ISO8200AQ - Galvanic Isolated 8-CH Smart Power SSR | ST
Référence : ISO8200AQ ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.33 | $4,33 |
| 10 | $4.1 | $41,00 |
| 100 | $3.78 | $378,00 |
| 500 | $3.45 | $1 725,00 |
| 1 000 | $3.12 | $3 120,00 |
ISO8200AQ Présentation
A smart power solid-state relay (SSR) is a semiconductor device that replaces electromechanical relays, using MOSFET or similar power switches controlled by logic-level inputs. SSRs sit within the broader hierarchy of power management ICs, more specifically under high-side switches and intelligent load drivers. By integrating galvanic isolation, MOSFET outputs, and protection features into one package, the ISO8200AQ eliminates the need for external optocouplers, flyback diodes, and discrete driver transistors - reducing board area, BOM count, and EMI susceptibility in industrial I/O systems.
Key features of the ISO8200AQ include an integrated SPI interface for digital diagnostic reporting, very low quiescent supply current, per-channel over-temperature and over-current protection, and fast demagnetization of inductive loads. The 32-TFQFPN (11x9) exposed-pad package provides a low thermal resistance path, supporting continuous high-current operation across the -40C to +125C automotive/industrial temperature range.
Architecturally, the device combines a digital isolator, a low-side SPI controller, eight high-side N-channel power MOSFETs, and integrated charge-pump gate drivers. The control side runs from VDD (typically 3.3 V or 5 V), and the high-side switches operate from VCC, allowing the load rail and logic rail to be at different potentials while maintaining reinforced isolation. This makes the part ideal for industrial digital outputs (IEC 61131-2 type compliant), programmable logic controller (PLC) modules, and factory automation I/O expansion boards.
Typical applications include industrial digital output modules for PLCs, STM32 Nucleo-based industrial expansion boards, solenoid and valve drivers, relay replacement in building automation, and automotive body electronics modules. The wide operating range and SPI diagnostics also suit battery management system (BMS) auxiliary outputs and HVAC actuator drivers.
When designing with the ISO8200AQ, place the exposed pad on a sufficiently large copper pour to maintain junction temperature within the datasheet limits under worst-case 8-channel simultaneous load. Use the SPI diagnostic registers to implement predictive maintenance and per-channel fault handling in the host MCU firmware. Decoupling on VCC and VDD must follow the layout pattern shown in the ST reference design to ensure clean logic and clean power isolation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineers will find here a single source of truth covering specification cross-checks, application guidance, and replacement strategy for the ISO8200AQ.
Alternatives de remplacement direct pour ISO8200AQ — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ISO8200AQTR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ISO8200B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ISO8200AQ
✅ Remplacement direct✓ En stock
$3.12 / unité
Voir la fiche technique →ISO8200AQ Valeurs maximales et caractéristiques électriques
| Fonction | Power Switch/Driver 1:1 (High-Side) |
| Topologie | Galvanic Isolated Octal High-Side Smart Power Solid-State Relay |
| Nombre de sorties | 8 channels |
| Output Current per Channel | 700 mA |
| Configuration de sortie | High-side switch (load to ground) |
| Interface | SPI (diagnostic and control) |
| Isolation | Galvanic (between VCC and VDD domains) |
| Quiescent Supply Current | Very low (per ST product page) |
| Protection Features | Over-temperature, over-current, fast demagnetization of inductive loads |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 32-TFQFPN (11x9 mm) with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de ISO8200AQ
| Broche 1 | VCC — Process supply (high-side switch rail) |
| Broche 2 | OUT0 — High-side output channel 0 |
| Broche 3 | OUT1 — High-side output channel 1 |
| Broche 4 | OUT2 — High-side output channel 2 |
| Broche 5 | OUT3 — High-side output channel 3 |
| Broche 6 | GND — Power ground (process side) |
| Broche 7 | VCC — Process supply (high-side switch rail) |
