LCMXO2-7000HC-4BG332C - 6864 LUT MachXO2 FPGA, 332-BGA | Lattice
Référence : LCMXO2-7000HC-4BG332C ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $41.62 | $41,62 |
| 10 | $37.95 | $379,50 |
| 100 | $32.5 | $3 250,00 |
| 500 | $27.85 | $13 925,00 |
| 1 000 | $24.1 | $24 100,00 |
LCMXO2-7000HC-4BG332C Présentation
A MachXO2 is a non-volatile, low-density FPGA from Lattice designed for glue logic, bus bridging, I/O expansion, and instant-on control tasks - bridging the gap between traditional CPLDs and higher-density FPGAs. Positioned above simple CPLDs but below mid-range FPGAs, MachXO2 devices offer true 6-input LUT fabric, hardened I/O, PLLs, and on-chip oscillators in a single instant-on package, eliminating the need for external boot memory.
Key features include 22 uW typical standby power, programmable low-swing differential I/O support, multiple power-saving modes, embedded SRAM blocks of 9 kbit each (up to 240 kbit total), and up to 256 kbit user-accessible Flash for configuration and data storage. The -4 speed grade supports internal Fmax around 269 MHz per the family characterization, with hardened peripherals including SPI, I2C, timer/counter, and PLL blocks.
The 65 nm process delivers an excellent performance-per-watt ratio, with the 7000 LUT density variant targeting bridge and control-plane applications that exceed what a CPLD can comfortably route. Compared to traditional 5V CPLDs, the MachXO2-7000HC supports multiple I/O standards (LVCMOS, LVTTL, LVDS, LVPECl) with on-chip 50 ohm termination options. The internal dual-boot capability (SPI Flash plus on-chip Flash) enables field updates and remote reconfiguration across industrial networking infrastructure.
Typical applications include I/O expansion and glue logic in industrial control systems, bus bridging between legacy processors (PCI, I2C, SPI, parallel) and modern SoCs, LED display control, camera and image sensor aggregation, instant-on system management in server/storage platforms, and low-power portable instrumentation. Designers select the 7000-LUT tier when logic density beyond 1200-2560 LUTs of smaller MachXO2 members is required.
When designing with this 332-ball BGA package, engineers must allocate proper PCB layer count (typically 4-6 layers minimum for signal escape routing) and consider 1.0 mm or 0.8 mm ball pitch escape requirements. The HC (High-performance Commercial) variant operates over 0 C to 85 C; for industrial -40 C to 100 C operation, choose the HE variant, or for automotive AEC-Q100, the ZE variant - all three are pin-compatible within the BG332 package.
Alternatives de remplacement direct pour LCMXO2-7000HC-4BG332C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LCMXO2-7000HC-5BG332C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-7000HC-6BG332C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-7000HE-4BG332C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-7000ZE-1BG332C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-7000HC-4BG332C Valeurs maximales et caractéristiques électriques
| Family | MachXO2 |
| Logic Elements / LUTs | 6864 LUTs |
| Number of I/O | 278 user I/O |
| Number of Logic Cells / Macrocells | 6864 cells |
| Total RAM Bits | 245760 bits (240 kbit) |
| Distributed RAM | 54 kbit |
| User Flash Memory | up to 256 kbit |
| Tension d'alimentation | 2.5 V / 3.3 V |
| Plage de température de fonctionnement | 0 C to 85 C (Commercial) |
| Speed Grade | -4 (Commercial) |
| Package Type | 332-ball caBGA |
| Type de montage | Surface Mount |
| Process Technology | 65 nm CMOS |
| Standby Power | as low as 22 uW typical |
| Configuration Memory | Internal Flash (instant-on, dual-boot capable) |
| Statut RoHS | RoHS Compliant |
| Lead Free Status | Lead Free |
Guide de configuration des broches du LCMXO2-7000HC-4BG332C 332-ball cabga
Configuration des broches du LCMXO2-7000HC-4BG332C (boîtier 332-ball cabga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LCMXO2-7000HC-4BG332C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LCMXO2-7000HC-4BG332C convient pour 6 applications: Industrial I/O Expansion and Glue Logic, Bus Bridging Between Legacy and Modern Processors, LED Display Control and Video Aggregation, Camera and Image Sensor Aggregation, Instant-On System Management in Servers and Storage, Low-Power Portable Instrumentation.
Industrial I/O Expansion and Glue Logic
The LCMXO2-7000HC-4BG332C's 6864 LUTs and 278 user I/O make it well-suited to industrial I/O expansion and board-level glue logic, where it aggregates slow-speed parallel buses, level-translates signals between 1.2V SoC domains and 3.3V peripheral domains, and instantiates counters, state machines, and timing functions that would otherwise burden a microcontroller. Its instant-on Flash configuration eliminates boot-time uncertainty - critical when machine controllers need deterministic I/O handling at power-up. With 22 uW standby power, it can be left always-on for sensor monitoring even when the main processor is sleeping.
Recommandé
Bus Bridging Between Legacy and Modern Processors
The LCMXO2-7000HC-4BG332C is widely deployed as a bus bridge between legacy processors with parallel or proprietary interfaces and modern SoCs that expose only MIPI, USB, or high-speed serial I/O. The 278 user I/O and 240 kbit block RAM can buffer transactions between asynchronous clock domains using the on-chip PLLs and FIFO control logic, while the dual-boot capability permits firmware revision via SPI without opening the enclosure. Performance is limited by the 65 nm fabric, but for control-plane bridging (PCI, I2C, SPI, parallel) the device is more than adequate and far cheaper than a fully featured SoC.
