M1AFS1500-FG676I - 1.5M Gate Fusion FPGA 676-FBGA | Microchip
MPN: M1AFS1500-FG676I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425.73 | $425.73 |
| 10 | $425.73 | $4,257.30 |
| 100 | $425.73 | $42,573.00 |
| 500 | $425.73 | $212,865.00 |
| 1,000 | $425.73 | $425,730.00 |
Drop-in alternatives for M1AFS1500-FG676I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1AFS1500-FG676
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$372 / Unit
View Datasheet →M1AFS1500-1FGG676I
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Contact for price
View Datasheet →M1AFS1500-2FG676I
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$405 / Unit
View Datasheet →M1AFS1500-FG676I Maximum Ratings & Electrical Characteristics
| Family | Fusion (M1AFS1500) |
| System Gates | 1.5 M |
| Technology | 130 nm flash-based |
| Core Supply Voltage | 1.5 V |
| User I/O | 252 |
| Package | 676-ball FBGA (FG676) |
| Mounting Type | Surface Mount |
| Configuration Type | Flash-based, non-volatile (no external config PROM) |
| Analog Blocks | Configurable analog subsystem (ADC, voltage/temp monitors) |
| Clock Management | Integrated CCC (clock conditioning circuits) with PLL |
| On-chip Flash Memory | Large flash memory blocks integrated |
| Performance Figure | 1098.9 MHz (family-rated internal clock figure) |
| Temperature Grade | Industrial (-40C to +85C), suffix I |
| Packaging | Tray |
M1AFS1500-FG676I 676-ball fbga (fg676) Pin Configuration Guide
Complete pinout information for M1AFS1500-FG676I (676-ball fbga (fg676) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-FG676I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-FG676I is suitable for 6 applications: Industrial Automation and Motor Control, Board Power Management and Sequencing, Secure Embedded Control Systems, Aerospace and Defense Ground Equipment, Test and Measurement Instrumentation, Communications and Networking Line Cards.
Industrial Automation and Motor Control
The M1AFS1500-FG676I fits industrial automation because its flash-based 1.5M-gate fabric delivers deterministic, instantly-on logic while the integrated Fusion analog subsystem (ADC plus voltage and temperature monitors) closes local control loops without external converters. In a motor drive, the 252 user I/O implement PWM generation, encoder interfaces, and fault-latch logic, while on-die sensing supervises drive rail voltages. Because configuration is stored in on-chip flash, the controller is active within microseconds of power application - critical for safety interlocks. The industrial -40C to +85C rating of the I-grade part matches factory-floor ambient extremes, and the 676-FBGA supports the dense I/O fan-out typical of multi-axis servo boards.
Recommended
Board Power Management and Sequencing
Fusion was designed specifically for smart power board management, and the M1AFS1500-FG676I implements complete power-tree supervision in one chip. The configurable analog blocks continuously monitor multiple supply rails through on-chip ADC channels, while the flash fabric executes sequencing state machines, brown-out detection, and fan control without a boot delay. The 1.5V core and 130nm process yield low static power for an always-on supervisor role. Compared with a discrete sequencer plus microcontroller plus ADC chain, the monolithic Fusion device removes 3-5 BOM line items and eliminates inter-chip communication latency, and the 676-FBGA leaves abundant I/O for rail enable, PGOOD, and I2C/PMBus telemetry interfaces.
Recommended
Secure Embedded Control Systems
The flash-based M1AFS1500-FG676I suits secure embedded control where bitstream confidentiality is mandatory. Unlike SRAM FPGAs that load configuration from an external device at every power-up, the Fusion fabric stores configuration in on-chip flash, so the design never appears on an external bus where it could be intercepted, and readback paths are architecturally absent. The 1.5M-gate capacity accommodates crypto accelerators, secure boot state machines, and custom peripherals alongside application logic. The industrial temperature rating and mature, verified 130nm flash process make it a common choice in defense ground equipment, secure communications, and industrial IP-protective designs that must survive long field lifetimes with no configuration device to fail.
