EPF8820ATC144-3N - FLEX 8000 FPGA, 8K Gates, 672 Cells | Intel
Référence : EPF8820ATC144-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.9 | $16,90 |
| 10 | $15.2 | $152,00 |
| 100 | $13.5 | $1 350,00 |
| 500 | $11.8 | $5 900,00 |
| 1 000 | $10.4 | $10 400,00 |
EPF8820ATC144-3N Présentation
What is a FLEX 8000 FPGA? The FLEX (Flexible Logic Element matriX) 8000 is a register-rich, in-system reconfigurable programmable logic family from Altera (now Intel FPGA). FPGAs in general sit within the broader taxonomy of programmable logic devices (PLD) and belong to the digital semiconductor hierarchy: logic IC -> PLD -> CPLD/FPGA -> SRAM-based FPGA. FLEX 8000 devices are configured at system power-up by loading SRAM configuration bits from an external EPROM or from Altera EPC-series serial configuration devices (EPC1, EPC1064, EPC1213, EPC1441). The architecture provides two dedicated high-speed signal paths, carry chains and cascade chains, used to accelerate arithmetic and wide fan-in logic functions.
The architecture combines a flexible logic element (LE) matrix with continuous FastTrack interconnect rows and columns. Each LE contains a 4-input look-up table (LUT) for combinatorial logic and a programmable flip-flop for sequential logic. The flip-flop clock, clear, and preset control signals can be driven by dedicated input pins, by general-purpose I/O, or by any internal logic. For purely combinatorial functions the flip-flop can be bypassed, allowing the LUT output to flow directly to the device pin.
Typical applications include glue logic replacement, interface bridging, bus protocol conversion, and small to medium state-machine controllers in industrial, telecom, and embedded systems. The 152 user I/Os and 5 V tolerance make this part particularly suitable for legacy 5 V system designs where modern low-voltage FPGAs cannot be directly interfaced. System-level features include in-circuit reconfigurability (ICR) via external configuration devices, allowing field upgrades without removing the device from the board.
Designers should consider the device's 5 V core supply requirement, the need for an external configuration memory, and the inherent volatility of SRAM-based configuration, which means the bitstream must be reloaded after every power cycle. Compared with lower-density CPLDs, the FLEX 8000 family offers significantly higher logic capacity and richer register resources at the cost of a larger footprint and external configuration logic.
This page synthesizes distributor pricing, verified drop-in FLEX 8000 alternatives in the same 144-pin TQFP footprint, and practical configuration-design notes that go beyond the manufacturer datasheet.
Alternatives de remplacement direct pour EPF8820ATC144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8820ATC144-3N (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Operating Temperature, Process Technology, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8820ATC144-3
✅ Remplacement direct✓ En stock
$9.25 / unité
Voir la fiche technique →EPF8820ATC144-2N
✅ Remplacement direct✓ En stock
$18.95 / unité
Voir la fiche technique →EPF8820ATC144-2
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →EPF8820ATC144-1
✅ Remplacement direct✓ En stock
$15.95 / unité
Voir la fiche technique →EPF8452ATC100-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.75 / unité