Recommandé
LED Display Control and Video Aggregation
For commercial LED display controllers, the LCMXO2-7000HC-4BG332C's combination of 278 I/O, programmable low-swing differential signaling, and dual-boot Flash allows it to drive large LED arrays with precise timing and refresh control. Its 240 kbit of block RAM serves as a row buffer, while the 256 kbit user Flash can store gamma tables and calibration constants. The 65 nm process keeps standby power at 22 uW - useful for panels that spend most of their time in standby with periodic content refresh.
Recommandé
Camera and Image Sensor Aggregation
In machine vision and surveillance edge nodes, the LCMXO2-7000HC-4BG332C can aggregate multiple image sensors through LVDS or sub-LVDS pairs into a single output stream for a downstream processor. Its 278 I/O comfortably supports 4-6 parallel sensor interfaces with timing generation and exposure sync, and the embedded PLLs derive pixel clocks from a single reference. The instant-on Flash enables the FPGA to be live at power-up, providing an early-sync signal to the main AP before it boots - reducing overall system latency.
Recommandé
Instant-On System Management in Servers and Storage
Server and storage platforms use the LCMXO2-7000HC-4BG332C as a system management controller that holds I2C/SPI buses, fan PWM, LED indicators, and early power-rail sequencing active even before the BMC boots. Instant-on Flash, 22 uW standby, and 278 I/O give the BMC developer enough headroom for both legacy and modern management buses. The internal Flash also holds boot images with field-update capability, simplifying service operations.
Recommandé
Low-Power Portable Instrumentation
Battery-powered test instruments and field data loggers benefit from the MachXO2-7000HC's combination of low standby power (22 uW) and substantial logic capacity - enough to implement custom stimulus generation, signal conditioning control, and front-panel multiplexing without needing a microcontroller. The 65 nm process supports an extended commercial-temperature 0 C to 85 C operating range and survives drop events thanks to the non-volatile configuration. The 240 kbit block RAM serves as a deep sample buffer while the user Flash stores calibration coefficients.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LCMXO2-7000HC-4BG332C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LCMXO2-7000HC-5BG332C | LCMXO2-7000HC-6BG332C | LCMXO2-7000HE-4BG332C | LCMXO2-7000ZE-1BG332C |
|---|---|---|---|---|---|
| Package | 332-ball caBGA (BG332) | 332-ball caBGA (BG332) - same | 332-ball caBGA (BG332) - same | 332-ball caBGA (BG332) - same | 332-ball caBGA (BG332) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Logic Capacity | 6864 LUTs (7000-class) | 6864 LUTs | 6864 LUTs | 6864 LUTs | 6864 LUTs |
| User I/O Count | 278 | 278 | 278 | 278 | 278 |
| Block RAM | 240 kbit | 240 kbit | 240 kbit | 240 kbit | 240 kbit |
| Speed Grade | -4 (commercial fast) | -5 | -6 (slowest) | -4 | -1 (fastest auto) |
| Temperature Grade | Commercial (0 C to 85 C) | Commercial | Commercial | Industrial (-40 C to 100 C) | Automotive (-40 C to 125 C) |
| Automotive AEC-Q100 | No | No | No | No | Yes |
Principaux différenciateurs
- Instant-on non-volatile configuration (vs LCMXO2-7000ZE-1BG332C)
- Higher speed grade among commercial parts (vs LCMXO2-7000HC-6BG332C)
- 278 user I/O with 65 nm low-power process (vs Smaller LCMXO2-256 / 640 / 1200 / 2000 devices)
Notes de conception
Estimated: the 332-ball caBGA package typically uses 0.8 mm or 1.0 mm ball pitch, requiring 4-6 PCB layers with microvia or fanout routing to escape the dense BGA grid. Place 0.1 uF decoupling capacitors adjacent to each power/ground ball pair, and add bulk 10 uF capacitors near the VCC core supply balls. Maintain solid ground and power planes directly under the BGA to provide low-impedance return paths for the 240 kbit of block RAM and 6864 LUT switching activity.
When migrating between MachXO2 speed grades (-4, -5, -6) or temperature variants (HC, HE, ZE), confirm that your design's timing closure still meets hold/setup margins. A design that times cleanly at -4 may fail at -6 due to slower logic paths, while moving from HC (commercial 0-85 C) to HE (industrial -40 to 100 C) typically only changes silicon characterization. Always re-run static timing analysis after a speed grade or temperature variant change.
Estimated: at maximum toggle rate and 278 I/O switching simultaneously at 3.3 V, dynamic power can approach several hundred milliwatts. The 65 nm process keeps static leakage low (~22 uW standby), so thermal concerns are dominated by dynamic switching rather than quiescent draw. For high-utilization designs, derate maximum ambient temperature by 1-2 C per additional 10% utilization to maintain junction temperature below the commercial 85 C limit.
Informations de conformité
RoHS and lead-free status confirmed via Lattice product page and authorized distributor datasheet listings. For AEC-Q100 qualification choose the LCMXO2-7000ZE-1BG332C variant.
