EPF8820ATC144-3N - FLEX 8000 FPGA, 8K Gates, 672 Cells | Intel
N.º da peça: EPF8820ATC144-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16.9 | $16,90 |
| 10 | $15.2 | $152,00 |
| 100 | $13.5 | $1.350,00 |
| 500 | $11.8 | $5.900,00 |
| 1.000 | $10.4 | $10.400,00 |
EPF8820ATC144-3N Visão geral
What is a FLEX 8000 FPGA? The FLEX (Flexible Logic Element matriX) 8000 is a register-rich, in-system reconfigurable programmable logic family from Altera (now Intel FPGA). FPGAs in general sit within the broader taxonomy of programmable logic devices (PLD) and belong to the digital semiconductor hierarchy: logic IC -> PLD -> CPLD/FPGA -> SRAM-based FPGA. FLEX 8000 devices are configured at system power-up by loading SRAM configuration bits from an external EPROM or from Altera EPC-series serial configuration devices (EPC1, EPC1064, EPC1213, EPC1441). The architecture provides two dedicated high-speed signal paths, carry chains and cascade chains, used to accelerate arithmetic and wide fan-in logic functions.
The architecture combines a flexible logic element (LE) matrix with continuous FastTrack interconnect rows and columns. Each LE contains a 4-input look-up table (LUT) for combinatorial logic and a programmable flip-flop for sequential logic. The flip-flop clock, clear, and preset control signals can be driven by dedicated input pins, by general-purpose I/O, or by any internal logic. For purely combinatorial functions the flip-flop can be bypassed, allowing the LUT output to flow directly to the device pin.
Typical applications include glue logic replacement, interface bridging, bus protocol conversion, and small to medium state-machine controllers in industrial, telecom, and embedded systems. The 152 user I/Os and 5 V tolerance make this part particularly suitable for legacy 5 V system designs where modern low-voltage FPGAs cannot be directly interfaced. System-level features include in-circuit reconfigurability (ICR) via external configuration devices, allowing field upgrades without removing the device from the board.
Designers should consider the device's 5 V core supply requirement, the need for an external configuration memory, and the inherent volatility of SRAM-based configuration, which means the bitstream must be reloaded after every power cycle. Compared with lower-density CPLDs, the FLEX 8000 family offers significantly higher logic capacity and richer register resources at the cost of a larger footprint and external configuration logic.
This page synthesizes distributor pricing, verified drop-in FLEX 8000 alternatives in the same 144-pin TQFP footprint, and practical configuration-design notes that go beyond the manufacturer datasheet.
Alternativas drop-in para EPF8820ATC144-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF8820ATC144-3N (mesmo formato e footprint) — diferindo em Package, Configuration Method, Operating Temperature, Process Technology, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF8820ATC144-3
✅ Drop-In✓ Em estoque
$9.25 / unidade
Ver ficha técnica →EPF8820ATC144-2N
✅ Drop-In✓ Em estoque
$18.95 / unidade
Ver ficha técnica →EPF8820ATC144-2
✅ Drop-In✓ Em estoque
$19.85 / unidade
Ver ficha técnica →EPF8820ATC144-1
✅ Drop-In✓ Em estoque
$15.95 / unidade
