FTSH-105-01-L-DV-K-A-TR - 10-Pin SMT Micro Header Strip | Samtec
Référence : FTSH-105-01-L-DV-K-A-TR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.27 | $2,27 |
| 10 | $1.96 | $19,60 |
| 100 | $1.58 | $158,00 |
| 500 | $1.32 | $660,00 |
| 1 000 | $1.12 | $1 120,00 |
FTSH-105-01-L-DV-K-A-TR Présentation
A board-to-board header strip is a surface-mount electromechanical interconnect that provides a detachable, multi-position link between a daughter card and a host PCB. It sits within the broader family of pin headers, which are organized into unshrouded (breakaway) and shrouded (shrouded/boxed) variants. FTSH parts are unshrouded and rely on a keying notch rather than a plastic shroud to prevent mis-mating. Within Samtec's catalog the FTSH series sits above lower-cost breakaway headers and below fully shrouded, locking Tiger Eye or QTE/QSE interfaces, placing it in the mid-tier for moderate reliability and signal integrity.
Key features of the FTSH-105-01-L-DV-K-A-TR include a liquid crystal polymer (LCP) insulator rated for reflow soldering up to 260 C in accordance with JEDEC J-STD-020, phosphor-bronze contact springs for stable contact force, and the '-K-A' polarization key that orients mating halves relative to pin A1. Operating temperature spans -55 C to +125 C. The TR suffix denotes Tape and Reel packaging compatible with automated pick-and-place assembly. The 'e3' termination finish designation refers to a tin (Sn) finish with a nickel underplate; this variant retains a lead-containing contact plating consistent with the legacy '-L' coding.
Typical applications include FPGA and MCU debug/JTAG headers, signal break-out boards, mezzanine-to-board interconnects for industrial controllers, test and programming fixtures, and routing for differential low-speed signal buses such as SPI, I2C, and GPIO banks. Designers select this footprint when board real estate is constrained and a vertical, shrouded-or-keyed interface is not required. When comparing drop-in alternatives note that all variants in the FTSH-105-01 family share the same 1.27 mm pitch, 10-pin count, and insulator body - only the plating (L), keying position (K-A), and packaging (TR or tube) change.
Design considerations include ensuring pad geometry matches the recommended land pattern in the Samtec FTSH datasheet, providing adequate keep-out for the post tails to avoid solder wicking, and confirming that mating socket housings such as CLP or FLE series are specified for the same polar-key orientation. This page synthesizes distributor pricing and drop-in alternatives from DigiKey, Mouser, and LCSC that are not consolidated on the manufacturer datasheet.
Alternatives de remplacement direct pour FTSH-105-01-L-DV-K-A-TR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
FTSH-105-01-L-DV-K-A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
FTSH-105-01-L-DV-K-A-P-TR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
FTSH-105-01-L-DV-K-TR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
FTSH-105-01-L-DV-K-A-P-FR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
FTSH-105-01-STL-DV-K-P-TR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
FTSH-105-01-L-DV-K-A-TR Spécifications
| Series | FTSH |
| Number of Positions | 10 |
| Number of Rows | 2 |
| Pitch | 0.050 in (1.27 mm) |
| Type de montage | Surface Mount |
| Orientation | Vertical |
| Connector Type | Header, unshrouded, breakable (cuttable) |
| Contact Material | Phosphor bronze |
| Contact Finish (Mating) | 10 uin (0.25 um) Gold |
| Contact Finish (Termination) | Tin (e3) |
| Post Length (Overall) | 0.120 in (3.05 mm) |
| Insulator Material | Liquid Crystal Polymer (LCP) |
| Température de fonctionnement | -55 C to +125 C |
| Keying Feature | Polarization notch on side A |
| Packaging | Tape and Reel (TR) |
Guide de configuration des broches du FTSH-105-01-L-DV-K-A-TR standard
Configuration des broches du FTSH-105-01-L-DV-K-A-TR (boîtier standard). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour FTSH-105-01-L-DV-K-A-TR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
FTSH-105-01-L-DV-K-A-TR convient pour 6 applications: FPGA / MCU Debug and Programming Header, Industrial Breakout Board Interconnect, Modular Sensor Daughter Card Interface, Test & Programming Fixture, Mezzanine Signal Routing Card, LED Lighting Module Interconnect.
FPGA / MCU Debug and Programming Header
The FTSH-105-01-L-DV-K-A-TR serves as a robust vertical programming/debug port for FPGA and MCU boards where JTAG, SWD, or UART lines must be brought to a single 1.27 mm keyed connector. Its 10-position 2x5 layout matches the ARM Cortex 10-pin JTAG pinout convention, while the polarization key prevents the cable from being inserted backwards on first-power boards. Designers appreciate the 10 uin gold plating for test-cycle durability and the 0.120 in post length for low-insertion-force mating cycles over a product's life.
Recommandé
Industrial Breakout Board Interconnect
On industrial signal-breakout boards the FTSH-105-01-L-DV-K-A-TR acts as the stacked daughtercard-to-mainboard interface, carrying SPI, I2C, GPIO, and analog signals between isolated board sections. Its 1.27 mm pitch allows dense routing under 5 mm board-to-board clearance, while the LCP insulator survives wave and reflow profiles used in industrial assembly. The vertical orientation suits placements where the daughter board sits above I/O connectors, and the keyed alignment avoids field-replacement wiring errors.
