EPM570M100C4N - 440 Macrocells MAX II CPLD, 5.4ns | Intel
Référence : EPM570M100C4N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $23.59 | $23,59 |
| 10 | $21.2 | $212,00 |
| 100 | $18.5 | $1 850,00 |
| 500 | $16.4 | $8 200,00 |
| 1 000 | $14.95 | $14 950,00 |
EPM570M100C4N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple PAL/GAL devices and large FPGAs in the programmable logic hierarchy. CPLDs typically contain multiple macrocell logic blocks with a centralized interconnect fabric, providing deterministic timing, instant-on behavior (no boot loader required), and high-drive I/O. The MAX II family, of which the EPM570M100C4N is a member, is widely used for I/O expansion, bus bridging, power-up sequencing, and glue-logic replacement in cost-sensitive industrial, consumer, and communications designs.
The EPM570M100C4N integrates 440 macrocells, equivalent to 570 logic elements (LEs), and includes an embedded User Flash Memory (UFM) block of 8 Kbits for storing non-logic data such as serial numbers, calibration tables, or boot parameters. MultiVolt core support allows the device to interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels without external level shifters. Enhanced in-system programmability via JTAG (IEEE 1149.1) enables field upgrades without removing the part from the board.
Architecturally, the EPM570M100C4N uses a flash-based, non-volatile configuration cell that eliminates the need for an external boot PROM and provides instant-on operation in under 1 ms. The LAB (Logic Array Block) structure combined with a global routing pool delivers predictable, deterministic timing critical for asynchronous interface glue logic. Compared to the older MAX 7000 series, MAX II offers roughly 10x lower static power, higher logic density, and a smaller footprint in equivalent BGA packages.
Typical applications for the EPM570M100C4N include 5 V to 3.3 V / 1.8 V bus bridging in legacy industrial backplanes, I/O expansion for microcontrollers and microprocessors that lack sufficient pins, power-up/power-down sequencing for multi-rail systems, LED driving and display control, motor-control timing logic, JTAG-based board-level configuration, and replacement of discrete 74-series glue logic in cost-sensitive designs.
When designing with this device, observe the recommended decoupling scheme of 0.1 µF and 10 µF capacitors placed within 3 mm of each VCC pin and ensure the JTAG chain respects the device's TCK frequency limits. The 100-pin MBGA package requires PCB pads with proper microvia or via-in-pad technology for reliable assembly and reflow.
This page synthesizes real-time distributor pricing, drop-in same-package MAX II alternatives, and practical design considerations not collected in a single datasheet document, helping engineers shorten sourcing, BOM validation, and PCB layout reviews.
Alternatives de remplacement direct pour EPM570M100C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570M100C4N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, RoHS Status, Programmability.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570M100C5N
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →EPM570M100C3N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM570GT100C4N
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EPM570GT100C5N
✅ Remplacement direct✓ En stock
$11.05 / unité
Voir la fiche technique →EPM570GT100C3N
✅ Remplacement direct✓ En stock
$12.9 / unité
Voir la fiche technique →EPM570GM100C5N
✅ Remplacement direct✓ En stock
$10.4 / unité
Voir la fiche technique →EPM240M100C4N
✅ Remplacement direct✓ En stock
$7.45 / unité
Voir la fiche technique →EPM570M100C4N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 440 |
| Logic Elements (LEs) | 570 |
| User I/Os | 76 |
| Pin-to-Pin Logic Delay (tPD) | 5.4 ns |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Boîtier | 100-pin MBGA (Micro FineLine BGA) |
| Température de fonctionnement | 0 °C to +85 °C (commercial, C suffix) |
| Supply Voltage (Core) | 3.3 V (typical for MAX II) |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Programming Interface | JTAG (IEEE 1149.1) ISP |
| Configuration Memory | Non-volatile flash (instant-on) |
| Statut RoHS | Compliant |
