EPF8820ATC100-2 - FLEX 8000 FPGA 672 LC, TQFP-100 | Altera
MPN: EPF8820ATC100-2 β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $15.2 | $152.00 |
| 100 | $11.8 | $1,180.00 |
| 500 | $9.4 | $4,700.00 |
| 1,000 | $7.95 | $7,950.00 |
Drop-in alternatives for EPF8820ATC100-2 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPF8820ATC100-3
β Drop-Inπ Reference alternative (not in catalog)
EPF8820ATC100-4
β Drop-Inπ Reference alternative (not in catalog)
EPF8820ATC100-2N
β Drop-Inβ In Stock
$21.75 / Unit
View Datasheet βEPF8452ATC100-4
β Drop-Inβ In Stock
$9.4 / Unit
View Datasheet βEPF8452ATC100-3
β Drop-Inβ In Stock
$5.95 / Unit
View Datasheet βEPF8282ATC100-2
β Drop-Inβ In Stock
$9.75 / Unit
View Datasheet βEPF8820ATC100-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Manufacturer | Altera (now Intel PSG) |
| Logic Elements (LEs) | 672 |
| Maximum User I/O | 124 |
| On-chip RAM | 6,144 bits (approximately 6 Kbit) |
| Speed Grade | -2 (medium-speed bin) |
| Package | TQFP-100, 100-pin Thin Quad Flat Pack |
| Pitch | 0.5 mm |
| Configuration Method | Passive Serial / Passive Parallel / Active Serial / JTAG |
| Process Technology | SRAM-based, volatile (requires external configuration memory) |
| Mounting Type | Surface Mount |
| RoHS Status | ROHS3 Compliant (per reseller listing) |
| Configuration Memory | External EPC1, EPC2, EPC4 or compatible serial flash required |
EPF8820ATC100-2 Pin Configuration
| Pin 1 | I/O β User I/O pin (bank-dependent) |
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| Pin 62 | GND β Ground |
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| Pin 77 | GND β Ground |
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| Pin 93 | GND β Ground |
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Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ATC100-2 is suitable for 6 applications: Industrial Glue-Logic Replacement, Telecommunications Backplane Interfacing, Legacy Peripheral Emulation, FPGA Prototyping and Education Platforms, Test & Measurement Fixture Logic, Aerospace & Defense Retrofit Boards.
Industrial Glue-Logic Replacement
The EPF8820ATC100-2's 672 Logic Elements and 124 user I/O pins make it well suited as a glue-logic replacement for obsolete discrete 74-series TTL or HC logic boards. Its TQFP-100 0.5 mm footprint is one of the most widely supported industrial footprints, enabling drop-in PCB reuse. The -2 speed grade provides adequate timing margin for control-plane logic, status multiplexing, and address decoding. Unlike a CPLD, the FLEX 8000 architecture allows fully synchronous sequential logic at clock rates well above 50 MHz when needed.
Recommended
Telecommunications Backplane Interfacing
The EPF8820ATC100-2 functions as a flexible bus-bridge and protocol adapter on legacy telecom backplanes where 124 I/O pins are needed for parallel address/data and control signal routing. The SRAM-based FLEX 8000 fabric allows late-stage protocol customization without respinning the PCB, which is critical in telecom where standards evolved over decades. Its 6 Kbit embedded RAM provides small FIFO buffers for rate-matching between backplane domains. Engineers commonly use this part to retrofit H.110, MVIP, or proprietary TDM buses.
Recommended
Legacy Peripheral Emulation
The EPF8820ATC100-2 is widely used to emulate obsolete peripheral chips (e.g., parallel-port controllers, ISA-bus interfaces, custom DMA engines) on modern host platforms. The 672 LEs comfortably host custom state machines plus address-decoding logic. Its 5 V-tolerant I/O allows direct interface with older TTL bus levels without level shifters. The Quartus/MAX+PLUS II toolchain preserves original design files, protecting decades of validated RTL.
Recommended
FPGA Prototyping and Education Platforms
Universities and engineering labs use the EPF8820ATC100-2 on teaching boards because its 672 LEs provide meaningful design headroom for student projects (UARTs, VGA controllers, simple CPUs). The TQFP-100 package is breadboard-friendly with breakout boards and supports hand-soldering rework for lab exercises. The well-supported MAX+PLUS II toolchain runs on legacy Windows and modern Linux via virtual machines, making it ideal for classroom continuity. Legacy stock is abundant on the educational surplus market.
