M1AFS1500-FG676I - 1.5M Gate Fusion FPGA 676-FBGA | Microchip
Référence : M1AFS1500-FG676I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $425.73 | $425,73 |
| 10 | $425.73 | $4 257,30 |
| 100 | $425.73 | $42 573,00 |
| 500 | $425.73 | $212 865,00 |
| 1 000 | $425.73 | $425 730,00 |
M1AFS1500-FG676I Présentation
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable fabric, allowing designers to implement custom digital circuits after manufacturing. Within the programmable logic hierarchy, the Fusion family sits in Microchip's (formerly Microsemi/Actel) flash-based FPGA portfolio, occupying the mixed-signal niche between pure digital ProASIC3 devices and radiation-tolerant RTAX space parts.
Key differentiating features of the Fusion family include configurable analog blocks (ADC, monitors) integrated on the same die, large flash memory blocks, comprehensive clock generation and management circuitry (PLL/CCC), and high-performance flash-based programmable logic in a monolithic device. The flash-based fabric is inherently non-volatile and secure: no configuration PROM is required at power-up, and bitstream readback is prevented by design, which matters for defense and industrial designs where IP protection is mandatory.
Technically, the device is fabricated on a 130nm flash process with a 1.5V core supply, and family documentation cites an internal performance figure of 1098.9 MHz. Because configuration cells are flash rather than SRAM, the device achieves very low static power and high resistance to single-event configuration upsets compared with SRAM FPGAs, and the M1 prefix denotes the Fusion mixed-signal variant with analog subsystem access.
Typical applications include industrial automation and motor control where on-die analog monitoring replaces external ADCs, embedded systems requiring secure non-volatile configuration, power-supply supervision and board-management controllers, and aerospace/defense ground equipment using the industrial-temperature I-grade device.
Design consideration: the 676-FBGA package demands controlled-impedance PCB stackup and precise ball-map fan-out; verify power-rail sequencing of the 1.5V core versus I/O banks in your layout before tape-out.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-02.
Alternatives de remplacement direct pour M1AFS1500-FG676I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec M1AFS1500-FG676I (même facteur de forme et même empreinte) — différant par Family, Package, Process Technology, Speed Grade, System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
M1AFS1500-FG676
✅ Remplacement direct✓ En stock
$372 / unité
Voir la fiche technique →M1AFS1500-1FGG676I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →M1AFS1500-2FG676I
✅ Remplacement direct✓ En stock
$405 / unité
Voir la fiche technique →M1AFS1500-FG676I Valeurs maximales et caractéristiques électriques
| Family | Fusion (M1AFS1500) |
| System Gates | 1.5 M |
| Technology | 130 nm flash-based |
| Core Supply Voltage | 1.5 V |
| User I/O | 252 |
| Boîtier | 676-ball FBGA (FG676) |
| Type de montage | Surface Mount |
| Configuration Type | Flash-based, non-volatile (no external config PROM) |
| Analog Blocks | Configurable analog subsystem (ADC, voltage/temp monitors) |
| Clock Management | Integrated CCC (clock conditioning circuits) with PLL |
| On-chip Flash Memory | Large flash memory blocks integrated |
| Performance Figure | 1098.9 MHz (family-rated internal clock figure) |
| Temperature Grade | Industrial (-40C to +85C), suffix I |
| Packaging | Tray |
Guide de configuration des broches du M1AFS1500-FG676I 676-ball fbga (fg676)
Configuration des broches du M1AFS1500-FG676I (boîtier 676-ball fbga (fg676)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour M1AFS1500-FG676I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
M1AFS1500-FG676I convient pour 6 applications: Industrial Automation and Motor Control, Board Power Management and Sequencing, Secure Embedded Control Systems, Aerospace and Defense Ground Equipment, Test and Measurement Instrumentation, Communications and Networking Line Cards.
Industrial Automation and Motor Control
The M1AFS1500-FG676I fits industrial automation because its flash-based 1.5M-gate fabric delivers deterministic, instantly-on logic while the integrated Fusion analog subsystem (ADC plus voltage and temperature monitors) closes local control loops without external converters. In a motor drive, the 252 user I/O implement PWM generation, encoder interfaces, and fault-latch logic, while on-die sensing supervises drive rail voltages. Because configuration is stored in on-chip flash, the controller is active within microseconds of power application - critical for safety interlocks. The industrial -40C to +85C rating of the I-grade part matches factory-floor ambient extremes, and the 676-FBGA supports the dense I/O fan-out typical of multi-axis servo boards.
Recommandé
Board Power Management and Sequencing
Fusion was designed specifically for smart power board management, and the M1AFS1500-FG676I implements complete power-tree supervision in one chip. The configurable analog blocks continuously monitor multiple supply rails through on-chip ADC channels, while the flash fabric executes sequencing state machines, brown-out detection, and fan control without a boot delay. The 1.5V core and 130nm process yield low static power for an always-on supervisor role. Compared with a discrete sequencer plus microcontroller plus ADC chain, the monolithic Fusion device removes 3-5 BOM line items and eliminates inter-chip communication latency, and the 676-FBGA leaves abundant I/O for rail enable, PGOOD, and I2C/PMBus telemetry interfaces.
