E1 and SONET framing circuits. The 153 MHz Fmax supports TDM bit-clock rates up to 77 MHz in double-data-rate mode, sufficient for STS-1/STS-3 framing glue. The industrial -40C to +85C temperature range meets NEBS-style thermal envelopes for central-office deployment. Designers should add proper bus-termination resistors and verify FLEX 6000 I/O VCCIO bank compatibility with the surrounding 3.3V or 5V devices, since mixed-voltage interfaces may require level-shifters on bank boundaries.
Recommandé
Motor Control Co-Processor
The EPF6024AQI240-2N functions as a real-time co-processor next to a microcontroller in industrial motor drives, offloading PWM generation, encoder quadrature decoding, and Hall-sensor processing. Its 1,960 LEs are sufficient to implement a 3-phase space-vector modulator and quadrature decoder at PWM frequencies of 10-20 kHz with sub-microsecond latency. The 199 I/O count accommodates 6 PWM outputs, 6 Hall-sensor inputs, 2 quadrature encoder inputs, and 30+ GPIO for fault handling and status LEDs. Designers should allocate adequate FPGA logic for dead-time insertion and shoot-through protection, and respect FLEX 6000 I/O current-limit specifications when driving IGBT gate drivers directly.
Recommandé
Legacy Embedded System Replacement
The EPF6024AQI240-2N is widely used as a drop-in replacement for aging discrete-PAL or masked-ASIC designs in long-lifecycle embedded systems such as avionics, military radios, and industrial process controllers. Its 240-PQFP package matches legacy footprints from the late 1990s, while its SRAM-based reprogrammability allows bug fixes without board respins. The -2 speed grade covers the 25-50 MHz operating frequencies typical of these legacy systems, and the industrial temperature rating maintains compliance with original equipment specifications. Designers porting from PALs should regenerate the logic using Altera MAX+PLUS II or Quartus legacy-support tools, and verify that the new bitstream fits within the 1,960-LE capacity before committing to layout.
Recommandé
Test & Measurement Front-End Logic
In test and measurement equipment, the EPF6024AQI240-2N can implement the front-end sequencing, channel multiplexing, and trigger logic between analog front ends and an instrument controller. Its 199 I/O count easily supports 32+ channel multiplexers, handshaking signals, and trigger distribution, while the 153 MHz Fmax enables pattern generation at rates up to 100 MHz with proper pipelining. The industrial temperature range accommodates lab and field environments. Designers should keep high-speed analog signals away from the PQFP lead frame to minimize coupling, and use FLEX 6000 I/O banks to group logic-level standards (LVTTL vs LVCMOS) for cleaner signal integrity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024AQI240-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024AQI240-2 | EPF6024AQI240-1N | EPF6024AQI240-1 | EPF6024AQC240-2N | EPF6024AQC240-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-PQFP (0.500 mm pitch) | 240-PQFP (same) | 240-PQFP (same) | 240-PQFP (same) | 240-PQFP (same) | 240-PQFP (same) |
| Logic Elements | 1,960 LEs | 1,960 LEs | 1,960 LEs | 1,960 LEs | 1,960 LEs | 1,960 LEs |
| User I/O Pins | 199 | 199 | 199 | 199 | 199 | 199 |
| Speed Grade | -2 (~153 MHz Fmax) | -2 (same) | -1 (~125 MHz) | -1 (~125 MHz) | -2 (same) | -2 (same) |
| Operating Temperature | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C |
| Lead-Free Finish | Yes (-N suffix) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (limited stock) | Obsolete |
Principaux différenciateurs
- Higher Fmax at -2 speed grade (vs EPF6024AQI240-1N)
- Industrial temperature range qualification (vs EPF6024AQC240-2N)
- Lead-free (-N) finish (vs EPF6024AQI240-2 (without -N))
Notes de conception
The EPF6024AQI240-2N requires both VCCINT (core supply, [DATA_NEEDED: V]) and VCCIO (per-bank I/O supply, [DATA_NEEDED: V]) rails. Both supplies must ramp together within the datasheet-specified monotonicity window to avoid incomplete configuration. Decouple each VCCIO bank pin with a 0.1 uF ceramic cap placed within 5 mm of the package lead, and add a bulk 10-100 uF tantalum or polymer cap at each supply pin pair. Use a star-ground topology with the FPGA ground pins tied to a low-impedance ground plane to minimize switching noise on the internal logic.
The 240-PQFP package has a junction-to-ambient thermal resistance (theta_JA) in the 30-45 C/W range depending on PCB copper area and airflow. At typical FLEX 6000 core currents of 50-150 mA, dissipation is well below 1 W and no heatsink is required, but the PQFP body must still be soldered with adequate copper land area on the PCB. Estimated: with 1 square inch of 2-oz copper pour, theta_JA drops to approximately 35 C/W, giving a 5C rise above ambient at 150 mA core current - well within the 85C industrial ceiling.
Route all 199 user I/O signals with 50 ohm controlled impedance if any signal exceeds 25 MHz, and keep high-speed traces away from the PQFP lead frame to reduce coupling. Place the configuration PROM (EPC1/EPC2) within 50 mm of the FPGA's DCLK/DATA0 pins, and route the configuration signals as a short point-to-point pair with ground shielding. Add a JTAG header (TCK, TMS, TDI, TDO, GND, VCCIO) for in-system programming per IEEE 1149.1, with TMS and TDI pulled up to VCCIO through 10 kohm resistors.
Do not confuse the EPF6024AQI240-2N (industrial temp) with the EPF6024AQC240-2N (commercial temp) - using a C-grade part in an industrial product will fail temperature testing. Also do not exceed the maximum I/O count of 199 by enabling JTAG USERCODE or other features that steal I/O pins - always check the Quartus fitter report. Finally, ensure the configuration bitstream is compiled for the correct device (EPF6024A) and speed grade (-2); using a -1 or -3 bitstream on a -2 device causes configuration errors at power-on.
Informations de conformité
Lead-free finish is denoted by the -N suffix per Altera/Intel nomenclature. RoHS compliance inferred from the lead-free finish; the formal RoHS certificate should be verified against the lot date code. The FLEX 6000 family is not AEC-Q100 qualified for automotive - choose a Cyclone or MAX variant for new automotive designs.
