Intel

EPM570M100C4N - 440 Macrocells MAX II CPLD, 5.4ns | Intel

부품 번호: EPM570M100C4N ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
3.3 V (typical for MAX II) Vdss 100-pin MBGA (Micro FineLine BGA) Package 8 Kbits Memory
시작가 $14.95 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-12
볼륨 가격
수량 단가 합계
1 $23.59 $23.59
10 $21.2 $212.00
100 $18.5 $1,850.00
500 $16.4 $8,200.00
1,000 $14.95 $14,950.00
ℹ️ 모든 가격은 USD 기준입니다

EPM570M100C4N 개요

The Intel (formerly Altera) EPM570M100C4N is a MAX II family CPLD (Complex Programmable Logic Device) with 440 macrocells and 76 user I/Os, fabricated on a 0.18 µm, 6-layer-metal flash process. It features a 5.4 ns pin-to-pin logic delay and is housed in a 100-pin MBGA (Micro FineLine BGA) package with non-volatile on-chip flash configuration memory of 8 Kbits. The device supports instant-on, in-system programmability (ISP) and MultiVolt core operation across multiple I/O standards.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple PAL/GAL devices and large FPGAs in the programmable logic hierarchy. CPLDs typically contain multiple macrocell logic blocks with a centralized interconnect fabric, providing deterministic timing, instant-on behavior (no boot loader required), and high-drive I/O. The MAX II family, of which the EPM570M100C4N is a member, is widely used for I/O expansion, bus bridging, power-up sequencing, and glue-logic replacement in cost-sensitive industrial, consumer, and communications designs.

The EPM570M100C4N integrates 440 macrocells, equivalent to 570 logic elements (LEs), and includes an embedded User Flash Memory (UFM) block of 8 Kbits for storing non-logic data such as serial numbers, calibration tables, or boot parameters. MultiVolt core support allows the device to interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels without external level shifters. Enhanced in-system programmability via JTAG (IEEE 1149.1) enables field upgrades without removing the part from the board.

Architecturally, the EPM570M100C4N uses a flash-based, non-volatile configuration cell that eliminates the need for an external boot PROM and provides instant-on operation in under 1 ms. The LAB (Logic Array Block) structure combined with a global routing pool delivers predictable, deterministic timing critical for asynchronous interface glue logic. Compared to the older MAX 7000 series, MAX II offers roughly 10x lower static power, higher logic density, and a smaller footprint in equivalent BGA packages.

Typical applications for the EPM570M100C4N include 5 V to 3.3 V / 1.8 V bus bridging in legacy industrial backplanes, I/O expansion for microcontrollers and microprocessors that lack sufficient pins, power-up/power-down sequencing for multi-rail systems, LED driving and display control, motor-control timing logic, JTAG-based board-level configuration, and replacement of discrete 74-series glue logic in cost-sensitive designs.

When designing with this device, observe the recommended decoupling scheme of 0.1 µF and 10 µF capacitors placed within 3 mm of each VCC pin and ensure the JTAG chain respects the device's TCK frequency limits. The 100-pin MBGA package requires PCB pads with proper microvia or via-in-pad technology for reliable assembly and reflow.

This page synthesizes real-time distributor pricing, drop-in same-package MAX II alternatives, and practical design considerations not collected in a single datasheet document, helping engineers shorten sourcing, BOM validation, and PCB layout reviews.

드롭인 대체품: EPM570M100C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EPM570M100C4N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, RoHS Status, Programmability.

