EPF8820ATC100-2N - FLEX 8000 FPGA, 672 LEs, TQFP-100 | Altera
Référence : EPF8820ATC100-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2 890,00 |
| 500 | $24.5 | $12 250,00 |
| 1 000 | $21.75 | $21 750,00 |
EPF8820ATC100-2N Présentation
The FLEX 8000 family combines the architectural advantages of both erasable programmable logic devices (EPLDs) and field-programmable gate arrays (FPGAs). As a CPLD/FPGA hybrid class, FLEX 8000 devices occupy the mid-density programmable logic hierarchy between small PLDs and high-end SRAM FPGAs: they fit above simple gate arrays (PAL/GAL), alongside early-generation CPLDs, and below modern high-density FPGAs in both logic capacity and pin count.
Key features include 8 Embedded Array Blocks (EABs) for implementing RAM, ROM, or FIFO functions, tri-state buffer emulation on every I/O pin for bus-oriented designs, and a -2 speed grade suitable for commercial logic integration. The device supports JTAG boundary-scan testing, conforms to PCI bus interface standards with appropriate clamping, and provides 5V-tolerant I/O on the 5.0V VCCIO variant. The TQFP-100 (TC100) 14x14 mm package offers a thermal resistance theta_JA of approximately 47 C/W with standard PCB copper.
Typical applications include legacy industrial control systems, glue-logic replacement for discrete 74-series TTL, PCI bus interface bridges, multi-drop bus arbitration, and embedded controller co-processing. The 672-LE capacity suits designs that exceed simple PLD capability but do not require modern high-density FPGAs, making the FLEX 8000 family a cost-effective upgrade path for mature designs.
When designing with this device, ensure configuration is loaded from a valid serial or parallel EPROM at every power-up. Provide a clean 5V core supply with decoupling capacitors placed close to VCC pins, and respect setup/hold times for the -2 speed grade. The TC100 package requires a 1.0 mm pitch PCB land pattern and standard reflow profile for surface-mount assembly.
Alternatives de remplacement direct pour EPF8820ATC100-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8820ATC100-2N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Configuration Method, Logic Array Blocks (LABs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8820ATC100-2
✅ Remplacement direct✓ En stock
$7.95 / unité
Voir la fiche technique →EPF8636ATC100-2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF8452ATC100-4N
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →EPF6024ATC100-10
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPF8282ATC100-2
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPF8820ATC100-2N Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Logic Elements (LEs) | 672 |
| Flipflops | 672 |
| Logic Array Blocks (LABs) | 84 (8 LEs each) |
| Embedded Array Blocks (EABs) | 8 |
| Total RAM Bits | 16384 (2048 x 8 per EAB) |
| Maximum User I/O Pins | 68 |
| FastTrack Interconnect Rows | 8 |
| Boîtier | TQFP-100 (TC100) 14x14 mm |
| Speed Grade | -2 |
| Process Technology | 0.42 µm CMOS SRAM |
| Core Voltage (VCCINT) | 5.0 V |
| I/O Voltage (VCCIO) | 5.0 V |
| Température de fonctionnement | -40C to +85C (industrial) |
| Configuration Method | Serial or parallel EPROM |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
Configuration des broches de EPF8820ATC100-2N
| Broche 1 | I/O — User I/O pin (bidirectional, tri-state capable) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | VCCINT — Core supply voltage (5.0V) |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | I/O — User I/O pin |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | GND — Ground |
| Broche 11 | I/O — User I/O pin |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | VCCIO — I/O supply voltage (5.0V) |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | I/O — User I/O pin |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | VCCINT — Core supply voltage (5.0V) |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | GND — Ground |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | VCCIO — I/O supply voltage (5.0V) |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | GND — Ground |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | VCCINT — Core supply voltage (5.0V) |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | VCCIO — I/O supply voltage (5.0V) |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | GND — Ground |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | I/O — User I/O pin |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | VCCINT — Core supply voltage (5.0V) |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | VCCIO — I/O supply voltage (5.0V) |
| Broche 89 | TDI — JTAG test data input |
| Broche 90 | TMS — JTAG test mode select |
| Broche 91 | TCK — JTAG test clock |
| Broche 92 | TDO — JTAG test data output |
| Broche 93 | nSTATUS — Configuration status (open-drain) |
| Broche 94 | nCONFIG — Configuration start input (active-low) |
| Broche 95 | DCLK — Configuration clock input |
| Broche 96 | DATA0 — Configuration data input |
| Broche 97 | CONF_DONE — Configuration complete output |
| Broche 98 | GND — Ground |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
Applications typiques
EPF8820ATC100-2N convient pour 7 applications: Legacy Industrial Glue Logic, PCI Bus Interface Bridge, Multi-Drop Bus Arbitration, Embedded Controller Co-Processor, Test and Measurement Instrumentation, Automotive Aftermarket ECU Retrofits, Educational and Prototyping Platforms.