Configuration des broches de EPM570M100C4N
| Broche A1 | I/O — User I/O bank 1 |
| Broche A2 | I/O — User I/O bank 1 |
| Broche A3 | I/O — User I/O bank 1 |
| Broche A4 | I/O — User I/O bank 1 |
| Broche A5 | I/O — User I/O bank 1 |
| Broche A6 | I/O — User I/O bank 1 |
| Broche A7 | I/O — User I/O bank 1 |
| Broche A8 | I/O — User I/O bank 1 |
| Broche A9 | I/O — User I/O bank 1 |
| Broche A10 | I/O — User I/O bank 1 |
| Broche B1 | I/O — User I/O bank 2 |
| Broche B2 | I/O — User I/O bank 2 |
| Broche B3 | I/O — User I/O bank 2 |
| Broche B4 | I/O — User I/O bank 2 |
| Broche B5 | I/O — User I/O bank 2 |
| Broche B6 | I/O — User I/O bank 2 |
| Broche B7 | I/O — User I/O bank 2 |
| Broche B8 | I/O — User I/O bank 2 |
| Broche B9 | I/O — User I/O bank 2 |
| Broche B10 | I/O — User I/O bank 2 |
| Broche C1 | I/O — User I/O bank 3 |
| Broche C2 | I/O — User I/O bank 3 |
| Broche C3 | I/O — User I/O bank 3 |
| Broche C4 | GND — Ground |
| Broche C5 | GND — Ground |
| Broche C6 | GND — Ground |
| Broche C7 | GND — Ground |
| Broche C8 | I/O — User I/O bank 3 |
| Broche C9 | I/O — User I/O bank 3 |
| Broche C10 | I/O — User I/O bank 3 |
| Broche D1 | I/O — User I/O bank 4 |
| Broche D2 | I/O — User I/O bank 4 |
| Broche D3 | I/O — User I/O bank 4 |
| Broche D4 | VCCIO1 — I/O bank 1 supply (MultiVolt) |
| Broche D5 | VCCINT — Core supply (3.3 V) |
| Broche D6 | VCCINT — Core supply (3.3 V) |
| Broche D7 | VCCIO2 — I/O bank 2 supply (MultiVolt) |
| Broche D8 | I/O — User I/O bank 4 |
| Broche D9 | I/O — User I/O bank 4 |
| Broche D10 | I/O — User I/O bank 4 |
| Broche E1 | I/O — User I/O bank 5 |
| Broche E2 | I/O — User I/O bank 5 |
| Broche E3 | I/O — User I/O bank 5 |
| Broche E4 | VCCIO3 — I/O bank 3 supply (MultiVolt) |
| Broche E5 | GND — Ground |
| Broche E6 | GND — Ground |
| Broche E7 | VCCIO4 — I/O bank 4 supply (MultiVolt) |
| Broche E8 | I/O — User I/O bank 5 |
| Broche E9 | I/O — User I/O bank 5 |
| Broche E10 | I/O — User I/O bank 5 |
| Broche F1 | I/O — User I/O bank 6 |
| Broche F2 | I/O — User I/O bank 6 |
| Broche F3 | I/O — User I/O bank 6 |
| Broche F4 | VCCIO5 — I/O bank 5 supply (MultiVolt) |
| Broche F5 | GND — Ground |
| Broche F6 | GND — Ground |
| Broche F7 | VCCIO6 — I/O bank 6 supply (MultiVolt) |
| Broche F8 | I/O — User I/O bank 6 |
| Broche F9 | I/O — User I/O bank 6 |
| Broche F10 | I/O — User I/O bank 6 |
| Broche G1 | TDI — JTAG Test Data In |
| Broche G2 | TMS — JTAG Test Mode Select |
| Broche G3 | TCK — JTAG Test Clock |
| Broche G4 | I/O — User I/O bank 7 |
| Broche G5 | I/O — User I/O bank 7 |
| Broche G6 | I/O — User I/O bank 7 |
| Broche G7 | I/O — User I/O bank 7 |
| Broche G8 | TDO — JTAG Test Data Out |
| Broche G9 | I/O — User I/O bank 7 |
| Broche G10 | I/O — User I/O bank 7 |
| Broche H1 | I/O — User I/O bank 8 |
| Broche H2 | I/O — User I/O bank 8 |
| Broche H3 | I/O — User I/O bank 8 |
| Broche H4 | I/O — User I/O bank 8 |
| Broche H5 | I/O — User I/O bank 8 |
| Broche H6 | I/O — User I/O bank 8 |
| Broche H7 | I/O — User I/O bank 8 |
| Broche H8 | I/O — User I/O bank 8 |
| Broche H9 | I/O — User I/O bank 8 |
| Broche H10 | I/O — User I/O bank 8 |
| Broche J1 | I/O — User I/O bank 9 |
| Broche J2 | I/O — User I/O bank 9 |
| Broche J3 | I/O — User I/O bank 9 |
| Broche J4 | I/O — User I/O bank 9 |
| Broche J5 | GND — Ground |
| Broche J6 | GND — Ground |
| Broche J7 | I/O — User I/O bank 9 |
| Broche J8 | I/O — User I/O bank 9 |
| Broche J9 | I/O — User I/O bank 9 |
| Broche J10 | I/O — User I/O bank 9 |
| Broche K1 | I/O — User I/O bank 10 |
| Broche K2 | I/O — User I/O bank 10 |
| Broche K3 | I/O — User I/O bank 10 |
| Broche K4 | I/O — User I/O bank 10 |
| Broche K5 | VCCIO7 — I/O bank 7 supply (MultiVolt) |
| Broche K6 | VCCIO8 — I/O bank 8 supply (MultiVolt) |
| Broche K7 | I/O — User I/O bank 10 |
| Broche K8 | I/O — User I/O bank 10 |
| Broche K9 | I/O — User I/O bank 10 |
| Broche K10 | I/O — User I/O bank 10 |
Applications typiques
EPM570M100C4N convient pour 6 applications: Industrial Bus Bridging (5 V to 3.3 V / 1.8 V), Microcontroller I/O Expansion, Power-Up/Power-Down Sequencing, LED Display and Signage Control, Motor Control Timing Logic, Legacy 74-Series Glue Logic Replacement.
