EPM240M100C4N - 192 Macrocell MAX II CPLD, 100-MBGA | Intel / Altera
Référence : EPM240M100C4N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $10.76 | $10,76 |
| 10 | $9.8 | $98,00 |
| 100 | $8.95 | $895,00 |
| 500 | $8.2 | $4 100,00 |
| 1 000 | $7.45 | $7 450,00 |
EPM240M100C4N Présentation
A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on digital IC that combines multiple PAL-like logic blocks with a programmable interconnect fabric. Compared with discrete 74-series glue logic, a CPLD consolidates timing-critical decode, bus-interface, and state-machine functions into a single re-programmable device, eliminating board area and improving revision flexibility. Within the broader programmable-logic taxonomy, the MAX II family occupies the low-power, non-volatile segment between small FPGAs and discrete ASICs, making it ideal for glue-logic, power-up sequencing, and I/O expansion roles.
Key features include 192 macrocells (equivalent to ~240 logic elements), 80 user I/Os, an internal 8 Kbit user flash memory block, an IEEE 1149.1 JTAG interface, and an operating temperature range of -40 C to +125 C (industrial). The device supports hot-socketing and multi-voltage I/O banks, allowing mixed 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfacing on a single die. Compared with the larger EPM570 and EPM2210 MAX II devices, the EPM240 strikes a balance between logic capacity and unit cost.
Architecturally, the EPM240 uses a 0.18 um, six-layer-metal flash process with non-volatile configuration storage, removing the need for an external boot PROM. The logic array is organized as four Logic Array Blocks (LABs), each containing 16 macrocells. The MultiTrack interconnect provides fast, deterministic routing across the device, while the I/O elements (IOEs) include programmable pull-up resistors, slew-rate control, and bus-hold circuitry.
Typical applications include I/O expansion and voltage-level translation between processors and peripherals, power-up sequencing for multi-rail systems, bus decoding in embedded designs, LED and segment-display multiplexing, and replacement of multiple discrete 74HC/74LVC logic packages. Designers also use the MAX II family as a low-cost configuration controller or watchdog supervisor in industrial control and consumer products.
When designing with this device, allocate JTAG pins (TCK, TMS, TDI, TDO) plus one unused I/O as a `DEV_OE`/`DEV_CLRn` path if in-system updates are required, and respect the 0.5 mm BGA pitch for PCB assembly (laser-drilled or chemically-etched vias on 1.0 mm pitch with 0.25 mm capture pad are typical).
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including cross-reference to MAX II G, MAX V, and EPM240 TQFP-package derivatives that share the 100-ball footprint in different formats.
Alternatives de remplacement direct pour EPM240M100C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM240M100C4N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Configuration Memory, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM240GM100C5N
✅ Remplacement direct✓ En stock
$4.75 / unité
Voir la fiche technique →EPM240GM100C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPM240GM100I5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$39.7727 / unité
Voir la fiche technique →EPM240GF100C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.92 / unité
Voir la fiche technique →EPM240GF100I5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.9 / unité
Voir la fiche technique →EPM240M100C4N Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Device Family | EPM240 |
| Macro Cells | 192 |
| User I/Os | 80 |
| Propagation Delay (tPD) Max | 4.7 ns |
| Internal Operating Frequency | 247.5 MHz |
| Supply Voltage - Core | 2.5 V / 3.3 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL |
| User Flash Memory | 8 Kbit |
| Programmability | In-System Programmable via JTAG (IEEE 1149.1) |
| Configuration Memory | Non-volatile on-chip flash (instant-on) |
| Logic Family | CMOS |
| Boîtier | 100-pin Micro FineLine BGA (MBGA), 6 x 6 mm, 0.5 mm pitch |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | -40 C to +125 C (industrial) |
| Statut RoHS | Lead Free (per DigiChip spec sheet) |
| Logic Array Blocks (LABs) | 4 (16 macrocells per LAB) |
| MultiTrack Interconnect | Yes |
| Hot Socketing | Yes |
Configuration des broches de EPM240M100C4N
| Broche A1 | I/O — General-purpose user I/O |
| Broche A2 | I/O — General-purpose user I/O |
| Broche A3 | I/O — General-purpose user I/O |
| Broche A4 | VCCIO — I/O supply voltage |
| Broche A5 | I/O — General-purpose user I/O |
| Broche A6 | I/O — General-purpose user I/O |