Ver ficha técnica →EPF8452ATC100-3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$13.75 / unidade
Ver ficha técnica →EPF8820ATC144-3N Classificações máximas e características elétricas
| Family | FLEX 8000 |
| Logic Cells | 672 |
| Usable Gates | 8,000 (typical) |
| Logic Array Blocks (LABs) | 84 |
| User I/Os | 112 to 152 (per package) |
| Process Technology | 0.42 µm CMOS SRAM |
| Tensão de alimentação | 4.75 V to 5.25 V (5 V nominal) |
| Speed Grade | -3 |
| Temperatura de operação | 0 °C to +70 °C (Commercial) |
| Encapsulamento | 144-pin TQFP / LFQFP (20 x 20 mm) |
| Configuration Method | SRAM, external EPROM or EPC-series device |
| In-Circuit Reconfigurable | Yes |
| Tipo de montagem | Surface Mount (Gull-Wing) |
Configuração de pinos do EPF8820ATC144-3N
| Pino 1 | I/O — User I/O - bank 1 |
| Pino 2 | I/O — User I/O - bank 1 |
| Pino 3 | VCC — 5 V supply |
| Pino 4 | I/O — User I/O - bank 1 |
| Pino 5 | I/O — User I/O - bank 1 |
| Pino 6 | GND — Ground |
| Pino 7 | I/O — User I/O - bank 1 |
| Pino 8 | I/O — User I/O - bank 1 |
| Pino 9 | I/O — User I/O - bank 1 |
| Pino 10 | I/O — User I/O - bank 1 |
| Pino 11 | I/O — User I/O - bank 1 |
| Pino 12 | I/O — User I/O - bank 1 |
| Pino 13 | I/O — User I/O - bank 1 |
| Pino 14 | I/O — User I/O - bank 1 |
| Pino 15 | VCC — 5 V supply |
| Pino 16 | I/O — User I/O - bank 1 |
| Pino 17 | I/O — User I/O - bank 1 |
| Pino 18 | I/O — User I/O - bank 1 |
| Pino 19 | I/O — User I/O - bank 1 |
| Pino 20 | GND — Ground |
| Pino 21 | I/O — User I/O - bank 1 |
| Pino 22 | I/O — User I/O - bank 1 |
| Pino 23 | I/O — User I/O - bank 1 |
| Pino 24 | I/O — User I/O - bank 1 |
| Pino 25 | I/O — User I/O - bank 1 |
| Pino 26 | I/O — User I/O - bank 1 |
| Pino 27 | I/O — User I/O - bank 1 |
| Pino 28 | I/O — User I/O - bank 1 |
| Pino 29 | I/O — User I/O - bank 1 |
| Pino 30 | I/O — User I/O - bank 1 |
| Pino 31 | VCC — 5 V supply |
| Pino 32 | I/O — User I/O - bank 1 |
| Pino 33 | I/O — User I/O - bank 1 |
| Pino 34 | I/O — User I/O - bank 1 |
| Pino 35 | I/O — User I/O - bank 1 |
| Pino 36 | GND — Ground |
| Pino 37 | I/O — User I/O - bank 1 |
| Pino 38 | I/O — User I/O - bank 1 |
| Pino 39 | I/O — User I/O - bank 1 |
| Pino 40 | I/O — User I/O - bank 1 |
| Pino 41 | I/O — User I/O - bank 2 |
| Pino 42 | I/O — User I/O - bank 2 |
| Pino 43 | I/O — User I/O - bank 2 |
| Pino 44 | I/O — User I/O - bank 2 |
| Pino 45 | I/O — User I/O - bank 2 |
| Pino 46 | I/O — User I/O - bank 2 |
| Pino 47 | I/O — User I/O - bank 2 |
| Pino 48 | VCC — 5 V supply |
| Pino 49 | I/O — User I/O - bank 2 |
| Pino 50 | I/O — User I/O - bank 2 |
| Pino 51 | I/O — User I/O - bank 2 |
| Pino 52 | GND — Ground |
| Pino 53 | I/O — User I/O - bank 2 |
| Pino 54 | I/O — User I/O - bank 2 |
| Pino 55 | I/O — User I/O - bank 2 |
| Pino 56 | I/O — User I/O - bank 2 |
| Pino 57 | I/O — User I/O - bank 2 |
| Pino 58 | I/O — User I/O - bank 2 |
| Pino 59 | I/O — User I/O - bank 2 |
| Pino 60 | I/O — User I/O - bank 2 |
| Pino 61 | I/O — User I/O - bank 2 |
| Pino 62 | I/O — User I/O - bank 2 |
| Pino 63 | I/O — User I/O - bank 2 |
| Pino 64 | VCC — 5 V supply |
| Pino 65 | I/O — User I/O - bank 2 |
| Pino 66 | I/O — User I/O - bank 2 |
| Pino 67 | I/O — User I/O - bank 2 |
