Lattice Semiconductor

LCMXO2-7000HC-4BG332C - 6864 LUT MachXO2 FPGA, 332-BGA | Lattice

料号: LCMXO2-7000HC-4BG332C ✓ 量产中
有现货 1-3 个工作日内发货
2.5 V / 3.3 V Vdss 332-ball caBGA Package -4 (Commercial) Speed up to 256 kbit Memory
低至 $24.1 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-13
批量定价
数量 单价 小计
1 $41.62 $41.62
10 $37.95 $379.50
100 $32.5 $3,250.00
500 $27.85 $13,925.00
1,000 $24.1 $24,100.00
ℹ️ 所有价格均以 USD 计价

LCMXO2-7000HC-4BG332C 概述

The Lattice Semiconductor LCMXO2-7000HC-4BG332C is a 6864-LUT MachXO2 family Field Programmable Gate Array (FPGA) with 278 user I/O, built on an advanced 65 nm low-power CMOS process, housed in a 332-ball caBGA package with commercial-grade speed grade 4. The device combines instant-on non-volatile configuration (Flash + SRAM) with 240 kbit embedded SRAM and 54 kbit distributed RAM, supporting up to 256 kbit user Flash memory plus dedicated FIFO control logic.

A MachXO2 is a non-volatile, low-density FPGA from Lattice designed for glue logic, bus bridging, I/O expansion, and instant-on control tasks - bridging the gap between traditional CPLDs and higher-density FPGAs. Positioned above simple CPLDs but below mid-range FPGAs, MachXO2 devices offer true 6-input LUT fabric, hardened I/O, PLLs, and on-chip oscillators in a single instant-on package, eliminating the need for external boot memory.

Key features include 22 uW typical standby power, programmable low-swing differential I/O support, multiple power-saving modes, embedded SRAM blocks of 9 kbit each (up to 240 kbit total), and up to 256 kbit user-accessible Flash for configuration and data storage. The -4 speed grade supports internal Fmax around 269 MHz per the family characterization, with hardened peripherals including SPI, I2C, timer/counter, and PLL blocks.

The 65 nm process delivers an excellent performance-per-watt ratio, with the 7000 LUT density variant targeting bridge and control-plane applications that exceed what a CPLD can comfortably route. Compared to traditional 5V CPLDs, the MachXO2-7000HC supports multiple I/O standards (LVCMOS, LVTTL, LVDS, LVPECl) with on-chip 50 ohm termination options. The internal dual-boot capability (SPI Flash plus on-chip Flash) enables field updates and remote reconfiguration across industrial networking infrastructure.

Typical applications include I/O expansion and glue logic in industrial control systems, bus bridging between legacy processors (PCI, I2C, SPI, parallel) and modern SoCs, LED display control, camera and image sensor aggregation, instant-on system management in server/storage platforms, and low-power portable instrumentation. Designers select the 7000-LUT tier when logic density beyond 1200-2560 LUTs of smaller MachXO2 members is required.

When designing with this 332-ball BGA package, engineers must allocate proper PCB layer count (typically 4-6 layers minimum for signal escape routing) and consider 1.0 mm or 0.8 mm ball pitch escape requirements. The HC (High-performance Commercial) variant operates over 0 C to 85 C; for industrial -40 C to 100 C operation, choose the HE variant, or for automotive AEC-Q100, the ZE variant - all three are pin-compatible within the BG332 package.

直接替换替代料: LCMXO2-7000HC-4BG332C ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

快速对比工具——选择替代料号进行并排对比:

LCMXO2-7000HC-5BG332C

✅ 直接替换
📦 332-ball caBGA (BG332)
same die, -5 speed grade (slower than -4, Fmax ~150 MHz lower), pin-to-pin compatible

📋 参考替代料(不在目录中)

LCMXO2-7000HC-6BG332C

✅ 直接替换
📦 332-ball caBGA (BG332)
same die, -6 speed grade (slowest commercial option), pin-to-pin compatible

📋 参考替代料(不在目录中)

LCMXO2-7000HE-4BG332C

✅ 直接替换
📦 332-ball caBGA (BG332)
industrial temperature grade (-40 C to 100 C vs 0 C to 85 C), same die and ball map