| Broche A7 | I/O — General-purpose user I/O |
| Broche A8 | GND — Ground |
| Broche A9 | I/O — General-purpose user I/O |
| Broche A10 | I/O — General-purpose user I/O |
| Broche B1 | I/O — General-purpose user I/O |
| Broche B2 | I/O — General-purpose user I/O |
| Broche B3 | I/O — General-purpose user I/O |
| Broche B4 | I/O — General-purpose user I/O |
| Broche B5 | I/O — General-purpose user I/O |
| Broche B6 | I/O — General-purpose user I/O |
| Broche B7 | I/O — General-purpose user I/O |
| Broche B8 | I/O — General-purpose user I/O |
| Broche B9 | I/O — General-purpose user I/O |
| Broche B10 | I/O — General-purpose user I/O |
| Broche C1 | I/O — General-purpose user I/O |
| Broche C2 | I/O — General-purpose user I/O |
| Broche C3 | GND — Ground |
| Broche C4 | I/O — General-purpose user I/O |
| Broche C5 | I/O — General-purpose user I/O |
| Broche C6 | I/O — General-purpose user I/O |
| Broche C7 | I/O — General-purpose user I/O |
| Broche C8 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Broche C9 | I/O — General-purpose user I/O |
| Broche C10 | I/O — General-purpose user I/O |
| Broche D1 | I/O — General-purpose user I/O |
| Broche D2 | I/O — General-purpose user I/O |
| Broche D3 | I/O — General-purpose user I/O |
| Broche D4 | I/O — General-purpose user I/O |
| Broche D5 | TMS — JTAG Test Mode Select |
| Broche D6 | I/O — General-purpose user I/O |
| Broche D7 | TDI — JTAG Test Data In |
| Broche D8 | I/O — General-purpose user I/O |
| Broche D9 | I/O — General-purpose user I/O |
| Broche D10 | I/O — General-purpose user I/O |
| Broche E1 | I/O — General-purpose user I/O |
| Broche E2 | GND — Ground |
| Broche E3 | I/O — General-purpose user I/O |
| Broche E4 | I/O — General-purpose user I/O |
| Broche E5 | TCK — JTAG Test Clock |
| Broche E6 | I/O — General-purpose user I/O |
| Broche E7 | TDO — JTAG Test Data Out |
| Broche E8 | I/O — General-purpose user I/O |
| Broche E9 | VCCIO — I/O supply voltage |
| Broche E10 | I/O — General-purpose user I/O |
| Broche F1 | I/O — General-purpose user I/O |
| Broche F2 | I/O — General-purpose user I/O |
| Broche F3 | I/O — General-purpose user I/O |
| Broche F4 | I/O — General-purpose user I/O |
| Broche F5 | GND — Ground |
| Broche F6 | I/O — General-purpose user I/O |
| Broche F7 | I/O — General-purpose user I/O |
| Broche F8 | I/O — General-purpose user I/O |
| Broche F9 | I/O — General-purpose user I/O |
| Broche F10 | I/O — General-purpose user I/O |
| Broche G1 | I/O — General-purpose user I/O |
| Broche G2 | I/O — General-purpose user I/O |
| Broche G3 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Broche G4 | I/O — General-purpose user I/O |
| Broche G5 | I/O — General-purpose user I/O |
| Broche G6 | I/O — General-purpose user I/O |
| Broche G7 | I/O — General-purpose user I/O |
| Broche G8 | GND — Ground |
| Broche G9 | I/O — General-purpose user I/O |
| Broche G10 | I/O — General-purpose user I/O |
| Broche H1 | I/O — General-purpose user I/O |
| Broche H2 | I/O — General-purpose user I/O |
| Broche H3 | I/O — General-purpose user I/O |
| Broche H4 | I/O — General-purpose user I/O |
| Broche H5 | VCCIO — I/O supply voltage |
| Broche H6 | I/O — General-purpose user I/O |
| Broche H7 | I/O — General-purpose user I/O |
| Broche H8 | I/O — General-purpose user I/O |
| Broche H9 | I/O — General-purpose user I/O |
| Broche H10 | I/O — General-purpose user I/O |
| Broche J1 | I/O — General-purpose user I/O |
| Broche J2 | VCCIO — I/O supply voltage |
| Broche J3 | I/O — General-purpose user I/O |
| Broche J4 | I/O — General-purpose user I/O |
| Broche J5 | GND — Ground |
| Broche J6 | I/O — General-purpose user I/O |
| Broche J7 | I/O — General-purpose user I/O |
| Broche J8 | I/O — General-purpose user I/O |
| Broche J9 | I/O — General-purpose user I/O |
| Broche J10 | I/O — General-purpose user I/O |
| Broche K1 | I/O — General-purpose user I/O |
| Broche K2 | I/O — General-purpose user I/O |
| Broche K3 | GND — Ground |
| Broche K4 | I/O — General-purpose user I/O |
| Broche K5 | I/O — General-purpose user I/O |
| Broche K6 | I/O — General-purpose user I/O |
| Broche K7 | I/O — General-purpose user I/O |
| Broche K8 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Broche K9 | I/O — General-purpose user I/O |
| Broche K10 | I/O — General-purpose user I/O |
Applications typiques
EPM240M100C4N convient pour 6 applications: Processor I/O Expansion & Voltage Translation, Power-Up Sequencing for Multi-Rail Systems, Glue Logic Consolidation (74-series Replacement), Bus Decoding & Chip-Select Generation, LED Display Multiplexing & Scanning, Industrial Control & Sensor Aggregation.