| Pino 68 | I/O — User I/O - bank 2 |
| Pino 69 | GND — Ground |
| Pino 70 | I/O — User I/O - bank 2 |
| Pino 71 | I/O — User I/O - bank 2 |
| Pino 72 | I/O — User I/O - bank 2 |
| Pino 73 | I/O — User I/O - bank 2 |
| Pino 74 | I/O — User I/O - bank 2 |
| Pino 75 | I/O — User I/O - bank 2 |
| Pino 76 | I/O — User I/O - bank 2 |
| Pino 77 | I/O — User I/O - bank 2 |
| Pino 78 | I/O — User I/O - bank 2 |
| Pino 79 | I/O — User I/O - bank 2 |
| Pino 80 | I/O — User I/O - bank 2 |
| Pino 81 | VCC — 5 V supply |
| Pino 82 | I/O — User I/O - bank 3 |
| Pino 83 | I/O — User I/O - bank 3 |
| Pino 84 | I/O — User I/O - bank 3 |
| Pino 85 | I/O — User I/O - bank 3 |
| Pino 86 | GND — Ground |
| Pino 87 | I/O — User I/O - bank 3 |
| Pino 88 | I/O — User I/O - bank 3 |
| Pino 89 | I/O — User I/O - bank 3 |
| Pino 90 | I/O — User I/O - bank 3 |
| Pino 91 | I/O — User I/O - bank 3 |
| Pino 92 | I/O — User I/O - bank 3 |
| Pino 93 | I/O — User I/O - bank 3 |
| Pino 94 | I/O — User I/O - bank 3 |
| Pino 95 | I/O — User I/O - bank 3 |
| Pino 96 | I/O — User I/O - bank 3 |
| Pino 97 | VCC — 5 V supply |
| Pino 98 | I/O — User I/O - bank 3 |
| Pino 99 | I/O — User I/O - bank 3 |
| Pino 100 | I/O — User I/O - bank 3 |
| Pino 101 | I/O — User I/O - bank 3 |
| Pino 102 | GND — Ground |
| Pino 103 | I/O — User I/O - bank 3 |
| Pino 104 | I/O — User I/O - bank 3 |
| Pino 105 | I/O — User I/O - bank 3 |
| Pino 106 | I/O — User I/O - bank 3 |
| Pino 107 | I/O — User I/O - bank 3 |
| Pino 108 | I/O — User I/O - bank 3 |
| Pino 109 | I/O — User I/O - bank 3 |
| Pino 110 | I/O — User I/O - bank 3 |
| Pino 111 | I/O — User I/O - bank 3 |
| Pino 112 | I/O — User I/O - bank 3 |
| Pino 113 | VCC — 5 V supply |
| Pino 114 | I/O — User I/O - bank 4 |
| Pino 115 | I/O — User I/O - bank 4 |
| Pino 116 | I/O — User I/O - bank 4 |
| Pino 117 | I/O — User I/O - bank 4 |
| Pino 118 | GND — Ground |
| Pino 119 | I/O — User I/O - bank 4 |
| Pino 120 | I/O — User I/O - bank 4 |
| Pino 121 | I/O — User I/O - bank 4 |
| Pino 122 | I/O — User I/O - bank 4 |
| Pino 123 | I/O — User I/O - bank 4 |
| Pino 124 | I/O — User I/O - bank 4 |
| Pino 125 | I/O — User I/O - bank 4 |
| Pino 126 | I/O — User I/O - bank 4 |
| Pino 127 | I/O — User I/O - bank 4 |
| Pino 128 | I/O — User I/O - bank 4 |
| Pino 129 | VCC — 5 V supply |
| Pino 130 | I/O — User I/O - bank 4 |
| Pino 131 | I/O — User I/O - bank 4 |
| Pino 132 | I/O — User I/O - bank 4 |
| Pino 133 | I/O — User I/O - bank 4 |
| Pino 134 | GND — Ground |
| Pino 135 | I/O — User I/O - bank 4 |
| Pino 136 | I/O — User I/O - bank 4 |
| Pino 137 | I/O — User I/O - bank 4 |
| Pino 138 | I/O — User I/O - bank 4 |
| Pino 139 | I/O — User I/O - bank 4 |
| Pino 140 | I/O — User I/O - bank 4 |
| Pino 141 | I/O — User I/O - bank 4 |
| Pino 142 | I/O — User I/O - bank 4 |
| Pino 143 | I/O — User I/O - bank 4 |
| Pino 144 | I/O — User I/O - bank 4 (dedicated clock/control inputs clustered on package corner per FLEX 8000 pinout) |
Aplicações típicas
EPF8820ATC144-3N é adequado para 6 aplicaçãos: Legacy 5 V Industrial Control Glue Logic, Telecom Backplane Protocol Bridging, Legacy PCI / ISA Bridge FPGA, Flat-Panel Display Controller / LVDS Adapter, Avionics / Military 5 V Retrofit Logic, Test & Measurement Front-End Logic.