📋 参考替代料(不在目录中)

LCMXO2-7000ZE-1BG332C

✅ 直接替换
📦 332-ball caBGA (BG332)
automotive AEC-Q100 grade, -1 speed grade, pin-compatible ball map

📋 参考替代料(不在目录中)

ℹ️ 1 个跨封装料号已隐藏——不同封装需要 PCB 改动,并非真正的直接替换。 联系我们 如果您需要跨封装建议。

LCMXO2-7000HC-4BG332C 最大额定值与电气特性

Family MachXO2
Logic Elements / LUTs 6864 LUTs
Number of I/O 278 user I/O
Number of Logic Cells / Macrocells 6864 cells
Total RAM Bits 245760 bits (240 kbit)
Distributed RAM 54 kbit
User Flash Memory up to 256 kbit
电源电压 2.5 V / 3.3 V
工作温度范围 0 C to 85 C (Commercial)
Speed Grade -4 (Commercial)
Package Type 332-ball caBGA
安装类型 Surface Mount
Process Technology 65 nm CMOS
Standby Power as low as 22 uW typical
Configuration Memory Internal Flash (instant-on, dual-boot capable)
RoHS 状态 RoHS Compliant
Lead Free Status Lead Free

LCMXO2-7000HC-4BG332C 332-ball cabga 引脚配置指南

LCMXO2-7000HC-4BG332C(332-ball cabga 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

LCMXO2-7000HC-4BG332C 的 332-ball cabga 封装引脚图

暂无详细引脚数据: LCMXO2-7000HC-4BG332C.

请参阅 数据手册 以查看完整引脚配置。

典型应用

LCMXO2-7000HC-4BG332C 适用于 6 应用s: Industrial I/O Expansion and Glue Logic, Bus Bridging Between Legacy and Modern Processors, LED Display Control and Video Aggregation, Camera and Image Sensor Aggregation, Instant-On System Management in Servers and Storage, Low-Power Portable Instrumentation.

🏭

Industrial I/O Expansion and Glue Logic

The LCMXO2-7000HC-4BG332C's 6864 LUTs and 278 user I/O make it well-suited to industrial I/O expansion and board-level glue logic, where it aggregates slow-speed parallel buses, level-translates signals between 1.2V SoC domains and 3.3V peripheral domains, and instantiates counters, state machines, and timing functions that would otherwise burden a microcontroller. Its instant-on Flash configuration eliminates boot-time uncertainty - critical when machine controllers need deterministic I/O handling at power-up. With 22 uW standby power, it can be left always-on for sensor monitoring even when the main processor is sleeping.

🌐

Bus Bridging Between Legacy and Modern Processors

The LCMXO2-7000HC-4BG332C is widely deployed as a bus bridge between legacy processors with parallel or proprietary interfaces and modern SoCs that expose only MIPI, USB, or high-speed serial I/O. The 278 user I/O and 240 kbit block RAM can buffer transactions between asynchronous clock domains using the on-chip PLLs and FIFO control logic, while the dual-boot capability permits firmware revision via SPI without opening the enclosure. Performance is limited by the 65 nm fabric, but for control-plane bridging (PCI, I2C, SPI, parallel) the device is more than adequate and far cheaper than a fully featured SoC.

💡

LED Display Control and Video Aggregation

For commercial LED display controllers, the LCMXO2-7000HC-4BG332C's combination of 278 I/O, programmable low-swing differential signaling, and dual-boot Flash allows it to drive large LED arrays with precise timing and refresh control. Its 240 kbit of block RAM serves as a row buffer, while the 256 kbit user Flash can store gamma tables and calibration constants. The 65 nm process keeps standby power at 22 uW - useful for panels that spend most of their time in standby with periodic content refresh.

🎥

Camera and Image Sensor Aggregation

In machine vision and surveillance edge nodes, the LCMXO2-7000HC-4BG332C can aggregate multiple image sensors through LVDS or sub-LVDS pairs into a single output stream for a downstream processor. Its 278 I/O comfortably supports 4-6 parallel sensor interfaces with timing generation and exposure sync, and the embedded PLLs derive pixel clocks from a single reference. The instant-on Flash enables the FPGA to be live at power-up, providing an early-sync signal to the main AP before it boots - reducing overall system latency.

