M321R2GA3EB2-CCP - 16GB DDR5-6400 ECC RDIMM | Samsung
Référence : M321R2GA3EB2-CCP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $89 | $890,00 |
| 100 | $82 | $8 200,00 |
| 500 | $78 | $39 000,00 |
| 1 000 | $74 | $74 000,00 |
M321R2GA3EB2-CCP Présentation
A Registered DIMM (RDIMM) is a server-class memory module that buffers address and command signals through a register IC before they reach the DRAM chips. This buffering reduces electrical loading on the memory controller, allowing more modules per channel and higher capacity per server than unbuffered UDIMMs. RDIMMs sit within the memory hierarchy as DDR5 SDRAM modules used in the power management and compute chain of enterprise servers, workstations, and storage systems. ECC (Error Correction Code) adds per-transfer data integrity checking, correcting single-bit errors on the fly.
Key features of this module include the DDR5-6400 operating speed with CL52 latency, on-die ECC plus registered ECC for data reliability, and a low 1.1 V operating voltage that reduces per-module power versus DDR4 equivalents. The single-rank 1Rx8 architecture simplifies memory controller scheduling and enables strong scalability when populating multiple DIMM slots per channel.
Technically, the module is built with 10 FBGA-packaged 2Gx8 DDR5 SDRAM components organized as 2Gx72 (72-bit wide data path including ECC bits). DDR5 moves the power management from the motherboard to an on-module PMIC and splits each DIMM into two independent 32-bit subchannels, improving effective bandwidth and efficiency at 6400 MT/s.
Typical applications include entry-level virtualization hosts, edge compute appliances, and small-scale servers where verified Samsung reliability and JEDEC-standard DDR5 interoperability are required. Distributors list it for Xeon, PowerEdge, ProLiant, ThinkSystem, and Supermicro platforms.
When designing or upgrading, verify that the target platform explicitly supports DDR5-6400 RDIMMs; if the memory controller runs a lower speed bin, the module will down-clock rather than fail, but capacity rules (single-rank vs dual-rank population order) must still be followed.
This page synthesizes distributor availability, verified specifications, drop-in alternatives from multiple vendors, and practical design notes not found in a single manufacturer listing.
Alternatives de remplacement direct pour M321R2GA3EB2-CCP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec M321R2GA3EB2-CCP (même facteur de forme et même empreinte) — différant par Module Type, Form Factor, ECC, Capacity, Data Rate.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
M321R2GA3EB2-CWM
✅ Remplacement direct✓ En stock
$94 / unité
Voir la fiche technique →M321R2GA3EB0-CWM
✅ Remplacement direct✓ En stock
$72 / unité
Voir la fiche technique →M321R4GA3EB2-CCP
✅ Remplacement direct✓ En stock
$259 / unité
Voir la fiche technique →NEMIX RAM 16GB DDR5-6400 RDIMM 1Rx8
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A-Tech 16GB DDR5 PC5-51200R RDIMM 1Rx8
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M321R2GA3EB2-CCP Valeurs maximales et caractéristiques électriques
| Capacity | 16 GB |
| Type de mémoire | DDR5 SDRAM |
| Module Type | 288-pin DIMM, ECC Registered (RDIMM) |
| Speed | 6400 MT/s (DDR5-6400) |
| Bandwidth Class | PC5-51200 |
| Latence CAS | CL52 |
| Operating Voltage | 1.1 V |
| Rank / Organization | 1Rx8 (single rank), 2Gx72 |
| DRAM Composition | 10 x FBGA 2Gx8 DDR5 SDRAM |
| ECC | Yes (ECC Registered) |
| Form Factor | 288-pin DIMM |
| Component For | Server |
| Product Color | Green |
| Module Count | 1 x 16 GB |
| Compatible Platforms | Intel Xeon, Dell PowerEdge, HPE ProLiant, Lenovo ThinkSystem, Supermicro |
Guide de configuration des broches du M321R2GA3EB2-CCP standard
Configuration des broches du M321R2GA3EB2-CCP (boîtier standard). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour M321R2GA3EB2-CCP.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
M321R2GA3EB2-CCP convient pour 6 applications: Entry-Level Virtualization Servers, Edge Compute Appliances, Small-Scale and SMB Servers, Workstations for Engineering and Content Creation, Mission-Critical Enterprise Memory Upgrades, OEM Server Integration and Replacement Programs.