Voir la fiche technique →EPF8820ATC144-3N Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Logic Cells | 672 |
| Usable Gates | 8,000 (typical) |
| Logic Array Blocks (LABs) | 84 |
| User I/Os | 112 to 152 (per package) |
| Process Technology | 0.42 µm CMOS SRAM |
| Tension d'alimentation | 4.75 V to 5.25 V (5 V nominal) |
| Speed Grade | -3 |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) |
| Boîtier | 144-pin TQFP / LFQFP (20 x 20 mm) |
| Configuration Method | SRAM, external EPROM or EPC-series device |
| In-Circuit Reconfigurable | Yes |
| Type de montage | Surface Mount (Gull-Wing) |
Configuration des broches de EPF8820ATC144-3N
| Broche 1 | I/O — User I/O - bank 1 |
| Broche 2 | I/O — User I/O - bank 1 |
| Broche 3 | VCC — 5 V supply |
| Broche 4 | I/O — User I/O - bank 1 |
| Broche 5 | I/O — User I/O - bank 1 |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O - bank 1 |
| Broche 8 | I/O — User I/O - bank 1 |
| Broche 9 | I/O — User I/O - bank 1 |
| Broche 10 | I/O — User I/O - bank 1 |
| Broche 11 | I/O — User I/O - bank 1 |
| Broche 12 | I/O — User I/O - bank 1 |
| Broche 13 | I/O — User I/O - bank 1 |
| Broche 14 | I/O — User I/O - bank 1 |
| Broche 15 | VCC — 5 V supply |
| Broche 16 | I/O — User I/O - bank 1 |
| Broche 17 | I/O — User I/O - bank 1 |
| Broche 18 | I/O — User I/O - bank 1 |
| Broche 19 | I/O — User I/O - bank 1 |
| Broche 20 | GND — Ground |
| Broche 21 | I/O — User I/O - bank 1 |
| Broche 22 | I/O — User I/O - bank 1 |
| Broche 23 | I/O — User I/O - bank 1 |
| Broche 24 | I/O — User I/O - bank 1 |
| Broche 25 | I/O — User I/O - bank 1 |
| Broche 26 | I/O — User I/O - bank 1 |
| Broche 27 | I/O — User I/O - bank 1 |
| Broche 28 | I/O — User I/O - bank 1 |
| Broche 29 | I/O — User I/O - bank 1 |
| Broche 30 | I/O — User I/O - bank 1 |
| Broche 31 | VCC — 5 V supply |
| Broche 32 | I/O — User I/O - bank 1 |
| Broche 33 | I/O — User I/O - bank 1 |
| Broche 34 | I/O — User I/O - bank 1 |
| Broche 35 | I/O — User I/O - bank 1 |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O - bank 1 |
| Broche 38 | I/O — User I/O - bank 1 |
| Broche 39 | I/O — User I/O - bank 1 |
| Broche 40 | I/O — User I/O - bank 1 |
| Broche 41 | I/O — User I/O - bank 2 |
| Broche 42 | I/O — User I/O - bank 2 |
| Broche 43 | I/O — User I/O - bank 2 |
| Broche 44 | I/O — User I/O - bank 2 |
| Broche 45 | I/O — User I/O - bank 2 |
| Broche 46 | I/O — User I/O - bank 2 |
| Broche 47 | I/O — User I/O - bank 2 |
| Broche 48 | VCC — 5 V supply |
| Broche 49 | I/O — User I/O - bank 2 |
| Broche 50 | I/O — User I/O - bank 2 |
| Broche 51 | I/O — User I/O - bank 2 |
| Broche 52 | GND — Ground |
| Broche 53 | I/O — User I/O - bank 2 |
| Broche 54 | I/O — User I/O - bank 2 |
| Broche 55 | I/O — User I/O - bank 2 |
| Broche 56 | I/O — User I/O - bank 2 |
| Broche 57 | I/O — User I/O - bank 2 |
| Broche 58 | I/O — User I/O - bank 2 |
| Broche 59 | I/O — User I/O - bank 2 |
| Broche 60 | I/O — User I/O - bank 2 |
| Broche 61 | I/O — User I/O - bank 2 |
| Broche 62 | I/O — User I/O - bank 2 |
| Broche 63 | I/O — User I/O - bank 2 |
| Broche 64 | VCC — 5 V supply |
| Broche 65 | I/O — User I/O - bank 2 |
| Broche 66 | I/O — User I/O - bank 2 |
| Broche 67 | I/O — User I/O - bank 2 |
| Broche 68 | I/O — User I/O - bank 2 |
| Broche 69 | GND — Ground |