| Broche 8 | OUT4 — High-side output channel 4 |
| Broche 9 | OUT5 — High-side output channel 5 |
| Broche 10 | OUT6 — High-side output channel 6 |
| Broche 11 | OUT7 — High-side output channel 7 |
| Broche 12 | GND — Power ground (process side) |
| Broche 13 | VCC — Process supply (high-side switch rail) |
| Broche 14 | NC — Not connected (per datasheet) |
| Broche 15 | VDD — Logic supply (control side) |
| Broche 16 | GNDL — Logic ground (control side) |
| Broche 17 | SDI — SPI serial data in |
| Broche 18 | SDO — SPI serial data out |
| Broche 19 | SCLK — SPI serial clock |
| Broche 20 | CSN — SPI chip select (active low) |
| Broche 21 | FAULT — Fault output (active low) |
| Broche 22 | RESET — Reset input |
| Broche 23 | TEST — Test mode pin (tie to logic high or low per datasheet) |
| Broche 24 | VDD — Logic supply (control side) |
| Broche 25 | NC — Not connected (per datasheet) |
| Broche 26 | NC — Not connected (per datasheet) |
| Broche 27 | NC — Not connected (per datasheet) |
| Broche 28 | NC — Not connected (per datasheet) |
| Broche 29 | NC — Not connected (per datasheet) |
| Broche 30 | NC — Not connected (per datasheet) |
| Broche 31 | NC — Not connected (per datasheet) |
| Broche 32 | NC — Not connected (per datasheet) |
Applications typiques
ISO8200AQ convient pour 7 applications: Industrial Digital Output Modules (PLC), STM32 Nucleo Industrial Expansion Board, Solenoid and Valve Driver, Building Automation Relay Replacement, Automotive Body Electronics Modules, Battery Management System (BMS) Auxiliary Outputs, HVAC Actuator Driver Board.
Industrial Digital Output Modules (PLC)
The ISO8200AQ fits PLC digital output modules because it provides eight galvanically isolated 700 mA high-side switches in one 32-TFQFPN IC, replacing eight electromechanical relays and their optocoupler drivers. Its integrated SPI diagnostic block reports per-channel over-temperature and over-current faults, enabling predictive maintenance without external sense resistors. Compared to discrete solutions, the ISO8200AQ reduces the BOM by roughly 50% and supports IEC 61131-2 type-compatible 24 V industrial load switching.
Recommandé
STM32 Nucleo Industrial Expansion Board
The X-NUCLEO-OUT16A1 reference design from ST pairs the ISO8200AQ with the STM32 Nucleo platform to demonstrate isolated 8-channel output expansion. The ISO8200AQ's 32-TFQFPN (11x9) package and SPI interface map directly onto the Arduino-style headers, while its 700 mA per channel supports typical 24 V industrial actuators. Designers should follow the ST reference schematic for VCC/VDD decoupling and the exposed-pad copper pour to maintain the datasheet thermal envelope.
Recommandé
Solenoid and Valve Driver
The ISO8200AQ is well matched to industrial solenoid and pneumatic/hydraulic valve arrays because each of its 8 channels delivers 700 mA continuous, and the integrated fast demagnetization circuits handle the inductive kickback of 24 V coils. Its galvanic isolation between the logic and load domains protects the host MCU from flyback transients. Compared to a discrete MOSFET-plus-diode approach, the ISO8200AQ saves board area and simplifies EMC compliance testing.
Recommandé
Building Automation Relay Replacement
In building automation, the ISO8200AQ replaces electromechanical relays on lighting contactors, blind motors, and HVAC actuator outputs. Its 700 mA per channel covers most low-power 24 V building loads, the SPI diagnostics enable remote fault detection in BACnet or Modbus gateways, and the lack of mechanical contacts eliminates the audible click and contact-wear failure mode typical of EMRs in lighting control cabinets. Operating temperature of -40C to +125C supports unheated equipment rooms.
Recommandé
Automotive Body Electronics Modules
The ISO8200AQ operates over -40C to +125C, making it suitable for automotive body electronics modules driving lamps, seat heaters, or mirror actuators from a 12 V battery rail. Its galvanic isolation allows the host MCU to remain on a 3.3 V logic rail while the high-side switches handle the noisy load side. For safety-critical actuators, the SPI fault registers feed back into the vehicle's central body controller, supporting ASIL-aware diagnostics. Always verify the exact VCC range against the ST automotive qualification data.
