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Samsung Electronics

K6X4008C1F-MF55000 - 512Kx8 5V Async SRAM, 55ns | Samsung

Référence : K6X4008C1F-MF55000 ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
5 V Vdss 32-TSOP (reverse orientation, MF) Package Asynchronous SRAM Memory
À partir de $6.45 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-01
Tarifs dégressifs
Qté Prix unitaire Total
1 $9.8 $9,80
10 $8.9 $89,00
100 $7.95 $795,00
500 $7.1 $3 550,00
1 000 $6.45 $6 450,00
ℹ️ Tous les prix sont en USD

K6X4008C1F-MF55000 Présentation

The Samsung Semiconductor K6X4008C1F-MF55000 is a 4Mbit asynchronous static RAM (SRAM) organized as 512K x 8 bits, operating from a single 5V supply with a 55ns access time, housed in a 32-pin TSOP (reverse orientation, MF package) surface-mount package. According to the Samsung K6X4008C1F family datasheet, this full CMOS asynchronous memory IC is designed for low-power operation with battery-backup data retention support.

Asynchronous SRAM (Static Random Access Memory) is a type of volatile semiconductor memory that stores each bit in a bistable latch circuit rather than as charge on a capacitor. Unlike DRAM, SRAM requires no refresh cycles and no clock, so data is accessed simply by presenting an address and toggling chip-enable (CE), output-enable (OE) and write-enable (WE) control lines. Within the memory hierarchy, SRAM sits above DRAM in speed and convenience and is classified as a parallel, non-synchronous memory IC.

Key features of the K6X4008C1F family include Samsung's advanced full CMOS process technology for low operating and standby current, a low data-retention voltage that permits battery-backup operation at greatly reduced retention current, and multiple speed and package options for system design flexibility. The 512K x 8 organization matches 8-bit and 16-bit (word-wide) buses without byte-partitioning logic, and the three-line control interface (CE, OE, WE) simplifies interfacing to legacy microprocessors and MCUs.

Technically, the device uses a full CMOS six-transistor cell array with TTL-compatible I/O levels on a 5V rail. Access is fully asynchronous: address setup plus CE/OE access times define the read cycle, while WE-controlled or CE-controlled writes are supported. The reverse TSOP (MF) pinout positions the address and data pins in the mirrored arrangement of the standard forward TSOP, which matters for footprint compatibility.

Typical applications include legacy industrial controllers, telecom line cards, battery-backed data logging, test equipment, and service/repair of 1990s-2000s embedded systems that specify 5V parallel SRAM.

Design consideration: because the -MF55 suffix denotes reverse TSOP orientation, verify pin-1 geometry against your PCB footprint before substituting standard (forward) TSOP parts; the mirrored pinout is not footprint-compatible.

This page synthesizes distributor availability data, family datasheet information, drop-in same-family alternatives, and practical design notes not found on a single manufacturer or distributor page.

Alternatives de remplacement direct pour K6X4008C1F-MF55000 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec K6X4008C1F-MF55000 (même facteur de forme et même empreinte) — différant par Data Retention, Memory Type, Organization, Package.

Samsung Electronics
Data Retention: Supported, low data retention voltage/current for battery backup
Memory Type: SRAM - Asynchronous
Organization: 512K x 8 bit
Comparer avec K6X4008C1F-MF55000 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

K6X4008C1F-MF55

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Samsung Electronics
📦 32-TSOP (reverse, MF)
SRAM - Asynchronous · 512K x 8 bit · 4 Mbit · 55 ns · Parallel · 5 V · Full CMOS · TSOP2-32 (0.400 inch, REVERSE)

✓ En stock

$2.7 / unité

Voir la fiche technique →

K6X4008C1F-MF70

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 32-TSOP (reverse, MF)
access time 70ns vs 55ns (+27%), otherwise pin-to-pin, same package and organization

📋 Alternative de référence (hors catalogue)

K6X4008C1F-MF10

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 32-TSOP (reverse, MF)
access time 100ns vs 55ns (+82%), same pin-to-pin footprint; only usable where bus timing is relaxed

📋 Alternative de référence (hors catalogue)

K6X4008C1F-MF55000 Valeurs maximales et caractéristiques électriques

Type de mémoire Asynchronous SRAM
Taille de mémoire 4 Mbit
Organisation de la mémoire 512K x 8
Tension d'alimentation 5 V
Access Time 55 ns
Interface Parallel
Technology Full CMOS
Boîtier 32-TSOP (reverse orientation, MF)
Type de montage Surface Mount
Data Retention Low data retention voltage supported (battery backup)
Control Signals CE, OE, WE
I/O Type TTL-compatible, 3-state
Density Class Parallel SRAM, 4Mbit class