Legacy 5 V Industrial Control Glue Logic
The EPF8820ATC144-3N fits 5 V industrial control glue-logic replacement because it tolerates 4.75 V to 5.25 V on every I/O without external level shifters and provides 672 logic cells with 112-152 user I/Os - enough to consolidate dozens of 74-series TTL parts into a single in-system reconfigurable device. Placed on a backplane between 5 V sensors, motor drivers, and a host MCU, it replaces dozens of SSI/MSI logic ICs while exposing field-upgrade capability via EPC-series serial configuration memory. Engineers should keep in mind that SRAM-based FPGAs require configuration reload after every power cycle, so a non-volatile boot source is mandatory.
Recomendado
Telecom Backplane Protocol Bridging
The EPF8820ATC144-3N suits telecom backplane protocol bridging between 5 V legacy buses (H.110, E1/T1 framing, HDLC controllers) and modern 3.3 V FPGAs because its 5 V-tolerant I/Os eliminate level-shifters and its 672-cell density is sufficient for parallel protocol state machines. Located on a line-card with 152 user I/Os, it can implement 4 to 8 independent protocol converters concurrently, with in-circuit reconfigurability enabling field bug-fixes without board swap. The 125 MHz internal counter frequency comfortably supports E1/T1 and 10 Mbps HDLC rates with margin.
Recomendado
Legacy PCI / ISA Bridge FPGA
The EPF8820ATC144-3N is a well-known choice for 5 V PCI (33 MHz, 32-bit) and ISA bridge implementations where its 5 V I/O tolerance directly interfaces with PCI/ISA signalling without bus switches. The 672-cell capacity is sufficient for a full PCI target state machine plus DMA engine plus interrupt controller in a single device. Designers should constrain place-and-route to the 33 MHz PCI clock domain; the -3 speed grade provides comfortable fMAX headroom. Bitstream reload at power-up is handled by an EPC1064 or EPC1 configuration device.
Recomendado
Flat-Panel Display Controller / LVDS Adapter
The EPF8820ATC144-3N can be used as a flat-panel display timing controller or LVDS-to-TTL adapter, leveraging 112-152 user I/Os to drive 18/24-bit LVDS display panels from a parallel RGB source. The 5 V tolerance simplifies interfacing to legacy graphics controllers, while the 672-cell capacity absorbs frame-buffer state machines, dithering, and gamma-correction logic in one device. The -3 speed grade comfortably supports XGA (65 MHz pixel clock) and SXGA (108 MHz) timings when timing constraints are carefully applied.
Recomendado
Avionics / Military 5 V Retrofit Logic
The EPF8820ATC144-3N fits avionics and military 5 V retrofit projects where modern sub-3.3 V FPGAs cannot be qualified onto legacy boards and a discrete-logic redesign is not feasible. Although this is the commercial (0 °C to +70 °C) grade, system integrators in non-flight subsystems have used FLEX 8000 commercial parts in ruggedized enclosures as cost-effective replacements for obsolete 54-series TTL. Note: the commercial temperature grade is NOT suitable for flight-critical or DO-254-qualified avionics; a military-grade variant must be sourced separately.
