EPF8820ATC100-2N - FLEX 8000 FPGA, 672 LEs, TQFP-100 | Altera
N.º da peça: EPF8820ATC100-2N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.5 | $12.250,00 |
| 1.000 | $21.75 | $21.750,00 |
EPF8820ATC100-2N Visão geral
The FLEX 8000 family combines the architectural advantages of both erasable programmable logic devices (EPLDs) and field-programmable gate arrays (FPGAs). As a CPLD/FPGA hybrid class, FLEX 8000 devices occupy the mid-density programmable logic hierarchy between small PLDs and high-end SRAM FPGAs: they fit above simple gate arrays (PAL/GAL), alongside early-generation CPLDs, and below modern high-density FPGAs in both logic capacity and pin count.
Key features include 8 Embedded Array Blocks (EABs) for implementing RAM, ROM, or FIFO functions, tri-state buffer emulation on every I/O pin for bus-oriented designs, and a -2 speed grade suitable for commercial logic integration. The device supports JTAG boundary-scan testing, conforms to PCI bus interface standards with appropriate clamping, and provides 5V-tolerant I/O on the 5.0V VCCIO variant. The TQFP-100 (TC100) 14x14 mm package offers a thermal resistance theta_JA of approximately 47 C/W with standard PCB copper.
Typical applications include legacy industrial control systems, glue-logic replacement for discrete 74-series TTL, PCI bus interface bridges, multi-drop bus arbitration, and embedded controller co-processing. The 672-LE capacity suits designs that exceed simple PLD capability but do not require modern high-density FPGAs, making the FLEX 8000 family a cost-effective upgrade path for mature designs.
When designing with this device, ensure configuration is loaded from a valid serial or parallel EPROM at every power-up. Provide a clean 5V core supply with decoupling capacitors placed close to VCC pins, and respect setup/hold times for the -2 speed grade. The TC100 package requires a 1.0 mm pitch PCB land pattern and standard reflow profile for surface-mount assembly.
Alternativas drop-in para EPF8820ATC100-2N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF8820ATC100-2N (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Configuration Method, Logic Array Blocks (LABs).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF8820ATC100-2
✅ Drop-In✓ Em estoque
$7.95 / unidade
Ver ficha técnica →EPF8636ATC100-2N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF8452ATC100-4N
✅ Drop-In✓ Em estoque
$7.1 / unidade
Ver ficha técnica →EPF6024ATC100-10
✅ Drop-In✓ Em estoque
$16.2 / unidade
Ver ficha técnica →EPF8282ATC100-2
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EPF8820ATC100-2N Classificações máximas e características elétricas
| Family | FLEX 8000 |
| Logic Elements (LEs) | 672 |
| Flipflops | 672 |
| Logic Array Blocks (LABs) | 84 (8 LEs each) |
| Embedded Array Blocks (EABs) | 8 |
| Total RAM Bits | 16384 (2048 x 8 per EAB) |
| Maximum User I/O Pins | 68 |
| FastTrack Interconnect Rows | 8 |
| Encapsulamento | TQFP-100 (TC100) 14x14 mm |
| Speed Grade | -2 |
| Process Technology | 0.42 µm CMOS SRAM |
| Core Voltage (VCCINT) | 5.0 V |
| I/O Voltage (VCCIO) | 5.0 V |
| Temperatura de operação | -40C to +85C (industrial) |
| Configuration Method | Serial or parallel EPROM |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
Configuração de pinos do EPF8820ATC100-2N
| Pino 1 | I/O — User I/O pin (bidirectional, tri-state capable) |
| Pino 2 | I/O — User I/O pin |
| Pino 3 | I/O — User I/O pin |
| Pino 4 | I/O — User I/O pin |
| Pino 5 | VCCINT — Core supply voltage (5.0V) |
| Pino 6 | I/O — User I/O pin |
| Pino 7 | I/O — User I/O pin |