Recommandé
Modular Sensor Daughter Card Interface
Wearable and IoT sensor stacks use the FTSH-105-01-L-DV-K-A-TR as a low-profile stacking interface to a sensor daughter card carrying accelerometers, IMUs, or environmental sensors. The header's 3.05 mm post length enables 5 mm or larger board-to-board separations necessary for housing sensors, while the keyed polarization prevents assembly misalignment during automated pick-and-place runs. Gold mating surface ensures stable contact through repeated service cycles in fielded wearables.
Recommandé
Test & Programming Fixture
In-circuit test (ICT) and bed-of-nails fixtures rely on the FTSH-105-01-L-DV-K-A-TR's high mating-cycle endurance and exact 1.27 mm grid to align pogo-pin probes. The keyed orientation guarantees fixture-to-DUT correspondence across many test cycles without retooling, while the LCP body tolerates thermal cycling from -55 C to +125 C during burn-in. Tape-and-Reel packaging supports the high-volume fixture builds used by contract manufacturers.
Recommandé
Mezzanine Signal Routing Card
The FTSH-105-01-L-DV-K-A-TR provides the vertical signal link between a baseboard and a mezzanine module carrying high-speed serial links, FPGAs, or ADC channels. Its 1.27 mm pitch matches Samtec's 0.050in family stack height of approximately 5-7 mm, fitting standard mezzanine card cage dimensions without mechanical spacers. Phosphor-bronze contacts maintain low contact resistance over the long-life requirements of telecom and defense mezzanine modules.
Recommandé
LED Lighting Module Interconnect
LED lighting modules and pixel arrays use the FTSH-105-01-L-DV-K-A-TR as a low-profile keyed interconnect for segment-to-segment data and power routing in mini-LED backlights and architectural fixtures. The 1.27 mm pitch and 10-position footprint accommodate DMX, SPI, and ground-reference signals on a single connector. Tape-and-reel packaging streamlines SMD placement on lighting PCBs where connectors sit between LED rows.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour FTSH-105-01-L-DV-K-A-TR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | FTSH-105-01-L-DV-K-A | FTSH-105-01-L-DV-K-A-P-TR | FTSH-105-01-L-DV-K-TR | FTSH-105-01-L-DV-K-A-P-FR | FTSH-105-01-STL-DV-K-P-TR |
|---|---|---|---|---|---|---|
| Brand | Samtec | Samtec | Samtec | Samtec | Samtec | Samtec |
| Package | SMT Vertical 10-pin 0.050in (1.27mm) | SMT Vertical 10-pin 0.050in | SMT Vertical 10-pin 0.050in | SMT Vertical 10-pin 0.050in | SMT Vertical 10-pin 0.050in | SMT Vertical 10-pin 0.050in |
| Number of Positions | 10 (2 rows x 5) | 10 (2x5) | 10 (2x5) | 10 (2x5) | 10 (2x5) | 10 (2x5) |
| Keying / Polarization | Key A | Key A | Key A | No Key | Key A | Key K (different side) |
| Mating Plating | 10 uin Gold | 10 uin Gold | Gold (P grade) | 10 uin Gold | Gold (P grade) | Selective Tin-Lead (STL) |
| Termination Plating | Tin (e3) | Tin (e3) | Tin (e3) | Tin (e3) | Tin (e3) | Tin-Lead (e0 class) |
| Post Length | 0.120 in (3.05 mm) | 0.120 in (3.05 mm) | 0.120 in (3.05 mm) | 0.120 in (3.05 mm) | 0.120 in (3.05 mm) | 0.120 in (3.05 mm) |
| Packaging | Tape & Reel (TR) | Tube | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (FR alignment) | Tape & Reel (TR) |
Principaux différenciateurs
- Polarization key on side A prevents mis-mating (vs FTSH-105-01-L-DV-K-TR)
- Tape & Reel packaging for automated assembly (vs FTSH-105-01-L-DV-K-A)
- Legacy lead-containing 'L' plating for mission-critical use (vs FTSH-105-01-STL-DV-K-P-TR)
Notes de conception
Land pattern: use the recommended 1.27 mm-pitch SMT land geometry from Samtec FTSH datasheet, with two SMT pads per pin plus a perimeter keep-out of 0.25 mm around the post tails to prevent solder bridging. Reels are supplied with cover tape that must be removed after reflow; avoid screening solder paste beyond the pad outline as excess paste can wick up the post.
Place the FTSH near the board edge when it serves as a programming port to keep ribbon-cable routing short and to allow probe access during ICT. Maintain at least 1.27 mm clearance between the header body and adjacent tall components (>5 mm) so that polarization key on side A remains mappable. For multi-connector layouts, mirror part orientation to ensure all Key-A notches align in the same direction for technician consistency.
The 1.27 mm FTSH is unshrouded and not designed for controlled-impedance high-speed lanes - the maximum practical single-ended data rate is approximately 100 Mbps over short (<50 mm) traces. For LVDS, USB 2.0 differential pairs, or faster serial links route signals on a connector-impedance-matched interface (Samtec QSE/QTE or Razor Beam) rather than the FTSH series.
Do not mix Key-A, Key-B, and Key-K variants on the same PCB - although pins match, polarization mis-match prevents correct orientation detection during assembly. Specified 10 uin gold plating is suitable for moderate mating cycles; for >500-cycle applications consider Samtec Tiger Eye or TFM series. Confirm the e3 termination vs e0 designation per current RoHS requirements, since 'L' indicates legacy lead-containing plating on the contact side.
Informations de conformité
The 'L' plating code indicates legacy tin-lead contacts that are RoHS-restricted; this part may qualify for an exemption under EU Commission Decision 2002/525/EC Annex II per TTI's compliance documentation, but full RoHS/REACH status was not verified in the provided data. AEC-Q100 is not applicable to a passive connector.