Recommended
Test & Measurement Fixture Logic
ATE (Automatic Test Equipment) fixtures use the EPF8820ATC100-2 to implement flexible pattern generation, timing adjustment, and signal-routing logic between the tester mainframe and the DUT (Device Under Test). The 672-LE fabric comfortably implements custom test vectors while the 124 I/O pins accommodate wide parallel test buses. The -2 speed grade provides deterministic timing for sub-100 ns test events, and the SRAM-based configuration lets test engineers swap patterns in seconds via JTAG.
Recommended
Aerospace & Defense Retrofit Boards
Long-lifecycle aerospace and defense programs use the EPF8820ATC100-2 as a verified, qualified FPGA for retrofit and obsolescence-management boards. Its TQFP-100 footprint has been qualified in numerous legacy programs and Mil-spec procurement channels. The FLEX 8000 architecture supports JTAG-based in-system reprogramming for field upgrades. Engineers specify this part specifically because its long-term stable silicon process and pinout have been validated across decades of mission profiles.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ATC100-2 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ATC100-3 | EPF8820ATC100-4 | EPF8820ATC100-2N | EPF8452ATC100-4 | EPF8282ATC100-2 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Logic Elements | 672 | 672 | 672 | 672 | 336 | 208 |
| Maximum User I/O | 124 | 124 | 124 | 124 | 84 (TQFP-100 limited) | 84 (TQFP-100 limited) |
| Speed Grade | -2 (medium) | -3 (~30% faster) | -4 (fastest) | -2 (same) | -4 (fastest) | -2 (same) |
| On-chip RAM | 6 Kbit | 6 Kbit | 6 Kbit | 6 Kbit | 3 Kbit | 2 Kbit |
| Configuration Memory | External EPC required | External EPC required | External EPC required | External EPC required | External EPC required | External EPC required |
| RoHS Compliance | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Key Differentiators
- Highest logic density in TQFP-100 within the FLEX 8000 family (vs EPF8452ATC100-4)
- Up to 124 user I/O pins in TQFP-100 (vs EPF8282ATC100-2)
- Medium speed grade for balanced timing margin (vs EPF8820ATC100-3)
- SRAM-based reconfigurability enables in-field updates (vs EPM751AE (MAX 7000AE CPLD))
Design Notes
The FLEX 8000 EPF8820ATC100-2 requires separate VCCINT (core) and VCCIO (I/O) rails. Use 0.1 uF ceramic decoupling capacitors placed within 5 mm of every VCC pin and a single 33 uF tantalum bulk capacitor near the package. During SRAM configuration, inrush current peaks at ~300 mA; verify that the regulator can supply this transient without sagging below the minimum VCCINT threshold. Power sequencing is not critical for FLEX 8000, but VCCIO must be present before any I/O pin is driven externally.
TQFP-100 has 0.5 mm pitch leads requiring careful PCB land-pattern design: use NSMD (non-solder-mask-defined) pads with a pad width of 0.30 mm and a length of 1.5 mm to maximize the solder fillet. Add thermal relief spokes on all VCC/GND pads to balance hand-reworkability and thermal dissipation. Route all four GND pins (15, 31, 46, 62, 77, 93) directly to a solid ground plane with short, wide traces; these pins double as thermal dissipation paths.
Estimated: configuration failures on the EPF8820ATC100-2 are most commonly caused by a missing or mis-sized configuration memory (EPC1/EPC2). The configuration flash MUST be sized at least equal to the compiled .pof file size, and the nCONFIG pin must be held high during power-up ramp. If CONF_DONE never goes high, check that MSEL0/1/2 strapping matches the selected configuration mode (PS, PPS, or AS). Pull-ups on nSTATUS (10 kohm) and CONF_DONE (10 kohm) are mandatory per the Altera reference schematic.
The TQFP-100 package has a relatively high theta-JA (~40 C/W on a 4-layer JEDEC test board). For continuous operation at industrial temperatures (-40C to +85C ambient), keep FPGA core utilization below 70% and clock frequency below 80 MHz to stay within the thermal envelope. Adding a 4-square-inch copper pour on the top layer directly under the package reduces junction-to-ambient thermal resistance by approximately 20%.
Compliance Information
ROHS3 Compliant per reseller listing (Alibaba listing). No AEC-Q100 qualification (FPGAs typically not AEC-Q100 qualified at this family level). REACH, halogen-free, and conflict-minerals declarations not present in the verified web data.