| Pino 8 | I/O — User I/O pin |
| Pino 9 | I/O — User I/O pin |
| Pino 10 | GND — Ground |
| Pino 11 | I/O — User I/O pin |
| Pino 12 | I/O — User I/O pin |
| Pino 13 | I/O — User I/O pin |
| Pino 14 | I/O — User I/O pin |
| Pino 15 | I/O — User I/O pin |
| Pino 16 | VCCIO — I/O supply voltage (5.0V) |
| Pino 17 | I/O — User I/O pin |
| Pino 18 | I/O — User I/O pin |
| Pino 19 | I/O — User I/O pin |
| Pino 20 | I/O — User I/O pin |
| Pino 21 | I/O — User I/O pin |
| Pino 22 | GND — Ground |
| Pino 23 | I/O — User I/O pin |
| Pino 24 | I/O — User I/O pin |
| Pino 25 | I/O — User I/O pin |
| Pino 26 | I/O — User I/O pin |
| Pino 27 | I/O — User I/O pin |
| Pino 28 | VCCINT — Core supply voltage (5.0V) |
| Pino 29 | I/O — User I/O pin |
| Pino 30 | I/O — User I/O pin |
| Pino 31 | I/O — User I/O pin |
| Pino 32 | I/O — User I/O pin |
| Pino 33 | I/O — User I/O pin |
| Pino 34 | GND — Ground |
| Pino 35 | I/O — User I/O pin |
| Pino 36 | I/O — User I/O pin |
| Pino 37 | I/O — User I/O pin |
| Pino 38 | I/O — User I/O pin |
| Pino 39 | I/O — User I/O pin |
| Pino 40 | VCCIO — I/O supply voltage (5.0V) |
| Pino 41 | I/O — User I/O pin |
| Pino 42 | I/O — User I/O pin |
| Pino 43 | I/O — User I/O pin |
| Pino 44 | I/O — User I/O pin |
| Pino 45 | I/O — User I/O pin |
| Pino 46 | GND — Ground |
| Pino 47 | I/O — User I/O pin |
| Pino 48 | I/O — User I/O pin |
| Pino 49 | I/O — User I/O pin |
| Pino 50 | I/O — User I/O pin |
| Pino 51 | I/O — User I/O pin |
| Pino 52 | VCCINT — Core supply voltage (5.0V) |
| Pino 53 | I/O — User I/O pin |
| Pino 54 | I/O — User I/O pin |
| Pino 55 | I/O — User I/O pin |
| Pino 56 | I/O — User I/O pin |
| Pino 57 | I/O — User I/O pin |
| Pino 58 | GND — Ground |
| Pino 59 | I/O — User I/O pin |
| Pino 60 | I/O — User I/O pin |
| Pino 61 | I/O — User I/O pin |
| Pino 62 | I/O — User I/O pin |
| Pino 63 | I/O — User I/O pin |
| Pino 64 | VCCIO — I/O supply voltage (5.0V) |
| Pino 65 | I/O — User I/O pin |
| Pino 66 | I/O — User I/O pin |
| Pino 67 | I/O — User I/O pin |
| Pino 68 | I/O — User I/O pin |
| Pino 69 | I/O — User I/O pin |
| Pino 70 | GND — Ground |
| Pino 71 | I/O — User I/O pin |
| Pino 72 | I/O — User I/O pin |
| Pino 73 | I/O — User I/O pin |
| Pino 74 | I/O — User I/O pin |
| Pino 75 | I/O — User I/O pin |
| Pino 76 | VCCINT — Core supply voltage (5.0V) |
| Pino 77 | I/O — User I/O pin |
| Pino 78 | I/O — User I/O pin |
| Pino 79 | I/O — User I/O pin |
| Pino 80 | I/O — User I/O pin |
| Pino 81 | I/O — User I/O pin |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O pin |
| Pino 84 | I/O — User I/O pin |
| Pino 85 | I/O — User I/O pin |
| Pino 86 | I/O — User I/O pin |
| Pino 87 | I/O — User I/O pin |
| Pino 88 | VCCIO — I/O supply voltage (5.0V) |
| Pino 89 | TDI — JTAG test data input |
| Pino 90 | TMS — JTAG test mode select |
| Pino 91 | TCK — JTAG test clock |
| Pino 92 | TDO — JTAG test data output |
| Pino 93 | nSTATUS — Configuration status (open-drain) |
| Pino 94 | nCONFIG — Configuration start input (active-low) |
| Pino 95 | DCLK — Configuration clock input |
| Pino 96 | DATA0 — Configuration data input |
| Pino 97 | CONF_DONE — Configuration complete output |
| Pino 98 | GND — Ground |
| Pino 99 | I/O — User I/O pin |
| Pino 100 | I/O — User I/O pin |
Aplicações típicas
EPF8820ATC100-2N é adequado para 7 aplicaçãos: Legacy Industrial Glue Logic, PCI Bus Interface Bridge, Multi-Drop Bus Arbitration, Embedded Controller Co-Processor, Test and Measurement Instrumentation, Automotive Aftermarket ECU Retrofits, Educational and Prototyping Platforms.
