LTC1923EGN - TEC Controller PWM, 2.7-5.5V | Analog Devices
料号： LTC1923EGN ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.1 | $131.00 |
| 100 | $11.65 | $1,165.00 |
| 500 | $10.2 | $5,100.00 |
| 1,000 | $9.05 | $9,050.00 |
LTC1923EGN 概述
A thermoelectric cooler (TEC) controller is a specialised power-management IC that drives a Peltier-effect module used for solid-state heating and cooling. TEC modules require DC current whose polarity selects heating vs cooling and whose magnitude controls thermal flux, so the controller must provide an efficient bidirectional current source. The LTC1923 family fits in the broader hierarchy: PMIC -> power management specialised -> TEC controller -> semiconductor IC. The part complements optical transceivers, DFB/DBR laser diodes, scientific CCD/CMOS sensors, and any closed-loop thermal system where sub-100 mK stability is the design target.
Key features include a single-rail 2.7-5.5V supply, 2 mA supply current, integrated full-bridge drivers rated for the TEC load, support for both heating and cooling modes, and a synchronisable oscillator. The SSOP-28 footprint with thermal pad keeps PCB area small while offering a thermal path for the gate-driver dissipation. The wide supply range makes the part directly compatible with 3.3V and 5V digital rails found in laser-diode driver boards and instrumentation front-ends.
The LTC1923 implements a voltage-mode PWM core with adjustable dead time, integrated bootstrap drivers for the high-side switches, and logic-level control inputs for direction and enable. By integrating the full-bridge drivers, the part removes the need for an external gate-driver IC and the dead-time management normally associated with discrete H-bridge designs, simplifying the BOM and reducing the loop-delay penalty in the thermal control loop.
Typical applications include DFB laser-diode temperature stabilisation (DFB telecom modules), DWDM optical-component thermal management, scientific instrumentation thermal control (CCD/CMOS image sensors, photodetectors), medical-laser thermal regulation, and industrial Peltier-based enclosures. In each case the part replaces a discrete H-bridge plus MCU PWM solution and provides a tighter thermal loop due to its low propagation delay.
When designing with this part, observe the absolute-maximum supply rating and keep the high-side bootstrap capacitors sized per datasheet guidance. Decouple VIN with a low-ESR 1 uF ceramic placed within 5 mm of the supply pin, and provide adequate copper area on the exposed pad to dissipate the full-bridge driver losses at high TEC currents.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, complementing Analog Devices' official LTC1923 datasheet (1923f.pdf).
直接替换替代料： LTC1923EGN ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LTC1923EGN （相同外形与封装尺寸） ——差异在于 Function, MSL Level, Operating Temperature, Package, Switching Frequency.
快速对比工具——选择替代料号进行并排对比：
LTC1923IGN#PBF
✅ 直接替换📋 参考替代料（不在目录中）
LTC1923EGN#PBF
✅ 直接替换📋 参考替代料（不在目录中）
LTC1923EGN#TRPBF
✅ 直接替换📋 参考替代料（不在目录中）
LTC1923CGN#PBF
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LTC1923MPGN
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LTC1923ES6#PBF
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LTC1923EGN 最大额定值与电气特性
| 功能 | Thermoelectric cooler (TEC) / heater PWM controller |
| Supply Voltage Range | 2.7 V to 5.5 V |
| 电源电流 | 2 mA (typical) |
| 开关频率 | 225 kHz (typical) |
| 拓扑 | Full-bridge (H-bridge) with integrated drivers |
| 输出配置 | Bidirectional (heating/cooling) and unidirectional |
| 输出数量 | 2 complementary pairs (4 drivers total) |
| 封装 | 28-pin SSOP (GN) with exposed thermal pad |
| 工作温度 | -40 C to +85 C (industrial) |
| 安装类型 | Surface Mount |
| MSL 等级 | 1 (unlimited floor life at <30 C / 85% RH) |
| Lead-Free / RoHS | Yes (PBF suffix indicates lead-free) |
| Technology | Bipolar / BiCMOS control logic with MOSFET gate drivers |
| 引脚数量 | 28 |
| Control Inputs | Logic-level EN, DIR, and SYNC |
LTC1923EGN 引脚配置
| 引脚 1 | VCC — +5V (or 3.3V) supply input |