Intel
Operating Temperature: -40 C to +125 C (industrial)
Package: 100-pin Micro FineLine BGA (MBGA), 6 x 6 mm, 0.5 mm pitch
RoHS Status: Lead Free (per DigiChip spec sheet)
비교 대상: EPM570M100C4N →
Intel
Operating Temperature: -40C to +125C (industrial)
비교 대상: EPM570M100C4N →
Altera
Operating Temperature: 0C to 85C (TJ, commercial)
Package: 100-pin TQFP (14x14 mm)
Process Technology: 0.18 um
비교 대상: EPM570M100C4N →
Altera
Operating Temperature: Commercial (0C to +85C)
Package: TQFP-100 (11 x 11 mm, 0.5 mm pitch)
비교 대상: EPM570M100C4N →
Intel
Operating Temperature: 0C to +85C (Commercial)
Package: TQFP-100
Programmability: Flash-based, non-volatile (ISP via JTAG)
비교 대상: EPM570M100C4N →
Intel
Package: 100-MBGA (FineLine BGA, 6 x 6 mm, 0.5 mm pitch)
Process Technology: 0.18 um, 6-layer-metal flash
RoHS Status: Lead-Free / Compliant
비교 대상: EPM570M100C4N →
Intel
Operating Temperature: -40 °C to +100 °C (I5 grade)
Package: 100-ball Micro FBGA (MBGA), 6 mm x 6 mm
Process Technology: 0.18 µm flash
비교 대상: EPM570M100C4N →
Intel
Operating Temperature: -40°C to +100°C (I5 grade)
Process Technology: 0.18 µm CMOS
Programmability: In-System via JTAG (IEEE 1149.1), non-volatile
비교 대상: EPM570M100C4N →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EPM570M100C5N

✅ 드롭인
Intel
📦 100-pin MBGA
MAX II · EPM570 · CPLD (Complex Programmable Logic Device) · 440 · 570 · 76 · 100

✓ 재고 있음

$11.85 / 개

데이터시트 보기 →

EPM570M100C3N

✅ 드롭인
📦 100-pin MBGA
same 100-pin MBGA footprint, slower tPD (~7.0 ns vs 5.4 ns, +30%), pin-to-pin compatible

📋 참조 대체품 (카탈로그에 없음)

EPM570GT100C4N

✅ 드롭인
Altera
📦 100-pin MBGA
570 · 440 · 76 · 8 Kbits · 1.8 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V · TQFP-100 (11 x 11 mm, 0.5 mm pitch) · C4 (-4)

✓ 재고 있음

$9.85 / 개

데이터시트 보기 →

EPM570GT100C5N

✅ 드롭인
Intel
📦 100-pin MBGA
MAX II · 570 · 440 · 76 · 36 · 304 MHz · 8 Kbit

✓ 재고 있음

$11.05 / 개

데이터시트 보기 →

EPM570GT100C3N

✅ 드롭인
Altera
📦 100-pin MBGA
MAX II · MAX II G (Green) · 570 · 440 · 76 · 8 Kbits · 5.4 ns · 1.71 V to 1.89 V (1.8 V typical)

✓ 재고 있음

$12.9 / 개

데이터시트 보기 →

EPM570GM100C5N

✅ 드롭인
Intel
📦 100-pin MBGA
MAX II · CPLD (Complex Programmable Logic Device) · 440 · 76 · 440 · 100 · Micro FBGA-100 (MBGA), 6 x 6 mm, 0.5 mm pitch · 5.4 ns

✓ 재고 있음

$10.4 / 개

데이터시트 보기 →

EPM240M100C4N

✅ 드롭인
Intel
📦 100-pin MBGA
MAX II · EPM240 · 192 · 80 · 4.7 ns · 247.5 MHz · 2.5 V / 3.3 V · 1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL

✓ 재고 있음

$7.45 / 개

데이터시트 보기 →

EPM570M100C4N 최대 정격 & 전기적 특성

Family MAX II
Device Type CPLD (Complex Programmable Logic Device)
Macrocells 440
Logic Elements (LEs) 570
User I/Os 76
Pin-to-Pin Logic Delay (tPD) 5.4 ns
User Flash Memory (UFM) 8 Kbits
Process Technology 0.18 µm 6-layer-metal flash
패키지 100-pin MBGA (Micro FineLine BGA)
동작 온도 0 °C to +85 °C (commercial, C suffix)
Supply Voltage (Core) 3.3 V (typical for MAX II)
MultiVolt I/O Support 1.5 V / 1.8 V / 2.5 V / 3.3 V
Programming Interface JTAG (IEEE 1149.1) ISP
Configuration Memory Non-volatile flash (instant-on)
RoHS 상태 Compliant