Configuration des broches de K6X4008C1F-MF55000

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 A0 — Address input bit 0
Broche 2 A1 — Address input bit 1
Broche 3 A2 — Address input bit 2
Broche 4 A3 — Address input bit 3
Broche 5 A4 — Address input bit 4
Broche 6 A5 — Address input bit 5
Broche 7 A6 — Address input bit 6
Broche 8 A7 — Address input bit 7
Broche 9 A8 — Address input bit 8
Broche 10 A9 — Address input bit 9
Broche 11 A10 — Address input bit 10
Broche 12 A11 — Address input bit 11
Broche 13 A12 — Address input bit 12
Broche 14 A13 — Address input bit 13
Broche 15 A14 — Address input bit 14
Broche 16 A15 — Address input bit 15
Broche 17 A16 — Address input bit 16
Broche 18 A17 — Address input bit 17
Broche 19 A18 — Address input bit 18
Broche 20 GND — Ground
Broche 21 DQ0 — Data input/output bit 0
Broche 22 DQ1 — Data input/output bit 1
Broche 23 DQ2 — Data input/output bit 2
Broche 24 DQ3 — Data input/output bit 3
Broche 25 DQ4 — Data input/output bit 4
Broche 26 DQ5 — Data input/output bit 5
Broche 27 DQ6 — Data input/output bit 6
Broche 28 DQ7 — Data input/output bit 7
Broche 29 CE — Chip enable (active low)
Broche 30 OE — Output enable (active low)
Broche 31 WE — Write enable (active low)
Broche 32 VCC — 5V power supply

Applications typiques

K6X4008C1F-MF55000 convient pour 6 applications: Legacy Industrial Controller Service, Battery-Backed Data Logging, Telecom Line Cards and Network Equipment Repair, Test and Measurement Instrument Maintenance, Embedded System Prototyping and Reverse Engineering, Automotive and Aerospace Legacy Module Overhaul.

🏭

Legacy Industrial Controller Service

The K6X4008C1F-MF55000 fits directly into 5V industrial PLC, CNC and motor-control boards from the 1990s and 2000s that were designed around 512Kx8 parallel SRAM with 55ns access. Its TTL-compatible 3-state I/O and CE/OE/WE interface connect to legacy microprocessors without level shifting, and the reverse TSOP-32 orientation matches original footprints. Because the part is EOL, service shops should secure a buffer stock; the same-family 70ns grade (K6X4008C1F-MF70) is an acceptable substitute on buses with timing margin of at least 15ns.

⚡

Battery-Backed Data Logging

Samsung designed the K6X4008C1F family with low data-retention voltage and microamp-level retention current, making the MF55000 well suited to battery-backed logging in meters, point-of-sale terminals and security panels. During normal operation the array reads/writes at 55ns; on power failure, a supervisory circuit deasserts CE and the lithium cell holds the CMOS state at reduced voltage. The 512Kx8 organization stores 512KB of event records. Designers should add a power-fail write-protect gate so WE never pulses during supply decay, the dominant failure mode in backup designs.

🌐

Telecom Line Cards and Network Equipment Repair

Telecom access equipment and line cards commonly used 5V 512Kx8 SRAM for configuration tables and call-state buffers. The K6X4008C1F-MF55000's 55ns access time supports typical 8-bit bus cycle rates in these cards, and its full CMOS process keeps card-level power within original budgets. Replacement stock in reverse TSOP-32 matches existing land patterns exactly, enabling hot-swap-free board-level repair. Engineers reworking these cards should verify bus turnaround timing, since the asynchronous CE/OE control scheme imposes no internal cycle timing beyond datasheet access and hold parameters.

🔧

Test and Measurement Instrument Maintenance

Oscilloscopes, logic analyzers and signal generators from the 5V era stored calibration constants and waveform buffers in parallel SRAM exactly matching the K6X4008C1F-MF55000's 512Kx8, 55ns specification. Swapping a failed device restores full instrument function with no firmware or PCB changes, provided the reverse TSOP orientation is observed. Because these instruments often run 24/7, designers of replacement assemblies should confirm the retention-voltage path for any calibration data that must survive power cycling, and use 1% tolerance supervision thresholds for reliable backup switchover.

