EPM240GT100C3N - MAX II CPLD 240 LE TQFP-100 | Intel
Référence : EPM240GT100C3N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.47 | $5,47 |
| 10 | $4.92 | $49,20 |
| 100 | $4.38 | $438,00 |
| 500 | $3.95 | $1 975,00 |
| 1 000 | $3.52 | $3 520,00 |
EPM240GT100C3N Présentation
What is a CPLD? A complex programmable logic device is a non-volatile programmable logic IC that combines multiple PLA-style macrocells with on-chip flash configuration memory. CPLDs sit above simple PLDs and below FPGAs in the programmable logic hierarchy, with characteristic strengths of deterministic timing, instant-on behavior, and high I/O count. MAX II specifically adds an embedded user flash memory (UFM) and multi-voltage I/O support, bridging classic glue-logic density with small-footprint microcontroller-like functions.
Key features include 240 logic elements, 4.7 ns worst-case tPD, 80 I/Os supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL), an on-chip UFM block that can hold 8 Kbits of user data, in-system programmability via JTAG, and a 3.3 V core with MultiVolt I/O banks that interface cleanly to 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails. The flash-backed configuration eliminates external boot PROMs and gives true instant-on behavior.
Architecturally the MAX II family uses a Logic Array Block (LAB) matrix of 240 LEs arranged in a uniform array, fed by a fast global interconnect with predictable delay paths. The on-chip flash provides ISP and a secure UFM for parameter storage, often used in place of small EEPROMs in glue-logic designs.
Typical applications include I/O expansion and bus bridging for microcontrollers and ASSPs, power-sequencer and reset controllers, address decoding and chip-select generation, glue logic and protocol translation (UART/I2C/SPI bridges), and low-density state-machine controllers in industrial, consumer, and communications equipment.
Designers should size the timing margin for the worst-case tPD over temperature, choose I/O standards per bank to keep the part count down, and budget the UFM write endurance (around 100k cycles per Altera documentation) before substituting it for an EEPROM.
Alternatives de remplacement direct pour EPM240GT100C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM240GT100C3N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Programming Interface, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM240GT100C3
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EPM240GT100-5N
✅ Remplacement direct✓ En stock
$3.65 / unité
Voir la fiche technique →EPM240GT100
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →EPM240GM100I5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$39.7727 / unité
Voir la fiche technique →EPM240GM100C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.75 / unité
Voir la fiche technique →EPM240T100C5N
✅ Remplacement direct✓ En stock
$4.65 / unité
Voir la fiche technique →EPM240GT100C3N Valeurs maximales et caractéristiques électriques
| Manufacturer | Intel (formerly Altera) |
| Series | MAX II |
| Device Family | MAX II G (instant-on, non-volatile CPLD) |
| Logic Elements (LE) | 240 |
| Equivalent Macrocells | 192 |
| User I/O Pins | 80 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD) | 4.7 ns |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage | 3.3 V |
| MultiVolt I/O Standards | LVTTL, LVCMOS, PCI, SSTL (1.5 V / 1.8 V / 2.5 V / 3.3 V) |
| Programmability | In-System Programmable (ISP) via JTAG |
| Boîtier | TQFP-100 (GT100), 16 x 16 mm, 0.5 mm pitch |
| Température de fonctionnement | 0 °C to +85 °C (commercial, suffix C) |
| Lead-Free / RoHS | Lead Free, RoHS Compliant |
| Type de montage | Surface Mount |
Configuration des broches de EPM240GT100C3N
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O (bank 2) |
| Broche 13 | I/O — User I/O (bank 2) |
| Broche 14 | I/O — User I/O (bank 2) |
| Broche 15 | I/O — User I/O (bank 2) |
| Broche 16 | I/O — User I/O (bank 2) |
| Broche 17 | I/O — User I/O (bank 2) |
| Broche 18 | I/O — User I/O (bank 2) |
| Broche 19 | I/O — User I/O (bank 2) |
| Broche 20 | I/O — User I/O (bank 2) |
| Broche 21 | I/O — User I/O (bank 2) |
| Broche 22 | I/O — User I/O (bank 2) |
| Broche 23 | I/O — User I/O (bank 2) |
| Broche 24 | I/O — User I/O (bank 2) |
| Broche 25 | I/O — User I/O (bank 2) |
| Broche 26 | GND — Ground |