EPM570M100C4N 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 A1 I/O — User I/O bank 1
핀 A2 I/O — User I/O bank 1
핀 A3 I/O — User I/O bank 1
핀 A4 I/O — User I/O bank 1
핀 A5 I/O — User I/O bank 1
핀 A6 I/O — User I/O bank 1
핀 A7 I/O — User I/O bank 1
핀 A8 I/O — User I/O bank 1
핀 A9 I/O — User I/O bank 1
핀 A10 I/O — User I/O bank 1
핀 B1 I/O — User I/O bank 2
핀 B2 I/O — User I/O bank 2
핀 B3 I/O — User I/O bank 2
핀 B4 I/O — User I/O bank 2
핀 B5 I/O — User I/O bank 2
핀 B6 I/O — User I/O bank 2
핀 B7 I/O — User I/O bank 2
핀 B8 I/O — User I/O bank 2
핀 B9 I/O — User I/O bank 2
핀 B10 I/O — User I/O bank 2
핀 C1 I/O — User I/O bank 3
핀 C2 I/O — User I/O bank 3
핀 C3 I/O — User I/O bank 3
핀 C4 GND — Ground
핀 C5 GND — Ground
핀 C6 GND — Ground
핀 C7 GND — Ground
핀 C8 I/O — User I/O bank 3
핀 C9 I/O — User I/O bank 3
핀 C10 I/O — User I/O bank 3
핀 D1 I/O — User I/O bank 4
핀 D2 I/O — User I/O bank 4
핀 D3 I/O — User I/O bank 4
핀 D4 VCCIO1 — I/O bank 1 supply (MultiVolt)
핀 D5 VCCINT — Core supply (3.3 V)
핀 D6 VCCINT — Core supply (3.3 V)
핀 D7 VCCIO2 — I/O bank 2 supply (MultiVolt)
핀 D8 I/O — User I/O bank 4
핀 D9 I/O — User I/O bank 4
핀 D10 I/O — User I/O bank 4
핀 E1 I/O — User I/O bank 5
핀 E2 I/O — User I/O bank 5
핀 E3 I/O — User I/O bank 5
핀 E4 VCCIO3 — I/O bank 3 supply (MultiVolt)
핀 E5 GND — Ground
핀 E6 GND — Ground
핀 E7 VCCIO4 — I/O bank 4 supply (MultiVolt)
핀 E8 I/O — User I/O bank 5
핀 E9 I/O — User I/O bank 5
핀 E10 I/O — User I/O bank 5
핀 F1 I/O — User I/O bank 6
핀 F2 I/O — User I/O bank 6
핀 F3 I/O — User I/O bank 6
핀 F4 VCCIO5 — I/O bank 5 supply (MultiVolt)
핀 F5 GND — Ground
핀 F6 GND — Ground
핀 F7 VCCIO6 — I/O bank 6 supply (MultiVolt)
핀 F8 I/O — User I/O bank 6
핀 F9 I/O — User I/O bank 6
핀 F10 I/O — User I/O bank 6
핀 G1 TDI — JTAG Test Data In
핀 G2 TMS — JTAG Test Mode Select
핀 G3 TCK — JTAG Test Clock
핀 G4 I/O — User I/O bank 7
핀 G5 I/O — User I/O bank 7
핀 G6 I/O — User I/O bank 7
핀 G7 I/O — User I/O bank 7
핀 G8 TDO — JTAG Test Data Out
핀 G9 I/O — User I/O bank 7
핀 G10 I/O — User I/O bank 7
핀 H1 I/O — User I/O bank 8
핀 H2 I/O — User I/O bank 8
핀 H3 I/O — User I/O bank 8
핀 H4 I/O — User I/O bank 8
핀 H5 I/O — User I/O bank 8
핀 H6 I/O — User I/O bank 8
핀 H7 I/O — User I/O bank 8
핀 H8 I/O — User I/O bank 8
핀 H9 I/O — User I/O bank 8
핀 H10 I/O — User I/O bank 8
핀 J1 I/O — User I/O bank 9
핀 J2 I/O — User I/O bank 9
핀 J3 I/O — User I/O bank 9
핀 J4 I/O — User I/O bank 9
핀 J5 GND — Ground
핀 J6 GND — Ground
핀 J7 I/O — User I/O bank 9
핀 J8 I/O — User I/O bank 9
핀 J9 I/O — User I/O bank 9
핀 J10 I/O — User I/O bank 9
핀 K1 I/O — User I/O bank 10
핀 K2 I/O — User I/O bank 10
핀 K3 I/O — User I/O bank 10
핀 K4 I/O — User I/O bank 10
핀 K5 VCCIO7 — I/O bank 7 supply (MultiVolt)
핀 K6 VCCIO8 — I/O bank 8 supply (MultiVolt)
핀 K7 I/O — User I/O bank 10
핀 K8 I/O — User I/O bank 10
핀 K9 I/O — User I/O bank 10
핀 K10 I/O — User I/O bank 10

일반적인 애플리케이션

EPM570M100C4N 적합 용도: 6 애플리케이션s: Industrial Bus Bridging (5 V to 3.3 V / 1.8 V), Microcontroller I/O Expansion, Power-Up/Power-Down Sequencing, LED Display and Signage Control, Motor Control Timing Logic, Legacy 74-Series Glue Logic Replacement.