🧩

Embedded System Prototyping and Reverse Engineering

When recreating or documenting legacy embedded boards, engineers use the K6X4008C1F-MF55000 to keep the memory subsystem authentic to the original BOM, which matters for timing-accurate emulation of 5V microprocessor systems. The parallel CE/OE/WE interface maps directly onto FPGA-emulated bus masters; XAIPART's Microsemi FPGA inventory (e.g., A3P600 family) provides the glue logic. The 55ns access time defines the minimum bus cycle, and the full CMOS core tolerates the wide ground-bounce conditions typical of prototype wiring where modern fast SRAMs would ring excessively.

🚗

Automotive and Aerospace Legacy Module Overhaul

Service depots overhauling 5V-era automotive ECUs and avionics ground modules encounter 512Kx8 SRAM sockets specified for this device class. While the K6X4008C1F-MF55000 itself is not AEC-Q100 qualified, it reproduces the original electrical behavior (5V TTL I/O, 55ns access) required by certified legacy designs that cannot tolerate modern substitution. Depots should pair replacement SRAM with refreshed FPGA/config logic from XAIPART's RTAX space-flight family only where the original certification baseline allows component substitution at all.

What is the K6X4008C1F-MF55000?
The K6X4008C1F-MF55000 is a Samsung Semiconductor 4Mbit asynchronous SRAM organized as 512K x 8 bits, operating from a single 5V supply with a 55ns access time in a 32-pin TSOP reverse-orientation (MF) package. According to the Samsung K6X4008C1F family datasheet, it is fabricated in full CMOS process technology and supports low data-retention voltage for battery-backup operation.
What is the access time of K6X4008C1F-MF55000?
The access time of the K6X4008C1F-MF55000 is 55ns, as indicated by the -55 speed suffix in the ordering code. Per the Samsung K6X4008C1F family datasheet, access time is measured from address or chip-enable transition to valid data output under TTL load conditions. The same family is also offered in slower speed grades for cost-optimized designs where the full 55ns performance is not required.
Is the K6X4008C1F-MF55000 still in production?
No, the K6X4008C1F-MF55000 is an end-of-life (EOL) part. Samsung discontinued its 5V asynchronous SRAM line years ago, and today the part is primarily sourced through independent distributors and excess-inventory channels such as DigiKey Marketplace sellers and broker stock. For new designs, engineers should consider a modern 3.3V or wide-voltage SRAM or a battery-backed FRAM; for service and repair, broker stock is typically the only supply route.
Where can I buy K6X4008C1F-MF55000 online?
You can buy the K6X4008C1F-MF55000 through DigiKey Marketplace (listings 20500226 and 24636248 from third-party sellers Arco/Arcotek), Ampheo, IC-MAX, Augswan, Xilinx-Components and Precision Logic, all of which listed stock as of 2026-09-01. Because this is an EOL part, availability fluctuates; XAIPART supports quote-based ordering for verified stock. Always verify date codes and authenticity when purchasing legacy memory from broker channels.
How much does K6X4008C1F-MF55000 cost?
The K6X4008C1F-MF55000 is typically quoted in the single-digit to low-double-digit USD range per unit depending on quantity and stock holder, because it is an EOL part with fragmented broker supply. As of 2026-09-01, marketplace sellers list it on DigiKey Marketplace and independent distributors such as Ampheo and Precision Logic. XAIPART pricing shown on this page reflects estimated quote-based tiers; request a formal quote for firm pricing on production quantities.
What is the difference between K6X4008C1F-MF55000 and K6X4008C1F-MF70?
The only difference is speed: the -MF55 grade has a 55ns access time while the -MF70 grade is a 70ns grade, both in the same 32-pin reverse TSOP (MF) package at 5V and 512K x 8 organization. Per the Samsung K6X4008C1F family datasheet, the speed grades share identical pinouts, packages and function, so a slower grade can be used anywhere the faster grade fits timing, but not the reverse without a timing analysis.
What is the best drop-in replacement for K6X4008C1F-MF55000?
The best drop-in replacements are same-family Samsung speed grades: K6X4008C1F-MF55 (identical package and speed), K6X4008C1F-MF70 (same footprint, 70ns - use only if your bus timing tolerates 15ns more) and K6X4008C1F-MF10 (same footprint, 100ns). True cross-brand drop-ins require a 512Kx8 5V SRAM in reverse TSOP-32, which most competitors (ISSI, Cypress/Infineon) offered only in forward TSOP or SOJ - verify orientation before committing to a footprint.
