LTC1923EGN - TEC Controller PWM, 2.7-5.5V | Analog Devices
N.º da peça: LTC1923EGN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.1 | $131,00 |
| 100 | $11.65 | $1.165,00 |
| 500 | $10.2 | $5.100,00 |
| 1.000 | $9.05 | $9.050,00 |
LTC1923EGN Visão geral
A thermoelectric cooler (TEC) controller is a specialised power-management IC that drives a Peltier-effect module used for solid-state heating and cooling. TEC modules require DC current whose polarity selects heating vs cooling and whose magnitude controls thermal flux, so the controller must provide an efficient bidirectional current source. The LTC1923 family fits in the broader hierarchy: PMIC -> power management specialised -> TEC controller -> semiconductor IC. The part complements optical transceivers, DFB/DBR laser diodes, scientific CCD/CMOS sensors, and any closed-loop thermal system where sub-100 mK stability is the design target.
Key features include a single-rail 2.7-5.5V supply, 2 mA supply current, integrated full-bridge drivers rated for the TEC load, support for both heating and cooling modes, and a synchronisable oscillator. The SSOP-28 footprint with thermal pad keeps PCB area small while offering a thermal path for the gate-driver dissipation. The wide supply range makes the part directly compatible with 3.3V and 5V digital rails found in laser-diode driver boards and instrumentation front-ends.
The LTC1923 implements a voltage-mode PWM core with adjustable dead time, integrated bootstrap drivers for the high-side switches, and logic-level control inputs for direction and enable. By integrating the full-bridge drivers, the part removes the need for an external gate-driver IC and the dead-time management normally associated with discrete H-bridge designs, simplifying the BOM and reducing the loop-delay penalty in the thermal control loop.
Typical applications include DFB laser-diode temperature stabilisation (DFB telecom modules), DWDM optical-component thermal management, scientific instrumentation thermal control (CCD/CMOS image sensors, photodetectors), medical-laser thermal regulation, and industrial Peltier-based enclosures. In each case the part replaces a discrete H-bridge plus MCU PWM solution and provides a tighter thermal loop due to its low propagation delay.
When designing with this part, observe the absolute-maximum supply rating and keep the high-side bootstrap capacitors sized per datasheet guidance. Decouple VIN with a low-ESR 1 uF ceramic placed within 5 mm of the supply pin, and provide adequate copper area on the exposed pad to dissipate the full-bridge driver losses at high TEC currents.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, complementing Analog Devices' official LTC1923 datasheet (1923f.pdf).
Alternativas drop-in para LTC1923EGN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LTC1923EGN (mesmo formato e footprint) — diferindo em Function, MSL Level, Operating Temperature, Package, Switching Frequency.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LTC1923IGN#PBF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LTC1923EGN#PBF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LTC1923EGN#TRPBF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LTC1923CGN#PBF
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LTC1923MPGN
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LTC1923ES6#PBF
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LTC1923EGN Classificações máximas e características elétricas
| Função | Thermoelectric cooler (TEC) / heater PWM controller |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Corrente de alimentação | 2 mA (typical) |
| Frequência de comutação | 225 kHz (typical) |
| Topologia | Full-bridge (H-bridge) with integrated drivers |
| Configuração de saída | Bidirectional (heating/cooling) and unidirectional |
| Número de saídas | 2 complementary pairs (4 drivers total) |
| Encapsulamento | 28-pin SSOP (GN) with exposed thermal pad |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 1 (unlimited floor life at <30 C / 85% RH) |
| Lead-Free / RoHS | Yes (PBF suffix indicates lead-free) |