🖥️

Instant-On System Management in Servers and Storage

Server and storage platforms use the LCMXO2-7000HC-4BG332C as a system management controller that holds I2C/SPI buses, fan PWM, LED indicators, and early power-rail sequencing active even before the BMC boots. Instant-on Flash, 22 uW standby, and 278 I/O give the BMC developer enough headroom for both legacy and modern management buses. The internal Flash also holds boot images with field-update capability, simplifying service operations.

🔧

Low-Power Portable Instrumentation

Battery-powered test instruments and field data loggers benefit from the MachXO2-7000HC's combination of low standby power (22 uW) and substantial logic capacity - enough to implement custom stimulus generation, signal conditioning control, and front-panel multiplexing without needing a microcontroller. The 65 nm process supports an extended commercial-temperature 0 C to 85 C operating range and survives drop events thanks to the non-volatile configuration. The 240 kbit block RAM serves as a deep sample buffer while the user Flash stores calibration coefficients.

What is the LCMXO2-7000HC-4BG332C?
The LCMXO2-7000HC-4BG332C is a 6864-LUT MachXO2 family FPGA from Lattice Semiconductor with 278 user I/O, housed in a 332-ball caBGA package, built on a 65 nm low-power CMOS process and offering instant-on Flash-based configuration. It targets glue logic, bus bridging, and I/O expansion in commercial-grade 0 C to 85 C applications.
What is the LUT count of LCMXO2-7000HC-4BG332C?
The LCMXO2-7000HC-4BG332C contains 6864 Look-Up Tables (LUTs), which corresponds to the 7000-LUT density tier of the MachXO2 family (the part is named for its 7000 LUT class, with 6864 enabled). This capacity is well above the smaller LCMXO2-256 and LCMXO2-640 parts and supports complex glue logic designs at commercial-grade operating temperatures.
How many I/O pins does LCMXO2-7000HC-4BG332C have?
The LCMXO2-7000HC-4BG332C exposes 278 general-purpose user I/O pins through its 332-ball caBGA package, with the remaining balls dedicated to power, ground, configuration, JTAG, and clock pins. The high I/O count makes it well-suited to wide-parallel bus bridging and aggregator designs that need many LVCMOS or LVDS channels.
What is the difference between LCMXO2-7000HC-4BG332C and LCMXO2-7000HE-4BG332C?
The LCMXO2-7000HC-4BG332C is the commercial temperature grade (0 C to 85 C), while the LCMXO2-7000HE-4BG332C is the industrial temperature grade (-40 C to 100 C) with otherwise identical 7000 LUT density and 332-BGA footprint. Both are pin-compatible in the BG332 package - only the temperature range and supporting characterization differ. According to Lattice MachXO2 family datasheet, ZE, HC, and HE variants are functionally and pin-compatible within the same package.
Is LCMXO2-7000HC-4BG332C in stock at distributors?
Stock status at Lattice authorized distributors varies by week; DigiKey and Mouser list the LCMXO2-7000HC-4BG332C as ship-today in tray packaging per their product pages, although 332-BGA FPGAs are typically quote-only at small quantities. For current stock and lead time, query the part number at DigiKey or Mouser directly, or contact a Lattice franchised distributor for volume pricing.
What is the price of LCMXO2-7000HC-4BG332C?
The LCMXO2-7000HC-4BG332C lists at approximately 41.62 USD per unit at qty-1 in tray packaging, declining to roughly 24.10 USD at qty-1000, per distributor data as of October 2026. Octopart and DigiKey typically show real-time distributor pricing across multiple sources; volumes above 1000 units should request a direct factory quote from Lattice for the most accurate pricing.
What is the lead time for LCMXO2-7000HC-4BG332C orders?
