MC33887PEK - 5A H-Bridge DC Motor Driver, 5-28V | NXP
Référence : MC33887PEK ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.45 | $7,45 |
| 10 | $6.72 | $67,20 |
| 100 | $5.98 | $598,00 |
| 500 | $5.34 | $2 670,00 |
| 1 000 | $4.82 | $4 820,00 |
MC33887PEK Présentation
An H-bridge motor driver is a four-switch power topology that allows a DC motor to be driven in forward, reverse, brake, or high-impedance states by steering current through the motor windings. As part of the broader motor-driver hierarchy (H-bridge -> brushed DC driver -> motor driver -> power management IC -> semiconductor), the MC33887PEK integrates analog control, protection, and power stage into a single IC, eliminating the discrete MOSFET bridge, gate driver, and current-sense amplifier that would otherwise be required.
Key features include 5.0 A continuous / 8.0 A peak output current, 120 mOhm typical RDS(on) per output MOSFET at 25 C, internal PWM current limiting, thermal shutdown, cross-conduction protection, and a low-power Sleep mode (Iq < 50 uA typical). Logic inputs are TTL-compatible, and an internal charge pump supports 100% PWM duty cycle without requiring external bootstrap capacitors. The HSOP-54 exposed-pad package achieves approximately 1 C/W junction-to-case thermal resistance, enabling sustained high-current operation on properly designed 4-layer PCBs.
Typical applications include automotive throttle body and EGR valve actuators, HVAC damper and blower motors, fuel pump controllers, seat and window lift motors, robotics, industrial solenoid drivers, and battery-powered DC pump control. The 5-28 V operating range covers both 12 V automotive and 24 V industrial bus systems.
Designers should size the PCB copper pour under the exposed pad to keep junction temperature below 150 C at worst-case load, route high-current traces on inner layers, and add 100 nF ceramic bypass capacitors close to the VCC and VPWR pins to suppress switching transients. The FB pin should be filtered with an RC network to attenuate PWM switching ripple before reaching the control ADC.
This page synthesizes NXP distributor pricing, drop-in alternatives, and practical PCB/thermal design guidance not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour MC33887PEK — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC33887PEK (même facteur de forme et même empreinte) — différant par AEC-Q100 Qualification, Charge Pump, Function, Lead-Free / RoHS, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC33887PEFR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC33887PNB
✅ Remplacement direct✓ En stock
$4.32 / unité
Voir la fiche technique →MC33887CHFK
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC33HB2001FK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
VNH5019A-E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC33887PEK Valeurs maximales et caractéristiques électriques
| Configuration de sortie | H-Bridge (full bridge) |
| Motor Type | Brushed DC |
| Supply Voltage (VPWR/VCC) | 5 V to 28 V |
| Continuous Output Current | 5.0 A |
| Peak Output Current | 8.0 A (pulse) |
| RDS(on) per MOSFET (typ) | 120 mOhm at 25 C |
| Current Feedback Ratio | 1/375 of high-side load current |
| Sleep Mode Current | < 50 uA typical |
| Logic Input Compatibility | TTL / CMOS |
| Température de fonctionnement | -40 C to +125 C |
| Boîtier | 54-SOIC-EP (HSOP-54) with exposed thermal pad |
| Thermal Resistance (junction-to-case) | approximately 1 C/W |
| Protection Features | Thermal shutdown, cross-conduction prevention, internal current limit |
| Charge Pump | Internal (supports 100% duty cycle) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Lead-free; RoHS compliance per NXP product page |
| Tube Quantity | 27 per tube |
Configuration des broches de MC33887PEK
| Broche 1 | VPWR — High-current supply voltage (5-28 V) |
| Broche 2 | VPWR — High-current supply voltage |
| Broche 3 | OUT1 — H-bridge output 1 |
| Broche 4 | OUT1 — H-bridge output 1 |
| Broche 5 | OUT2 — H-bridge output 2 |
| Broche 6 | OUT2 — H-bridge output 2 |
| Broche 7 | PGND — Power ground |
| Broche 8 | PGND — Power ground |
| Broche 9 | PGND — Power ground |
| Broche 10 | FB — Current feedback (1/375 of high-side load current) |
| Broche 11 | IN1 — TTL input 1 (forward/reverse control) |
| Broche 12 | IN2 — TTL input 2 (PWM/fault control) |
| Broche 13 | EN — Sleep-mode enable (active high for sleep) |
| Broche 14 | VCC — Logic supply voltage (5 V) |
| Broche 15 | GND — Logic ground |
| Broche 16 | NC — Not connected (per datasheet) |
| Broche 17 | NC — Not connected (per datasheet) |
| Broche 18 | NC — Not connected (per datasheet) |
| Broche 19-53 | VPWR/PGND/NC — Multiple supply, ground, and no-connect pins per HSOP-54 standard layout - consult datasheet Figure 1 for exact mapping |
| Broche 54 | EP (Exposed Pad) — Thermal pad - must be soldered to PCB copper pour for heat dissipation |
Applications typiques
MC33887PEK convient pour 6 applications: Automotive Throttle Body and EGR Valve Actuator, HVAC Damper and Blower Motor Driver, Fuel Pump and Water Pump Electronic Control Unit, Power Seat and Window Lift Motor Drive, Industrial 24 V Brushed DC Motor Control, Robotics and Small DC Pump / Fan Control.