Legacy Industrial Glue Logic
The EPF8820ATC100-2N's 672 Logic Elements and tri-state bus emulation on every I/O pin make it well suited to replace multiple discrete 74-series TTL packages in legacy industrial controllers. With 68 user I/O pins in the TQFP-100 footprint, it can absorb glue logic between microprocessors, memory, and peripheral ICs that previously required dozens of discrete gates. The -2 speed grade supports 5V TTL clock rates up to 80 MHz, sufficient for typical 8/16-bit industrial bus glue. Designers can re-program the same PCB for variants, avoiding re-spin tooling.
Recommandé
PCI Bus Interface Bridge
The EPF8820ATC100-2N is suitable for implementing PCI 5V target and initiator state machines, address decoding, and bus arbitration logic with appropriate external clamping diodes on the I/O lines. Its 672 LEs accommodate typical PCI bridge designs including configuration space registers, target/initiator state machines, and parity logic. The 16384-bit on-chip RAM via 8 Embedded Array Blocks (EABs) supports small FIFOs for PCI bus mastering. The TQFP-100 industrial-grade temperature range fits PCI expansion card operating environments.
Recommandé
Multi-Drop Bus Arbitration
Multi-drop bus arbitration designs benefit from the EPF8820ATC100-2N's tri-state buffer emulation on every I/O pin, allowing clean implementation of bidirectional bus transceivers, request/grant priority encoders, and mailbox registers. The 672-LE capacity supports dozens of bus participants with per-device handshake logic. The 8 EABs provide small RAM tables for mailbox and FIFO data buffering. The 5V-tolerant I/O interfaces directly with backplane transceivers used in industrial fieldbus systems.
Recommandé
Embedded Controller Co-Processor
The EPF8820ATC100-2N serves as a custom co-processor for 8-bit and 16-bit embedded microcontrollers, offloading time-critical DSP filters, motor-control state machines, or protocol stacks. With 672 LEs and 16384 bits of RAM, it implements FIR filters, PID controllers, or UART/SPI slaves that run deterministically at the FPGA clock. The TQFP-100 industrial temperature range meets harsh embedded environments. Configuration is loaded from a serial EPROM at boot, requiring no host-side driver support.
Recommandé
Test and Measurement Instrumentation
The EPF8820ATC100-2N's flexible I/O and reconfigurable logic make it useful for digital test fixtures, custom protocol analyzers, and laboratory instrumentation front-ends. The 672 LEs support pattern generators, timing generators, and stimulus-response comparators. JTAG boundary scan support enables production-board interconnect testing. The industrial temperature range supports test-fixture deployment in factory environments. Legacy FLEX 8000 designs in existing ATE systems can be replicated for spares and replacements.
Recommandé
Automotive Aftermarket ECU Retrofits
The EPF8820ATC100-2N's industrial temperature range (-40C to +85C) and robust 5V supply tolerance support automotive aftermarket ECU retrofit applications where legacy fuel injection or engine management electronics need custom glue logic or signal conditioning. The 672 LEs handle injector driver timing, sensor signal multiplexing, and CAN/LIN slave interfaces. While not AEC-Q100 qualified, the industrial grade meets many aftermarket requirements. Drop-in compatibility with EPF8820ATC100-2 allows flexibility in RoHS or non-RoHS end-product assembly.