Recomendado
Test & Measurement Front-End Logic
The EPF8820ATC144-3N is well-suited to test-and-measurement front-end logic - scan-path controllers, pattern generators, and timing-aware switching matrices - because its 152 I/Os can drive dozens of test points simultaneously and its in-system reconfigurability lets engineers update test patterns without board rework. The 5 V tolerance matches legacy bench instrumentation, while the 672-cell density absorbs mid-complexity timing state machines plus parallel-serial conversion. Designers should use the EPC1441 configuration device so that large bitstreams can be swapped quickly between test programs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF8820ATC144-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF8820ATC144-3 | EPF8820ATC144-2N | EPF8820ATC144-2 | EPF8820ATC144-1 | EPF8452ATC100-3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 100-pin TQFP - different |
| Family | FLEX 8000 | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same |
| Speed Grade | -3 (mid) | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 |
| Supply Voltage | 5 V (4.75-5.25 V) | 5 V | 5 V | 5 V | 5 V | 5 V |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
| Configuration Memory | External EPC1/1064/1213/1441 | External EPC-series | External EPC-series | External EPC-series | External EPC-series | External EPC-series |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Identical-die base part in same 144-pin TQFP footprint (vs EPF8820ATC144-3)
- Mid-tier -3 speed grade (vs EPF8820ATC144-2N)
- 5 V tolerant I/O eliminates level shifters (vs Modern 3.3 V FPGAs (e.g. Cyclone IV))
Notas de projeto
The EPF8820ATC144-3N requires a clean 5 V supply at 4.75 V to 5.25 V with adequate bulk decoupling. Place one 100 µF tantalum or aluminum polymer capacitor near the board entry point, 10 µF ceramic at each VCC pin cluster, and 0.1 µF ceramic as close as possible to every individual VCC pin. Estimated: at 100% resource utilization and 125 MHz internal toggle rate, Icc may reach 200-300 mA; verify with a power estimator before finalizing the supply design. Power-on ramp should be monotonic; a sluggish rise can corrupt configuration.
The 144-pin TQFP (20 x 20 mm, 0.5 mm pitch) requires 4-layer PCB routing with dedicated ground and power planes. Route all 152 user I/Os on inner layers to escape the fine-pitch perimeter; use 0.2 mm traces with 0.2 mm spacing on outer layers. Place the EPC-series configuration memory no more than 50 mm from the FPGA's DATA, DCLK, nCONFIG, nSTATUS, and CONFIG_DONE pins to keep configuration traces short and noise-free. The 5 V I/O banks generate simultaneous-switching noise (SSN); keep sensitive analog traces away from I/O banks and add ground guards.
Critical pitfalls: (1) SRAM-based FPGAs are volatile - if the EPC configuration memory is missing, mis-programmed, or the bitstream is corrupted, the device will not function. (2) Always pull nCONFIG high with a 10 kΩ resistor and tie nSTATUS and CONFIG_DONE high through 10 kΩ per the FLEX 8000 reference design. (3) Do not assert I/O drive before configuration completes; tristate all I/Os during configuration. (4) The commercial (0 °C to +70 °C) grade is NOT suitable for industrial -40 °C to +85 °C or military -55 °C to +125 °C environments; spec a wider-temperature FLEX 8000 variant instead. (5) Quartus II support for FLEX 8000 is legacy-only - use MAX+PLUS II baseline 10.x for the most reliable synthesis results.
Decoupling strategy: place 0.1 µF X7R ceramics directly under each VCC pin on the opposite PCB side, connected by short vias (less than 1 mm). Add 1 nF and 10 nF caps in parallel for high-frequency noise suppression above 100 MHz. Use a solid ground pour on layer 2 directly under the FPGA body; do not split the ground plane under the device. For multi-FPGA designs, isolate configuration busses per device and avoid sharing DCLK across multiple FPGAs - use point-to-point daisy-chain configuration instead.
Informações de conformidade
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status for EPF8820ATC144-3N were not present in the Verified Web Data and are flagged as [DATA_NEEDED] in the specs array. AEC-Q100 is not applicable because this part is a commercial-grade FPGA, not an automotive-qualified IC.