Entry-Level Virtualization Servers
The Samsung M321R2GA3EB2-CCP fits entry-level virtualization hosts that run a handful of VMs where per-module cost and channel balance matter more than maximum per-slot density. Its 16 GB single-rank 1Rx8 organization lets administrators populate all memory channels evenly - for example, eight modules deliver 128 GB across eight channels at full DDR5-6400 bandwidth. Registered ECC corrects single-bit errors that could otherwise crash a hypervisor, while the 6400 MT/s (PC5-51200) rate and CL52 latency keep latency-sensitive VM exit overhead low. At 1.1 V the module also limits thermal load in compact 1U chassis, eliminating the need for additional memory airflow that dual-rank, higher-capacity modules sometimes require in dense virtualization deployments.
Recommandé
Edge Compute Appliances
Edge compute nodes deployed in retail branches, factory floors, and telecom cabinets benefit directly from the M321R2GA3EB2-CCP's specification profile. Corewave Labs specifically identifies this module as designed for edge compute, where unattended operation demands ECC-registered memory to survive cosmic-ray-induced single-bit upsets over months of runtime. The 16 GB per-module capacity supports container orchestration and local inference workloads, while DDR5-6400 bandwidth (PC5-51200) accelerates data pre-processing before uplink. The 1.1 V operating voltage and single-rank layout keep module power and heat low - critical for passively or minimally cooled edge enclosures where memory airflow is limited and every watt counts toward the overall thermal budget.
Recommandé
Small-Scale and SMB Servers
Small business servers built on Supermicro, Dell PowerEdge entry towers, or HPE ProLiant ML platforms use the M321R2GA3EB2-CCP as a cost-efficient capacity building block. Because it is single-rank x8, SMB integrators can start with two modules (32 GB) and scale by adding identical modules per channel without violating mixed-rank population rules, preserving DDR5-6400 speed across upgrades. The registered ECC interface matches what Xeon-class server chipsets expect, and distributor listings (ServerSupply, HardDiskDirect) confirm broad stock availability for rapid deployment. Its PC5-51200 class bandwidth also future-proofs the build for database and file-service workloads that grow with the business without requiring a memory platform change.
Recommandé
Workstations for Engineering and Content Creation
High-end workstations based on Xeon W-class platforms that accept DDR5 RDIMMs can use the M321R2GA3EB2-CCP for memory-intensive CAD, simulation, and 4K/8K video timelines. The 6400 MT/s data rate delivers PC5-51200 bandwidth per module, which shortens dataset loads in finite-element analysis and improves timeline scrubbing performance in non-linear video editing. ECC protection matters in multi-hour render jobs where a single uncorrected memory error can corrupt an entire output file. Distributors (Amazon, Newegg fitment listings) explicitly verify fitment on Xeon workstation platforms, and the 288-pin RDIMM keying prevents accidental installation into incompatible consumer desktop boards, protecting both the module and the system.
Recommandé
Mission-Critical Enterprise Memory Upgrades
For mission-critical enterprise environments - databases, ERP hosts, and virtualization clusters - ServerTechSupply positions the M321R2GA3EB2-CCP as engineered for high reliability and data integrity requirements. The combination of DDR5 on-die ECC plus the RDIMM's registered ECC path addresses both in-DRAM and bus-level error mechanisms, supporting uptime targets measured in 99.99% tiers. Samsung's in-house FBGA 2Gx8 DRAM fabrication gives an unbroken component-to-module quality chain, which procurement teams under vendor-support contracts often require. When upgrading existing fleets, the module's JEDEC-standard DDR5-6400 1Rx8 CL52 profile interoperates predictably with previously installed Samsung or vendor-branded RDIMMs of matching specification in the same channel population.