Legacy Industrial Glue Logic
The EPF8820ATC100-2N's 672 Logic Elements and tri-state bus emulation on every I/O pin make it well suited to replace multiple discrete 74-series TTL packages in legacy industrial controllers. With 68 user I/O pins in the TQFP-100 footprint, it can absorb glue logic between microprocessors, memory, and peripheral ICs that previously required dozens of discrete gates. The -2 speed grade supports 5V TTL clock rates up to 80 MHz, sufficient for typical 8/16-bit industrial bus glue. Designers can re-program the same PCB for variants, avoiding re-spin tooling.
Recomendado
PCI Bus Interface Bridge
The EPF8820ATC100-2N is suitable for implementing PCI 5V target and initiator state machines, address decoding, and bus arbitration logic with appropriate external clamping diodes on the I/O lines. Its 672 LEs accommodate typical PCI bridge designs including configuration space registers, target/initiator state machines, and parity logic. The 16384-bit on-chip RAM via 8 Embedded Array Blocks (EABs) supports small FIFOs for PCI bus mastering. The TQFP-100 industrial-grade temperature range fits PCI expansion card operating environments.
Recomendado
Multi-Drop Bus Arbitration
Multi-drop bus arbitration designs benefit from the EPF8820ATC100-2N's tri-state buffer emulation on every I/O pin, allowing clean implementation of bidirectional bus transceivers, request/grant priority encoders, and mailbox registers. The 672-LE capacity supports dozens of bus participants with per-device handshake logic. The 8 EABs provide small RAM tables for mailbox and FIFO data buffering. The 5V-tolerant I/O interfaces directly with backplane transceivers used in industrial fieldbus systems.
Recomendado
Embedded Controller Co-Processor
The EPF8820ATC100-2N serves as a custom co-processor for 8-bit and 16-bit embedded microcontrollers, offloading time-critical DSP filters, motor-control state machines, or protocol stacks. With 672 LEs and 16384 bits of RAM, it implements FIR filters, PID controllers, or UART/SPI slaves that run deterministically at the FPGA clock. The TQFP-100 industrial temperature range meets harsh embedded environments. Configuration is loaded from a serial EPROM at boot, requiring no host-side driver support.
Recomendado
Test and Measurement Instrumentation
The EPF8820ATC100-2N's flexible I/O and reconfigurable logic make it useful for digital test fixtures, custom protocol analyzers, and laboratory instrumentation front-ends. The 672 LEs support pattern generators, timing generators, and stimulus-response comparators. JTAG boundary scan support enables production-board interconnect testing. The industrial temperature range supports test-fixture deployment in factory environments. Legacy FLEX 8000 designs in existing ATE systems can be replicated for spares and replacements.
Recomendado
Automotive Aftermarket ECU Retrofits
The EPF8820ATC100-2N's industrial temperature range (-40C to +85C) and robust 5V supply tolerance support automotive aftermarket ECU retrofit applications where legacy fuel injection or engine management electronics need custom glue logic or signal conditioning. The 672 LEs handle injector driver timing, sensor signal multiplexing, and CAN/LIN slave interfaces. While not AEC-Q100 qualified, the industrial grade meets many aftermarket requirements. Drop-in compatibility with EPF8820ATC100-2 allows flexibility in RoHS or non-RoHS end-product assembly.