| Broche 27 | I/O — User I/O (bank 2) |
| Broche 28 | I/O — User I/O (bank 2) |
| Broche 29 | I/O — User I/O (bank 2) |
| Broche 30 | I/O — User I/O (bank 2) |
| Broche 31 | I/O — User I/O (bank 2) |
| Broche 32 | I/O — User I/O (bank 2) |
| Broche 33 | I/O — User I/O (bank 2) |
| Broche 34 | I/O — User I/O (bank 2) |
| Broche 35 | I/O — User I/O (bank 2) |
| Broche 36 | VCCINT — Core supply 3.3 V |
| Broche 37 | I/O — User I/O (bank 3) |
| Broche 38 | I/O — User I/O (bank 3) |
| Broche 39 | I/O — User I/O (bank 3) |
| Broche 40 | I/O — User I/O (bank 3) |
| Broche 41 | I/O — User I/O (bank 3) |
| Broche 42 | I/O — User I/O (bank 3) |
| Broche 43 | I/O — User I/O (bank 3) |
| Broche 44 | I/O — User I/O (bank 3) |
| Broche 45 | I/O — User I/O (bank 3) |
| Broche 46 | I/O — User I/O (bank 3) |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O (bank 3) |
| Broche 49 | I/O — User I/O (bank 3) |
| Broche 50 | I/O — User I/O (bank 3) |
| Broche 51 | I/O — User I/O (bank 3) |
| Broche 52 | I/O — User I/O (bank 3) |
| Broche 53 | I/O — User I/O (bank 3) |
| Broche 54 | I/O — User I/O (bank 3) |
| Broche 55 | I/O — User I/O (bank 3) |
| Broche 56 | I/O — User I/O (bank 3) |
| Broche 57 | VCCIO — I/O supply (bank 3) |
| Broche 58 | I/O — User I/O (bank 3) |
| Broche 59 | I/O — User I/O (bank 3) |
| Broche 60 | I/O — User I/O (bank 3) |
| Broche 61 | GND — Ground |
| Broche 62 | I/O — User I/O (bank 3) |
| Broche 63 | I/O — User I/O (bank 3) |
| Broche 64 | I/O — User I/O (bank 3) |
| Broche 65 | I/O — User I/O (bank 3) |
| Broche 66 | I/O — User I/O (bank 3) |
| Broche 67 | I/O — User I/O (bank 3) |
| Broche 68 | I/O — User I/O (bank 3) |
| Broche 69 | I/O — User I/O (bank 3) |
| Broche 70 | I/O — User I/O (bank 3) |
| Broche 71 | I/O — User I/O (bank 3) |
| Broche 72 | VCCINT — Core supply 3.3 V |
| Broche 73 | I/O — User I/O (bank 4) |
| Broche 74 | I/O — User I/O (bank 4) |
| Broche 75 | I/O — User I/O (bank 4) |
| Broche 76 | I/O — User I/O (bank 4) |
| Broche 77 | I/O — User I/O (bank 4) |
| Broche 78 | I/O — User I/O (bank 4) |
| Broche 79 | I/O — User I/O (bank 4) |
| Broche 80 | I/O — User I/O (bank 4) |
| Broche 81 | I/O — User I/O (bank 4) |
| Broche 82 | I/O — User I/O (bank 4) |
| Broche 83 | GND — Ground |
| Broche 84 | I/O — User I/O (bank 4) |
| Broche 85 | I/O — User I/O (bank 4) |
| Broche 86 | I/O — User I/O (bank 4) |
| Broche 87 | I/O — User I/O (bank 4) |
| Broche 88 | I/O — User I/O (bank 4) |
| Broche 89 | I/O — User I/O (bank 4) |
| Broche 90 | I/O — User I/O (bank 4) |
| Broche 91 | I/O — User I/O (bank 4) |
| Broche 92 | I/O — User I/O (bank 4) |
| Broche 93 | I/O — User I/O (bank 4) |
| Broche 94 | I/O — User I/O (bank 4) |
| Broche 95 | I/O — User I/O (bank 4) |
| Broche 96 | VCCIO — I/O supply (bank 4) |
| Broche 97 | TCK — JTAG test clock |
| Broche 98 | TMS — JTAG test mode select |
| Broche 99 | TDI — JTAG test data in |
| Broche 100 | TDO — JTAG test data out |
Applications typiques
EPM240GT100C3N convient pour 6 applications: Microcontroller I/O Expansion & Bus Bridging, Industrial Control & Power Sequencing, Communications Equipment & Protocol Translation, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic, Automotive Body Electronics (Non-Safety).
Microcontroller I/O Expansion & Bus Bridging
The EPM240GT100C3N is widely used to expand a microcontroller's GPIO count and bridge between incompatible bus protocols. With 240 logic elements and 80 user I/Os, it can implement address decoding, chip-select generation, and parallel-to-serial conversion in a single device, freeing the host MCU from real-time I/O work. The 4.7 ns tPD supports glue-logic paths at 100 MHz+ system clocks, while the 8-Kbit UFM can store calibration or configuration constants that would otherwise require an external EEPROM.
Recommandé
Industrial Control & Power Sequencing
In industrial PLCs, motor controllers, and power-conversion modules, the EPM240GT100C3N is used for deterministic power-supervisor and reset-sequencing logic. The device's instant-on flash-backed configuration starts in microseconds, with no boot PROM, making it ideal for safety-critical sequencing where the MCU's boot time is too long. With 4.7 ns tPD it can synchronously gate power MOSFET drivers or interlock fault signals at high PWM rates, and the 80 I/Os accommodate wide fan-in from multiple sensor rails.
