LCMXO2-7000HC-4BG332C - 6864 LUT MachXO2 FPGA, 332-BGA | Lattice
Артикул: LCMXO2-7000HC-4BG332C ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $41.62 | $41,62 |
| 10 | $37.95 | $379,50 |
| 100 | $32.5 | $3.250,00 |
| 500 | $27.85 | $13.925,00 |
| 1.000 | $24.1 | $24.100,00 |
LCMXO2-7000HC-4BG332C Обзор
A MachXO2 is a non-volatile, low-density FPGA from Lattice designed for glue logic, bus bridging, I/O expansion, and instant-on control tasks - bridging the gap between traditional CPLDs and higher-density FPGAs. Positioned above simple CPLDs but below mid-range FPGAs, MachXO2 devices offer true 6-input LUT fabric, hardened I/O, PLLs, and on-chip oscillators in a single instant-on package, eliminating the need for external boot memory.
Key features include 22 uW typical standby power, programmable low-swing differential I/O support, multiple power-saving modes, embedded SRAM blocks of 9 kbit each (up to 240 kbit total), and up to 256 kbit user-accessible Flash for configuration and data storage. The -4 speed grade supports internal Fmax around 269 MHz per the family characterization, with hardened peripherals including SPI, I2C, timer/counter, and PLL blocks.
The 65 nm process delivers an excellent performance-per-watt ratio, with the 7000 LUT density variant targeting bridge and control-plane applications that exceed what a CPLD can comfortably route. Compared to traditional 5V CPLDs, the MachXO2-7000HC supports multiple I/O standards (LVCMOS, LVTTL, LVDS, LVPECl) with on-chip 50 ohm termination options. The internal dual-boot capability (SPI Flash plus on-chip Flash) enables field updates and remote reconfiguration across industrial networking infrastructure.
Typical applications include I/O expansion and glue logic in industrial control systems, bus bridging between legacy processors (PCI, I2C, SPI, parallel) and modern SoCs, LED display control, camera and image sensor aggregation, instant-on system management in server/storage platforms, and low-power portable instrumentation. Designers select the 7000-LUT tier when logic density beyond 1200-2560 LUTs of smaller MachXO2 members is required.
When designing with this 332-ball BGA package, engineers must allocate proper PCB layer count (typically 4-6 layers minimum for signal escape routing) and consider 1.0 mm or 0.8 mm ball pitch escape requirements. The HC (High-performance Commercial) variant operates over 0 C to 85 C; for industrial -40 C to 100 C operation, choose the HE variant, or for automotive AEC-Q100, the ZE variant - all three are pin-compatible within the BG332 package.
Аналоги без доработки для LCMXO2-7000HC-4BG332C — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
LCMXO2-7000HC-5BG332C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LCMXO2-7000HC-6BG332C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LCMXO2-7000HE-4BG332C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LCMXO2-7000ZE-1BG332C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LCMXO2-7000HC-4BG332C Максимальные параметры и электрические характеристики
| Family | MachXO2 |
| Logic Elements / LUTs | 6864 LUTs |
| Number of I/O | 278 user I/O |
| Number of Logic Cells / Macrocells | 6864 cells |
| Total RAM Bits | 245760 bits (240 kbit) |
| Distributed RAM | 54 kbit |
| User Flash Memory | up to 256 kbit |
| Напряжение питания | 2.5 V / 3.3 V |
| Диапазон рабочих температур | 0 C to 85 C (Commercial) |
| Speed Grade | -4 (Commercial) |
| Package Type | 332-ball caBGA |
| Тип монтажа | Surface Mount |
| Process Technology | 65 nm CMOS |
| Standby Power | as low as 22 uW typical |
| Configuration Memory | Internal Flash (instant-on, dual-boot capable) |
| Статус RoHS | RoHS Compliant |
| Lead Free Status | Lead Free |
Руководство по цоколевке LCMXO2-7000HC-4BG332C в корпусе 332-ball cabga
Цоколевка для LCMXO2-7000HC-4BG332C (корпус 332-ball cabga). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для LCMXO2-7000HC-4BG332C.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
LCMXO2-7000HC-4BG332C подходит для 6 применениеs: Industrial I/O Expansion and Glue Logic, Bus Bridging Between Legacy and Modern Processors, LED Display Control and Video Aggregation, Camera and Image Sensor Aggregation, Instant-On System Management in Servers and Storage, Low-Power Portable Instrumentation.
Industrial I/O Expansion and Glue Logic
The LCMXO2-7000HC-4BG332C's 6864 LUTs and 278 user I/O make it well-suited to industrial I/O expansion and board-level glue logic, where it aggregates slow-speed parallel buses, level-translates signals between 1.2V SoC domains and 3.3V peripheral domains, and instantiates counters, state machines, and timing functions that would otherwise burden a microcontroller. Its instant-on Flash configuration eliminates boot-time uncertainty - critical when machine controllers need deterministic I/O handling at power-up. With 22 uW standby power, it can be left always-on for sensor monitoring even when the main processor is sleeping.
Рекомендуется
Bus Bridging Between Legacy and Modern Processors
The LCMXO2-7000HC-4BG332C is widely deployed as a bus bridge between legacy processors with parallel or proprietary interfaces and modern SoCs that expose only MIPI, USB, or high-speed serial I/O. The 278 user I/O and 240 kbit block RAM can buffer transactions between asynchronous clock domains using the on-chip PLLs and FIFO control logic, while the dual-boot capability permits firmware revision via SPI without opening the enclosure. Performance is limited by the 65 nm fabric, but for control-plane bridging (PCI, I2C, SPI, parallel) the device is more than adequate and far cheaper than a fully featured SoC.