| Technology | Bipolar / BiCMOS control logic with MOSFET gate drivers |
| Contagem de pinos | 28 |
| Control Inputs | Logic-level EN, DIR, and SYNC |
Configuração de pinos do LTC1923EGN
| Pino 1 | VCC — +5V (or 3.3V) supply input |
| Pino 2 | OUTA_HI — Bridge A high-side driver output |
| Pino 3 | OUTA_LO — Bridge A low-side driver output |
| Pino 4 | OUTB_LO — Bridge B low-side driver output |
| Pino 5 | OUTB_HI — Bridge B high-side driver output |
| Pino 6 | GND — Analog / power ground |
| Pino 7 | CT — Oscillator timing capacitor |
| Pino 8 | RT — Oscillator timing resistor |
| Pino 9 | SYNC — Oscillator sync input (tie to GND if unused) |
| Pino 10 | EN — Logic-level enable (active high) |
| Pino 11 | DIR — Direction control for TEC current polarity |
| Pino 12 | SENSE — TEC current-sense input |
| Pino 13 | COMP — Error-amplifier output / PWM compensation |
| Pino 14 | VREF — Internal reference voltage output |
| Pino 15 | FB — Feedback input from thermistor bridge |
| Pino 16 | OSC — Oscillator node |
| Pino 17 | SS — Soft-start programming |
| Pino 18 | PGND — Power ground (return for gate drivers) |
| Pino 19 | BST_A — Bootstrap supply for bridge A high-side |
| Pino 20 | BST_B — Bootstrap supply for bridge B high-side |
| Pino 21 | NC — Not connected (per datasheet) |
| Pino 22 | NC — Not connected (per datasheet) |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
Aplicações típicas
LTC1923EGN é adequado para 6 aplicaçãos: DFB Laser-Diode Temperature Stabilisation, DWDM Optical-Component Thermal Management, Scientific CCD/CMOS Image-Sensor Cooling, Medical Laser Thermal Regulation, Industrial Peltier-Based Enclosures, Lab-Bench TEC Temperature Controllers.
DFB Laser-Diode Temperature Stabilisation
The LTC1923EGN drives the TEC stack that holds a DFB or DBR laser diode at a fixed set-point, typically 25 C, to lock the emission wavelength and avoid mode-hopping. Its full-bridge output stage provides bidirectional current for both heating and cooling, and the 225 kHz PWM keeps the loop bandwidth high enough for the <0.1 C stability demanded by telecom-grade DFB lasers. With a 2.7V to 5.5V supply the part drops directly onto 3.3V laser-driver boards; the 28-pin SSOP footprint and exposed pad simplify thermal management of the gate-driver dissipation at multi-amp TEC currents.
Recomendado
DWDM Optical-Component Thermal Management
Dense WDM systems use TECs to lock the wavelength of AWGs, wavelength lockers, and tunable lasers to the ITU grid. The LTC1923EGN's 5.5V absolute-maximum supply makes it easy to power from the standard 5V telecom rail, and the integrated full bridge removes the need for a discrete gate-driver IC and its associated dead-time management. Synchronising multiple LTC1923EGN devices to a common oscillator avoids beat-frequency EMI that would otherwise interfere with the photodetector pre-amplifiers in adjacent channels.
Recomendado
Scientific CCD/CMOS Image-Sensor Cooling
Astronomical and low-light scientific cameras use TEC-cooled CCD or CMOS image sensors to suppress dark current and read noise. The LTC1923EGN drives the TEC that cools the sensor to -30 C or -40 C from ambient, with its bidirectional H-bridge allowing warm-up cycles when the camera is powered down. The 28-pin SSOP package fits inside the sensor-head housing, and the 225 kHz switching frequency is well above the sensor's readout bandwidth, eliminating switching noise from contaminating the image. The exposed thermal pad keeps the part's junction temperature in spec during long exposures.
Recomendado
Medical Laser Thermal Regulation
Medical laser systems (dermatology, ophthalmology, surgical) use TECs to stabilise the diode temperature and maintain calibrated output power. The LTC1923EGN's wide 2.7V-5.5V supply range and full-bridge output deliver bidirectional TEC drive for fast warm-up and steady-state hold, with logic-level EN input for hardware interlock to the laser's safety shutter. The small SSOP-28 footprint fits within the laser-handpiece PCB, and 225 kHz PWM is high enough to be inaudible and above any audio-band EMI concerns.