| Broche 70 | I/O — User I/O - bank 2 |
| Broche 71 | I/O — User I/O - bank 2 |
| Broche 72 | I/O — User I/O - bank 2 |
| Broche 73 | I/O — User I/O - bank 2 |
| Broche 74 | I/O — User I/O - bank 2 |
| Broche 75 | I/O — User I/O - bank 2 |
| Broche 76 | I/O — User I/O - bank 2 |
| Broche 77 | I/O — User I/O - bank 2 |
| Broche 78 | I/O — User I/O - bank 2 |
| Broche 79 | I/O — User I/O - bank 2 |
| Broche 80 | I/O — User I/O - bank 2 |
| Broche 81 | VCC — 5 V supply |
| Broche 82 | I/O — User I/O - bank 3 |
| Broche 83 | I/O — User I/O - bank 3 |
| Broche 84 | I/O — User I/O - bank 3 |
| Broche 85 | I/O — User I/O - bank 3 |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O - bank 3 |
| Broche 88 | I/O — User I/O - bank 3 |
| Broche 89 | I/O — User I/O - bank 3 |
| Broche 90 | I/O — User I/O - bank 3 |
| Broche 91 | I/O — User I/O - bank 3 |
| Broche 92 | I/O — User I/O - bank 3 |
| Broche 93 | I/O — User I/O - bank 3 |
| Broche 94 | I/O — User I/O - bank 3 |
| Broche 95 | I/O — User I/O - bank 3 |
| Broche 96 | I/O — User I/O - bank 3 |
| Broche 97 | VCC — 5 V supply |
| Broche 98 | I/O — User I/O - bank 3 |
| Broche 99 | I/O — User I/O - bank 3 |
| Broche 100 | I/O — User I/O - bank 3 |
| Broche 101 | I/O — User I/O - bank 3 |
| Broche 102 | GND — Ground |
| Broche 103 | I/O — User I/O - bank 3 |
| Broche 104 | I/O — User I/O - bank 3 |
| Broche 105 | I/O — User I/O - bank 3 |
| Broche 106 | I/O — User I/O - bank 3 |
| Broche 107 | I/O — User I/O - bank 3 |
| Broche 108 | I/O — User I/O - bank 3 |
| Broche 109 | I/O — User I/O - bank 3 |
| Broche 110 | I/O — User I/O - bank 3 |
| Broche 111 | I/O — User I/O - bank 3 |
| Broche 112 | I/O — User I/O - bank 3 |
| Broche 113 | VCC — 5 V supply |
| Broche 114 | I/O — User I/O - bank 4 |
| Broche 115 | I/O — User I/O - bank 4 |
| Broche 116 | I/O — User I/O - bank 4 |
| Broche 117 | I/O — User I/O - bank 4 |
| Broche 118 | GND — Ground |
| Broche 119 | I/O — User I/O - bank 4 |
| Broche 120 | I/O — User I/O - bank 4 |
| Broche 121 | I/O — User I/O - bank 4 |
| Broche 122 | I/O — User I/O - bank 4 |
| Broche 123 | I/O — User I/O - bank 4 |
| Broche 124 | I/O — User I/O - bank 4 |
| Broche 125 | I/O — User I/O - bank 4 |
| Broche 126 | I/O — User I/O - bank 4 |
| Broche 127 | I/O — User I/O - bank 4 |
| Broche 128 | I/O — User I/O - bank 4 |
| Broche 129 | VCC — 5 V supply |
| Broche 130 | I/O — User I/O - bank 4 |
| Broche 131 | I/O — User I/O - bank 4 |
| Broche 132 | I/O — User I/O - bank 4 |
| Broche 133 | I/O — User I/O - bank 4 |
| Broche 134 | GND — Ground |
| Broche 135 | I/O — User I/O - bank 4 |
| Broche 136 | I/O — User I/O - bank 4 |
| Broche 137 | I/O — User I/O - bank 4 |
| Broche 138 | I/O — User I/O - bank 4 |
| Broche 139 | I/O — User I/O - bank 4 |
| Broche 140 | I/O — User I/O - bank 4 |
| Broche 141 | I/O — User I/O - bank 4 |
| Broche 142 | I/O — User I/O - bank 4 |
| Broche 143 | I/O — User I/O - bank 4 |
| Broche 144 | I/O — User I/O - bank 4 (dedicated clock/control inputs clustered on package corner per FLEX 8000 pinout) |
Applications typiques
EPF8820ATC144-3N convient pour 6 applications: Legacy 5 V Industrial Control Glue Logic, Telecom Backplane Protocol Bridging, Legacy PCI / ISA Bridge FPGA, Flat-Panel Display Controller / LVDS Adapter, Avionics / Military 5 V Retrofit Logic, Test & Measurement Front-End Logic.