🏭

Industrial Bus Bridging (5 V to 3.3 V / 1.8 V)

The EPM570M100C4N's MultiVolt I/O support across 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels makes it ideal for industrial backplane bus bridging, where legacy 5 V peripherals must communicate with modern 1.8 V microcontrollers and ASICs. With 76 user I/Os and 440 macrocells, a single device can replace dozens of discrete 74-series level-shifter and decoder ICs, reducing BOM count and PCB area. The 5.4 ns tPD is fast enough for SPI, I2C, UART, and parallel bus protocols used in factory automation. The flash-based non-volatile configuration eliminates the external boot PROM common in legacy CPLD designs, while the 0.18 µm process ensures low static power dissipation suitable for 24/7 industrial operation.

🔧

Microcontroller I/O Expansion

Many modern microcontrollers ship in small pin-count packages (QFN-32, QFN-48) but require additional GPIOs, PWM channels, or custom peripheral interfaces. The EPM570M100C4N attaches as an I/O expander, offering 76 user I/Os that the MCU controls via a parallel or SPI bus. With 440 macrocells and 5.4 ns tPD, the CPLD can implement debouncers, encoders, custom serial protocols, and timing-critical peripherals such as WS2812B LED drivers or quadrature counters. Compared to discrete I/O expander ICs (e.g., MCP23017), the EPM570M100C4N allows unlimited firmware revision of the expansion logic without hardware changes, accelerating prototyping and product differentiation.

⚡

Power-Up/Power-Down Sequencing

Multi-rail systems (FPGA + DDR + analog + I/O) require strict power-rail sequencing to prevent latch-up, inrush damage, and logic contention. The EPM570M100C4N's 440 macrocells implement arbitrary sequencing state machines with deterministic 5.4 ns timing, and its flash-based instant-on capability ensures the sequencer is operational in under 1 ms after rails rise. Each of the 76 user I/Os can directly drive a MOSFET gate or enable pin, replacing complex analog sequencer ICs. The non-volatile UFM block stores configuration data such as timing parameters or board-revision codes, accessible via JTAG for production traceability.

💡

LED Display and Signage Control

Large LED walls, scoreboards, and digital signage need high-channel-count PWM generation with precise timing. The EPM570M100C4N provides 76 high-drive I/Os that can be grouped into PWM channels for thousands of LEDs using Charlieplex or multiplexed matrix topologies. The 5.4 ns tPD allows refresh rates above 1 kHz to eliminate visible flicker, while the 8 Kbit UFM block holds gamma-correction tables or per-LED calibration data. Compared to microcontroller-based LED drivers, the CPLD's deterministic timing avoids the interrupt-jitter artifacts that cause banding in video-rate applications.

🏭

Motor Control Timing Logic

Stepper, BLDC, and servo motor controllers rely on deterministic timing for Hall-sensor decoding, commutation, and PWM generation. The EPM570M100C4N implements these timing-critical functions in 440 macrocells with 5.4 ns pin-to-pin delay, far more predictable than microcontroller interrupt latency. The 76 user I/Os support multi-axis drives (3 axes typically consume 24-36 I/Os), while MultiVolt I/O directly interfaces 3.3 V MCUs with 5 V gate drivers. The non-volatile flash ensures the controller starts in the correct state instantly on power-up, critical for safety in robotic and CNC applications.

🖥️

Legacy 74-Series Glue Logic Replacement

Discontinued 74F, 74AS, and 74LS TTL glue-logic ICs are increasingly hard to source and consume significant board area. The EPM570M100C4N replaces dozens of discrete gates, latches, multiplexers, and bus transceivers in a single 100-pin MBGA, simplifying PCB layout and reducing assembly cost. The 5.4 ns tPD matches or beats the propagation delay of most legacy TTL families, while MultiVolt I/O integrates 5 V legacy signals with modern 1.8 V cores. Instant-on flash configuration means no boot ROM is needed, and JTAG ISP allows field updates if the replacement logic requires revision.