Lead time for the LCMXO2-7000HC-4BG332C depends on tray or reel quantity and distributor stock state at order entry; production parts typically ship within 6-10 weeks from Lattice or authorized distributors for replenishment orders. For urgent prototyping, distributor stock (DigiKey, Mouser, Arrow) usually offers immediate shipment of small tray quantities.
What can replace LCMXO2-7000HC-4BG332C in a 332-BGA design?
Direct drop-in 332-BGA replacements within the same MachXO2 family include the LCMXO2-7000HC-6BG332C (speed grade -6, slower timing), LCMXO2-7000HC-5BG332C (speed grade -5), and LCMXO2-7000HE-4BG332C (industrial temperature). For automotive applications, the LCMXO2-7000ZE-1BG332C is pin-compatible but adds AEC-Q100 qualification. Cross-brand true drop-in equivalents are not available because the MachXO2 fabric is unique to Lattice.
LCMXO2-7000HC-4BG332C vs LCMXO2-4000HC-4BG256C - which is better?
The LCMXO2-7000HC-4BG332C has 6864 LUTs in a 332-BGA package, while the LCMXO2-4000HC-4BG256C has roughly 4320 LUTs in a 256-BGA package - a different footprint. Choose the 7000-LUT variant when your design exceeds ~4000 LUTs and you need 278 user I/O; choose the 4000-LUT variant for smaller designs in a smaller BGA. They are not drop-in because of differing package and ball map.
Where can I download the LCMXO2-7000HC-4BG332C datasheet PDF?
The official Lattice datasheet (MachXO2 Family Data Sheet, document_id=38834) is available at https://www.latticesemi.com/view_document?document_id=38834. It covers the entire MachXO2 family including the LCMXO2-7000HC-4BG332C pinout, electrical characteristics, configuration modes, and reference designs.
What is the pinout of LCMXO2-7000HC-4BG332C BG332 package?
The 332-ball caBGA pinout for LCMXO2-7000HC-4BG332C is documented in the MachXO2 Family Data Sheet, including ball map coordinates, dedicated JTAG, configuration, PLL, and clock pins, as well as the bank-based general-purpose I/O assignments. Engineers typically read the pinout alongside the Lattice Diamond or Radiant tool generated pin report to confirm signal mapping per design.
Is the LCMXO2-7000HC-4BG332C RoHS compliant?
Yes, the LCMXO2-7000HC-4BG332C is RoHS compliant and lead-free per the Lattice product page and authorized distributor datasheet listings. The 332-ball caBGA package uses lead-free solder balls compatible with standard lead-free reflow profiles up to 260 C peak per JEDEC J-STD-020. Halogen-free and REACH statements are also provided on the Lattice environmental compliance page.
What design tools support the LCMXO2-7000HC-4BG332C?
The LCMXO2-7000HC-4BG332C is fully supported by Lattice Diamond design software (legacy) and the newer Lattice Radiant toolchain, both of which provide synthesis, place-and-route, simulation, IP library access, and bitstream generation. Programmatic configuration is possible through Lattice programming cables and the Lattice programming tool for in-system Flash programming and dual-boot management.
When should I choose LCMXO2-7000HC-4BG332C over an ECP5 or iCE40?
Choose the LCMXO2-7000HC-4BG332C when you need instant-on, on-chip non-volatile configuration without an external boot Flash, and when your design fits within 6864 LUTs and 240 kbit block RAM. Choose the larger Lattice ECP5 when you need higher LUT count, SerDes, or higher performance; choose iCE40 only when ultra-low static power and small package size matter more than feature density. MachXO2 sits between iCE40 and ECP5 in the Lattice portfolio.
What is the standby power of LCMXO2-7000HC-4BG332C?
The LCMXO2-7000HC-4BG332C achieves standby power as low as 22 uW typical in deep-sleep mode per the MachXO2 family datasheet, enabled by the 65 nm low-power CMOS process and the device's multiple programmable power-saving modes. This makes it well-suited to battery-backed or energy-harvesting systems where quiescent draw dominates battery life.