Recommandé
Secure Embedded Control Systems
The flash-based M1AFS1500-FG676I suits secure embedded control where bitstream confidentiality is mandatory. Unlike SRAM FPGAs that load configuration from an external device at every power-up, the Fusion fabric stores configuration in on-chip flash, so the design never appears on an external bus where it could be intercepted, and readback paths are architecturally absent. The 1.5M-gate capacity accommodates crypto accelerators, secure boot state machines, and custom peripherals alongside application logic. The industrial temperature rating and mature, verified 130nm flash process make it a common choice in defense ground equipment, secure communications, and industrial IP-protective designs that must survive long field lifetimes with no configuration device to fail.
Recommandé
Aerospace and Defense Ground Equipment
The industrial-grade M1AFS1500-FG676I serves aerospace and defense ground and test equipment that needs rugged logic without radiation-tolerant RTAX pricing. Flash configuration cells are inherently less susceptible to single-event configuration upsets than SRAM cells, improving availability in environments with particle flux, while the 1.5V core limits dynamic power in conduction-cooled enclosures. The 252 user I/O and 676-FBGA footprint support high-pin-count backplane and sensor interfaces, and Microchip's ProASIC/RTAX tool-chain lineage means Libero SoC design flows carry directly to flight-grade siblings if a program later upgrades to RTAX2000S devices. Typical uses include telemetry formatting, sensor fusion, and platform management controllers.
Recommandé
Test and Measurement Instrumentation
In test and measurement hardware, the M1AFS1500-FG676I provides glueless interfacing between high-pin-count front-end ASICs, ADCs, and a backplane, with 252 user I/O absorbing data capture, trigger logic, and protocol bridging. The integrated PLL-based clock conditioning circuits generate and clean the sampling clocks the fabric consumes, and the family's 1098.9 MHz internal performance figure supports fast synchronous capture paths. Non-volatile flash configuration means an instrument powers up ready in instrument-grade boot times with no external loader. The industrial temperature range covers bench-to-field deployment, and the monolithic analog monitoring channel can log chassis temperature and rail health for calibration records.
Recommandé
Communications and Networking Line Cards
The M1AFS1500-FG676I fits communications line-card control-plane roles: framing, link supervision, LED/alarms, and JTAG boundary management for denser switching silicon. Its flash fabric is live at power-on, which matters for背面板 address decoding and hot-swap controllers that must be active before host software boots. The 676-FBGA provides the dense I/O edge required to reach many transceiver and PHY control pins from one controller, and PLL-based clock conditioning simplifies distributing a clean reference across the card. Designers also value the low static power of 130nm flash fabric for always-on management traffic, and the industrial I-grade covers telecom central-office ambient specifications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour M1AFS1500-FG676I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | M1AFS1500-FG676 | M1AFS1500-1FGG676I | M1AFS1500-2FG676I |
|---|---|---|---|---|
| Package | 676-ball FBGA (FG676) | 676-ball FBGA (FG676) - same | 676-ball FBGA (FGG676, green) - same footprint | 676-ball FBGA (FG676) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| User I/O | 252 | 252 | 252 | 252 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | Standard | Standard | -1 | -2 (fastest) |
| Temperature Range | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Configuration Type | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile |
Principaux différenciateurs
- Non-volatile flash configuration with no external boot device (vs SRAM-based FPGAs (Xilinx/Intel equivalents))
- Integrated mixed-signal analog subsystem (vs M1AFS600-FG484I)
- Industrial-grade availability with speed-grade flexibility (vs M1AFS1500-2FG676I)
Notes de conception
The 676-ball FBGA demands a controlled-impedance stackup and disciplined fan-out. Plan via-in-pad or dog-house escapes for the inner ball columns, and allocate complete I/O banks before routing so VCCO domains stay coherent. Obtain the FG676 ball map directly from Microchip Libero SoC rather than third-party mirrors, then lock your pin assignment early because Fusion bank rules constrain which signals may share a supply domain.
The device uses a 1.5V core with separate I/O bank supplies; confirm power-rail sequencing in your design. Because flash fabric is non-volatile, the device begins configuration immediately at power-up, so all monitored rails must be valid before logic that acts on them executes. Estimate: at typical mid-density utilization, static power of 130nm flash fabric is low, but dynamic power scales with clock rate - run Microchip's power estimator with your post-layout netlist rather than relying on rules of thumb.
Do not treat the M1AFS1500 as a commodity FPGA: the Fusion analog subsystem has its own reference and layout requirements - keep analog monitor inputs away from switching nodes and follow the Fusion datasheet's analog layout guidance. Also verify speed grade before timing sign-off: standard, -1, and -2 grades close timing differently, and downgrading a -2 design to standard grade can fail timing at the same clock frequency.
Estimated: a 676-FBGA dissipating a few watts on a standard 4-layer PCB requires solid ground-plane coupling under the package. Ball-count thermal resistance is dominated by the PCB, not the package, so maximize via arrays from the package perimeter into inner ground planes. If your design runs the fabric near the 1098.9 MHz family performance figure, budget airflow or a heatsink based on Microchip's thermal calculator output for your exact layer count.
Informations de conformité
Distributor snippets for this exact MPN do not state RoHS/lead-free status; verify on the Microchip product page environmental data. G-suffix FGG variants indicate green (halogen-free) packaging within the same family.