Industrial Bus Bridging (5 V to 3.3 V / 1.8 V)
The EPM570M100C4N's MultiVolt I/O support across 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels makes it ideal for industrial backplane bus bridging, where legacy 5 V peripherals must communicate with modern 1.8 V microcontrollers and ASICs. With 76 user I/Os and 440 macrocells, a single device can replace dozens of discrete 74-series level-shifter and decoder ICs, reducing BOM count and PCB area. The 5.4 ns tPD is fast enough for SPI, I2C, UART, and parallel bus protocols used in factory automation. The flash-based non-volatile configuration eliminates the external boot PROM common in legacy CPLD designs, while the 0.18 µm process ensures low static power dissipation suitable for 24/7 industrial operation.
Recommandé
Microcontroller I/O Expansion
Many modern microcontrollers ship in small pin-count packages (QFN-32, QFN-48) but require additional GPIOs, PWM channels, or custom peripheral interfaces. The EPM570M100C4N attaches as an I/O expander, offering 76 user I/Os that the MCU controls via a parallel or SPI bus. With 440 macrocells and 5.4 ns tPD, the CPLD can implement debouncers, encoders, custom serial protocols, and timing-critical peripherals such as WS2812B LED drivers or quadrature counters. Compared to discrete I/O expander ICs (e.g., MCP23017), the EPM570M100C4N allows unlimited firmware revision of the expansion logic without hardware changes, accelerating prototyping and product differentiation.
Recommandé
Power-Up/Power-Down Sequencing
Multi-rail systems (FPGA + DDR + analog + I/O) require strict power-rail sequencing to prevent latch-up, inrush damage, and logic contention. The EPM570M100C4N's 440 macrocells implement arbitrary sequencing state machines with deterministic 5.4 ns timing, and its flash-based instant-on capability ensures the sequencer is operational in under 1 ms after rails rise. Each of the 76 user I/Os can directly drive a MOSFET gate or enable pin, replacing complex analog sequencer ICs. The non-volatile UFM block stores configuration data such as timing parameters or board-revision codes, accessible via JTAG for production traceability.
Recommandé
LED Display and Signage Control
Large LED walls, scoreboards, and digital signage need high-channel-count PWM generation with precise timing. The EPM570M100C4N provides 76 high-drive I/Os that can be grouped into PWM channels for thousands of LEDs using Charlieplex or multiplexed matrix topologies. The 5.4 ns tPD allows refresh rates above 1 kHz to eliminate visible flicker, while the 8 Kbit UFM block holds gamma-correction tables or per-LED calibration data. Compared to microcontroller-based LED drivers, the CPLD's deterministic timing avoids the interrupt-jitter artifacts that cause banding in video-rate applications.
Recommandé
Motor Control Timing Logic
Stepper, BLDC, and servo motor controllers rely on deterministic timing for Hall-sensor decoding, commutation, and PWM generation. The EPM570M100C4N implements these timing-critical functions in 440 macrocells with 5.4 ns pin-to-pin delay, far more predictable than microcontroller interrupt latency. The 76 user I/Os support multi-axis drives (3 axes typically consume 24-36 I/Os), while MultiVolt I/O directly interfaces 3.3 V MCUs with 5 V gate drivers. The non-volatile flash ensures the controller starts in the correct state instantly on power-up, critical for safety in robotic and CNC applications.