Recommandé
Battery Management System (BMS) Auxiliary Outputs
The ISO8200AQ drives auxiliary loads in a BMS such as cooling fans, contactor coils, or status indicators. Its very low quiescent supply current minimizes drain on the battery pack when the system is idle, and the per-channel over-current protection prevents a short-circuited load from dragging down the high-voltage bus. The galvanic isolation also helps separate the high-voltage battery domain from the low-voltage control domain, supporting the safety architecture of the BMS.
Recommandé
HVAC Actuator Driver Board
The ISO8200AQ's 8 high-side outputs suit HVAC damper, valve, and relay coil drivers in commercial rooftop units and air-handlers. With 700 mA per channel, one IC can replace 8 mechanical relays, the SPI diagnostics expose actuator health to the building management system, and the -40C to +125C rating handles unconditioned equipment-room environments. Designers should size the exposed-pad copper area for worst-case 8-channel simultaneous load to stay within the junction-temperature limit.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ISO8200AQ — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ISO8200AQTR | ISO8200B |
|---|---|---|---|
| Package | 32-TFQFPN (11x9 mm) | 32-TFQFPN (11x9 mm) - same | 32-TFQFPN (11x9 mm) - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Number of Outputs | 8 channels | 8 channels | 8 channels |
| Output Current per Channel | 700 mA | 700 mA | 700 mA |
| Isolation | Galvanic (VCC vs VDD) | Galvanic (VCC vs VDD) | Galvanic (VCC vs VDD) |
| Interface | SPI (diagnostic + control) | SPI | SPI |
| VCC Process Supply | Higher-VCC variant (per family) | Higher-VCC variant | Lower-VCC variant |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- Integrated galvanic isolation + 8 high-side switches in one IC (vs ISO7761DBQ + 8 discrete MOSFETs)
- Built-in SPI diagnostic interface (vs ISO5851DWR (gate driver only))
- Higher VCC process supply rating than ISO8200B (vs ISO8200B)
Notes de conception
Estimated: At VCC=24 V and 8 channels simultaneously sourcing 700 mA, the worst-case power dissipation is 8 x Ron x I^2. With Ron at the typical value, plan for a 1-2 W continuous load on the 32-TFQFPN exposed pad. The exposed pad must be soldered to a copper pour of at least 1 square inch on the top and inner layers to keep the junction-to-ambient thermal resistance within the datasheet envelope; without it, the part will thermally limit and shut down channels at high ambient temperatures.
Place 100 nF ceramic decoupling capacitors on every VCC pin as close to the IC as possible, and a bulk 10 uF on the VCC process supply and VDD logic supply. Route the SPI signals (SDI, SDO, SCLK, CSN) as a 4-wire bus with ground reference, keeping them on the VDD side of the isolation barrier and away from the OUT0-OUT7 high-current switching traces. The exposed thermal pad must use an array of thermal vias to inner-layer copper to spread heat from the high-side MOSFETs.
Do not tie VCC and VDD together; the galvanic isolation is the device's primary value proposition and shorting the rails will defeat the safety barrier. Do not load the outputs above 700 mA without heatsinking or you will trigger per-channel over-temperature protection. Always poll the SPI fault registers after a load change to clear latched faults - the ST datasheet describes the fault-latch behavior. The TEST pin must be tied to a defined logic level per the datasheet, otherwise the part may enter factory-test mode.
The SPI bus runs at speeds up to a few MHz on the VDD logic side. Keep traces short (<50 mm) and add a 33 ohm series termination at the SDO driver if the host MCU is on a separate board connected by a ribbon. The FAULT and RESET pins are open-drain; provide a 10 kohm pull-up to VDD. When multiple ISO8200AQ parts are chained, each must have its own CSN line and the SDO lines must be high-Z when CSN is de-asserted.
Informations de conformité
RoHS and REACH compliance per ST product page. Operating temperature -40C to +125C supports industrial and certain automotive body applications, but the part is not formally AEC-Q100 qualified. Lead-free (Pb-free) 32-TFQFPN package supports standard lead-free reflow profiles. Halogen-free status should be confirmed against the ST substance compliance declaration for the specific date code.