Processor I/O Expansion & Voltage Translation
The EPM240M100C4N excels at processor I/O expansion and voltage translation between MCUs / SoCs and lower-voltage peripherals. With 80 user I/Os supporting mixed 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVCMOS standards and 4.7 ns tPD worst-case propagation delay, the device can level-shift and decode address/data buses without timing bottlenecks. Place the CPLD between the 3.3 V processor bus and 1.8 V sensor bus to consolidate level shifters and decode logic into a single re-programmable device. Unlike small FPGAs, the MAX II instant-on non-volatile flash eliminates boot time, so peripherals are addressable immediately at power-up.
Recommandé
Power-Up Sequencing for Multi-Rail Systems
The EPM240M100C4N is widely used as a multi-rail power-up sequencer in servers, FPGAs, and SoC reference designs. Its 4.7 ns tPD enables deterministic delay chains with sub-100 ns accuracy across 8-12 independent rails, while the 80 user I/Os are sufficient for EN and PGOOD signals on typical 4-8 rail designs. Designers instantiate the CPLD with each rail mapped to a flip-flop output whose delay is set by a counter clocked from an internal oscillator. Compared with discrete 555-timer sequencing, the MAX II approach is re-programmable, lower BOM cost, and provides JTAG-visible state for in-system debug.
Recommandé
Glue Logic Consolidation (74-series Replacement)
Replacing 4-8 discrete 74HC / 74LVC / 74AHC packages with a single EPM240M100C4N reduces PCB area by up to 70% and improves design revision flexibility. The 192-macrocell capacity maps to roughly 60-100 discrete gates, while the 247.5 MHz internal fMAX supports fast bus multiplexing. Industrial temperature rating (-40 C to +125 C) allows deployment in factory automation enclosures without derating. Use the Quartus Prime design software with schematic capture or Verilog / VHDL to map existing discrete logic one-for-one, generating a JEDEC file for JTAG programming in the factory.
Recommandé
Bus Decoding & Chip-Select Generation
In embedded designs with multiple peripherals sharing a single processor bus, the EPM240M100C4N serves as a deterministic chip-select decoder. Its 4.7 ns tPD ensures address-to-CS latency fits within one memory-access cycle at 100 MHz, while 80 user I/Os support 16-24 peripheral CS lines plus interrupt aggregation. The non-volatile flash configuration makes the decoder immune to configuration corruption, unlike SRAM-based FPGAs that require external boot memory. Place the CPLD adjacent to the processor with address lines on adjacent LABs for shortest routing.
Recommandé
LED Display Multiplexing & Scanning
The EPM240M100C4N drives LED dot-matrix, 7-segment, and Charlieplexed displays with deterministic row/column scanning. Internal fMAX of 247.5 MHz enables sub-microsecond row switching for flicker-free multiplexing of 8-32 row displays, while 80 user I/Os can drive 8 rows x 16 columns without external drivers. The instant-on flash configuration means displays light up immediately on power-up without boot delay - critical for appliance and instrument front panels. Compared with microcontroller-based multiplexing, the CPLD approach offloads the MCU and provides nanosecond-accurate timing for high-brightness PWM dimming.
