M1AFS1500-FG676I - 1.5M Gate Fusion FPGA 676-FBGA | Microchip
부품 번호: M1AFS1500-FG676I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425.73 | $425.73 |
| 10 | $425.73 | $4,257.30 |
| 100 | $425.73 | $42,573.00 |
| 500 | $425.73 | $212,865.00 |
| 1,000 | $425.73 | $425,730.00 |
M1AFS1500-FG676I 개요
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable fabric, allowing designers to implement custom digital circuits after manufacturing. Within the programmable logic hierarchy, the Fusion family sits in Microchip's (formerly Microsemi/Actel) flash-based FPGA portfolio, occupying the mixed-signal niche between pure digital ProASIC3 devices and radiation-tolerant RTAX space parts.
Key differentiating features of the Fusion family include configurable analog blocks (ADC, monitors) integrated on the same die, large flash memory blocks, comprehensive clock generation and management circuitry (PLL/CCC), and high-performance flash-based programmable logic in a monolithic device. The flash-based fabric is inherently non-volatile and secure: no configuration PROM is required at power-up, and bitstream readback is prevented by design, which matters for defense and industrial designs where IP protection is mandatory.
Technically, the device is fabricated on a 130nm flash process with a 1.5V core supply, and family documentation cites an internal performance figure of 1098.9 MHz. Because configuration cells are flash rather than SRAM, the device achieves very low static power and high resistance to single-event configuration upsets compared with SRAM FPGAs, and the M1 prefix denotes the Fusion mixed-signal variant with analog subsystem access.
Typical applications include industrial automation and motor control where on-die analog monitoring replaces external ADCs, embedded systems requiring secure non-volatile configuration, power-supply supervision and board-management controllers, and aerospace/defense ground equipment using the industrial-temperature I-grade device.
Design consideration: the 676-FBGA package demands controlled-impedance PCB stackup and precise ball-map fan-out; verify power-rail sequencing of the 1.5V core versus I/O banks in your layout before tape-out.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-02.
드롭인 대체품: M1AFS1500-FG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS1500-FG676I (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, Process Technology, Speed Grade, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS1500-FG676
✅ 드롭인✓ 재고 있음
$372 / 개
데이터시트 보기 →M1AFS1500-1FGG676I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS1500-2FG676I
✅ 드롭인✓ 재고 있음
$405 / 개
데이터시트 보기 →M1AFS1500-FG676I 최대 정격 & 전기적 특성
| Family | Fusion (M1AFS1500) |
| System Gates | 1.5 M |
| Technology | 130 nm flash-based |
| Core Supply Voltage | 1.5 V |
| User I/O | 252 |
| 패키지 | 676-ball FBGA (FG676) |
| 실장 유형 | Surface Mount |
| Configuration Type | Flash-based, non-volatile (no external config PROM) |
| Analog Blocks | Configurable analog subsystem (ADC, voltage/temp monitors) |
| Clock Management | Integrated CCC (clock conditioning circuits) with PLL |
| On-chip Flash Memory | Large flash memory blocks integrated |
| Performance Figure | 1098.9 MHz (family-rated internal clock figure) |
| Temperature Grade | Industrial (-40C to +85C), suffix I |
| Packaging | Tray |
M1AFS1500-FG676I 676-ball fbga (fg676) 핀 구성 가이드
M1AFS1500-FG676I(676-ball fbga (fg676) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS1500-FG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS1500-FG676I 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Board Power Management and Sequencing, Secure Embedded Control Systems, Aerospace and Defense Ground Equipment, Test and Measurement Instrumentation, Communications and Networking Line Cards.
Industrial Automation and Motor Control
The M1AFS1500-FG676I fits industrial automation because its flash-based 1.5M-gate fabric delivers deterministic, instantly-on logic while the integrated Fusion analog subsystem (ADC plus voltage and temperature monitors) closes local control loops without external converters. In a motor drive, the 252 user I/O implement PWM generation, encoder interfaces, and fault-latch logic, while on-die sensing supervises drive rail voltages. Because configuration is stored in on-chip flash, the controller is active within microseconds of power application - critical for safety interlocks. The industrial -40C to +85C rating of the I-grade part matches factory-floor ambient extremes, and the 676-FBGA supports the dense I/O fan-out typical of multi-axis servo boards.
추천
Board Power Management and Sequencing
Fusion was designed specifically for smart power board management, and the M1AFS1500-FG676I implements complete power-tree supervision in one chip. The configurable analog blocks continuously monitor multiple supply rails through on-chip ADC channels, while the flash fabric executes sequencing state machines, brown-out detection, and fan control without a boot delay. The 1.5V core and 130nm process yield low static power for an always-on supervisor role. Compared with a discrete sequencer plus microcontroller plus ADC chain, the monolithic Fusion device removes 3-5 BOM line items and eliminates inter-chip communication latency, and the 676-FBGA leaves abundant I/O for rail enable, PGOOD, and I2C/PMBus telemetry interfaces.
