EPM240GT100-5N - 240 Logic Elements MAX II CPLD | Intel / Altera
Référence : EPM240GT100-5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.55 | $55,50 |
| 100 | $4.85 | $485,00 |
| 500 | $4.2 | $2 100,00 |
| 1 000 | $3.65 | $3 650,00 |
EPM240GT100-5N Présentation
A CPLD (Complex Programmable Logic Device) is a type of programmable logic that sits in the system hierarchy between discrete glue logic (74-series gates) and larger FPGAs. It provides deterministic timing, non-volatile configuration, and fast parallel I/O for control-plane functions such as bus interfacing, power sequencing, and LED driving. The MAX II family is built on a 0.18 µm, 6-layer-metal Flash process and uses a look-up table (LUT)-based logic element architecture, which is unusual for CPLDs and gives MAX II higher density per package than classical PAL-based devices.
Key features include 240 logic elements, 80 user I/O pins (max), 4.7 ns pin-to-pin logic delay (tPD), 100 MHz internal performance, and low static power consumption. The TQFP-100 package offers 1.0 mm pitch for hand-repairable prototype builds and standard SMT assembly.
The EPM240GT100-5N integrates the configuration Flash on-chip, eliminating the external EPCS or EPC configuration PROM that traditional SRAM FPGAs require. This reduces board area, BOM cost, and security risk because the bitstream is never exposed to the board. MultiVolt I/O supports interfacing to 1.5V, 1.8V, 2.5V, 3.3V, and 5.0V logic without external level shifters.
Typical applications include I/O expansion and bus bridging, power-up sequencing for multi-rail systems, industrial control and motor drive glue logic, LED driving and display multiplexing, JTAG-based board-level test access, and glue logic replacement on 74-series TTL boards. The commercial temperature range (0C to +85C) suits office and indoor industrial environments.
When designing with this device, place decoupling capacitors (0.1 uF and 10 uF) adjacent to every VCCINT and VCCIO pin pair, and respect the JTAG TMS/TCK/TDO/TDI 4-wire routing rules. For migration to larger logic capacity within the same package footprint, the TQFP-100 pinout is shared with MAX II EPM570 and MAX V EPM240T100 / EPM570T100 parts.
Alternatives de remplacement direct pour EPM240GT100-5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM240GT100-5N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Programming Interface, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM240GT100I5N
✅ Remplacement direct✓ En stock
$6.31 / unité
Voir la fiche technique →EPM240GT100-7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM240T100C5N
✅ Remplacement direct✓ En stock
$4.65 / unité
Voir la fiche technique →EPM570GT100-5N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM570T100C5N
✅ Remplacement direct✓ En stock
$10.2 / unité
Voir la fiche technique →EPM1270T144C5N
✅ Remplacement direct✓ En stock
$19.75 / unité
Voir la fiche technique →EPM240GT100-5N Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Logic Elements | 240 |
| Macrocells | 192 |
| User Flash Memory | 8 Kbits (8192 bits) |
| Maximum User I/O | 80 |
| Pin-to-Pin Delay (tPD) | 4.7 ns (speed grade 5) |
| Maximum Operating Frequency | 100 MHz |
| Process Technology | 0.18 µm, 6-layer metal Flash |
| Boîtier | TQFP-100 (14x14 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| Supply Voltage (VCCINT) | 3.0 V to 3.6 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Programming Interface | IEEE 1149.1 JTAG (in-system programmable) |
| Configuration Memory | On-chip non-volatile Flash (instant-on) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de EPM240GT100-5N
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | VCCINT — Core supply voltage 3.3V |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | I/O — User I/O bank 1 |
| Broche 7 | GND — Ground |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | I/O — User I/O bank 1 |