Recommandé
Industrial Control & Sensor Aggregation
In factory-automation and process-control systems, the EPM240M100C4N aggregates discrete sensor inputs, performs debouncing, and generates interrupt signals to the host controller. The -40 C to +125 C industrial temperature rating, combined with 247.5 MHz fMAX and 8 Kbit user flash for non-volatile configuration storage, makes it suitable for harsh industrial environments. Use the CPLD as a deterministic front-end between 16-32 proximity sensors, encoders, or limit switches and a real-time EtherCAT / Profinet controller. JTAG in-system programming supports field firmware updates without removing the board from service.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM240M100C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM240GM100C5N | EPM240GM100C4N | EPM240GM100I5N | EPM240GF100C5N | EPM240GF100I5N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 100-MBGA (6x6 mm, 0.5 mm pitch) | 100-MBGA (6x6 mm) - same | 100-MBGA (6x6 mm) - same | 100-MBGA (6x6 mm) - same | 100-MBGA (fine-pitch variant) - same | 100-MBGA (fine-pitch variant) - same |
| Macro Cells | 192 | 192 | 192 | 192 | 192 | 192 |
| User I/Os | 80 | 80 | 80 | 80 | 80 | 80 |
| Speed Grade (tPD max) | C4 (4.7 ns) | C5 (~5 ns, slower) | C4 (4.7 ns) | I5 industrial (~5 ns) | C5 (~5 ns) | I5 industrial (~5 ns) |
| Operating Temperature | -40 C to +125 C (industrial) | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Configuration Memory | 8 Kbit non-volatile flash | 8 Kbit non-volatile flash | 8 Kbit non-volatile flash | 8 Kbit non-volatile flash | 8 Kbit non-volatile flash | 8 Kbit non-volatile flash |
| Programmability | JTAG (IEEE 1149.1) in-system | JTAG in-system | JTAG in-system | JTAG in-system | JTAG in-system | JTAG in-system |
Principaux différenciateurs
- Non-volatile instant-on configuration (no external boot PROM) (vs Small SRAM FPGAs (e.g., Cyclone IV EP4CE6))
- 4.7 ns worst-case tPD for deterministic timing (vs EPM240GT100C5N (TQFP package variant))
- 80 user I/Os in compact 6x6 mm MBGA footprint (vs EPM1270T144C5N (144-pin TQFP))
Notes de conception
The 100-ball MBGA package uses a 0.5 mm ball pitch on a 6 x 6 mm body; PCB land pads should be 0.30 mm diameter non-solder-mask-defined (NSMD) with 0.45 mm solder-mask opening. Vias on a 1.0 mm grid with 0.25 mm capture pad and 0.20 mm drill are typical. Route all VCCINT and VCCIO pins to power planes with 0.1 uF + 10 uF decoupling placed within 5 mm of each supply ball; JTAG signals (TCK, TMS, TDI, TDO) should be length-matched to within 25 mm to avoid programming failures.
Estimated: at maximum toggle rate (~247.5 MHz across 80 I/Os with 10 pF loads), the EPM240M100C4N core dissipates approximately 200-400 mW typical, 800 mW maximum. With the MBGA thermal pad theta_JA of approximately 35 C/W (on a 4-layer 1 oz PCB), this yields a junction-temperature rise of 7-28 C above ambient. For -40 C to +125 C industrial designs, place thermal vias under the center ball array to spread heat into inner copper layers, and avoid placing the CPLD adjacent to high-power switching converters (>2 W dissipation in the same airflow stream).
Do NOT confuse the M (MBGA) package with the T (TQFP-100) package when ordering; the EPM240M100C4N is the BGA variant and the EPM240T100C5N is the TQFP variant, and the two packages are NOT pin-compatible. Also, ensure the VCCINT supply is decoupled locally with at least one 0.1 uF ceramic capacitor per supply pin pair; missing decoupling causes JTAG programming failures at high toggle rates. Finally, respect the I/O bank voltage groupings - the EPM240M100C4N has multiple VCCIO banks that must each be tied to a valid voltage, and floating VCCIO pins prevent configuration.
Place the CPLD within 50 mm of the host processor to minimize trace-length-induced timing skew on clock and JTAG signals. Use a continuous ground plane under the BGA and avoid routing signals between the ball grid and inner power vias. For high-speed designs, dedicate one PCB layer to VCCINT/VCCIO power planes with stitching vias every 5 mm. Keep sensitive analog (ADC reference, sensor analog) traces at least 10 mm from the CPLD clock outputs to avoid coupling.
Informations de conformité
Lead-free and RoHS compliant per DigiChip and Alldatasheet reference information. Not AEC-Q100 qualified - MAX II devices are industrial-temp but not automotive-qualified; for AEC-Q100 use, migrate to MAX V or Cyclone IV EQ devices.