Recommandé
Communications Equipment & Protocol Translation
The EPM240GT100C3N is a workhorse in router, switch, and base-station line cards for low-density protocol translation - UART-to-I2C bridges, SPI-to-parallel decoders, and custom PHY glue. The 100-pin TQFP package exposes 80 user I/Os that can be configured as LVTTL, LVCMOS, or SSTL, enabling direct interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters. With 4.7 ns tPD it cleanly handles 100 Mbps MDIO and similar management buses.
Recommandé
Consumer Electronics Glue Logic
In set-top boxes, display controllers, and home appliances, the EPM240GT100C3N replaces dozens of 74-series logic chips with a single programmable device. The 240-LE capacity is sufficient for typical glue tasks - address latching, clock division, watchdog timing, and keypad scanning - while the on-chip UFM can store user preferences or factory calibration. Instant-on flash configuration avoids the FPGA-style boot wait, making it compatible with consumer power-on timing budgets.
Recommandé
Test & Measurement Front-End Logic
Test instruments and ATE fixtures use the EPM240GT100C3N for custom timing, signal-routing, and trigger-decoding logic. The 4.7 ns tPD lets it generate precise pulse patterns and decode incoming triggers at speeds that legacy PLDs cannot reach, while JTAG ISP enables fixture calibration in the field. The 80 I/Os provide enough headroom for multi-channel analog-front-end switching, and the 8-Kbit UFM stores per-channel calibration coefficients.
Recommandé
Automotive Body Electronics (Non-Safety)
In non-safety automotive body modules - HVAC controllers, lighting drivers, infotainment backplanes - the EPM240GT100C3N provides deterministic glue logic and instant-on configuration. Designers pair it with industrial-grade MAX II G variants for the wider temperature range; the commercial-temperature EPM240GT100C3N is typically used in cabin modules where -40 °C is not required. The 240-LE budget fits typical body-control tasks such as CAN/LIN bridging and switch-debounce logic.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM240GT100C3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM240GT100C3 | EPM240GT100-5N | EPM240GT100 | EPM240GM100I5N | EPM240T100C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | TQFP-100 (GT100) | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GM100) - same | TQFP-100 (T100) - same |
| Logic Elements | 240 | 240 | 240 | 240 | 240 | 240 |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | ~6.5 ns | 4.7 ns (typical C3) | ~6.5 ns | ~6.5 ns |
| User I/O Pins | 80 | 80 | 80 | 80 | 80 | 80 |
| Operating Temperature | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) |
| UFM Size | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS Compliant | Yes (lead-free) | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Fastest speed grade in the MAX II G 100-pin TQFP family (vs EPM240GT100-5N)
- On-chip UFM eliminates external EEPROM (vs EPM240T100C5N)
- True instant-on from non-volatile flash (vs Small SRAM-based FPGAs (e.g., Cyclone II))
Notes de conception
The EPM240GT100C3N requires a clean 3.3 V core supply (VCCINT) on pins 36 and 72, and per-bank VCCIO supplies (e.g., pin 57 for bank 3, pin 96 for bank 4) for the I/O rings. Place 0.1 µF decoupling capacitors as close as possible to every VCC pin, with at least one 10 µF bulk capacitor per supply rail within 25 mm of the device. Estimated: with all 80 I/Os toggling at 50 MHz, the device draws approximately 30-50 mA from VCCINT - budget accordingly and use a ferrite bead if the 3.3 V rail is shared with noisy digital loads.
Bank VCCIO voltages must match the I/O standard selected in the Quartus pin assignment. Mixing 1.5 V and 3.3 V signals in the same bank is not allowed - use separate banks for each voltage. Always check the MAX II Device Handbook chapter on I/O features before finalizing pin assignments; otherwise inputs may overstress on the lower-voltage bank or fail to meet VIH/VIL thresholds. JTAG pins TCK/TMS/TDI/TDO on pins 97-100 must be pulled or driven correctly during ISP; a floating TCK can cause unintended configuration events.
The 100-pin TQFP has a 0.5 mm lead pitch and is best routed on a 4-layer PCB with a continuous ground plane. Estimated: route all signal traces at 0.15 mm width with 0.15 mm clearance on the outer layers for a controlled-impedance 50 Ω microstrip (verify with your stackup). Place at least four via stitches around the TQFP thermal pad region even though this package does not have an exposed pad - this minimizes ground bounce and improves signal integrity for high-speed JTAG and clock signals.
Informations de conformité
RoHS compliant per Altera/Intel product page and distributor listings. Lead-free per 'N' suffix in the part number. Not AEC-Q100 qualified; the part targets commercial-grade industrial/consumer designs. The industrial-temperature MAX II G variant EPM240GT100I5N is preferred for -40 °C to +100 °C designs.