Recommandé
Educational and Prototyping Platforms
Universities and engineering training programs continue to use the EPF8820ATC100-2N in digital logic and computer architecture courses because the FLEX 8000 architecture is straightforward to teach. The 672-LE capacity fits labs on FSM design, CPU datapaths, and simple SoCs. TQFP-100 is hand-solderable on breakout boards for student projects. Despite being obsolete, the part is widely available in the surplus market at low cost, making it a budget-friendly platform for teaching programmable logic fundamentals.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8820ATC100-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8820ATC100-2 | EPF8636ATC100-2N | EPF8452ATC100-4N | EPF6024ATC100-10 | EPF8282ATC100-2 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-100 (TC100) 14x14 mm | TQFP-100 (TC100) 14x14 mm - same | TQFP-100 (TC100) 14x14 mm - same | TQFP-100 (TC100) 14x14 mm - same | TQFP-100 (TC100) 14x14 mm - same | TQFP-100 (TC100) 14x14 mm - same |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 | FLEX 8000 |
| Logic Elements (LEs) | 672 | 672 | 504 (-25%) | 336 (-50%) | 16 (-97%) | 208 (-69%) |
| RAM Bits (EAB) | 16384 | 16384 | 12288 (-25%) | 8192 (-50%) | 0 (no EAB) | 8192 (-50%) |
| Speed Grade | -2 | -2 | -2 | -4 (slower) | -10 (slowest) | -2 |
| Core Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest logic capacity in the FLEX 8000 TQFP-100 package family (vs EPF8636ATC100-2N)
- Lead-free RoHS-compliant assembly per -N ordering code (vs EPF8820ATC100-2)
- Embedded Array Blocks (EABs) for on-chip RAM, ROM, and FIFO (vs EPF6024ATC100-10 (FLEX 6000))
Notes de conception
The EPF8820ATC100-2N requires a stable 5.0V supply on both VCCINT and VCCIO pins; place 0.1 µF ceramic decoupling capacitors adjacent to every VCC/GND pin pair on the TQFP-100 package. Bulk 10 µF tantalum decoupling on each supply rail reduces switching transients. Power-on ramp should be monotonic and less than 100 ms to ensure clean configuration; for systems with slow-ramping supplies, add a POR supervisor to hold nCONFIG low until the rail reaches 4.75V. Estimated Icc (active) is approximately 250 mA at full speed across 672 LEs - verify against the FLEX 8000 datasheet worst-case Icc curve for thermal budgeting.
The TQFP-100 (TC100) package has a thermal resistance theta_JA of approximately 47 C/W on a standard 4-layer JEDEC test PCB with minimal copper. At maximum Icc of 250 mA (estimated) at 5.0V, the device dissipates about 1.25 W worst case, yielding a 59C junction-temperature rise above ambient (estimated: P=1.25W, theta_JA=47 C/W). For continuous operation above 60C ambient, use 1 oz copper pours connected to the GND pins and consider airflow. Industrial-temperature designs targeting +85C ambient need at least 0.5 square inches of additional top-side copper under the package.
Route all JTAG signals (TDI, TMS, TCK, TDO) as a single daisy-chained bus with 10 kΩ pull-ups on TMS and TDI per IEEE 1149.1 requirements. Keep configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) short and isolated from high-frequency switching nets; nSTATUS and CONF_DONE are open-drain and require 10 kΩ pull-ups to VCCIO. The TQFP-100 has a 0.5 mm lead pitch - use 0.20 mm solder paste stencil apertures and follow IPC-7351 land pattern guidelines. Place the serial configuration EPROM (EPC1/EPC1213/EPC1064/EPC1441) within 50 mm of DCLK to minimize skew.
Do not apply 3.3V directly to the I/O pins without verifying 5V tolerance via the datasheet - although the EPF8820ATC100-2N is a 5V part, some legacy FLEX 8000 device variants have 3.3V-only I/O. Always wait for CONF_DONE to assert before driving user I/O pins from external sources, or use the bus-hold feature during configuration. The -2 speed grade is the fastest commercial speed; if timing closure fails, step down to -3 or -4 instead of over-constraining. Configuration time is approximately 100 ms at 10 MHz DCLK - budget POR supervisor timeout accordingly.
Informations de conformité
Lead-free per -N ordering suffix; RoHS compliant. Not AEC-Q100 qualified - this is a commercial/industrial-grade part. Halogen-free status and conflict-mineral compliance not explicitly stated in the manufacturer datasheet and marked unknown.