Recommended
Aerospace and Defense Ground Equipment
The industrial-grade M1AFS1500-FG676I serves aerospace and defense ground and test equipment that needs rugged logic without radiation-tolerant RTAX pricing. Flash configuration cells are inherently less susceptible to single-event configuration upsets than SRAM cells, improving availability in environments with particle flux, while the 1.5V core limits dynamic power in conduction-cooled enclosures. The 252 user I/O and 676-FBGA footprint support high-pin-count backplane and sensor interfaces, and Microchip's ProASIC/RTAX tool-chain lineage means Libero SoC design flows carry directly to flight-grade siblings if a program later upgrades to RTAX2000S devices. Typical uses include telemetry formatting, sensor fusion, and platform management controllers.
Recommended
Test and Measurement Instrumentation
In test and measurement hardware, the M1AFS1500-FG676I provides glueless interfacing between high-pin-count front-end ASICs, ADCs, and a backplane, with 252 user I/O absorbing data capture, trigger logic, and protocol bridging. The integrated PLL-based clock conditioning circuits generate and clean the sampling clocks the fabric consumes, and the family's 1098.9 MHz internal performance figure supports fast synchronous capture paths. Non-volatile flash configuration means an instrument powers up ready in instrument-grade boot times with no external loader. The industrial temperature range covers bench-to-field deployment, and the monolithic analog monitoring channel can log chassis temperature and rail health for calibration records.
Recommended
Communications and Networking Line Cards
The M1AFS1500-FG676I fits communications line-card control-plane roles: framing, link supervision, LED/alarms, and JTAG boundary management for denser switching silicon. Its flash fabric is live at power-on, which matters for背面板 address decoding and hot-swap controllers that must be active before host software boots. The 676-FBGA provides the dense I/O edge required to reach many transceiver and PHY control pins from one controller, and PLL-based clock conditioning simplifies distributing a clean reference across the card. Designers also value the low static power of 130nm flash fabric for always-on management traffic, and the industrial I-grade covers telecom central-office ambient specifications.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-FG676I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-FG676 | M1AFS1500-1FGG676I | M1AFS1500-2FG676I |
|---|---|---|---|---|
| Package | 676-ball FBGA (FG676) | 676-ball FBGA (FG676) - same | 676-ball FBGA (FGG676, green) - same footprint | 676-ball FBGA (FG676) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| User I/O | 252 | 252 | 252 | 252 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | Standard | Standard | -1 | -2 (fastest) |
| Temperature Range | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Configuration Type | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile |
| Unit Price (qty 1) | $425.73 (as of 2026-09-02) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Non-volatile flash configuration with no external boot device (vs SRAM-based FPGAs (Xilinx/Intel equivalents))
- Integrated mixed-signal analog subsystem (vs M1AFS600-FG484I)
- Industrial-grade availability with speed-grade flexibility (vs M1AFS1500-2FG676I)
Design Notes
The 676-ball FBGA demands a controlled-impedance stackup and disciplined fan-out. Plan via-in-pad or dog-house escapes for the inner ball columns, and allocate complete I/O banks before routing so VCCO domains stay coherent. Obtain the FG676 ball map directly from Microchip Libero SoC rather than third-party mirrors, then lock your pin assignment early because Fusion bank rules constrain which signals may share a supply domain.
The device uses a 1.5V core with separate I/O bank supplies; confirm power-rail sequencing in your design. Because flash fabric is non-volatile, the device begins configuration immediately at power-up, so all monitored rails must be valid before logic that acts on them executes. Estimate: at typical mid-density utilization, static power of 130nm flash fabric is low, but dynamic power scales with clock rate - run Microchip's power estimator with your post-layout netlist rather than relying on rules of thumb.
Do not treat the M1AFS1500 as a commodity FPGA: the Fusion analog subsystem has its own reference and layout requirements - keep analog monitor inputs away from switching nodes and follow the Fusion datasheet's analog layout guidance. Also verify speed grade before timing sign-off: standard, -1, and -2 grades close timing differently, and downgrading a -2 design to standard grade can fail timing at the same clock frequency.
Estimated: a 676-FBGA dissipating a few watts on a standard 4-layer PCB requires solid ground-plane coupling under the package. Ball-count thermal resistance is dominated by the PCB, not the package, so maximize via arrays from the package perimeter into inner ground planes. If your design runs the fabric near the 1098.9 MHz family performance figure, budget airflow or a heatsink based on Microchip's thermal calculator output for your exact layer count.
Compliance Information
Distributor snippets for this exact MPN do not state RoHS/lead-free status; verify on the Microchip product page environmental data. G-suffix FGG variants indicate green (halogen-free) packaging within the same family.