What is the maximum pin-to-pin propagation delay of EPM570M100C4N?
The EPM570M100C4N provides a pin-to-pin logic delay (tPD) of 5.4 ns in its commercial speed grade (C4). This timing is derived directly from the MAX II CPLD datasheet and is suitable for glue-logic replacement, bus decoding, and asynchronous interface bridging. Designers targeting faster paths should consider the C5 (faster) or C3 speed grades within the same MAX II family footprint.
How many logic elements and macrocells does EPM570M100C4N have?
The EPM570M100C4N integrates 440 macrocells, which are equivalent to 570 logic elements (LEs) in the MAX II architecture. The device also includes an embedded 8 Kbit User Flash Memory (UFM) block. Per the MAX II family datasheet, the 570-LE density sits in the mid-range of the MAX II portfolio, between EPM240 (240 LEs) and EPM1270 (1,270 LEs).
Where can I download the EPM570M100C4N datasheet PDF?
The EPM570M100C4N datasheet is hosted by Alldatasheet and accessible via https://www.alldatasheet.com/datasheet-pdf/pdf/1575727/ALTERA/EPM570M100C4N.html. The document is part of the MAX II Device Family datasheet, which covers the entire EPM240/EPM570/EPM1270/EPM2210 series. Distributors such as DigiKey (1136029) and Mouser also host linked product pages referencing the same datasheet.
Is EPM570M100C4N still in production and active?
Yes, the EPM570M100C4N is listed as active by Intel (formerly Altera) and remains in production as of 2026-09-12. Inventory is currently available at DigiKey, Mouser, and LCSC. Engineers designing long-life industrial or communications equipment can rely on the MAX II family roadmap for ongoing supply, with vertical migration possible to EPM1270 and EPM2210 in compatible packages.
What is the difference between EPM570M100C4N and EPM570GT100C4N?
Both the EPM570M100C4N and EPM570GT100C4N share the same 100-pin MBGA package, 440 macrocells (570 LEs), and 76 user I/Os, making them drop-in compatible. The 'G' suffix indicates the device is in the MAX II G sub-family, which supports a 1.8 V internal core (lower power) versus the 3.3 V core of the standard MAX II in the C4N part. Pinouts are identical between the two speed grades for vertical migration.
What is the best drop-in replacement for EPM570M100C4N?
The best drop-in replacements for EPM570M100C4N are the other speed grades of the same EPM570 in the 100-pin MBGA package: EPM570M100C5N (faster timing), EPM570M100C3N (slower timing), and EPM570GT100C4N (MAX II G sub-family). All share the same pinout and PCB footprint, enabling direct substitution without layout rework. Vertical migration is also possible to EPM1270 and EPM2210 devices in the 256-pin MBGA package.
How many user I/Os does EPM570M100C4N provide?
The EPM570M100C4N exposes 76 user I/Os in its 100-pin MBGA package. The remaining pins are dedicated to VCC, GND, JTAG (TCK/TMS/TDO/TDI), and configuration functions. According to the MAX II family datasheet, the 76 I/Os support MultiVolt operation across 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic levels, enabling direct interfacing with most microcontrollers and ASICs without external level shifters.
What is the operating temperature range of EPM570M100C4N?
The 'C' suffix in EPM570M100C4N designates commercial-grade temperature range, which is 0 °C to +85 °C junction temperature per the MAX II datasheet ordering information. For industrial applications requiring -40 °C to +100 °C operation, designers should select the EPM570M100I4N variant (industrial suffix 'I') in the same 100-pin MBGA package for direct drop-in compatibility.
Does EPM570M100C4N include non-volatile configuration memory?
Yes, the EPM570M100C4N uses flash-based non-volatile configuration memory. This means the device powers up instantly in under 1 ms with no external boot PROM required. The on-chip flash also stores 8 Kbits of User Flash Memory (UFM) available for non-logic data such as calibration tables, serial numbers, or boot parameters.
Can I migrate from EPM570M100C4N to EPM1270 or EPM2210 in the same footprint?
Vertical migration within the 100-pin MBGA package is supported for EPM570 only. Migration to EPM1270 or EPM2210 requires moving to a larger package such as the 144-pin or 256-pin FineLine BGA. According to the MAX II datasheet, the 100-pin MBGA is dedicated to EPM240 and EPM570 devices, while higher-density members use the 144-pin, 208-pin, or 256-pin BGA packages.
What is the typical price of EPM570M100C4N as of 2026?
As of 2026-09-12, distributor pricing for EPM570M100C4N starts around USD 8.07 at LCSC for 1-piece orders, while authorized distributors such as DigiKey and Mouser list the part in the USD 18 to USD 24 range depending on quantity breaks. Industrial-grade EPM570M100I4N (different suffix, same footprint) typically lists higher. Prices fluctuate with market demand; consult current distributor quotes.
Is EPM570M100C4N suitable for 5 V to 3.3 V level shifting?
Yes, the EPM570M100C4N is well-suited for 5 V to 3.3 V or 5 V to 1.8 V bus bridging. MultiVolt I/O support allows each pin bank to be powered independently, while the core operates from 3.3 V. Engineers commonly use this device to interface legacy 5 V peripherals with modern 1.8 V microcontrollers and ASICs, replacing dozens of discrete level-shifter ICs.
Where to buy EPM570M100C4N online with stock availability?
EPM570M100C4N is currently in stock at authorized distributors including DigiKey (part number 1136029), Mouser, and at lower cost on LCSC Electronics (C1556453). Independent distributors Heisener and IC-1101 also list stock. For volume orders, requesting a direct quote from Intel/Altera franchised distributors is recommended to confirm lead time and original-component traceability.
What is the difference between MAX II and MAX II G devices?
MAX II devices (standard EPMxxx) operate from a 3.3 V core supply, while MAX II G devices (EPMxxxG) feature a lower-power 1.8 V core. Both sub-families share identical pinouts in matching BGA packages, enabling drop-in migration. MAX II G additionally offers MultiVolt core support for direct 1.5 V/1.8 V/2.5 V/3.3 V interfacing with reduced static power consumption.
What is the difference between EPM570M100C4N and XC9500XL CPLDs?
Compared to legacy Xilinx XC9500XL CPLDs in the same 100-ball BGA footprint, the EPM570M100C4N offers roughly 10x lower static power, on-chip User Flash Memory, and instant-on flash configuration (no external boot PROM). Pin counts and basic glue-logic functionality are similar, but the EPM570M100C4N integrates more macrocells and richer in-system programmability for modern designs.