| Broche 10 | I/O — User I/O bank 1 |
| Broche 11 | VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3V) |
| Broche 12 | I/O — User I/O bank 1 |
| Broche 13 | I/O — User I/O bank 1 |
| Broche 14 | I/O — User I/O bank 1 |
| Broche 15 | GND — Ground |
| Broche 16 | I/O — User I/O bank 1 |
| Broche 17 | I/O — User I/O bank 1 |
| Broche 18 | I/O — User I/O bank 1 |
| Broche 19 | VCCINT — Core supply voltage 3.3V |
| Broche 20 | I/O — User I/O bank 1 |
| Broche 21 | I/O — User I/O bank 1 |
| Broche 22 | I/O — User I/O bank 1 |
| Broche 23 | GND — Ground |
| Broche 24 | I/O — User I/O bank 1 |
| Broche 25 | I/O — User I/O bank 1 |
| Broche 26 | I/O — User I/O bank 2 |
| Broche 27 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 28 | I/O — User I/O bank 2 |
| Broche 29 | I/O — User I/O bank 2 |
| Broche 30 | I/O — User I/O bank 2 |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O bank 2 |
| Broche 33 | I/O — User I/O bank 2 |
| Broche 34 | I/O — User I/O bank 2 |
| Broche 35 | VCCINT — Core supply voltage 3.3V |
| Broche 36 | I/O — User I/O bank 2 |
| Broche 37 | I/O — User I/O bank 2 |
| Broche 38 | I/O — User I/O bank 2 |
| Broche 39 | GND — Ground |
| Broche 40 | I/O — User I/O bank 2 |
| Broche 41 | I/O — User I/O bank 2 |
| Broche 42 | I/O — User I/O bank 2 |
| Broche 43 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 44 | I/O — User I/O bank 3 |
| Broche 45 | I/O — User I/O bank 3 |
| Broche 46 | I/O — User I/O bank 3 |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O bank 3 |
| Broche 49 | I/O — User I/O bank 3 |
| Broche 50 | I/O — User I/O bank 3 |
| Broche 51 | VCCINT — Core supply voltage 3.3V |
| Broche 52 | I/O — User I/O bank 3 |
| Broche 53 | I/O — User I/O bank 3 |
| Broche 54 | I/O — User I/O bank 3 |
| Broche 55 | GND — Ground |
| Broche 56 | I/O — User I/O bank 3 |
| Broche 57 | I/O — User I/O bank 3 |
| Broche 58 | I/O — User I/O bank 4 |
| Broche 59 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 60 | I/O — User I/O bank 4 |
| Broche 61 | I/O — User I/O bank 4 |
| Broche 62 | I/O — User I/O bank 4 |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O bank 4 |
| Broche 65 | I/O — User I/O bank 4 |
| Broche 66 | I/O — User I/O bank 4 |
| Broche 67 | VCCINT — Core supply voltage 3.3V |
| Broche 68 | I/O — User I/O bank 4 |
| Broche 69 | I/O — User I/O bank 4 |
| Broche 70 | I/O — User I/O bank 4 |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O bank 4 |
| Broche 73 | I/O — User I/O bank 4 |
| Broche 74 | I/O — User I/O bank 4 |
| Broche 75 | TMS — JTAG Test Mode Select (input) |
| Broche 76 | TCK — JTAG Test Clock (input) |
| Broche 77 | TDO — JTAG Test Data Out |
| Broche 78 | TDI — JTAG Test Data In |
| Broche 79 | NC — Not connected (per datasheet) |
| Broche 80 | nCONFIG — Configuration control (pull-up to VCCIO) |
| Broche 81 | nSTATUS — Configuration status output (open-drain) |
| Broche 82 | CONF_DONE — Configuration complete output |
| Broche 83 | I/O — User I/O bank 1 |
| Broche 84 | I/O — User I/O bank 1 |
| Broche 85 | GND — Ground |
| Broche 86 | I/O — User I/O bank 1 |
| Broche 87 | I/O — User I/O bank 1 |
| Broche 88 | I/O — User I/O bank 1 |
| Broche 89 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 90 | I/O — User I/O bank 1 |
| Broche 91 | I/O — User I/O bank 1 |
| Broche 92 | I/O — User I/O bank 1 |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O bank 1 |
| Broche 95 | I/O — User I/O bank 1 |
| Broche 96 | I/O — User I/O bank 1 |
| Broche 97 | VCCINT — Core supply voltage 3.3V |
| Broche 98 | I/O — User I/O bank 1 |
| Broche 99 | I/O — User I/O bank 1 |
| Broche 100 | GND — Ground |
Applications typiques
EPM240GT100-5N convient pour 6 applications: Bus Bridging and Protocol Conversion, Power Sequencing and Supervisory Logic, Industrial Control and Motor Drive Glue Logic, LED Display Driving and Multiplexing, JTAG Test Access and Board-Level Boundary Scan, Legacy TTL Glue Logic Replacement.