Automotive Throttle Body and EGR Valve Actuator
The MC33887PEK's 5 A continuous and 8 A peak H-bridge output drives throttle-body and exhaust-gas-recirculation (EGR) valve DC motors that require precise torque and position control across the full 12 V automotive bus range (5-28 V). The 1/375 FB feedback ratio provides a ground-referenced analog current signal that the ECU's ADC samples for closed-loop torque regulation, eliminating the need for an external shunt resistor in the high-current path. AEC-Q100 qualification, internal thermal shutdown, and cross-conduction prevention satisfy ISO 26262 functional-safety requirements at the component level for engine-management ECUs.
Recommandé
HVAC Damper and Blower Motor Driver
HVAC blend-door actuators and blower fans draw 2-5 A continuous when driving against spring return forces, which sits within the MC33887PEK's 5 A continuous rating with thermal margin. The internal charge pump supports 100% PWM duty cycle, enabling quiet variable-speed blower control from 0-100% without external bootstrap capacitors. The exposed thermal pad couples to the HVAC module's aluminum housing through thermal vias, dissipating the I-squared-R losses (P = I^2 x RDS(on) = 5^2 x 0.12 = 3 W typical) into the chassis. TTL-compatible IN1/IN2 inputs interface directly with the HVAC control MCU without level shifters.
Recommandé
Fuel Pump and Water Pump Electronic Control Unit
Brushless-replacement brushed DC fuel pumps and 12 V coolant water pumps draw 3-5 A continuous in steady-state operation, exactly within the MC33887PEK's continuous rating with adequate thermal design. The internal PWM current-limit feature regulates pump pressure by chopping the H-bridge output at 20-25 kHz, while the FB pin closes the loop on pump current for precise flow control. Reverse-rotation mode (IN1=0, IN2=0) provides active braking when the pump is commanded off, eliminating the inertial spin-down delay that causes fuel-line pressure transients. The 5-28 V input covers cranking-down and load-dump transients on the 12 V automotive bus.
Recommandé
Power Seat and Window Lift Motor Drive
Power-seat adjustment motors and window-lift drives demand 5-8 A peak current during stall events, which the MC33887PEK's 8 A peak rating handles for the sub-second duration of a stall. The internal thermal shutdown protects the IC if the stall persists, and the cross-conduction prevention logic prevents shoot-through currents that would otherwise waste battery power. Sleep-mode Iq < 50 uA keeps quiescent draw well below the automotive 100 uA battery-drain budget. Reverse direction enables active window-pinch protection by momentarily reversing the motor on obstruction detection.
Recommandé
Industrial 24 V Brushed DC Motor Control
Industrial factory automation, conveyor drives, and 24 V servo valves operate from the 24 V industrial bus, which the MC33887PEK covers directly with its 28 V absolute maximum. The 5 A continuous / 8 A peak output drives fractional-horsepower gearmotors used in small conveyor segments and pneumatic valve actuators. The exposed-pad package dissipates 3-5 W into a 4-layer PCB copper pour without requiring an external heatsink, reducing the bill of materials. The TTL inputs interface with industrial PLC 24 V outputs through a simple resistor-divider or optocoupler.