엔지니어링 참조 데이터: EPM570M100C4N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EPM570M100C4N when you need a mid-density (440 macrocells), instant-on, non-volatile CPLD in a 100-pin MBGA package for industrial, consumer, or communications glue logic. The 3.3 V core suits designs already powered by 3.3 V rails and supports MultiVolt I/O for 1.5 V to 3.3 V interfacing. Pick the C4 (this part) for cost-optimized 5.4 ns designs, C5 for tighter timing (4.5 ns), C3 for slower cost-down (7.0 ns), or migrate to EPM570GT100C4N when a 1.8 V core and lower static power are required. For temperature-extended applications (-40 to +100 °C), select the industrial-grade EPM570M100I4N instead - same footprint. If 192 macrocells suffice, drop to EPM240M100C4N; if more than 570 LEs are needed, vertical migrate to EPM1270 (144-pin BGA) or EPM2210 (256-pin BGA).

대체품과의 비교

파라미터 이 제품 EPM570M100C5N EPM570M100C3N EPM570GT100C4N EPM570GT100C5N EPM240M100C4N
Package 100-pin MBGA (Micro FineLine BGA) 100-pin MBGA - same 100-pin MBGA - same 100-pin MBGA - same 100-pin MBGA - same 100-pin MBGA - same
Brand Intel (formerly Altera) Intel - same Intel - same Intel - same Intel - same Intel - same
Macrocells 440 440 440 440 440 192 (-56%)
Logic Elements (LEs) 570 570 570 570 240
Pin-to-Pin Delay (tPD) 5.4 ns (C4) ~4.5 ns (C5, -17%) ~7.0 ns (C3, +30%) ~5.4 ns (C4) ~5.4 ns (C4)
User I/Os 76 76 76 76 80 (+5%)
Sub-Family MAX II (3.3 V core) MAX II (3.3 V core) MAX II G (1.8 V core, lower power) MAX II G (1.8 V core) MAX II G (1.8 V core) MAX II (3.3 V core, lower density)
Temperature Grade Commercial 0 to +85 °C (C suffix) Commercial 0 to +85 °C Industrial -40 to +100 °C Commercial 0 to +85 °C Commercial 0 to +85 °C
User Flash Memory 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits

주요 차별점

  • Mid-range MAX II density with 440 macrocells / 570 LEs (vs EPM240M100C4N)
  • Standard MAX II 3.3 V core for direct 5 V-tolerant interfacing (vs EPM570GT100C4N (MAX II G))
  • C4 speed grade balances timing margin and cost (vs EPM570M100C5N (C5 faster))
  • On-chip User Flash Memory (8 Kbits) eliminates external EEPROM (vs Discrete MCU + external EEPROM designs)

설계 노트

The EPM570M100C4N requires a stable 3.3 V core supply (VCCINT) plus independently regulated VCCIO bank supplies (1.5 V / 1.8 V / 2.5 V / 3.3 V) for each MultiVolt I/O bank. Decouple each VCC pin with a 0.1 µF ceramic capacitor placed within 3 mm of the ball, and add one bulk 10 µF tantalum or ceramic capacitor per supply rail. For JTAG programming in noisy environments, add a 1 µF capacitor on TCK to suppress glitches that can interrupt ISP. Estimated: total quiescent current is approximately 30 mA (core) plus I/O leakage; consult datasheet DC characteristics for exact figures.

The 100-pin MBGA (Micro FineLine BGA) package uses a 0.5 mm ball pitch. PCB layout must use microvia-in-pad or via-on-pad technology with NSMD (non-solder-mask-defined) pads to ensure reliable reflow soldering. Ground and power planes should be continuous under the device, with at least 4 ground vias placed under the central ground balls for thermal dissipation. Maintain 50 Ω microstrip/stripline impedance on JTAG traces (TCK, TMS, TDI, TDO) and route them away from switching power or high-current signals.

JTAG chain integrity is critical for in-system programming of the EPM570M100C4N. Keep TCK rise time under 10 ns by using a series 33 Ω damping resistor near the driver, and ensure TMS and TDI are pulled high during power-up to prevent unintended TAP-state transitions. For multi-device JTAG chains, observe the cumulative TCK-to-TDO delay of all devices in series and keep total chain length below 32 devices to remain within typical programmer timing budgets. Recommended: add a 10 kΩ pull-up on nCONFIG (if used) and a 1 kΩ pull-up on nSTATUS to prevent floating-state programming errors.

Do not confuse the 'C' in C4N as a temperature suffix - it denotes the speed grade (C4 = 5.4 ns tPD commercial). The temperature grade is encoded separately: C = commercial (0 to +85 °C), I = industrial (-40 to +100 °C). Mixing up these suffixes during BOM ordering is one of the most common supply-chain errors for MAX II devices. Also note that EPM570 and EPM570G are pin-compatible but not voltage-compatible: a 1.8 V VCCINT will not power a standard EPM570, so always verify the 'G' suffix before PCB bring-up.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

RoHS and REACH compliant per Intel/Altera product declaration. Not AEC-Q100 qualified (CPLD is not a discrete power/sensor device). Halogen-free per JEDEC JS709B. Lead-free reflow profile J-STD-020 compatible.

데이터 검증일: 2026-09-12 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EPM570M100C4N EPM570M100C4N datasheet EPM570 MAX II CPLD 100-pin BGA Altera EPM570M100C4N Intel CPLD 440 macrocell CPLD 5.4 ns MAX II CPLD 100 MBGA pinout EPM570M100C4N bus bridging 5V to 3.3V EPM570M100C4N vs EPM570GT100C4N EPM570M100C4N drop-in replacement EPM570M100C4N buy price stock MAX II CPLD glue logic replacement EPM570M100C4N JTAG programming

관련 부품 & 용어

Intel Altera EPM570M100C4N MAX II MAX II G CPLD Complex Programmable Logic Device macrocell logic element User Flash Memory UFM MultiVolt MBGA Micro FineLine BGA JTAG IEEE 1149.1 ISP in-system programmability RoHS REACH JEDEC JS709B AEC-Q100 flash configuration memory LAB Logic Array Block glue logic bus bridging I/O expansion power sequencing LED driver motor control
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