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Secure Embedded Control Systems
The flash-based M1AFS1500-FG676I suits secure embedded control where bitstream confidentiality is mandatory. Unlike SRAM FPGAs that load configuration from an external device at every power-up, the Fusion fabric stores configuration in on-chip flash, so the design never appears on an external bus where it could be intercepted, and readback paths are architecturally absent. The 1.5M-gate capacity accommodates crypto accelerators, secure boot state machines, and custom peripherals alongside application logic. The industrial temperature rating and mature, verified 130nm flash process make it a common choice in defense ground equipment, secure communications, and industrial IP-protective designs that must survive long field lifetimes with no configuration device to fail.
추천
Aerospace and Defense Ground Equipment
The industrial-grade M1AFS1500-FG676I serves aerospace and defense ground and test equipment that needs rugged logic without radiation-tolerant RTAX pricing. Flash configuration cells are inherently less susceptible to single-event configuration upsets than SRAM cells, improving availability in environments with particle flux, while the 1.5V core limits dynamic power in conduction-cooled enclosures. The 252 user I/O and 676-FBGA footprint support high-pin-count backplane and sensor interfaces, and Microchip's ProASIC/RTAX tool-chain lineage means Libero SoC design flows carry directly to flight-grade siblings if a program later upgrades to RTAX2000S devices. Typical uses include telemetry formatting, sensor fusion, and platform management controllers.
추천
Test and Measurement Instrumentation
In test and measurement hardware, the M1AFS1500-FG676I provides glueless interfacing between high-pin-count front-end ASICs, ADCs, and a backplane, with 252 user I/O absorbing data capture, trigger logic, and protocol bridging. The integrated PLL-based clock conditioning circuits generate and clean the sampling clocks the fabric consumes, and the family's 1098.9 MHz internal performance figure supports fast synchronous capture paths. Non-volatile flash configuration means an instrument powers up ready in instrument-grade boot times with no external loader. The industrial temperature range covers bench-to-field deployment, and the monolithic analog monitoring channel can log chassis temperature and rail health for calibration records.
추천
Communications and Networking Line Cards
The M1AFS1500-FG676I fits communications line-card control-plane roles: framing, link supervision, LED/alarms, and JTAG boundary management for denser switching silicon. Its flash fabric is live at power-on, which matters for背面板 address decoding and hot-swap controllers that must be active before host software boots. The 676-FBGA provides the dense I/O edge required to reach many transceiver and PHY control pins from one controller, and PLL-based clock conditioning simplifies distributing a clean reference across the card. Designers also value the low static power of 130nm flash fabric for always-on management traffic, and the industrial I-grade covers telecom central-office ambient specifications.
추천
추천 제품 요약
엔지니어링 참조 데이터: M1AFS1500-FG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS1500-FG676 | M1AFS1500-1FGG676I | M1AFS1500-2FG676I |
|---|---|---|---|---|
| Package | 676-ball FBGA (FG676) | 676-ball FBGA (FG676) - same | 676-ball FBGA (FGG676, green) - same footprint | 676-ball FBGA (FG676) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| User I/O | 252 | 252 | 252 | 252 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | Standard | Standard | -1 | -2 (fastest) |
| Temperature Range | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Configuration Type | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile |
주요 차별점
- Non-volatile flash configuration with no external boot device (vs SRAM-based FPGAs (Xilinx/Intel equivalents))
- Integrated mixed-signal analog subsystem (vs M1AFS600-FG484I)
- Industrial-grade availability with speed-grade flexibility (vs M1AFS1500-2FG676I)
설계 노트
The 676-ball FBGA demands a controlled-impedance stackup and disciplined fan-out. Plan via-in-pad or dog-house escapes for the inner ball columns, and allocate complete I/O banks before routing so VCCO domains stay coherent. Obtain the FG676 ball map directly from Microchip Libero SoC rather than third-party mirrors, then lock your pin assignment early because Fusion bank rules constrain which signals may share a supply domain.
The device uses a 1.5V core with separate I/O bank supplies; confirm power-rail sequencing in your design. Because flash fabric is non-volatile, the device begins configuration immediately at power-up, so all monitored rails must be valid before logic that acts on them executes. Estimate: at typical mid-density utilization, static power of 130nm flash fabric is low, but dynamic power scales with clock rate - run Microchip's power estimator with your post-layout netlist rather than relying on rules of thumb.
Do not treat the M1AFS1500 as a commodity FPGA: the Fusion analog subsystem has its own reference and layout requirements - keep analog monitor inputs away from switching nodes and follow the Fusion datasheet's analog layout guidance. Also verify speed grade before timing sign-off: standard, -1, and -2 grades close timing differently, and downgrading a -2 design to standard grade can fail timing at the same clock frequency.
Estimated: a 676-FBGA dissipating a few watts on a standard 4-layer PCB requires solid ground-plane coupling under the package. Ball-count thermal resistance is dominated by the PCB, not the package, so maximize via arrays from the package perimeter into inner ground planes. If your design runs the fabric near the 1098.9 MHz family performance figure, budget airflow or a heatsink based on Microchip's thermal calculator output for your exact layer count.
규정 준수 정보
Distributor snippets for this exact MPN do not state RoHS/lead-free status; verify on the Microchip product page environmental data. G-suffix FGG variants indicate green (halogen-free) packaging within the same family.