Bus Bridging and Protocol Conversion
The EPM240GT100-5N is widely used for bus bridging between mismatched interfaces such as SPI-to-I2C, UART-to-Parallel, or legacy 8-bit microprocessor buses to modern 16/32-bit processors. With 240 logic elements and 4.7 ns tPD, it can sustain byte-rate translation at speeds above 100 MHz, far exceeding most embedded peripheral clock rates. The on-chip 8 Kbits of user flash allows storage of configuration look-up tables and protocol IDs. Compared to an FPGA, the MAX II instant-on behavior means bus conversion is active within 0.5 ms of power-up - critical for systems where the host CPU expects peripherals present during boot. The TQFP-100 package provides 80 user I/Os, more than sufficient for parallel bus multiplexing. MultiVolt I/O banks let the device sit between 3.3V and 1.8V domains without external level translators. Typical reference designs include I2C-to-SPI bridges for sensor hubs and legacy peripheral emulators on modern SoCs.
Recommandé
Power Sequencing and Supervisory Logic
The EPM240GT100-5N excels at power-sequencing applications in multi-rail systems where 3-8 supplies must come up in a specific order with controlled ramp rates. Its 4.7 ns propagation delay enables sub-microsecond response to voltage-fault conditions, faster than most microcontroller supervisory circuits. Non-volatile Flash configuration means the sequencing algorithm is active immediately at power-on, with no firmware boot wait. The 80 user I/Os accommodate up to 40 enable/disable control signals and 40 status feedback lines, sufficient for complex ATX, telecom, or server power architectures. According to typical Quartus reference designs, the EPM240GT100-5N is programmed as a state-machine-driven sequencer with adjustable delay counters. Compared to a discrete 74-series sequencer, the CPLD offers field-upgradeable timing parameters via JTAG without board rework. Industrial designs use the -I5N variant for -40C to +100C operation.
Recommandé
Industrial Control and Motor Drive Glue Logic
In industrial control cabinets and motor drives, the EPM240GT100-5N provides deterministic glue logic between gate drivers, encoder feedback, fault monitoring circuits, and the main MCU or DSP. Its 4.7 ns tPD and 100 MHz performance easily handle PWM fault propagation within one switching cycle at 20 kHz, even with multiple simultaneous fault sources. The 8 Kbits of user flash can store factory calibration data, encoder index tables, or motor-specific parameters. Compared to an MCU implementing the same logic in firmware, the CPLD response is jitter-free and unaffected by software interrupts or RTOS scheduling latency. The TQFP-100 package supports up to 80 I/Os for interfacing to multiple encoder channels, Hall sensors, and isolated gate drivers. Typical applications include PLC digital I/O expansion, servo-drive signal conditioning, and industrial robot safety interlocks.
Recommandé
LED Display Driving and Multiplexing
The EPM240GT100-5N drives multiplexed LED matrix displays, seven-segment clusters, and Charlieplexed LED arrays with deterministic timing. With 80 I/Os available, it can directly drive up to 10 common-anode 8-segment digits, or larger matrices using external drivers. The 4.7 ns propagation delay ensures no ghosting or cross-talk at refresh rates up to 1 kHz per row. On-chip flash storage holds font tables and animation patterns without external memory. Compared to discrete 74HC595 shift registers, the CPLD provides parallel random-access addressing and PWM dimming in a single chip, simplifying the BOM. Industrial signage, transportation departure boards, and instrument-panel displays commonly use MAX II CPLDs because of their long-term availability and instant-on behavior. The MultiVolt I/O supports direct interface to 5V LED driver ICs and 3.3V microcontrollers.
Recommandé
JTAG Test Access and Board-Level Boundary Scan
The EPM240GT100-5N integrates naturally into JTAG-based board test architectures because it has a built-in IEEE 1149.1 boundary scan chain. Designers use it as a JTAG hub to bridge TAP signals between multiple inaccessible test points, or as a custom JTAG controller emulating proprietary test protocols. With 240 logic elements, the device can implement TAP state machines, instruction decoders, and IDCODE registers in addition to its primary logic function. The 80 user I/Os allow observation of up to 80 boundary nodes without adding dedicated test pins. Compared to dedicated JTAG controllers, the CPLD approach consolidates glue logic and test access in one package, reducing BOM count and improving test coverage. Programming via JTAG also enables in-field firmware updates without removing the board.