Рекомендуется
LED Display Control and Video Aggregation
For commercial LED display controllers, the LCMXO2-7000HC-4BG332C's combination of 278 I/O, programmable low-swing differential signaling, and dual-boot Flash allows it to drive large LED arrays with precise timing and refresh control. Its 240 kbit of block RAM serves as a row buffer, while the 256 kbit user Flash can store gamma tables and calibration constants. The 65 nm process keeps standby power at 22 uW - useful for panels that spend most of their time in standby with periodic content refresh.
Рекомендуется
Camera and Image Sensor Aggregation
In machine vision and surveillance edge nodes, the LCMXO2-7000HC-4BG332C can aggregate multiple image sensors through LVDS or sub-LVDS pairs into a single output stream for a downstream processor. Its 278 I/O comfortably supports 4-6 parallel sensor interfaces with timing generation and exposure sync, and the embedded PLLs derive pixel clocks from a single reference. The instant-on Flash enables the FPGA to be live at power-up, providing an early-sync signal to the main AP before it boots - reducing overall system latency.
Рекомендуется
Instant-On System Management in Servers and Storage
Server and storage platforms use the LCMXO2-7000HC-4BG332C as a system management controller that holds I2C/SPI buses, fan PWM, LED indicators, and early power-rail sequencing active even before the BMC boots. Instant-on Flash, 22 uW standby, and 278 I/O give the BMC developer enough headroom for both legacy and modern management buses. The internal Flash also holds boot images with field-update capability, simplifying service operations.
Рекомендуется
Low-Power Portable Instrumentation
Battery-powered test instruments and field data loggers benefit from the MachXO2-7000HC's combination of low standby power (22 uW) and substantial logic capacity - enough to implement custom stimulus generation, signal conditioning control, and front-panel multiplexing without needing a microcontroller. The 65 nm process supports an extended commercial-temperature 0 C to 85 C operating range and survives drop events thanks to the non-volatile configuration. The 240 kbit block RAM serves as a deep sample buffer while the user Flash stores calibration coefficients.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для LCMXO2-7000HC-4BG332C — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | LCMXO2-7000HC-5BG332C | LCMXO2-7000HC-6BG332C | LCMXO2-7000HE-4BG332C | LCMXO2-7000ZE-1BG332C |
|---|---|---|---|---|---|
| Package | 332-ball caBGA (BG332) | 332-ball caBGA (BG332) - same | 332-ball caBGA (BG332) - same | 332-ball caBGA (BG332) - same | 332-ball caBGA (BG332) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Logic Capacity | 6864 LUTs (7000-class) | 6864 LUTs | 6864 LUTs | 6864 LUTs | 6864 LUTs |
| User I/O Count | 278 | 278 | 278 | 278 | 278 |
| Block RAM | 240 kbit | 240 kbit | 240 kbit | 240 kbit | 240 kbit |
| Speed Grade | -4 (commercial fast) | -5 | -6 (slowest) | -4 | -1 (fastest auto) |
| Temperature Grade | Commercial (0 C to 85 C) | Commercial | Commercial | Industrial (-40 C to 100 C) | Automotive (-40 C to 125 C) |
| Automotive AEC-Q100 | No | No | No | No | Yes |
Ключевые отличия
- Instant-on non-volatile configuration (против LCMXO2-7000ZE-1BG332C)
- Higher speed grade among commercial parts (против LCMXO2-7000HC-6BG332C)
- 278 user I/O with 65 nm low-power process (против Smaller LCMXO2-256 / 640 / 1200 / 2000 devices)
Заметки по проектированию
Estimated: the 332-ball caBGA package typically uses 0.8 mm or 1.0 mm ball pitch, requiring 4-6 PCB layers with microvia or fanout routing to escape the dense BGA grid. Place 0.1 uF decoupling capacitors adjacent to each power/ground ball pair, and add bulk 10 uF capacitors near the VCC core supply balls. Maintain solid ground and power planes directly under the BGA to provide low-impedance return paths for the 240 kbit of block RAM and 6864 LUT switching activity.
When migrating between MachXO2 speed grades (-4, -5, -6) or temperature variants (HC, HE, ZE), confirm that your design's timing closure still meets hold/setup margins. A design that times cleanly at -4 may fail at -6 due to slower logic paths, while moving from HC (commercial 0-85 C) to HE (industrial -40 to 100 C) typically only changes silicon characterization. Always re-run static timing analysis after a speed grade or temperature variant change.
Estimated: at maximum toggle rate and 278 I/O switching simultaneously at 3.3 V, dynamic power can approach several hundred milliwatts. The 65 nm process keeps static leakage low (~22 uW standby), so thermal concerns are dominated by dynamic switching rather than quiescent draw. For high-utilization designs, derate maximum ambient temperature by 1-2 C per additional 10% utilization to maintain junction temperature below the commercial 85 C limit.
Информация о соответствии
RoHS and lead-free status confirmed via Lattice product page and authorized distributor datasheet listings. For AEC-Q100 qualification choose the LCMXO2-7000ZE-1BG332C variant.