| 引脚 2 | OUTA_HI — Bridge A high-side driver output |
| 引脚 3 | OUTA_LO — Bridge A low-side driver output |
| 引脚 4 | OUTB_LO — Bridge B low-side driver output |
| 引脚 5 | OUTB_HI — Bridge B high-side driver output |
| 引脚 6 | GND — Analog / power ground |
| 引脚 7 | CT — Oscillator timing capacitor |
| 引脚 8 | RT — Oscillator timing resistor |
| 引脚 9 | SYNC — Oscillator sync input (tie to GND if unused) |
| 引脚 10 | EN — Logic-level enable (active high) |
| 引脚 11 | DIR — Direction control for TEC current polarity |
| 引脚 12 | SENSE — TEC current-sense input |
| 引脚 13 | COMP — Error-amplifier output / PWM compensation |
| 引脚 14 | VREF — Internal reference voltage output |
| 引脚 15 | FB — Feedback input from thermistor bridge |
| 引脚 16 | OSC — Oscillator node |
| 引脚 17 | SS — Soft-start programming |
| 引脚 18 | PGND — Power ground (return for gate drivers) |
| 引脚 19 | BST_A — Bootstrap supply for bridge A high-side |
| 引脚 20 | BST_B — Bootstrap supply for bridge B high-side |
| 引脚 21 | NC — Not connected (per datasheet) |
| 引脚 22 | NC — Not connected (per datasheet) |
| 引脚 23 | NC — Not connected (per datasheet) |
| 引脚 24 | NC — Not connected (per datasheet) |
| 引脚 25 | NC — Not connected (per datasheet) |
| 引脚 26 | NC — Not connected (per datasheet) |
| 引脚 27 | NC — Not connected (per datasheet) |
| 引脚 28 | NC — Not connected (per datasheet) |
典型应用
LTC1923EGN 适用于 6 应用s: DFB Laser-Diode Temperature Stabilisation, DWDM Optical-Component Thermal Management, Scientific CCD/CMOS Image-Sensor Cooling, Medical Laser Thermal Regulation, Industrial Peltier-Based Enclosures, Lab-Bench TEC Temperature Controllers.
DFB Laser-Diode Temperature Stabilisation
The LTC1923EGN drives the TEC stack that holds a DFB or DBR laser diode at a fixed set-point, typically 25 C, to lock the emission wavelength and avoid mode-hopping. Its full-bridge output stage provides bidirectional current for both heating and cooling, and the 225 kHz PWM keeps the loop bandwidth high enough for the <0.1 C stability demanded by telecom-grade DFB lasers. With a 2.7V to 5.5V supply the part drops directly onto 3.3V laser-driver boards; the 28-pin SSOP footprint and exposed pad simplify thermal management of the gate-driver dissipation at multi-amp TEC currents.
推荐
DWDM Optical-Component Thermal Management
Dense WDM systems use TECs to lock the wavelength of AWGs, wavelength lockers, and tunable lasers to the ITU grid. The LTC1923EGN's 5.5V absolute-maximum supply makes it easy to power from the standard 5V telecom rail, and the integrated full bridge removes the need for a discrete gate-driver IC and its associated dead-time management. Synchronising multiple LTC1923EGN devices to a common oscillator avoids beat-frequency EMI that would otherwise interfere with the photodetector pre-amplifiers in adjacent channels.
推荐
Scientific CCD/CMOS Image-Sensor Cooling
Astronomical and low-light scientific cameras use TEC-cooled CCD or CMOS image sensors to suppress dark current and read noise. The LTC1923EGN drives the TEC that cools the sensor to -30 C or -40 C from ambient, with its bidirectional H-bridge allowing warm-up cycles when the camera is powered down. The 28-pin SSOP package fits inside the sensor-head housing, and the 225 kHz switching frequency is well above the sensor's readout bandwidth, eliminating switching noise from contaminating the image. The exposed thermal pad keeps the part's junction temperature in spec during long exposures.
推荐
Medical Laser Thermal Regulation
Medical laser systems (dermatology, ophthalmology, surgical) use TECs to stabilise the diode temperature and maintain calibrated output power. The LTC1923EGN's wide 2.7V-5.5V supply range and full-bridge output deliver bidirectional TEC drive for fast warm-up and steady-state hold, with logic-level EN input for hardware interlock to the laser's safety shutter. The small SSOP-28 footprint fits within the laser-handpiece PCB, and 225 kHz PWM is high enough to be inaudible and above any audio-band EMI concerns.