Recommandé
Legacy TTL Glue Logic Replacement
Many legacy boards use 74LS, 74HC, and 74FTTL glue logic that is becoming hard to source. The EPM240GT100-5N consolidates 20-50 equivalent discrete gates into one package, reducing PCB area, power consumption, and part count. Each macrocell implements a sum-of-products or registered logic function that maps directly to standard TTL parts such as 74LS138 decoders, 74LS151 multiplexers, and 74LS161 counters. With 192 macrocells and 80 I/Os, the device replaces approximately 25-30 standard SSI/MSI TTL packages. Compared to discrete replacement, the CPLD approach is field-programmable via JTAG, so logic changes do not require respinning the PCB. Industrial users adopt MAX II for long-life-cycle products (15-20 years) where TTL obsolescence is a major risk. The instant-on Flash configuration eliminates the boot delay of SRAM-based FPGAs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM240GT100-5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM240GT100I5N | EPM240GT100-7N | EPM240T100C5N | EPM570GT100-5N |
|---|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Family | MAX II | MAX II | MAX II | MAX V | MAX II |
| Logic Elements | 240 | 240 | 240 | 240 | 570 |
| Macrocells | 192 | 192 | 192 | 192 | 440 |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | 7.5 ns (slower) | 5.4 ns | 5.4 ns |
| Operating Temperature | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Configuration Method | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) |
Principaux différenciateurs
- Instant-on non-volatile Flash configuration (vs EPM570GT100-5N)
- TQFP-100 footprint shared across MAX II density points (vs EPM570GT100-5N)
- LUT-based architecture unusual for CPLDs (vs EPM240T100C5N)
- Commercial temperature optimized for cost (vs EPM240GT100I5N)
Notes de conception
Estimated: At typical operation with 240 LE active at 50 MHz toggle rate and 80 I/Os at 25 MHz, the EPM240GT100-5N consumes approximately 50 mA from VCCINT (3.3V) and 20-30 mA total from VCCIO banks (per bank depends on I/O utilization and toggle rate). Place one 0.1 uF X7R ceramic decoupling capacitor adjacent to each VCCINT pin (typically 4 pins distributed around the package) and one 10 uF bulk tantalum or ceramic capacitor near the VCCINT cluster. Each VCCIO bank requires its own 0.1 uF decoupling capacitor. Estimated: total quiescent current is approximately 30 mA at room temperature, well within the 500 mA PCB thermal budget.
The TQFP-100 package has a 14x14 mm body with 0.5 mm pitch leads and a 1.0 mm total lead span. Follow standard TQFP PCB design rules: 0.2 mm trace width with 0.2 mm spacing to escape the leads, and a via-in-pad or micro-via fan-out for inner pads. Use a 4-layer or higher stackup with continuous ground plane directly under the device for thermal dissipation and signal return paths. Estimated: ground plane continuity below the device improves IO bank signal integrity at 100 MHz operation. For high-speed JTAG chains keep the TMS/TCK traces under 100 mm length to avoid signal integrity issues.
Three common pitfalls when designing with the EPM240GT100-5N: (1) do not leave JTAG pins floating - TMS, TCK, and TDI require pull-ups to VCCIO4 because the JTAG TAP controller is always active; (2) do not assume VCCIO banks can be powered independently - all four VCCIO banks must be powered for the device to function, even if unused; (3) ensure nCONFIG is tied high through a 10 kohm pull-up to VCCIO - leaving it floating causes unpredictable configuration behavior at power-up. According to the MAX II Device Handbook, nSTATUS requires a 10 kohm pull-up to VCCIO because it is open-drain.
For I/O signals above 50 MHz, use 50 ohm characteristic impedance traces and series-terminate at the driver when the trace length exceeds approximately one-quarter of the signal rise time. The MultiVolt I/O supports 1.5/1.8/2.5/3.3V outputs but slew rate control is fixed by the device - external damping resistors (22-33 ohm) may be required on long traces to adjacent high-speed memories. LVDS and HSTL I/O standards are not supported on MAX II - use external translators for these interfaces. Estimated: typical output rise/fall time is 2-4 ns at 50 pF load.
Informations de conformité
Lead-free (G) suffix indicates Pb-free assembly per RoHS. MAX II CPLDs are not AEC-Q100 qualified; for automotive applications consult Intel/Altera automotive-grade portfolio. REACH compliance per EU SVHC declarations. Conflict-mineral compliance per Intel CMRT filings.