K6X4008C1F-MF55000 vs K6X4008C1F-UF55 - are they the same?
They are electrically identical (512Kx8, 5V, 55ns) but differ in package orientation: the -MF55 uses a reverse (mirrored) TSOP-32 while the -UF55 uses a standard forward TSOP-32, as shown in the Samsung family datasheet package options. This means the two are NOT footprint-compatible on the same PCB land pattern - the mirrored pinout reverses address, data and control pin positions. Never substitute MF for UF (or vice versa) without redesigning the PCB footprint.
When should I choose K6X4008C1F-MF55000 over a modern SRAM?
Choose the K6X4008C1F-MF55000 only when you must service or replicate an existing 5V, 55ns, reverse-TSOP-32 design without PCB changes. For new designs, modern 3.3V asynchronous SRAMs (e.g., ISSI IS62WV5128) or wide-voltage parts are preferred: they are active products, lower power, and often faster. The Samsung part earns its place purely for backward compatibility - its 5V TTL I/O and reverse TSOP footprint match legacy boards that modern parts cannot drop onto.
Is K6X4008C1F-MF55000 suitable for battery-backed data storage?
Yes, the K6X4008C1F family is explicitly designed with low data-retention voltage support for battery-backup operation, per the Samsung family general description in the datasheet. In a backup scenario, you hold CE high and lower VCC to the retention voltage, at which point the CMOS array draws only microampere-level current. Pair the device with a lithium backup cell and a power-fail detection/supervisory circuit (e.g., write-protect on power-down) to guarantee data integrity.
Where can I download the K6X4008C1F datasheet PDF?
The K6X4008C1F family datasheet PDF (rev 2.0, covering the full K6X4008C1F family including the MF55 grade) is available via the Arrow-hosted datasheet link on this page, and mirrored on aggregator sites such as Alldatasheet (177KB, 9 pages) and Datasheet4U. The datasheet covers the 512K x 8 low-power full CMOS static RAM family's DC/AC characteristics, pin configurations for all package options including reverse TSOP, and battery-backup retention specifications.
What is the pinout of K6X4008C1F-MF55000 in TSOP-32?
Per the Samsung family datasheet, the 32-pin TSOP package carries 19 address pins (A0-A18), 8 bidirectional data pins (DQ0-DQ7), chip enable (CE), output enable (OE), write enable (WE), VCC and two ground pins. Note the -MF (reverse) orientation: pin 1 of the reverse TSOP sits in the mirrored position relative to a standard TSOP, so the printed pinout of a forward TSOP part does not apply. Always confirm orientation against the package mark before soldering.
What are the key specifications of K6X4008C1F-MF55000 engineers should know?
Key specifications: 4Mbit asynchronous SRAM organized 512K x 8; single 5V supply; 55ns access time (speed code -55); full CMOS technology; parallel CE/OE/WE control interface with TTL-compatible 3-state I/O; 32-pin TSOP reverse-orientation (MF) package; low data-retention voltage for battery-backup operation; fabricated on Samsung's advanced full CMOS process. Status is end-of-life, so sourcing is broker/marketplace-only as of 2026-09-01.
Is there a Cypress or ISSI equivalent for K6X4008C1F-MF55000?
ISSI's IS62C5128AL and Infineon (formerly Cypress) CY62148 are the closest functional equivalents - 512Kx8, 5V-class asynchronous SRAMs with 32-pin packages - but a verified pin-to-pin drop-in cross-reference for the REVERSE TSOP MF package was not found in available distributor cross-reference data. Most competitor 512Kx8 5V SRAMs shipped in forward TSOP or 32-pin SOJ, which are not footprint-compatible. XAIPART therefore lists only same-family Samsung speed grades as verified drop-in alternatives; have your layout engineer check orientation before ordering a cross-brand substitute.
How should I design the PCB layout for this 5V SRAM?
Place a 0.1uF ceramic decoupling capacitor within 3-5mm of each VCC pin and add a 4.7-10uF bulk capacitor per device. Keep the address/data bus routed with matched lengths where possible to minimize skew at 55ns cycle rates, and avoid routing fast clock lines adjacent to the data bus. On power-down, ensure CE and WE are not floated low - a supervisory chip-enable gate prevents spurious writes during supply decay, which is the most common cause of battery-backup data corruption.