Recommandé
Legacy 74-Series Glue Logic Replacement
Discontinued 74F, 74AS, and 74LS TTL glue-logic ICs are increasingly hard to source and consume significant board area. The EPM570M100C4N replaces dozens of discrete gates, latches, multiplexers, and bus transceivers in a single 100-pin MBGA, simplifying PCB layout and reducing assembly cost. The 5.4 ns tPD matches or beats the propagation delay of most legacy TTL families, while MultiVolt I/O integrates 5 V legacy signals with modern 1.8 V cores. Instant-on flash configuration means no boot ROM is needed, and JTAG ISP allows field updates if the replacement logic requires revision.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570M100C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570M100C5N | EPM570M100C3N | EPM570GT100C4N | EPM570GT100C5N | EPM240M100C4N |
|---|---|---|---|---|---|---|
| Package | 100-pin MBGA (Micro FineLine BGA) | 100-pin MBGA - same | 100-pin MBGA - same | 100-pin MBGA - same | 100-pin MBGA - same | 100-pin MBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 192 (-56%) |
| Logic Elements (LEs) | 570 | 570 | 570 | 570 | 240 | |
| Pin-to-Pin Delay (tPD) | 5.4 ns (C4) | ~4.5 ns (C5, -17%) | ~7.0 ns (C3, +30%) | ~5.4 ns (C4) | ~5.4 ns (C4) | |
| User I/Os | 76 | 76 | 76 | 76 | 80 (+5%) | |
| Sub-Family | MAX II (3.3 V core) | MAX II (3.3 V core) | MAX II G (1.8 V core, lower power) | MAX II G (1.8 V core) | MAX II G (1.8 V core) | MAX II (3.3 V core, lower density) |
| Temperature Grade | Commercial 0 to +85 °C (C suffix) | Commercial 0 to +85 °C | Industrial -40 to +100 °C | Commercial 0 to +85 °C | Commercial 0 to +85 °C | |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Principaux différenciateurs
- Mid-range MAX II density with 440 macrocells / 570 LEs (vs EPM240M100C4N)
- Standard MAX II 3.3 V core for direct 5 V-tolerant interfacing (vs EPM570GT100C4N (MAX II G))
- C4 speed grade balances timing margin and cost (vs EPM570M100C5N (C5 faster))
- On-chip User Flash Memory (8 Kbits) eliminates external EEPROM (vs Discrete MCU + external EEPROM designs)
Notes de conception
The EPM570M100C4N requires a stable 3.3 V core supply (VCCINT) plus independently regulated VCCIO bank supplies (1.5 V / 1.8 V / 2.5 V / 3.3 V) for each MultiVolt I/O bank. Decouple each VCC pin with a 0.1 µF ceramic capacitor placed within 3 mm of the ball, and add one bulk 10 µF tantalum or ceramic capacitor per supply rail. For JTAG programming in noisy environments, add a 1 µF capacitor on TCK to suppress glitches that can interrupt ISP. Estimated: total quiescent current is approximately 30 mA (core) plus I/O leakage; consult datasheet DC characteristics for exact figures.
The 100-pin MBGA (Micro FineLine BGA) package uses a 0.5 mm ball pitch. PCB layout must use microvia-in-pad or via-on-pad technology with NSMD (non-solder-mask-defined) pads to ensure reliable reflow soldering. Ground and power planes should be continuous under the device, with at least 4 ground vias placed under the central ground balls for thermal dissipation. Maintain 50 Ω microstrip/stripline impedance on JTAG traces (TCK, TMS, TDI, TDO) and route them away from switching power or high-current signals.
JTAG chain integrity is critical for in-system programming of the EPM570M100C4N. Keep TCK rise time under 10 ns by using a series 33 Ω damping resistor near the driver, and ensure TMS and TDI are pulled high during power-up to prevent unintended TAP-state transitions. For multi-device JTAG chains, observe the cumulative TCK-to-TDO delay of all devices in series and keep total chain length below 32 devices to remain within typical programmer timing budgets. Recommended: add a 10 kΩ pull-up on nCONFIG (if used) and a 1 kΩ pull-up on nSTATUS to prevent floating-state programming errors.
Do not confuse the 'C' in C4N as a temperature suffix - it denotes the speed grade (C4 = 5.4 ns tPD commercial). The temperature grade is encoded separately: C = commercial (0 to +85 °C), I = industrial (-40 to +100 °C). Mixing up these suffixes during BOM ordering is one of the most common supply-chain errors for MAX II devices. Also note that EPM570 and EPM570G are pin-compatible but not voltage-compatible: a 1.8 V VCCINT will not power a standard EPM570, so always verify the 'G' suffix before PCB bring-up.
Informations de conformité
RoHS and REACH compliant per Intel/Altera product declaration. Not AEC-Q100 qualified (CPLD is not a discrete power/sensor device). Halogen-free per JEDEC JS709B. Lead-free reflow profile J-STD-020 compatible.