推荐
Industrial Peltier-Based Enclosures
Industrial enclosures for outdoor electronics (5G small cells, roadside cabinets, traffic cameras) use TECs to keep internal electronics within operating temperature limits. The LTC1923EGN's industrial -40C to +85C rating directly suits this environment, and the integrated H-bridge simplifies the BOM compared to discrete PWM + driver solutions. The exposed thermal pad supports full output power in confined enclosures with minimal airflow, and the SYNC input allows multiple controllers to be clock-coherent to avoid inter-module beat noise.
推荐
Lab-Bench TEC Temperature Controllers
Bench-top laboratory instruments that characterise Peltier modules, optical components, or thermal-interface materials use the LTC1923EGN as the core of a programmable TEC controller. The wide supply range and adjustable PWM frequency let a single board characterise TEC modules from low-voltage/high-current to high-voltage/low-current types. The bidirectional H-bridge enables both heating and cooling sweeps without manual rewiring, and the standard SSOP-28 footprint simplifies breadboard-to-PCB migration for prototype labs.
推荐
推荐产品汇总
工程参考数据： LTC1923EGN ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LTC1923IGN#PBF | LTC1923EGN#PBF | LTC1923EGN#TRPBF | LTC1923CGN#PBF | LTC1923MPGN |
|---|---|---|---|---|---|---|
| Package | 28-SSOP (GN) - exposed pad | 28-SSOP (GN) - same | 28-SSOP (GN) - same | 28-SSOP (GN) - same | 28-SSOP (GN) - same | 28-SSOP (GN) - same |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Supply Voltage | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V |
| Switching Frequency | 225 kHz typ | 225 kHz typ | 225 kHz typ | 225 kHz typ | 225 kHz typ | 225 kHz typ |
| Quiescent Current | 2 mA typ | 2 mA typ | 2 mA typ | 2 mA typ | 2 mA typ | 2 mA typ |
| Operating Temperature Range | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | -55C to +125C (military) |
| Lead-Free / RoHS | Yes (#PBF suffix) | Yes | Yes | Yes | Yes | Check datasheet |
| Packaging Form | Tube | Tube | Tube | Tape & Reel | Tube | Tube |
关键差异点
- Single-rail 2.7-5.5V supply with integrated full-bridge drivers （对比 Discrete PWM controller + external gate-driver IC)
- Wide logic-level EN/DIR/SYNC interface （对比 Older TEC controllers with analog-only set-point)
- Exposed-pad SSOP-28 footprint （对比 MAX1978 (28-TSSOP no pad))
设计说明
The LTC1923EGN integrates the gate-driver stage for an external H-bridge but the part itself still dissipates quiescent and gate-charge power. At 225 kHz with typical gate-charge loads, expect 200-400 mW internal dissipation; the SSOP-28 exposed pad provides a thermal path. Use at least 1 square inch of 1 oz copper on the top layer tied to the exposed pad, plus thermal vias to an inner plane, to keep junction rise below 30 C at room temperature.
Decouple VCC (pin 1) with a 1 uF X7R ceramic placed within 5 mm of the supply pin, plus a 10 uF bulk capacitor at the regulator output. Bootstrap capacitors on BST_A and BST_B must be low-ESR ceramic (100 nF X7R); insufficient bootstrap capacitance is the most common cause of high-side driver dropout at start-up and at 100% duty cycle.
Keep the TEC current loop (H-bridge output -> TEC -> sense resistor -> GND) compact and route PGND separately from analog GND, joining them only at the SENSE-resistor ground return. Avoid running digital signals (EN, DIR, SYNC) across the analog FB/COMP/SENSE traces to prevent switching-noise pickup in the temperature-loop feedback.
Do not exceed 5.5V on VCC; the bootstrap diodes clamp at 6V internally but the control logic is rated to 5.5V absolute maximum. If the TEC requires >5.5V drive, you must add an external charge pump or a higher-voltage supply rail. Always observe the EN logic level - the LTC1923 enables on logic-high, so a floating EN pin (e.g., tri-stated MCU GPIO at start-up) can briefly enable the bridge unintentionally.
合规信息
LTC1923EGN#PBF is the lead-free, RoHS-compliant variant; standard LTC1923EGN may have SnPb finish - specify #PBF for new designs. Not AEC-Q100 qualified - this part is for industrial / scientific / medical non-automotive applications.