Recomendado
Industrial Peltier-Based Enclosures
Industrial enclosures for outdoor electronics (5G small cells, roadside cabinets, traffic cameras) use TECs to keep internal electronics within operating temperature limits. The LTC1923EGN's industrial -40C to +85C rating directly suits this environment, and the integrated H-bridge simplifies the BOM compared to discrete PWM + driver solutions. The exposed thermal pad supports full output power in confined enclosures with minimal airflow, and the SYNC input allows multiple controllers to be clock-coherent to avoid inter-module beat noise.
Recomendado
Lab-Bench TEC Temperature Controllers
Bench-top laboratory instruments that characterise Peltier modules, optical components, or thermal-interface materials use the LTC1923EGN as the core of a programmable TEC controller. The wide supply range and adjustable PWM frequency let a single board characterise TEC modules from low-voltage/high-current to high-voltage/low-current types. The bidirectional H-bridge enables both heating and cooling sweeps without manual rewiring, and the standard SSOP-28 footprint simplifies breadboard-to-PCB migration for prototype labs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LTC1923EGN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LTC1923IGN#PBF | LTC1923EGN#PBF | LTC1923EGN#TRPBF | LTC1923CGN#PBF | LTC1923MPGN |
|---|---|---|---|---|---|---|
| Package | 28-SSOP (GN) - exposed pad | 28-SSOP (GN) - same | 28-SSOP (GN) - same | 28-SSOP (GN) - same | 28-SSOP (GN) - same | 28-SSOP (GN) - same |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Supply Voltage | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V |
| Switching Frequency | 225 kHz typ | 225 kHz typ | 225 kHz typ | 225 kHz typ | 225 kHz typ | 225 kHz typ |
| Quiescent Current | 2 mA typ | 2 mA typ | 2 mA typ | 2 mA typ | 2 mA typ | 2 mA typ |
| Operating Temperature Range | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | -55C to +125C (military) |
| Lead-Free / RoHS | Yes (#PBF suffix) | Yes | Yes | Yes | Yes | Check datasheet |
| Packaging Form | Tube | Tube | Tube | Tape & Reel | Tube | Tube |
Principais diferenciais
- Single-rail 2.7-5.5V supply with integrated full-bridge drivers (vs Discrete PWM controller + external gate-driver IC)
- Wide logic-level EN/DIR/SYNC interface (vs Older TEC controllers with analog-only set-point)
- Exposed-pad SSOP-28 footprint (vs MAX1978 (28-TSSOP no pad))
Notas de projeto
The LTC1923EGN integrates the gate-driver stage for an external H-bridge but the part itself still dissipates quiescent and gate-charge power. At 225 kHz with typical gate-charge loads, expect 200-400 mW internal dissipation; the SSOP-28 exposed pad provides a thermal path. Use at least 1 square inch of 1 oz copper on the top layer tied to the exposed pad, plus thermal vias to an inner plane, to keep junction rise below 30 C at room temperature.
Decouple VCC (pin 1) with a 1 uF X7R ceramic placed within 5 mm of the supply pin, plus a 10 uF bulk capacitor at the regulator output. Bootstrap capacitors on BST_A and BST_B must be low-ESR ceramic (100 nF X7R); insufficient bootstrap capacitance is the most common cause of high-side driver dropout at start-up and at 100% duty cycle.
Keep the TEC current loop (H-bridge output -> TEC -> sense resistor -> GND) compact and route PGND separately from analog GND, joining them only at the SENSE-resistor ground return. Avoid running digital signals (EN, DIR, SYNC) across the analog FB/COMP/SENSE traces to prevent switching-noise pickup in the temperature-loop feedback.
Do not exceed 5.5V on VCC; the bootstrap diodes clamp at 6V internally but the control logic is rated to 5.5V absolute maximum. If the TEC requires >5.5V drive, you must add an external charge pump or a higher-voltage supply rail. Always observe the EN logic level - the LTC1923 enables on logic-high, so a floating EN pin (e.g., tri-stated MCU GPIO at start-up) can briefly enable the bridge unintentionally.
Informações de conformidade
LTC1923EGN#PBF is the lead-free, RoHS-compliant variant; standard LTC1923EGN may have SnPb finish - specify #PBF for new designs. Not AEC-Q100 qualified - this part is for industrial / scientific / medical non-automotive applications.