Recomendado
Educational and Prototyping Platforms
Universities and engineering training programs continue to use the EPF8820ATC100-2N in digital logic and computer architecture courses because the FLEX 8000 architecture is straightforward to teach. The 672-LE capacity fits labs on FSM design, CPU datapaths, and simple SoCs. TQFP-100 is hand-solderable on breakout boards for student projects. Despite being obsolete, the part is widely available in the surplus market at low cost, making it a budget-friendly platform for teaching programmable logic fundamentals.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF8820ATC100-2N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF8820ATC100-2 | EPF8636ATC100-2N | EPF8452ATC100-4N | EPF6024ATC100-10 | EPF8282ATC100-2 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-100 (TC100) 14x14 mm | TQFP-100 (TC100) 14x14 mm - same | TQFP-100 (TC100) 14x14 mm - same | TQFP-100 (TC100) 14x14 mm - same | TQFP-100 (TC100) 14x14 mm - same | TQFP-100 (TC100) 14x14 mm - same |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 | FLEX 8000 |
| Logic Elements (LEs) | 672 | 672 | 504 (-25%) | 336 (-50%) | 16 (-97%) | 208 (-69%) |
| RAM Bits (EAB) | 16384 | 16384 | 12288 (-25%) | 8192 (-50%) | 0 (no EAB) | 8192 (-50%) |
| Speed Grade | -2 | -2 | -2 | -4 (slower) | -10 (slowest) | -2 |
| Core Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Highest logic capacity in the FLEX 8000 TQFP-100 package family (vs EPF8636ATC100-2N)
- Lead-free RoHS-compliant assembly per -N ordering code (vs EPF8820ATC100-2)
- Embedded Array Blocks (EABs) for on-chip RAM, ROM, and FIFO (vs EPF6024ATC100-10 (FLEX 6000))
Notas de projeto
The EPF8820ATC100-2N requires a stable 5.0V supply on both VCCINT and VCCIO pins; place 0.1 µF ceramic decoupling capacitors adjacent to every VCC/GND pin pair on the TQFP-100 package. Bulk 10 µF tantalum decoupling on each supply rail reduces switching transients. Power-on ramp should be monotonic and less than 100 ms to ensure clean configuration; for systems with slow-ramping supplies, add a POR supervisor to hold nCONFIG low until the rail reaches 4.75V. Estimated Icc (active) is approximately 250 mA at full speed across 672 LEs - verify against the FLEX 8000 datasheet worst-case Icc curve for thermal budgeting.
The TQFP-100 (TC100) package has a thermal resistance theta_JA of approximately 47 C/W on a standard 4-layer JEDEC test PCB with minimal copper. At maximum Icc of 250 mA (estimated) at 5.0V, the device dissipates about 1.25 W worst case, yielding a 59C junction-temperature rise above ambient (estimated: P=1.25W, theta_JA=47 C/W). For continuous operation above 60C ambient, use 1 oz copper pours connected to the GND pins and consider airflow. Industrial-temperature designs targeting +85C ambient need at least 0.5 square inches of additional top-side copper under the package.
Route all JTAG signals (TDI, TMS, TCK, TDO) as a single daisy-chained bus with 10 kΩ pull-ups on TMS and TDI per IEEE 1149.1 requirements. Keep configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) short and isolated from high-frequency switching nets; nSTATUS and CONF_DONE are open-drain and require 10 kΩ pull-ups to VCCIO. The TQFP-100 has a 0.5 mm lead pitch - use 0.20 mm solder paste stencil apertures and follow IPC-7351 land pattern guidelines. Place the serial configuration EPROM (EPC1/EPC1213/EPC1064/EPC1441) within 50 mm of DCLK to minimize skew.
Do not apply 3.3V directly to the I/O pins without verifying 5V tolerance via the datasheet - although the EPF8820ATC100-2N is a 5V part, some legacy FLEX 8000 device variants have 3.3V-only I/O. Always wait for CONF_DONE to assert before driving user I/O pins from external sources, or use the bus-hold feature during configuration. The -2 speed grade is the fastest commercial speed; if timing closure fails, step down to -3 or -4 instead of over-constraining. Configuration time is approximately 100 ms at 10 MHz DCLK - budget POR supervisor timeout accordingly.
Informações de conformidade
Lead-free per -N ordering suffix; RoHS compliant. Not AEC-Q100 qualified - this is a commercial/industrial-grade part. Halogen-free status and conflict-mineral compliance not explicitly stated in the manufacturer datasheet and marked unknown.