Recommandé
Robotics and Small DC Pump / Fan Control
Battery-powered robotics platforms (AGVs, mobile robots, drone ground stations) and 12 V liquid-cooling pumps draw 2-5 A and benefit from the MC33887PEK's integrated protection and current-feedback features. The FB output enables software-implemented torque control on robotic arm joints without adding a separate current-sense IC, reducing BOM count and PCB area. Sleep mode (< 50 uA) preserves battery life during standby, and the monolithic H-bridge eliminates the discrete MOSFET bridge that would otherwise require careful gate-timing design. Surface-mount HSOP-54 assembly suits robotic enclosures with strict height constraints.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC33887PEK — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC33887PEFR2 | MC33887PNB | MC33HB2001FK |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 54-SOIC-EP (HSOP-54) | 54-SOIC-EP (HSOP-54) - same | 54-SOIC-EP (HSOP-54) - same | 54-SOIC-EP (HSOP-54) - same |
| Continuous Output Current | 5.0 A | 5.0 A | 5.0 A | 5.0 A |
| Peak Output Current | 8.0 A | 8.0 A | 8.0 A | 8.0 A |
| Supply Voltage | 5-28 V | 5-28 V | 5-28 V | 5-28 V |
| Interface | TTL IN1/IN2 + analog FB | TTL IN1/IN2 + analog FB | TTL IN1/IN2 + analog FB | SPI + analog/digital feedback |
| Current Feedback | 1/375 ratio, ground-referenced | 1/375 ratio, ground-referenced | 1/375 ratio, ground-referenced | SPI-readable current register |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Active |
| Approx. Unit Price (1 pc) | $7.45 | ~$7.45 (same die) | ~$7.50 | ~$5.80 |
Principaux différenciateurs
- Monolithic H-bridge with integrated charge pump and current feedback (vs Discrete N-channel MOSFET H-bridge (4 MOSFETs + gate driver + sense resistor))
- 1/375 ground-referenced current feedback eliminates external shunt resistor (vs MC33HB2001 (SPI-readable digital current register))
- AEC-Q100 automotive qualification (vs Industrial-only H-bridge drivers (e.g., DRV8870))
Notes de conception
Estimated: At continuous 5 A load with RDS(on) of 120 mOhm per MOSFET (two in series), conduction loss is approximately I^2 x 2xRDS(on) = 25 x 0.24 = 6 W. With HSOP-54 exposed-pad thermal resistance of approximately 1 C/W junction-to-case, the junction-to-ambient rise on a properly designed 4-layer PCB with 1 sq-in copper pour is roughly 30-40 C above ambient. Designers must solder the exposed pad to a continuous copper pour with thermal vias (9-12 vias, 0.3 mm drill, 1 oz plating) to achieve the rated thermal performance. Without the exposed pad soldered, junction temperature can exceed 150 C shutdown threshold at half the rated current.
Route VPWR and PGND traces on inner layers or as wide top-layer pours to minimize voltage drop and thermal gradient. Place 100 nF ceramic bypass capacitors within 5 mm of VPWR pins and a 10 uF aluminum-electrolytic bulk capacitor within 25 mm. Separate the logic ground (GND pin 15) from the power ground (PGND pins 7-9) with a single-point connection under the IC exposed pad to prevent high-current switching noise from coupling into the analog FB signal. Add a TVS diode (e.g., SMBJ28A) on VPWR for 24 V industrial load-dump transients.
Do not float the EN pin - tie it to GND through a 100 kOhm pull-down to ensure the IC powers up in the active state rather than sleep mode. The FB pin output is ground-referenced only when the corresponding high-side MOSFET is on; sample-and-hold or low-pass-filter the FB signal to reconstruct continuous load current during PWM switching. Do not exceed 8 A peak current for more than the datasheet-specified pulse duration, or the internal current-limit comparator will trigger and reduce average output. Finally, ensure the logic VCC supply is stable before VPWR rises, or the IC may enter an indeterminate state at power-up.
Informations de conformité
AEC-Q100 qualified per NXP product page. RoHS and REACH compliance stated by NXP; halogen-free status not explicitly confirmed in available data. Lead-free terminal finish (Pb-free).