Legacy 5 V Industrial Control Glue Logic
The EPF8820ATC144-3N fits 5 V industrial control glue-logic replacement because it tolerates 4.75 V to 5.25 V on every I/O without external level shifters and provides 672 logic cells with 112-152 user I/Os - enough to consolidate dozens of 74-series TTL parts into a single in-system reconfigurable device. Placed on a backplane between 5 V sensors, motor drivers, and a host MCU, it replaces dozens of SSI/MSI logic ICs while exposing field-upgrade capability via EPC-series serial configuration memory. Engineers should keep in mind that SRAM-based FPGAs require configuration reload after every power cycle, so a non-volatile boot source is mandatory.
Recommandé
Telecom Backplane Protocol Bridging
The EPF8820ATC144-3N suits telecom backplane protocol bridging between 5 V legacy buses (H.110, E1/T1 framing, HDLC controllers) and modern 3.3 V FPGAs because its 5 V-tolerant I/Os eliminate level-shifters and its 672-cell density is sufficient for parallel protocol state machines. Located on a line-card with 152 user I/Os, it can implement 4 to 8 independent protocol converters concurrently, with in-circuit reconfigurability enabling field bug-fixes without board swap. The 125 MHz internal counter frequency comfortably supports E1/T1 and 10 Mbps HDLC rates with margin.
Recommandé
Legacy PCI / ISA Bridge FPGA
The EPF8820ATC144-3N is a well-known choice for 5 V PCI (33 MHz, 32-bit) and ISA bridge implementations where its 5 V I/O tolerance directly interfaces with PCI/ISA signalling without bus switches. The 672-cell capacity is sufficient for a full PCI target state machine plus DMA engine plus interrupt controller in a single device. Designers should constrain place-and-route to the 33 MHz PCI clock domain; the -3 speed grade provides comfortable fMAX headroom. Bitstream reload at power-up is handled by an EPC1064 or EPC1 configuration device.
Recommandé
Flat-Panel Display Controller / LVDS Adapter
The EPF8820ATC144-3N can be used as a flat-panel display timing controller or LVDS-to-TTL adapter, leveraging 112-152 user I/Os to drive 18/24-bit LVDS display panels from a parallel RGB source. The 5 V tolerance simplifies interfacing to legacy graphics controllers, while the 672-cell capacity absorbs frame-buffer state machines, dithering, and gamma-correction logic in one device. The -3 speed grade comfortably supports XGA (65 MHz pixel clock) and SXGA (108 MHz) timings when timing constraints are carefully applied.
Recommandé
Avionics / Military 5 V Retrofit Logic
The EPF8820ATC144-3N fits avionics and military 5 V retrofit projects where modern sub-3.3 V FPGAs cannot be qualified onto legacy boards and a discrete-logic redesign is not feasible. Although this is the commercial (0 °C to +70 °C) grade, system integrators in non-flight subsystems have used FLEX 8000 commercial parts in ruggedized enclosures as cost-effective replacements for obsolete 54-series TTL. Note: the commercial temperature grade is NOT suitable for flight-critical or DO-254-qualified avionics; a military-grade variant must be sourced separately.