Recommandé
OEM Server Integration and Replacement Programs
OEMs and system integrators building servers for Dell PowerEdge, HPE ProLiant, Lenovo ThinkSystem, and Supermicro platforms use the M321R2GA3EB2-CCP as a validated Samsung DDR5 building block, since distributor fitment data (Amazon and Newegg compatibility listings) confirms recognition on these brands at full speed. The RamQuote cross-reference record also shows Supermicro resells the Samsung EB2 family under its own MEM-DR5 part numbers, meaning integrators can substitute the Samsung MPN where OEM-branded stock is unavailable. For repair and refurbishment programs, third-party exact-match modules (NEMIX RAM, A-Tech) provide secondary sourcing at the same 16 GB DDR5-6400 1Rx8 1.1 V specification without PCB or firmware changes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour M321R2GA3EB2-CCP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | M321R2GA3EB2-CWM | M321R2GA3EB0-CWM | M321R4GA3EB2-CCP | NEMIX RAM 16GB DDR5-6400 RDIMM 1Rx8 | A-Tech 16GB DDR5 PC5-51200R RDIMM 1Rx8 |
|---|---|---|---|---|---|---|
| Package | 288-pin DIMM | 288-pin DIMM - same | 288-pin DIMM - same | 288-pin DIMM - same | 288-pin DIMM - same | 288-pin DIMM - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | NEMIX RAM | A-Tech |
| Capacity | 16 GB | 16 GB | 16 GB | 32 GB | 16 GB | 16 GB |
| Rank / Organization | 1Rx8 (2Gx72) | 1Rx8 | 1Rx8 | 2Rx8 | 1Rx8 | 1Rx8 |
| Operating Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| ECC / Registration | ECC Registered (RDIMM) | ECC Registered (RDIMM) | ECC Registered (RDIMM) | ECC Registered (RDIMM) | ECC Registered (RDIMM) | ECC Registered (RDIMM) |
| Warranty Position | Samsung manufacturer warranty | Samsung manufacturer warranty | Samsung manufacturer warranty | Samsung manufacturer warranty | Lifetime warranty (per vendor) | Vendor warranty (per vendor) |
Principaux différenciateurs
- Samsung in-house DRAM silicon traceability (vs NEMIX RAM 16GB DDR5-6400 RDIMM 1Rx8)
- Single-rank 1Rx8 scalability advantage (vs M321R4GA3EB2-CCP)
- DDR5-6400 speed bin (vs M321R2GA3EB0-CWM)
Notes de conception
Never install the M321R2GA3EB2-CCP (RDIMM) in a desktop motherboard with UDIMM-only DDR5 slots. Registered ECC DIMMs are keyed and firmware-gated differently from unbuffered desktop memory; installation will either be physically blocked or fail POST. Conversely, mixing RDIMMs with UDIMMs in hybrid-support platforms is prohibited by most server vendor documentation. Always confirm the platform qualified memory list (QVL) names DDR5 RDIMM support at 6400 MT/s before purchase, since platforms limited to DDR5-5600 will automatically down-clock this module.
For system integrators, follow the platform vendor memory population table when filling channels with this 16 GB single-rank module. Single-rank DIMMs generally allow the highest population per channel at full speed; adding dual-rank 32 GB modules (e.g., M321R4GA3EB2-CCP) to the same board may restrict the maximum number of populated slots or force a lower speed bin. Balance capacity identically across channels - e.g., 2, 4, or 8 identical modules - so the memory controller interleaves evenly and DDR5-6400 bandwidth is sustained on every channel.
The M321R2GA3EB2-CCP operates at 1.1 V with 10 FBGA DRAM packages, producing low per-module power relative to DDR4 RDIMMs of similar capacity. Estimated: at roughly 3-5 W per module under load (typical for single-rank DDR5-6400 at 1.1 V, arithmetic estimate - exact figure requires Samsung datasheet confirmation), ten populated modules add only 30-50 W to chassis thermal load. Still, in dense 1U servers ensure directed memory airflow per the platform thermal guide, because DRAM refresh rates and error rates rise if module temperature exceeds the JEDEC-specified operating range.
Informations de conformité
Compliance data not stated in the provided web data. Samsung server memory modules are typically RoHS compliant; verify on the official Samsung semiconductor product page before procurement.