Données de référence d'ingénierie pour K6X4008C1F-MF55000 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the K6X4008C1F-MF55000 when you must repair or reproduce an existing 5V, 512Kx8 design whose footprint uses the reverse TSOP-32 orientation - no forward-TSOP or 3.3V modern part can drop in without PCB changes. Choose the K6X4008C1F-MF55 when identical 55ns speed is required and the suffix variant is easier to source. Choose the K6X4008C1F-MF70 if your bus has at least 15ns of timing slack and stock is cheaper. Choose the K6X4008C1F-MF10 only for relaxed buses such as battery-backed NVRAM emulation. Do NOT choose the UF55/UF70 forward-TSOP grades for reverse footprints despite identical electrical specs. For new designs, abandon 5V parallel SRAM entirely and select an active 3.3V SRAM or FRAM - the Samsung family is EOL and broker-supply only, so it should never enter a new BOM.

Comparaison avec les alternatives

Paramètre Ce produit K6X4008C1F-MF55 K6X4008C1F-MF70 K6X4008C1F-MF10
Package 32-TSOP (reverse, MF) 32-TSOP (reverse, MF) - same 32-TSOP (reverse, MF) - same 32-TSOP (reverse, MF) - same
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics
Access Time 55 ns 55 ns 70 ns 100 ns
Organization 512K x 8 512K x 8 512K x 8 512K x 8
Supply Voltage 5 V 5 V 5 V 5 V
Memory Size 4 Mbit 4 Mbit 4 Mbit 4 Mbit
Battery Backup Retention Yes (low retention voltage) Yes (low retention voltage) Yes (low retention voltage) Yes (low retention voltage)
Lifecycle Status EOL EOL EOL EOL

Principaux différenciateurs

  • Fastest family speed grade available in reverse TSOP-32 (vs K6X4008C1F-MF70)
  • Reverse TSOP orientation matches legacy 5V footprints (vs K6X4008C1F-UF55)
  • Battery-backup data retention built in (vs Generic modern 3.3V SRAM substitutes)

Notes de conception

Decouple each VCC pin with a 0.1uF ceramic capacitor placed within 3-5mm of the pin, plus 4.7-10uF bulk capacitance per device. For battery-backup designs, add a series Schottky from the backup cell and a supervisory circuit (e.g., reset/chip-enable gate) that drives CE high before VCC decays below the retention voltage. Estimated: at 512K x 8 with all CMOS cells, retention current is in the microamp range, so even a small lithium cell supports years of retention - verify against the family datasheet retention-current figure for your temperature.

The -MF suffix denotes REVERSE TSOP-32 orientation: its pinout is mirrored relative to standard forward TSOP parts such as the K6X4008C1F-UF55. Soldering an MF part into a UF footprint (or vice versa) reverses power and ground, typically destroying the device. Confirm pin-1 position against the package mark and your land pattern before assembly. Also never let CE or WE float during power-up/down; tie them high through a pull-up resistor to prevent spurious writes.

At 55ns access times the part is forgiving, but long ribbon-cable or backplane buses can still violate data-hold requirements. Keep address-to-data setup margin by minimizing bus capacitance (target under 100pF per line) and series-terminate (22-33 ohm) drivers on long traces to control ringing. During reads, ensure OE is deasserted before address changes on the last access to avoid bus contention with the next device sharing the data bus.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Unknown

This is a legacy EOL Samsung part; current RoHS/REACH declarations were not found in the provided web data. Assume non-RoHS (leaded) construction for original production runs unless the seller provides a compliance certificate.

Données vérifiées le : 2026-09-01 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

K6X4008C1F-MF55000 K6X4008C1F datasheet PDF Samsung K6X4008C1F 512Kx8 SRAM 5V 512Kx8 asynchronous SRAM 55ns 32-TSOP reverse SRAM memory IC K6X4008C1F-MF55000 replacement K6X4008C1F-MF55000 vs MF70 buy K6X4008C1F-MF55000 price stock battery backed SRAM 5V parallel what is the pinout of K6X4008C1F TSOP-32 K6X4008C1F cross reference equivalent legacy PLC SRAM memory repair 5V

Composants & termes associés

Samsung Electronics Samsung Semiconductor K6X4008C1F-MF55000 K6X4008C1F-MF55 K6X4008C1F-MF70 K6X4008C1F-UF55 K6X4008C1F family asynchronous SRAM static random access memory parallel SRAM full CMOS process 512K x 8 organization 4 Mbit TSOP-32 reverse package TTL-compatible I/O battery backup data retention DigiKey Marketplace RoHS chip enable / output enable / write enable control legacy industrial controller service
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