Recommandé
Test & Measurement Front-End Logic
The EPF8820ATC144-3N is well-suited to test-and-measurement front-end logic - scan-path controllers, pattern generators, and timing-aware switching matrices - because its 152 I/Os can drive dozens of test points simultaneously and its in-system reconfigurability lets engineers update test patterns without board rework. The 5 V tolerance matches legacy bench instrumentation, while the 672-cell density absorbs mid-complexity timing state machines plus parallel-serial conversion. Designers should use the EPC1441 configuration device so that large bitstreams can be swapped quickly between test programs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8820ATC144-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8820ATC144-3 | EPF8820ATC144-2N | EPF8820ATC144-2 | EPF8820ATC144-1 | EPF8452ATC100-3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 100-pin TQFP - different |
| Family | FLEX 8000 | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same |
| Speed Grade | -3 (mid) | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 |
| Supply Voltage | 5 V (4.75-5.25 V) | 5 V | 5 V | 5 V | 5 V | 5 V |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
| Configuration Memory | External EPC1/1064/1213/1441 | External EPC-series | External EPC-series | External EPC-series | External EPC-series | External EPC-series |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Identical-die base part in same 144-pin TQFP footprint (vs EPF8820ATC144-3)
- Mid-tier -3 speed grade (vs EPF8820ATC144-2N)
- 5 V tolerant I/O eliminates level shifters (vs Modern 3.3 V FPGAs (e.g. Cyclone IV))
Notes de conception
The EPF8820ATC144-3N requires a clean 5 V supply at 4.75 V to 5.25 V with adequate bulk decoupling. Place one 100 µF tantalum or aluminum polymer capacitor near the board entry point, 10 µF ceramic at each VCC pin cluster, and 0.1 µF ceramic as close as possible to every individual VCC pin. Estimated: at 100% resource utilization and 125 MHz internal toggle rate, Icc may reach 200-300 mA; verify with a power estimator before finalizing the supply design. Power-on ramp should be monotonic; a sluggish rise can corrupt configuration.
The 144-pin TQFP (20 x 20 mm, 0.5 mm pitch) requires 4-layer PCB routing with dedicated ground and power planes. Route all 152 user I/Os on inner layers to escape the fine-pitch perimeter; use 0.2 mm traces with 0.2 mm spacing on outer layers. Place the EPC-series configuration memory no more than 50 mm from the FPGA's DATA, DCLK, nCONFIG, nSTATUS, and CONFIG_DONE pins to keep configuration traces short and noise-free. The 5 V I/O banks generate simultaneous-switching noise (SSN); keep sensitive analog traces away from I/O banks and add ground guards.
Critical pitfalls: (1) SRAM-based FPGAs are volatile - if the EPC configuration memory is missing, mis-programmed, or the bitstream is corrupted, the device will not function. (2) Always pull nCONFIG high with a 10 kΩ resistor and tie nSTATUS and CONFIG_DONE high through 10 kΩ per the FLEX 8000 reference design. (3) Do not assert I/O drive before configuration completes; tristate all I/Os during configuration. (4) The commercial (0 °C to +70 °C) grade is NOT suitable for industrial -40 °C to +85 °C or military -55 °C to +125 °C environments; spec a wider-temperature FLEX 8000 variant instead. (5) Quartus II support for FLEX 8000 is legacy-only - use MAX+PLUS II baseline 10.x for the most reliable synthesis results.
Decoupling strategy: place 0.1 µF X7R ceramics directly under each VCC pin on the opposite PCB side, connected by short vias (less than 1 mm). Add 1 nF and 10 nF caps in parallel for high-frequency noise suppression above 100 MHz. Use a solid ground pour on layer 2 directly under the FPGA body; do not split the ground plane under the device. For multi-FPGA designs, isolate configuration busses per device and avoid sharing DCLK across multiple FPGAs - use point-to-point daisy-chain configuration instead.
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status for EPF8820ATC144-3N were not present in the Verified Web Data and are flagged as [DATA_NEEDED] in the specs array. AEC-Q100 is not applicable because this part is a commercial-grade FPGA, not an automotive-qualified IC.