工程参考数据: LCMXO2-7000HC-4BG332C ——对比、设计指导和合规信息。

选型指南

Choose the LCMXO2-7000HC-4BG332C when your design needs 6864 LUTs (MachXO2 7000-class density) with 278 user I/O, in the 332-ball caBGA package, and operates within the commercial 0 C to 85 C temperature range. Move to the LCMXO2-7000HE-4BG332C (industrial -40 C to 100 C) if your product is deployed in factory or outdoor environments. For higher timing margin pick the -4 speed grade (this part); for cost-sensitive designs with relaxed timing, the -5 or -6 grades are drop-in compatible. If your design must operate over -40 C to 125 C or requires AEC-Q100 qualification (automotive), use the LCMXO2-7000ZE-1BG332C instead. The MachXO2 family uses on-chip Flash configuration so no external boot memory is needed - a key advantage over SRAM-only FPGAs that require an external configuration Flash and add latency to system bring-up.

与替代料对比

参数 本产品 LCMXO2-7000HC-5BG332C LCMXO2-7000HC-6BG332C LCMXO2-7000HE-4BG332C LCMXO2-7000ZE-1BG332C
Package 332-ball caBGA (BG332) 332-ball caBGA (BG332) - same 332-ball caBGA (BG332) - same 332-ball caBGA (BG332) - same 332-ball caBGA (BG332) - same
Brand Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor
Logic Capacity 6864 LUTs (7000-class) 6864 LUTs 6864 LUTs 6864 LUTs 6864 LUTs
User I/O Count 278 278 278 278 278
Block RAM 240 kbit 240 kbit 240 kbit 240 kbit 240 kbit
Speed Grade -4 (commercial fast) -5 -6 (slowest) -4 -1 (fastest auto)
Temperature Grade Commercial (0 C to 85 C) Commercial Commercial Industrial (-40 C to 100 C) Automotive (-40 C to 125 C)
Automotive AEC-Q100 No No No No Yes

关键差异点

  • Instant-on non-volatile configuration (对比 LCMXO2-7000ZE-1BG332C)
  • Higher speed grade among commercial parts (对比 LCMXO2-7000HC-6BG332C)
  • 278 user I/O with 65 nm low-power process (对比 Smaller LCMXO2-256 / 640 / 1200 / 2000 devices)

设计说明

Estimated: the 332-ball caBGA package typically uses 0.8 mm or 1.0 mm ball pitch, requiring 4-6 PCB layers with microvia or fanout routing to escape the dense BGA grid. Place 0.1 uF decoupling capacitors adjacent to each power/ground ball pair, and add bulk 10 uF capacitors near the VCC core supply balls. Maintain solid ground and power planes directly under the BGA to provide low-impedance return paths for the 240 kbit of block RAM and 6864 LUT switching activity.

When migrating between MachXO2 speed grades (-4, -5, -6) or temperature variants (HC, HE, ZE), confirm that your design's timing closure still meets hold/setup margins. A design that times cleanly at -4 may fail at -6 due to slower logic paths, while moving from HC (commercial 0-85 C) to HE (industrial -40 to 100 C) typically only changes silicon characterization. Always re-run static timing analysis after a speed grade or temperature variant change.

Estimated: at maximum toggle rate and 278 I/O switching simultaneously at 3.3 V, dynamic power can approach several hundred milliwatts. The 65 nm process keeps static leakage low (~22 uW standby), so thermal concerns are dominated by dynamic switching rather than quiescent draw. For high-utilization designs, derate maximum ambient temperature by 1-2 C per additional 10% utilization to maintain junction temperature below the commercial 85 C limit.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS and lead-free status confirmed via Lattice product page and authorized distributor datasheet listings. For AEC-Q100 qualification choose the LCMXO2-7000ZE-1BG332C variant.

数据核验日期: 2026-10-14 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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相关元器件 & 术语

Lattice Semiconductor LCMXO2-7000HC-4BG332C LCMXO2-7000HC-5BG332C LCMXO2-7000HC-6BG332C LCMXO2-7000HE-4BG332C LCMXO2-7000ZE-1BG332C MachXO2 FPGA CPLD LUT caBGA 332-ball BGA 65 nm CMOS RoHS AEC-Q100 LVCMOS LVDS instant-on non-volatile configuration Flash memory SPI flash JTAG PLL dual-boot embedded SRAM standby power
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